Paul Deffenbaugh, Ph.D Senior Scientist nscrypt, Inc. Direct Digital Manufacturing: 3D Printed Electronics Enables Printed Circuit Structures

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1 Paul Deffenbaugh, Ph.D Senior Scientist nscrypt, Inc. Direct Digital Manufacturing: 3D Printed Electronics Enables Printed Circuit Structures sme.org/smartmfgseries

2 Direct Digital Manufacturing: 3D Printed Electronics Enables Printed Circuit Structures sme.org/smartmfgseries nscrypt.com

3 DDM: 3DP Electronics Enables PCS Paul I. Deffenbaugh, Ph.D. nscrypt, Inc., Orlando, FL

4 Real multimaterial Conductive Silver paste Structural Thermoplastic Active Pick and Place Resistive Carbon paste Flexible Thermoplastic urethane Smooth Milling Dry/cure/sinter Laser heat Dielectric High-K or low RF loss Adhesive Epoxy, silicone Strong Metal Stiff Carbon Fiber

5 Printing Plastic filament, 1.75 mm Feed motor Feed system Thermal isolation Heater, max 400 C Nozzle, 12.5 μm nscrypt nfd

6 Pick and Place

7 nmill Well-adjusted printing is smooth, but not 1 μm smooth 1 μm runout 50k rpm

8 Laser drying/curing/sintering 200 W CW 40 W 150 ns pulsed 10 W 8 ps pulsed Controlled temperature

9 Conventional printed electronics Printed on nscrypt equipment Functional, circa 2011

10 Fully 3D printed electronics Digital, shape agnostic Multi-material Pick and placed actives On one machine Minimal touch-up Print and play Nonstop operation Temperature cycled

11 How it s made ABS Filament Silver Paste 3D Printed Electronics FDM nscrypt

12 How it s made

13 Draw electronics

14 Draw electronics

15 Draw in 3D

16 3D print

17 3D print wires

18 3D print electronics

19 Test it out

20 World s first 3D printed PAA element

21 RF Design Dr. the University of South Florida HFSS, ADS

22 Model Real device manufacturing requires modeling

23 Prototype Power dividers Phase shifters Switches Capacitively-loaded phase delay lines Tuned split ring filter Antenna balun Antenna matching High impedance surface Main antenna elements 2 ground planes 4 substrate thicknesses

24 Gain and beam steering test

25 Measure Precision measurements Process optimization not one-off

26 PAA elements

27 Enablers

28 Accuracy nscrypt 3Dn-Tabletop 100 nm resolution, 10 µm accuracy 0.5 G acceleration, 0 to 100 mm/s in 20 ms nscrypt 3Dn-Gantry 10 nm resolution, 1 µm accuracy 5 G acceleration, 0 to 1 m/s in 20 ms Flow-optimized nozzles 12.5 µm to 1.75 mm ( to ) Common size is 125 µm (0.005, 32 gauge)

29 Reliability Humidity Heat cycle Cryo Long-term fatigue Environmental, encapsulation Fine features, opens and shorts Thermal tension, wire breaks Thermal management, lifetime Mech. Stress, adhesion 21,000 hours

30 Rapid manufacturing High speed, high acceleration Multi-nozzle Multi-material Many printers interconnected nscrypt machines are SMEMA standard 3Dn-500PF has linear stage for movement between 2 work areas Closed loop motion control Feedback mechanisms ensuring high yield

31 Closed loop Motion control with encoders Laser height sensing In-process vision Laser heat control Localized heat, no oven

32 Software integration Many steps, process of CAD to print nscrypt software supports sequential jobs with arbitrary devices nscrypt-solidworks plugin for 5-axis Autodesk is contributing Drafting software 3D printing

33 Automation Fully automated 2 thermoplastics Silver paste Pick and place LED SMEMA standard Plays well with others

34 Terms DDM Flex circuits Printed electronics 3D printing 3D printed electronics PCS digital manufacturing of any kind 2D conductors on non-printed media 2D circuits on non-printed media plastic or metal shapes electronically functional volumetrically arbitrary, customizable everything

35 Printed Circuit Structures Volumetrically arbitrary Customizable everything Multi everything Structure and circuits tightly integrated

36 Beyond PCBs Structure can benefit circuitry

37 Satellites

38 Arbitrary 3D is PCS Dr. Raymond C. Rumpf, UTEP US Provisional Patent 62,016,478

39 Spatially-variant RF Dr. Raymond C. Rumpf, UTEP emlab.utep.edu US Provisional Patent 62,016,478

40 Structural phased array antenna Wing + PAA structurally are one

41 World s first 3D printed phased array antenna

42 Printed circuit structures Smaller size, electrically functional mechanical members Fit into tight or oddly shaped non planar/flat spaces Weight savings Cost of assembly savings Concealment Mass customization Medicine, shoes, phones, food

43 Printed circuit structures PCB industry is $70B 3DP is only $5B Many groups are leading and most are following America, Germany, Japan are known for worlds best precision equipment Accuracy, precision, speed these are necessary for real devices

44 Thank you. Paul I. Deffenbaugh, Ph.D. nscrypt, Inc., Orlando, FL nscrypt.com

3D Printed Electronics for Printed Circuit Structures

3D Printed Electronics for Printed Circuit Structures Samuel LeBlanc, Paul Deffenbaugh, Jacob Denkins, Kenneth Church nscrypt, Inc. Orlando, Florida Abstract Printed electronics is a familiar term that