t p = 10 ms T j initial = T amb -65 to T L Maximum lead temperature for soldering during 10 s. 260 C
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1 SMAJ TRANSIL FEATURES Peak Pulse Power : 400 W (10/0µs) Stand off voltage range: From 5V to 188V Uni and Bidirectional types Low clamping factor Fast response time JEDEC registered package outline K A Unidirectional Bidirectional DESCRIPTION The SMAJ series are TRANSIL TM diodes designed specifically for protecting sensitive equipment against transient overvoltages. The SMA package allows save spacing on high density printed circuit boards. Transil diodes provide high overvoltage protection by clamping action. Their instantaneous response to transient overvoltages makes them particularly suited to protect voltage sensitive devices such as MOS Technology and low voltage supplied IC s. SMA (JEDEC DO-214AC) Table 1: Order Codes Part Number Marking SMAJxxxA-TR See page 2 SMAJxxxCA-TR See page 2 Table 2: Absolute Maximum Rating (T amb = 25 C) Symbol Parameter Value Unit P PP Peak pulse power dissipation (see note 1 ) T j initial = T amb 400 W P Power dissipation on infinite heatsink T amb = 50 C 3.3 W I FSM T stg T j Non repetitive surge peak forward current for unidirectional types Storage temperature range Maximum junction temperature t p = 10 ms T j initial = T amb 40 A -65 to T L Maximum lead temperature for soldering during 10 s. 260 C Note 1: for a surge greater than the maximum values, the diode will fail in short-circuit. C Table 3: Thermal Resistances Symbol Parameter Value Unit Rth(j-l) Junction to leads 30 C/W Rth(j-a) Junction to ambient on printed circuit on recommended pad layout 120 C/W February 2006 REV. 8 1/6
2 Table 4: Electrical Characteristics (T amb = 25 C) Symbol V RM V BR Parameter Stand-off voltage Breakdown voltage I I F I V CL I RM Clamping voltage Leakage current Peak pulse current V CL V BR V RM I RM I R V F V V CL V BR V RM I R I RM IRM I R V V RM V BR V CL αt Voltage temperature coefficient Unidirectional Bidirectional V F Forward voltage drop I V RM V I R V V αt C Types max min note2 max 10/0µs max 8/20µs max note3 typ note4 Unidirectional Mark. Bidirectional Mark. µa V V ma V A V A 10-4 / C pf SMAJ5.0A-TR AE SMAJ5.0CA-TR AA SMAJ6.0A-TR DUB SMAJ6.0CA-TR DBB SMAJ6.5A-TR DUC SMAJ6.5CA-TR DBC SMAJ8.5A-TR DUH SMAJ8.5CA-TR DBH SMAJ10A-TR AX SMAJ10CA-TR AC SMAJ12A-TR DUK SMAJ12CA-TR DBK SMAJ13A-TR BG SMAJ13CA-TR BH SMAJ15A-TR BM SMAJ15CA-TR AJ SMAJ18A-TR DUQ SMAJ18CA-TR DBQ SMAJ20A-TR DUR SMAJ20CA-TR DBR SMAJ22A-TR DUS SMAJ22CA-TR DBS SMAJ24A-TR DUT SMAJ24CA-TR DBT SMAJ26A-TR DUU SMAJ26CA-TR DBU SMAJ28A-TR CG SMAJ28CA-TR CH SMAJ30A-TR CK SMAJ30CA-TR CL SMAJ33A-TR CM SMAJ33CA-TR CN SMAJ40A-TR DUZ SMAJ40CA-TR DBZ SMAJ43A-TR EUA SMAJ43CA-TR EBA SMAJ48A-TR CX SMAJ48CA-TR CY SMAJ58A-TR EUF SMAJ58CA-TR EBF SMAJ70A-TR EUI SMAJ70CA-TR EBI SMAJ85A-TR EUL SMAJ85CA-TR EBL SMAJA-TR EUN SMAJCA-TR EBN SMAJ130A-TR EUQ SMAJ130CA-TR EBQ SMAJ154A-TR EUT SMAJ154CA-TR EBT SMAJ170A-TR SR SMAJ170CA-TR SS SMAJ188A-TR EUV SMAJ188CA-TR EBV Note 2: Note 3: Pulse test : t p < 50 ms. V BR = αt * (T amb - 25) * V BR (25 C). Note 4: V R = 0 V, F = 1 MHz. For bidirectional types, capacitance value is divided by 2. 2/6
3 Figure 1: Pulse waveform (10/0µs) Figure 2: Peak power dissipation versus initial junction temperature Ppp[Tj initial]/ppp[tj initial=25 C] Tj initial( C) Figure 3: Peak pulse power versus exponential pulse duration (Tj initial=25 C) 5000 Ppp(W) Figure 4: Clamping voltage versus peak pulse current (Tj initial=25 C) Exponential waveform tp=20ms & tp=1ms Ipp(A).0 tp = 20 µs SMAJ5.0A,CA SMAJ13A,CA tp = 1 ms SMAJ26A,CA tp=1ms SMAJ58A,CA SMAJ188A,CA 1.0 tp(ms) Figure 5: Capacitance versus reverse applied voltage (typical values) (SMAJxxA) 5000 C(pF) 0 SMAJ5.0A SMAJ13A SMAJ26A F=1MHz V CL(V) Figure 6: Capacitance versus reverse applied voltage (typical values) (SMAJxxCA) C(pF) SMAJ5.0CA SMAJ13CA SMAJ26CA SMAJ58CA F=1MHz SMAJ58A SMAJ188A 10 SMAJ188CA V R(V) V R(V) /6
4 Figure 7: Peak forward voltage drop versus peak forward current (typical values) I FM(A) Figure 8: Relative variation of thermal impedance junction to ambient versus pulse duration 1.00 Zth(j-a)/Rth(j-a) 1.00 Tj=125 C Tj=25 C V FM(V) Figure 9: Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4 e(cu)=35µm) Rth(j-a) ( C/W) S(Cu)(cm²) tp(s) E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Figure 10: Relative variation of leakage current versus junction temperature 2E+3 1E+3 1E+2 1E+1 1E+0 I R[Tj] / I R [Tj=25 C] VBR 8.5V V BR < 8.5V Tj( C) 1E Figure 11: Ordering Information Scheme SM A J 85 CA - TR Surface Mount Peak Pulse Power A = 400 W Stand off voltage 85 = 85 V Type A = Unidirectinal CA = Bidirectional Packaging TR = Tape & reel 4/6
5 Figure 12: SMA Package Mechanical Data C E1 E L D A1 A2 b REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A A b c E E D L Figure 13: Foot print dimensions (millimeters) Figure 14: Marking Cathode bar ( unidirectional devices only ) e3 x x x z y w w E : ECOPACK (Leadfree ) mention XXX : Marking Z : Manufacturing location Y : Year WW : week In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: Table 5: Ordering Information Part Number Marking Package Weight Base qty Delivery mode SMAJxxxA-TR See page 2 SMA g 5000 Tape & reel SMAJxxxCA-TR See page 2 SMA g 5000 Tape & reel Table 6: Revision History Date Revision Description of Changes September B Previous update. 02-Aug SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.) to 2.03mm (0.080). 10-Dec Template layout update. No content change. 10-Feb Added unidirectional marking on cover page and Figure 14. Changed Figure 13. Foot print. 5/6
6 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 6/6
- 65 to TL Maximum lead temperature for soldering during 10 s. 260 C
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More information- 65 to TL Maximum lead temperature for soldering during 10 s. 260 C
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