FS2...N Electrical Characteristics at Tamb = 25 C SYMBOL I GT GT GD I DRM / I RRM PRMETER Gate Trigger Current Gate Trigger oltage Gate Non Trigger ol

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1 FS2...N TO26 (SOT223) K () (2) G (3) OnState Current Gate Trigger Current.25 mp < 2 µ OffState oltage 4 8 FETURES Glass/passivated die junctions Low current SCR Low thermal resistance High surge current capability Low forward voltage drop Solder dip 26ºC, s Component in accordance to RoHS 2/65/EU and WEEE 22/96/EC Meets MSL level 3, per JSTD2, LF maximum peak of 26º C MECHNICL DT Case: TO26 (SOT223). Epoxy meets UL 94 flammability rating. Polarity: s marked on the body. Terminals: Matte tin plated leads, solderable per MILSTD75 Method 226, JSTD2 and JESD22B2. Consumer grade, meets JESD 2 class whisker test. TYPICL PPLICTIONS Thanks to highly sensitive triggering levels, the FS2xxxN SCR series is suitable for all applications where available gate current is limited, such as ground fault circuit interruptors, pilot circuits in solid state relays, standby mode power supplies, smoke and alarm detectors. Maximun Ratings and Electrical Characteristics at 25 C SYMBOL PRMETER CONDITIONS alue Unit I T(RMS) Onstate Current 8 Conduction ngle, T c = 5 C.25 I T() verage Onstate Current Half Cycle, Q = 8 º, T c = 5 C.8 I TSM Nonrepetitive OnState Current Half Cycle, 6 Hz 25 I TSM I 2 t I GM Nonrepetitive OnState Current Fusing Current Peak Gate Current Halfl Cycle, 5 Hz tp = ms, Half Cycle 2 µs max s P GM Peak Gate Dissipation 2 µs max. 3 W P G() T j T stg Gate Dissipation 2ms max..2 W Operating Temperature (4 to +25) C Storage Temperature (4 to +5) C T sld Soldering Temperature s max. 26 C SYMBOL DRM / RRM PRMETER Repetitive Peak Off State oltage CONDITIONS R GK = kw D 4 OLTGE M 6 N 8 Unit Revision: ersion: May3 Page Number: /6

2 FS2...N Electrical Characteristics at Tamb = 25 C SYMBOL I GT GT GD I DRM / I RRM PRMETER Gate Trigger Current Gate Trigger oltage Gate Non Trigger oltage OffState Leakage Current CONDITIONS D = 2 DC, R L = 4W. T j = 25 ºC SENSITIITY R GM Reverse Gate oltage I R G = µ, 8 I H Holding Current I T = 5 m, R GK = kw T j = 25 ºC I L Latching Current I G = m, R GK = kw d / dt Critical Rate of oltage Rise D =.67 x DRM, R GK = kw, Tj = 25 ºC di / dt Critical Rate of Current Rise D = 2 DC, R L = 4W, T j = 25 ºC D = DRM, R L = 3.3kW, R GK = 22W T j = 25 ºC tr ns, f = 6 Hz, T j = 25 ºC TM Onstate oltage at I T = 2.5 mp, tp = 38 µs, T j = 25 ºC t Threshold oltage T j = 25 ºC.9 r d Dynamic resistance T j = 25 ºC 5 mw R th(jl) Thermal Resistance JunctionLeads for DC I G = 2 x I GT D = DRM, R GK = kw T j = 25 ºC R = RRM, T j = 25 ºC Unit µ m m /µs /µs µ µ ºC/W R th(ja) Thermal Resistance Junctionmb for DC S () = 5 cm 2 6 ºC/W () S: Cooper surface under tab. Part Number Information F S 2 2 D N RB FGOR SCR CURRENT PCKGING FORG CSE OLTGE SENSITIITY Revision: ersion: May3 Page Number: 2/6

3 FS2...N Ordering information PREFERRED P/N PCKGE CODE DELIERY MODE BSE QUNTITY UNIT WEIGHT (g) FS22DN RS FS22DN RB RS REEL,.6 RB REEL 2,5.6 Package Outline Dimensions: (mm) TO26 (SOT223) B H Test sort name 6 max. (4x) D F E MC XXXNWWY G I Marking code Year code Week code Format type.5.5 C Max. J K Mounting Pad Layout 3.3 (3x) REF. B C D E F G H I J K DIMENSIONS Milimeters Min. Nominal Max Revision: ersion: May3 Page Number: 3/6

4 Ratings and Characteristics (Ta 25 ºC unless otherwise noted) FS2...N Fig. : Maximum average power dissipation versus average onstate current Fig. 2: verage and D.C. onstate current versus case temperature P (W).5 I T() () DC a = 8 º.2 36 º Fig. 3: Relative variation of thermal impedance junction to case versus pulse duration a T lead (ºC) Fig. 4: Relative variation of gate trigger current, holding and latching current versus junction temperature. [Zth(jc) / Rth (jc)] I GT, I H (Tj) / I GT, I H (Tj = 25 ºC) IH & IL I GT. tp (s) E3 E2 E E+ Fig. 5: Relative variation of holding current versus gatecathode resistance (typical values)..2. Tj (ºC) Fig. 6: Relative variation of d/dt immunity versus gatecathode resistance (typical values). 5 IH [RGK] / IH[RGK = kw] Tj=25 ºC. d/dt [RGK] / d/dt [RGK = 22W] Tj = 25 C D =.67xDRM RGK=(kW) E2 E E+ E RGK=(kW) Revision: ersion: May3 Page Number: 4/6

5 FS2...N Fig. 7: Relative variation of d/dt immunity versus gatecathode capacitance (typical values). Fig. 8: Non repetitive surge peak onstate current versus number of cycles. I TSM () 8 D =.67 x DRM Tj = 25 ºC RGK = 22W Tj initial = 25 ºC f = 5Hz Cgk(nF) Number of cycles Fig. 9: Non repetitive surge peak onstate current for a sinusoidal pulse with width: tp < ms, and corresponding value of I 2 t. Fig. : Onstate characteristics (maximum values) ITSM(). I 2 t ( 2 s) Tj initial = 25 ºC 5 ITM() Tj max T(O) =.85 rd = 9mW I TSM Tj =Tj max I 2 t Tj 25 ºC 2 5 tp(ms) TM() Revision: ersion: May3 Page Number: 5/6

6 FS2...N Revision History Date Revision Description of Changes 4Sep2 Original Data Sheet 27May23 2 and 7 eliminated Disclaimer ll product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. Fagor Electrónica, S.Coop., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Fagor"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Fagor makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Fagor disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, noninfringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Fagor's knowledge of typical requirements that are often placed on Fagor products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. ll operating parameters, including typical parameters, must be validated for each customer application by the customer's technical experts. Product specifications do not expand or otherwise modify Fagor's terms and conditions of purchase, including but nos limited to the warranty expressed therein. Except as expressly indicated in writing. Fagor products are not designed for use in medical, lifesaving, or lifesustaining applications or for any other application in which the failure of the Fagor product could result in personal injury or death. Customers using or selling Fagor products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Fagor and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attomeys fees, even if such claim alleges that Fagor or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Fagor personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Fagor, Product names and markings noted herein may be trademarks of their respective owners. Revision: ersion: May3 Page Number: 6/6