Analog front-end electronics in beam instrumentation

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1 Analog front-end electronics in beam instrumentation Basic instrumentation structure Silicon state of art Sampling state of art Instrumentation trend Comments and example on BPM Future Beam Position Instrumentation Conclusions

2 Basic measurement and control process Measurement process Physical domain event Input transducers sensors Front_end CODEC Symbolic processor Coded information abstract Symbols Output transducers actuators Driver DECODEC Symbolic processor domain Control process Coded target description

3 Generalized information capture process [A] [B] [C] [C] [C] [D] [E] Input transducer Processing Output transducer [information carrier]

4 Generalized information capture process example [P] [ε] [R] [V] [V] [V] [L] Elastic device Piezoresistive device R/V converter G 1+ sτ V u = f ( V i ) Magnetoelectric device Input transducer Processing Output transducer

5 Generalized instrumentation architecture [A] [B] [B] [code] [code] [code] Sensors Physic processor (analog) CODEC (A/D) Symbolic processor (numeric) Coded information (measure) [information carrier]

6 Classification criteria Time Amplitude System continuous continuous Full analog discrete continuous Sampled discrete discrete Full digital

7 Classification criteria Full analog (Time Continuous) is one must in: Impedance converter Common mode rejection High speed comparator Anti aliasing filter GHz oscillator

8 Generalized instrumentation architecture Instrument is an information based device capable to capture and to refine information from the physical word

9 Generalized instrumentation architecture The best choice is a synergic mix of the three different approach: analogic, sampled and numeric Raw information Refined information event sensors cabling protection TC processing TD processing coding Symbolic processing measure Physical word Abstract word

10 Analog front-end electronics in beam instrumentation Basic instrumentation structure Silicon state of art Sampling state of art Instrumentation trend Comments and example on BPM Future Beam Position Instrumentation Conclusions

11 Silicon State of art the MOS Cross-sectional transmission electron micrograph of 50 nm gate length mosfet

12 Silicon State of art This year we are celebrating the 40 th anniversary of Moore's Law

13 Silicon State of art NTRS and ITRS National and Internationals Roadmap for Semiconductors

14 Silicon State of art Mosfets scaling limit Open problems Gate insulators Gate electrodes Shallow junctions Junction contacts Some solutions Copper + low ε r SOI silicon on insulator Strained silicon High ε r gate insulator

15 Silicon State of art Driven force Embedded applications navigator, automotive, medical, consumer Personal communication one chip systems Home automation and Digital home New processors High speed serial bus (10Gb/s) IEEE ,IEEE 1394

16 Silicon State of art Current availability 65nm CMOS technology THz transistors 100Gsp/s electric sampling rate oscilloscope

17 Analog front-end electronics in beam instrumentation Basic instrumentation structure Silicon state of art Sampling state of art Instrumentation trend Comments and example on BPM Future Beam Position Instrumentation Conclusions

18 Sampling State of art the optoelectronic solution

19 Sampling State of art the optoelectronic solution Time stretcher analog to digital converter Time-stretch Analog-to-Digital Conversion. (a) with a time-limited input signal, and (b) with a continuous-time input signal. Physical implementation of the time-stretch preprocessing. Single SideBand (SSB) modulation removes the electrical bandwidth limitation imposed by dispersion. The differential Mach-Zehnder (MZ) modulation is used to remove common-mode distortion

20 Analog front-end electronics in beam instrumentation Basic instrumentation structure Silicon state of art Sampling state of art Instrumentation trend Comments and example on BPM Future Beam Position Instrumentation Conclusions

21 Instrumentation trends Key factors: General technological improvement Large number of components Availability of good analog switch

22 Instrumentation trends Performance evaluation Adaptive analog electronic Embedded controller Test embedded New class of device where all the techniques are fused together in order to optimize the cost performance ratio Switched capacitor technique Measurement methods Tuning methods

23 Instrumentation trends Physical word Raw information System on chip (soc) Abstract word Refined information conditioning event sensors wiring protection TC processing TD processing coding Symbolic processing Gateway measure Embedded test & tuning Embedded test & tuning Embedded test & tuning Embedded controller Smart sensor

24 Instrumentation trends Mixed Signal Array with On-Chip Controller Low level differential high speed (>2Gsps) ADC SSP sensor signal processor FPAA field programmable analog array PSoC programmable systems-on-chip

25 Instrumentation trends Low level differential high speed ADC (>2Gsps up to10 bit )

26 Instrumentation trends SSP sensor signal processor

27 Instrumentation trends FPAA field programmable analog array Configurable Analog Blocks (CABs) Switched capacitor based

28 Instrumentation trends Software design environment Simple implementation of complex functions Rapid prototype and test FPAA platform Addresses multiple sensors Allows tuning the data acquisition board for multiple sensors Zoom in on specific portions of the sensor curve Signal conditioning Adaptive under real time control Added precision Low latency

29 Instrumentation trends FPAA Feature/Benefits On-Chip; DC references, oscillators, custom waveform generators Temperature stable, no drift Lower cost of goods Programmable and Reconfigurable FPAA can adapt to different sensor conditioning needs Multiple sensor conditioning circuits can be built on a single FPAA Dynamic reconfigurability Adaptive and precise Auto frequency and gain control Auto compensation Auto calibration Competitive advantage

30 Instrumentation trends PSoC programmable systems-on-chip Configurable Analog Blocks (CABs) Switched capacitor based

31 Instrumentation trends The PSoC consists of many Mixed-Signal Array with On-Chip Controller devices. replaces multiple traditional MCU-based system components with one, low cost single-chip programmable component includes configurable blocks of analog and digital logic, as well as programmable interconnect

32 Example Mapping a voltage ramp in to Weibull function Vu = f ( Vi) β 1 β x γ β x γ α ( xα, β, γ ) = e α α for x γ, α 0, β > 0, γ 0; 0 elsewhere f Goals: Vu Global Accuracy 1% Resolution 0.5 % (8 bit) Vi

33 Example Full digital VCG 6 R1 R2 Rn Rm OP - CMOS No linearity ANN input 6 output 2 5 hidden nodes

34 Example Attribute Full digital VCA ANN Overall complexity H M L Design complexity L M H Standard tools availability H M L Latency H L L Thermal stability M M M Added noise H M/L L Testability H M L Programmability H H M Bandwidth L H M/H Device cost M M L Development time L M M Ranking

35 Example Conclusion: The proposed solutions are overall similar All the solution can be implemented by the same device FPAA, PSOC The choice is aim-cost dependent The choice is designer knowledge dependent

36 Analog front-end electronics in beam instrumentation Basic instrumentation structure Silicon state of art Sampling state of art Instrumentation trend Comments and example on BPM Future Beam Position Instrumentation Conclusions

37 Beam Position Sensor [A] [B] [C] [C] [C] [D] [E] Input transducer Processing Output transducer

38 Beam Position Sensor Vc Vd Va Vb X Position = (Va - Vb) / (Va + Vb) Y Position = (Vc - Vd) / (Vc + Vd)

39 Beam Position Sensor Analogy Position = (Va - Vb) / (Va + Vb) A Basic Linear Variable Displacement Transducers LVDT - Cross Section View

40 Beam Position Monitoring Requirements High dynamic range Low beam current dependence High resolution Variable bandwidth Suitable cost Goals Bunch-by-bunch Multi-bunch Turn-by turn

41 Beam Position Monitoring [A] [B] [C] [C] [C] [D] [E] Input transducer Processing Output transducer

42 Beam Position measurement method Frequency domain Time domain Phase normalizer schematic Time normalizer schematic

43 Beam Position state of art Down Filter +VCA converter Filter +VCA ADC DRX DSP Multi-bunch Turn-by turn BW 1KHz 1MHz hybrid Filter +VCA ADC DRX DSP Bunch-by-bunch BW 250 MHz Based on: Digital Receiver (DRX) Field Programmable Gate Array (FPGA) Digital Signal Processor (DSP) General Purpose Processor (GPP) Suitable Firmware

44

45 Beam Position metrological aspects VGA Gain/Phase normalized to low frequency value at each Av.

46 Beam Position example

47 Beam Position example

48 Beam Position example The programmable connectivity is the key factor

49 Analog front-end electronics in beam instrumentation Basic instrumentation structure Silicon state of art Sampling state of art Instrumentation trend Comments and example on BPM Future Beam Position Instrumentation Conclusions

50 Future Beam Position Instrumentation Wireless distributed one (few) chip autonomous system Physical domain Abstract domain BPS Hybrid diff VGA DRX PSOC PROC USB PSOC programmable system on chip PROC programmable receiver on chip Embedded test and supervisor

51 Future Beam Position Instrumentation Wireless distributed one (few) chip autonomous system Physical domain Abstract domain event BPS SSP PROC USB Embedded test and supervisor

52 Conclusions From Module to chip HW practice more easy High configurability by programmability More knowledge requirement Low development time Good cost performance ratio Good development tools

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