Power Plane and Decoupling Optimization. Isaac Waldron

Size: px
Start display at page:

Download "Power Plane and Decoupling Optimization. Isaac Waldron"

Transcription

1 Power Plane and Decoupling Optimization p Isaac Waldron

2 Overview Frequency- and time-domain power distribution system specifications Decoupling design example Bare board Added d capacitors Buried Capacitance Conclusion

3 Frequency Domain PDS Targets Excessive impedance seen by a device drawing power from a PDS will cause power voltage to fluctuate On a board, impedance must be below target from DC to several hundred MHz Working in the frequency domain allows quick estimation of power quality Mag. of Z Z target Z f

4 PDS Components Mag. of Z Z target Z f 1KHz 1MHz 100MHz 1GHz Switching Power Supply Electrolytic Bulk Capacitors High Frequency Ceramic Capacitors Power/Ground Planes Buried Capacitance

5 Time Domain PDS Targets S-parameters and impedance are calculated in the frequency domain Device specifications are typically given in the time domain Example: maximum VCC excursion 10% of nominal value 1.8 V VCC has an allowable range of 1.62 V to 1.98 V

6 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

7 Board Imported from Layout Measuring impedance at the six VCC pins on U41

8 Defining the Target Impedance Package Model C58 Cpkg L59 Lpkg R60 0 Rpkg VRM V35 VRM pullup logic_in io enable out_of_in pulldown 0 Driver R5 50 VRM VR RM A Name=vrm V33 DC=VCC 0 To define the target impedance we need to consider two factors: Peak current Determines maximum impedance Spectral power Determines cutoff frequency

9 Peak Current Peak current ma Six drivers and 0.18 V maximum voltage swing: Ansoft Corporation Driver Current Curve Info mag(ipositive(vrm)) se max Driver V ( ma) = 800 mω mag(ipos sitive(vrm)) [ma] Time [ns]

10 Driver Spectrum 95% of driver power is Ansoft Corporation 1.00E-003 below 667 MHz 1.00E-004 XY Plot MHz MHz Curve Info mag(vrm_pow er) Driver 1.00E E-006 rm_power) mag(v 1.00E E E E E E Spectrum [GHz]

11 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

12 Bare Board Target impedance 800 mohm to 667 MHz Bare Board

13 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

14 Time Domain Schematic C58 Cpkg L59 Lpkg R60 0 Rpkg VCC C_U41-2 Di Driver V35 logic_in enable VCC C_U41-2 pullup io out_of_in pulldown 0 R5 50 x6 VCC_U41-2 VCC_U41-21 VCC_U41-42 VCC_U41-2 VCC_U41-21 VCC_U41-42 J5_VC CC J5_VCC C VCC_U41-44 VCC_U41-63 VCC_U41-84 Board VCC_U41-44 VCC_U41-63 VCC_U41-84 J5_VCC 800 Mbps data rate VRM V33 DDR2 IBIS driver into ideal termination used as load for PDS DC=VCC 0 Package decoupling modeled using a capacitor w/ ESR, ESL

15 Switching Power Noise Ansoft Corporation 2.40 U41 Power Curve Info pk2pk Bare V(VCC_U41-2) V(VCC_U41-21) V(VCC_U41-42) V(VCC_U41-44) V(VCC_U41-63) Y1 [V] 1.80 V(VCC_U41-84) Shaded area represents time domain specification 1.8 V ± 10% Time [ns]

16 Spectral Analysis Ansoft Corporation 2.40 Y1 [V] Y U41 Power ~11-12 ns period Curve Info V(VCC_U41-2) V(VCC_U41-21) V(VCC_U41-42) V(VCC_U41-44) V(VCC_U41-63) V(VCC_U41-84) pk2pk Bare Ansoft Corporation Time [ns] m ns period corresponds to frequency of MHz This is confirmed by the spectral plot and correlates with the ideal driver simulation ua shown earlier e 83 MHz) Spectral Name 90 X MHz Y m m Curve Info db(v(vcc_u41-2)) db(v(vcc_u41-21)) db(v(vcc_u41-42)) db(v(vcc_u41-44)) Bare m2 db(v(vcc_u41-63)) Y db(v(vcc_u41-84)) Spectrum [MHz]

17 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

18 Adding Bulk Capacitors Added two 47 uf capacitors as specified by VRM manufacturer

19 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

20 Bare Board vs. Bulk Capacitors Target impedance 800 mohm to 667 MHz 50 MHz Bare Board Board w/ Bulk Caps

21 Bulk Capacitors Target impedance 800 mohm to 667 MHz 50 MHz Board w/ Bulk Caps

22 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

23 Switching Power Noise Ansoft Corporation 2.40 U41 Power ~ ns period Curve Info V(VCC_U41-2) Bulk pk2pk V(VCC_U41-21) V(VCC_U41-42) V(VCC_U41-44) V(VCC_U41-63) Y1 [V] 1.80 V(VCC_U41-84) Shaded area represents time domain specification 1.8 V ± 10% Time [ns]

24 Spectral Analysis Ansoft Corporation U41 Power ~11-12 ns period Curve Info V(VCC_U41-2) V(VCC_U41-21) V(VCC_U41-42) Bulk pk2pk Same ns period as exhibited by bare board 2.00 V(VCC_U41-44) V(VCC_U41-63) Y1 [V] 1.80 V(VCC_U41-84) Ansoft Corporation Time [ns] m1 Spectral MHz Name X Y m1 MHz m Bulk Curve Info db(v(vcc_u41-2)) db(v(vcc_u41-21)) db(v(vcc_u41-42)) 42)) db(v(vcc_u41-44)) db(v(vcc_u41-63)) db(v(vcc_u41-84)) Note that 50 MHz is not excited due as indicated by low spectral content at that frequency Y m Spectrum [MHz]

25 Resonance at 50 MHz U41

26 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

27 Choosing a Capacitor To reduce the effect of a resonance, choose a capacitor with a low impedance at the resonant frequency 22 nf Capacitor Board w/ Bulk Caps

28 Added HF Capacitors nf capacitors were added across the board to reduce high-frequency impedance and to cancel resonance at 50 MHz

29 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

30 Bulk vs. HF Capacitors 1 Target impedance 800 mohm to 667 MHz Board w/ Bulk Caps Board w/ HF Caps 1 No 50 MHz

31 HF Capacitors 1 Target impedance 800 mohm to 667 MHz Exceeds MHz Board w/ HF Caps 1 No 50 MHz

32 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

33 Switching Power Noise Ansoft Corporation 2.40 U41 Power Curve Info pk2pk HF1 V(VCC_U41-2) V(VCC_U41-21) V(VCC_U41-42) V(VCC_U41-44) V(VCC_U41-63) Y1 [V] 1.80 V(VCC_U41-84) Shaded area represents time domain specification 1.8 V ± 10% Time [ns]

34 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

35 Extending Low Impedance nf capacitors were added across the board to extend minimum highfrequency impedance 12nF 1.2 capacitor was chosen due to low impedance at 200 MHz 4 of these were located near U41 Added capacitors

36 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

37 HF 1 vs. HF 2 Target impedance 800 New 80 MHz mohm to 667 MHz Board w/ HF Caps 1 Board w/ HF Caps 2 Impedance exceeds MHz

38 HF 2 Target impedance 800 New 80 MHz mohm to 667 MHz Board w/ HF Caps 2 Impedance exceeds MHz

39 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

40 Switching Power Noise Ansoft Corporation 2.40 U41 Power Curve Info pk2pk HF2 V(VCC_U41-2) V(VCC_U41-21) V(VCC_U41-42) V(VCC_U41-44) V(VCC_U41-63) Y1 [V] 1.80 V(VCC_U41-84) Shaded area represents time domain specification 1.8 V ± 10% Time [ns]

41 Resonance at 80 MHz U41

42 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

43 Removing a Resonance Added capacitors Six 8 nf capacitors were added near U41 to cancel resonance at 80 MHz

44 Choosing a Capacitor To reduce the effect of a resonance, choose a capacitor with a low impedance at the resonant frequency 82nF 8.2 Capacitor Board w/ HF Caps 2

45 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

46 HF 2 vs. HF 3 Target impedance 800 mohm to 667 MHz Board w/ HF Caps 2 Board w/ HF Caps 3 No 80 MHz Impedance crosses MHz

47 HF 3 Target impedance 800 mohm to 667 MHz Board w/ HF Caps 3

48 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

49 Switching Power Noise Ansoft Corporation 2.40 U41 Power Curve Info pk2pk Final V(VCC_U41-2) Maximum peak to peak noise of 371 mv V(VCC_U41-21) V(VCC_U41-42) V(VCC_U41-44) V(VCC_U41-63) Y1 [V] 1.80 V(VCC_U41-84) Shaded area represents time domain specification 1.8 V ± 10% Time [ns]

50 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

51 Buried Capacitance Due to parasitic inductance it will be impossible to further decouple the board with capacitors Using a thinner dielectric layer between power and ground planes introduces additional capacitance and reduces high frequency impedance Capacitance of parallel plates: C A = ε d

52 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

53 HF 3 vs. Buried Capacitance Target impedance 800 mohm to 667 MHz Board w/ HF Caps 3 Board w/ Buried Capacitance Impedance crosses 800 >667 MHz

54 Buried Capacitance Target impedance 800 mohm to 667 MHz Target impedance specification met Board w/ Buried Capacitance

55 PDS Design Flow EM extraction of impedance for critical devices Determine frequencies of specification Simulate in time domain to check for compliance Choose capacitor or geometric change to address Alter design according to findings

56 Switching Power Noise Ansoft Corporation 2.40 U41 Power Curve Info pk2pk Buried V(VCC_U41-2) Maximum peak to peak noise 273 mv 24% smaller than limit V(VCC_U41-21) V(VCC_U41-42) V(VCC_U41-44) V(VCC_U41-63) Y1 [V] 1.80 V(VCC_U41-84) Time-domain noise specification met Shaded area represents time domain specification 1.8 V ± 10% Time [ns]

57 Conclusion Ansoft software allows PCB engineers to design effective decoupling solutions for their PCBs Impedance and resonant mode simulations connect the frequency domain to the spatial domain and allow selection of capacitor value and placement Frequency domain extractions are useful for quickly optimizing PDS designs, but time domain simulations are necessary to ensure compliance with device specs

EMI. Chris Herrick. Applications Engineer

EMI. Chris Herrick. Applications Engineer Fundamentals of EMI Chris Herrick Ansoft Applications Engineer Three Basic Elements of EMC Conduction Coupling process EMI source Emission Space & Field Conductive Capacitive Inductive Radiative Low, Middle

More information

Decoupling capacitor uses and selection

Decoupling capacitor uses and selection Decoupling capacitor uses and selection Proper Decoupling Poor Decoupling Introduction Covered in this topic: 3 different uses of decoupling capacitors Why we need decoupling capacitors Power supply rail

More information

Automotive PCB SI and PI analysis

Automotive PCB SI and PI analysis Automotive PCB SI and PI analysis SI PI Analysis Signal Integrity S-Parameter Timing analysis Eye diagram Power Integrity Loop / Partial inductance DC IR-Drop AC PDN Impedance Power Aware SI Signal Integrity

More information

IBIS Data for CML,PECL and LVDS Interface Circuits

IBIS Data for CML,PECL and LVDS Interface Circuits Application Note: HFAN-06.2 Rev.1; 04/08 IBIS Data for CML,PECL and LVDS Interface Circuits AVAILABLE IBIS Data for CML,PECL and LVDS Interface Circuits 1 Introduction The integrated circuits found in

More information

ANSYS CPS SOLUTION FOR SIGNAL AND POWER INTEGRITY

ANSYS CPS SOLUTION FOR SIGNAL AND POWER INTEGRITY ANSYS CPS SOLUTION FOR SIGNAL AND POWER INTEGRITY Rémy FERNANDES Lead Application Engineer ANSYS 1 2018 ANSYS, Inc. February 2, 2018 ANSYS ANSYS - Engineering simulation software leader Our industry reach

More information

Physically-Based Distributed Models for Multi-Layer Ceramic Capacitors

Physically-Based Distributed Models for Multi-Layer Ceramic Capacitors Physically-Based Distributed Models for Multi-Layer Ceramic Capacitors Charles R Sullivan and Yuqin Sun Thayer School of Engineering Dartmouth College http://power.thayer.dartmouth.edu/ Introduction Why

More information

A Resonance-Free Power Delivery System Design Methodology applying 3D Optimized Extended Adaptive Voltage Positioning.

A Resonance-Free Power Delivery System Design Methodology applying 3D Optimized Extended Adaptive Voltage Positioning. A Resonance-Free Power Delivery System Design Methodology applying 3D Optimized Extended Adaptive Voltage Positioning Tao Xu Brad Brim Agenda Adaptive voltage positioning (AVP) Extended adaptive voltage

More information

IC Decoupling and EMI Suppression using X2Y Technology

IC Decoupling and EMI Suppression using X2Y Technology IC Decoupling and EMI Suppression using X2Y Technology Summary Decoupling and EMI suppression of ICs is a complex system level engineering problem complicated by the desire for faster switching gates,

More information

Understanding, measuring, and reducing output noise in DC/DC switching regulators

Understanding, measuring, and reducing output noise in DC/DC switching regulators Understanding, measuring, and reducing output noise in DC/DC switching regulators Practical tips for output noise reduction Katelyn Wiggenhorn, Applications Engineer, Buck Switching Regulators Robert Blattner,

More information

March 6-9, 2016 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive- Session 4

March 6-9, 2016 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive- Session 4 Proceedings Archive March 6-9, 2016 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive- Session 4 2016 BiTS Workshop Image: Stiop / Dollarphotoclub Proceedings Archive Presentation / Copyright Notice The

More information

Session 5 PCB Advancements And Opportunities

Session 5 PCB Advancements And Opportunities Minimizing Socket & Board Inductance using a Novel decoupling Interposer 2007 Burn-in and Test Socket Workshop Nick Langston James Zhou, Hongjun Yao It is better to uncover a little than to cover a lot.

More information

Relationship Between Signal Integrity and EMC

Relationship Between Signal Integrity and EMC Relationship Between Signal Integrity and EMC Presented by Hasnain Syed Solectron USA, Inc. RTP, North Carolina Email: HasnainSyed@solectron.com 06/05/2007 Hasnain Syed 1 What is Signal Integrity (SI)?

More information

Decoupling capacitor placement

Decoupling capacitor placement Decoupling capacitor placement Covered in this topic: Introduction Which locations need decoupling caps? IC decoupling Capacitor lumped model How to maximize the effectiveness of a decoupling cap Parallel

More information

The Facts about the Input Impedance of Power and Ground Planes

The Facts about the Input Impedance of Power and Ground Planes The Facts about the Input Impedance of Power and Ground Planes The following diagram shows the power and ground plane structure of which the input impedance is computed. Figure 1. Configuration of the

More information

Advanced Topics in EMC Design. Issue 1: The ground plane to split or not to split?

Advanced Topics in EMC Design. Issue 1: The ground plane to split or not to split? NEEDS 2006 workshop Advanced Topics in EMC Design Tim Williams Elmac Services C o n s u l t a n c y a n d t r a i n i n g i n e l e c t r o m a g n e t i c c o m p a t i b i l i t y e-mail timw@elmac.co.uk

More information

Intro. to PDN Planning PCB Stackup Technology Series

Intro. to PDN Planning PCB Stackup Technology Series Introduction to Power Distribution Network (PDN) Planning Bill Hargin In-Circuit Design b.hargin@icd.com.au 425-301-4425 Intro. to PDN Planning 1. Intro/Overview 2. Bypass/Decoupling Strategy 3. Plane

More information

Adding On-Chip Capacitance in IBIS Format for SSO Simulation

Adding On-Chip Capacitance in IBIS Format for SSO Simulation Adding On-Chip Capacitance in IBIS Format for SSO Simulation Raymond Y. Chen SIGRITY, Inc. Jan. 2004 DesignCon 2004 - IBIS Summit Presentation Agenda 1. Is IBIS good for SSO simulation 2. SSO simulation

More information

Practical Limitations of State of the Art Passive Printed Circuit Board Power Delivery Networks for High Performance Compute Systems

Practical Limitations of State of the Art Passive Printed Circuit Board Power Delivery Networks for High Performance Compute Systems Practical Limitations of State of the Art Passive Printed Circuit Board Power Delivery Networks for High Performance Compute Systems Presented by Chad Smutzer Mayo Clinic Special Purpose Processor Development

More information

QPI-AN1 GENERAL APPLICATION NOTE QPI FAMILY BUS SUPPLY QPI CONVERTER

QPI-AN1 GENERAL APPLICATION NOTE QPI FAMILY BUS SUPPLY QPI CONVERTER QPI-AN1 GENERAL APPLICATION NOTE QPI FAMILY EMI control is a complex design task that is highly dependent on many design elements. Like passive filters, active filters for conducted noise require careful

More information

Application Guidelines for Non-Isolated Converters AN Input Filtering for Austin Lynx Series POL Modules

Application Guidelines for Non-Isolated Converters AN Input Filtering for Austin Lynx Series POL Modules PDF Name: input_filtering_an.pdf Application Guidelines for Non-Isolated Converters AN4-2 Introduction The Austin Lynx TM and Lynx II family of non-isolated POL (point-of-load) modules use the buck converter

More information

EMI/EMC of Entire Automotive Vehicles and Critical PCB s. Makoto Suzuki Ansoft Corporation

EMI/EMC of Entire Automotive Vehicles and Critical PCB s. Makoto Suzuki Ansoft Corporation EMI/EMC of Entire Automotive Vehicles and Critical PCB s Makoto Suzuki Ansoft Corporation WT10_SI EMI/EMC of Entire Automotive Vehicles and Critical PCB s Akira Ohta, Toru Watanabe, Benson Wei Makoto Suzuki

More information

X2Y versus CM Chokes and PI Filters. Content X2Y Attenuators, LLC

X2Y versus CM Chokes and PI Filters. Content X2Y Attenuators, LLC X2Y versus CM Chokes and PI Filters 1 Common Mode and EMI Most EMI compliance problems are common mode emissions. Only 10 s of uas in external cables are enough to violate EMC standards. 2 Common Mode

More information

Non-linear Control for very fast dynamics:

Non-linear Control for very fast dynamics: (CEI) cei@upm.es Non-linear Control for very fast dynamics: Tolerance Analysis and System Limitations Universidad Politécnica de Madrid Madrid DC-DC converter for very fast dynamics Current steps 5 V VRM

More information

Technical Report Printed Circuit Board Decoupling Capacitor Performance For Optimum EMC Design

Technical Report Printed Circuit Board Decoupling Capacitor Performance For Optimum EMC Design Technical Report Printed Circuit Board Decoupling Capacitor Performance For Optimum EMC Design Bruce Archambeault, Ph.D. Doug White Personal Systems Group Electromagnetic Compatibility Center of Competency

More information

CHQ SERIES. Surface Mount Chip Capacitors: Ultra High Frequency

CHQ SERIES. Surface Mount Chip Capacitors: Ultra High Frequency 26 High Frequency Measurement and Performance of High Multilayer Ceramic Capacitors Introduction Capacitors used in High Frequency applications are generally used in two particular circuit applications:

More information

Maxim > Design Support > Technical Documents > Application Notes > Wireless and RF > APP 3571

Maxim > Design Support > Technical Documents > Application Notes > Wireless and RF > APP 3571 Maxim > Design Support > Technical Documents > Application Notes > Wireless and RF > APP 3571 Keywords: automotive keyless entry, MAX2640, LNA, 315MHz, RKE, stability, automotive, keyless entry APPLICATION

More information

Development and Validation of a Microcontroller Model for EMC

Development and Validation of a Microcontroller Model for EMC Development and Validation of a Microcontroller Model for EMC Shaohua Li (1), Hemant Bishnoi (1), Jason Whiles (2), Pius Ng (3), Haixiao Weng (2), David Pommerenke (1), and Daryl Beetner (1) (1) EMC lab,

More information

PCB power supply noise measurement procedure

PCB power supply noise measurement procedure PCB power supply noise measurement procedure What has changed? Measuring power supply noise in high current, high frequency, low voltage designs is no longer simply a case of hooking up an oscilloscope

More information

A7221 DC-DC CONVERTER/ BUCK (STEP-DOWN) HIGH EFFICIENCY FAST RESPONSE, 2A, 16V INPUT SYNCHRONOUS STEP-DOWN CONVERTER

A7221 DC-DC CONVERTER/ BUCK (STEP-DOWN) HIGH EFFICIENCY FAST RESPONSE, 2A, 16V INPUT SYNCHRONOUS STEP-DOWN CONVERTER DESCRIPTION develops high efficiency synchronous step-down DC-DC converter capable of delivering 2A load current. operates over a wide input voltage range from 6V to 16V and integrates main switch and

More information

Development and Validation of IC Models for EMC

Development and Validation of IC Models for EMC Development and Validation of D. Beetner Missouri University University of Missouri of Science - Rolland Technology UMR EMC Laboratory 1 Who is the UMR/MS&T EMC Laboratory? People 5 professors 3 graduate

More information

Presented by: Jim P. Muccioli

Presented by: Jim P. Muccioli Dale L. Sanders X2Y Attenuators, LLC 37554 Hills Tech Dr. Farmington Hills, MI 48331 James P. Muccioli X2Y Attenuators, LLC 37554 Hills Tech Dr. Farmington Hills, MI 48331 Terry M. North DiamlerChrysler

More information

MP2313 High Efficiency 1A, 24V, 2MHz Synchronous Step Down Converter

MP2313 High Efficiency 1A, 24V, 2MHz Synchronous Step Down Converter The Future of Analog IC Technology MP2313 High Efficiency 1A, 24V, 2MHz Synchronous Step Down Converter DESCRIPTION The MP2313 is a high frequency synchronous rectified step-down switch mode converter

More information

The Inductance Loop Power Distribution in the Semiconductor Test Interface. Jason Mroczkowski Multitest

The Inductance Loop Power Distribution in the Semiconductor Test Interface. Jason Mroczkowski Multitest The Inductance Loop Power Distribution in the Semiconductor Test Interface Jason Mroczkowski Multitest j.mroczkowski@multitest.com Silicon Valley Test Conference 2010 1 Agenda Introduction to Power Delivery

More information

Features. = +25 C, 50 Ohm System, Vcc= 5V

Features. = +25 C, 50 Ohm System, Vcc= 5V Typical Applications Prescaler for 1 MHz to 13 GHz PLL Applications: Point-to-Point / Multi-Point Radios VSAT Radios Fiber Optic Test Equipment Space & Military Functional Diagram Features Ultra Low ssb

More information

Engineering the Power Delivery Network

Engineering the Power Delivery Network C HAPTER 1 Engineering the Power Delivery Network 1.1 What Is the Power Delivery Network (PDN) and Why Should I Care? The power delivery network consists of all the interconnects in the power supply path

More information

Understanding and Optimizing Electromagnetic Compatibility in Switchmode Power Supplies

Understanding and Optimizing Electromagnetic Compatibility in Switchmode Power Supplies Understanding and Optimizing Electromagnetic Compatibility in Switchmode Power Supplies 1 Definitions EMI = Electro Magnetic Interference EMC = Electro Magnetic Compatibility (No EMI) Three Components

More information

Improvements of LLC Resonant Converter

Improvements of LLC Resonant Converter Chapter 5 Improvements of LLC Resonant Converter From previous chapter, the characteristic and design of LLC resonant converter were discussed. In this chapter, two improvements for LLC resonant converter

More information

Quick guide to Power. V1.2.1 July 29 th 2013

Quick guide to Power. V1.2.1 July 29 th 2013 Quick guide to Power Distribution ib ti Network Design V1.2.1 July 29 th 2013 High level High current, high transient Power Distribution Networks (PDN) need to be able to respond to changes and transients

More information

Signal Integrity Modeling and Simulation for IC/Package Co-Design

Signal Integrity Modeling and Simulation for IC/Package Co-Design Signal Integrity Modeling and Simulation for IC/Package Co-Design Ching-Chao Huang Optimal Corp. October 24, 2004 Why IC and package co-design? The same IC in different packages may not work Package is

More information

SSO Noise, Eye Margin, and Jitter Characterization for I/O Power Integrity

SSO Noise, Eye Margin, and Jitter Characterization for I/O Power Integrity DESIGNCON 2009 SSO Noise, Eye Margin, and Jitter Characterization for I/O Power Integrity Vishram S. Pandit, Intel Corporation [vishram.s.pandit@intel.com, (916)356-2059] Ashish N. Pardiwala, Intel Corporation

More information

MP1495 High Efficiency 3A, 16V, 500kHz Synchronous Step Down Converter

MP1495 High Efficiency 3A, 16V, 500kHz Synchronous Step Down Converter The Future of Analog IC Technology DESCRIPTION The MP1495 is a high-frequency, synchronous, rectified, step-down, switch-mode converter with built-in power MOSFETs. It offers a very compact solution to

More information

PI3USB102 PI3USB102 Demo Board Rev.A User Manual

PI3USB102 PI3USB102 Demo Board Rev.A User Manual PI3USB102 PI3USB102 Demo Board Rev.A User Manual Introduction This user manual describes the components and operation of the PI3USB102 Demo Board. USB2.0 high-speed, fullspeed and low speed signal quality

More information

What is New about Thin Laminates in 2013?

What is New about Thin Laminates in 2013? PCBDesign 007 QuietPower column What is New about Thin Laminates in 2013? Istvan Novak, Oracle, February 2013 It is almost two years ago that the QuietPower column Thin Laminates: Buried Capacitance or

More information

MINIMIZING EMI EFFECTS DURING PCB LAYOUT OF Z8/Z8PLUS CIRCUITS

MINIMIZING EMI EFFECTS DURING PCB LAYOUT OF Z8/Z8PLUS CIRCUITS APPLICATION NOTE MINIMIZING EMI EFFECTS DURING PCB LAYOUT OF Z8/Z8PLUS CIRCUITS INTRODUCTION The Z8/Z8Plus families have redefined ease-of-use by being the simplest 8-bit microcontrollers to program. Combined

More information

Learning the Curve BEYOND DESIGN. by Barry Olney

Learning the Curve BEYOND DESIGN. by Barry Olney by Barry Olney coulmn BEYOND DESIGN Learning the Curve Currently, power integrity is just entering the mainstream market phase of the technology adoption life cycle. The early market is dominated by innovators

More information

AltiumLive 2017: Component selection for EMC

AltiumLive 2017: Component selection for EMC AltiumLive 2017: Component selection for EMC Martin O Hara Victory Lighting Ltd Munich, 24-25 October 2017 Component Selection Passives resistors, capacitors and inductors Discrete diodes, bipolar transistors,

More information

Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material

Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material April 28, 2010 Yu Xuequan, Yanhang, Zhang Gezi, Wang Haisan Huawei Technologies CO., LTD. Shanghai, China Tony_yu@huawei.com

More information

Application Notes: AN_SY8208A

Application Notes: AN_SY8208A Application Notes: High Efficiency Fast Response 8A Continuous, 16A Peak, 28V Input Synchronous Step Down Regulator General Description The SY8208A develops a high efficiency synchronous step-down DC-DC

More information

AT V,3A Synchronous Buck Converter

AT V,3A Synchronous Buck Converter FEATURES DESCRIPTION Wide 8V to 40V Operating Input Range Integrated 140mΩ Power MOSFET Switches Output Adjustable from 1V to 25V Up to 93% Efficiency Internal Soft-Start Stable with Low ESR Ceramic Output

More information

MP1496 High-Efficiency, 2A, 16V, 500kHz Synchronous, Step-Down Converter

MP1496 High-Efficiency, 2A, 16V, 500kHz Synchronous, Step-Down Converter The Future of Analog IC Technology DESCRIPTION The MP1496 is a high-frequency, synchronous, rectified, step-down, switch-mode converter with built-in power MOSFETs. It offers a very compact solution to

More information

Guidelines to Keep ADC Resolution within Specification

Guidelines to Keep ADC Resolution within Specification Guidelines to Keep ADC Resolution within Specification 1. Introduction This application note describes how to optimize the ADC hardware environment in order not to alter the intrinsic ADC resolution and

More information

Signal Integrity Design of TSV-Based 3D IC

Signal Integrity Design of TSV-Based 3D IC Signal Integrity Design of TSV-Based 3D IC October 24, 21 Joungho Kim at KAIST joungho@ee.kaist.ac.kr http://tera.kaist.ac.kr 1 Contents 1) Driving Forces of TSV based 3D IC 2) Signal Integrity Issues

More information

Application Note. Piezo Amplifier. Piezoelectric Amplifier Connection. accelinstruments.com

Application Note. Piezo Amplifier. Piezoelectric Amplifier Connection. accelinstruments.com Piezo Amplifier Piezo amplifier is ideal for driving high-capacitance and high-frequency piezoelectric devices. Piezo actuators and transducers are usually capacitive. Due to their high-capacitance, their

More information

Low Distortion Design 4

Low Distortion Design 4 Low Distortion Design 4 TIPL 1324 TI Precision Labs Op Amps Presented by Collin Wells Prepared by John Caldwell Prerequisites: Noise 1 3 (TIPL1311 TIPL1313) Distortion from Power Supplies Power supplies

More information

Constructing conducted emission models for integrated circuits

Constructing conducted emission models for integrated circuits Scholars' Mine Masters Theses Student Research & Creative Works Fall 2013 Constructing conducted emission models for integrated circuits Shuai Jin Follow this and additional works at: http://scholarsmine.mst.edu/masters_theses

More information

Measurement and Comparative S21 Performance of Raw and Mounted Decoupling Capacitors

Measurement and Comparative S21 Performance of Raw and Mounted Decoupling Capacitors Measurement and Comparative S21 Performance of Raw and Mounted Decoupling Capacitors Summary Introduction Capacitors All IC power systems require some level of passive decoupling. The ability to accurately

More information

Designing a Multi-Phase Asynchronous Buck Regulator Using the LM2639

Designing a Multi-Phase Asynchronous Buck Regulator Using the LM2639 Designing a Multi-Phase Asynchronous Buck Regulator Using the LM2639 Overview The LM2639 provides a unique solution to high current, low voltage DC/DC power supplies such as those for fast microprocessors.

More information

Non-Ideal Behavior of Components

Non-Ideal Behavior of Components Non-Ideal Behavior of Components Todd H. Hubing Dept. of Electrical and Computer Engineering Clemson, University Clemson, SC 29634 USA email: hubing@clemson.edu Telephone: 1-864-656-7219 Circuit Schematics

More information

Application Note 5525

Application Note 5525 Using the Wafer Scale Packaged Detector in 2 to 6 GHz Applications Application Note 5525 Introduction The is a broadband directional coupler with integrated temperature compensated detector designed for

More information

DL-150 The Ten Habits of Highly Successful Designers. or Design for Speed: A Designer s Survival Guide to Signal Integrity

DL-150 The Ten Habits of Highly Successful Designers. or Design for Speed: A Designer s Survival Guide to Signal Integrity Slide -1 Ten Habits of Highly Successful Board Designers or Design for Speed: A Designer s Survival Guide to Signal Integrity with Dr. Eric Bogatin, Signal Integrity Evangelist, Bogatin Enterprises, www.bethesignal.com

More information

A Simulation Study of Simultaneous Switching Noise

A Simulation Study of Simultaneous Switching Noise A Simulation Study of Simultaneous Switching Noise Chi-Te Chen 1, Jin Zhao 2, Qinglun Chen 1 1 Intel Corporation Network Communication Group, LOC4/19, 9750 Goethe Road, Sacramento, CA 95827 Tel: 916-854-1178,

More information

MP2314 High Efficiency 2A, 24V, 500kHz Synchronous Step Down Converter

MP2314 High Efficiency 2A, 24V, 500kHz Synchronous Step Down Converter The Future of Analog IC Technology MP2314 High Efficiency 2A, 24V, 500kHz Synchronous Step Down Converter DESCRIPTION The MP2314 is a high frequency synchronous rectified step-down switch mode converter

More information

High Speed BUFFER AMPLIFIER

High Speed BUFFER AMPLIFIER High Speed BUFFER AMPLIFIER FEATURES WIDE BANDWIDTH: MHz HIGH SLEW RATE: V/µs HIGH OUTPUT CURRENT: 1mA LOW OFFSET VOLTAGE: 1.mV REPLACES HA-33 IMPROVED PERFORMANCE/PRICE: LH33, LTC11, HS APPLICATIONS OP

More information

Waveforms for Stimulating Magnetic Cores

Waveforms for Stimulating Magnetic Cores Waveforms for Stimulating Magnetic Cores My assigned topic is test waveforms for magnetic cores, but I'm going to provide a little background, which touches on topics covered by other presenters here:

More information

LDO Regulator Stability Using Ceramic Output Capacitors

LDO Regulator Stability Using Ceramic Output Capacitors LDO Regulator Stability Using Ceramic Output Capacitors Introduction Ultra-low ESR capacitors such as ceramics are highly desirable because they can support fast-changing load transients and also bypass

More information

HA MHz, High Slew Rate, High Output Current Buffer. Description. Features. Applications. Ordering Information. Pinouts.

HA MHz, High Slew Rate, High Output Current Buffer. Description. Features. Applications. Ordering Information. Pinouts. SEMICONDUCTOR HA-2 November 99 Features Voltage Gain...............................99 High Input Impedance.................... kω Low Output Impedance....................... Ω Very High Slew Rate....................

More information

Effect of Power Noise on Multi-Gigabit Serial Links

Effect of Power Noise on Multi-Gigabit Serial Links Effect of Power Noise on Multi-Gigabit Serial Links Ken Willis (kwillis@sigrity.com) Kumar Keshavan (ckumar@sigrity.com) Jack Lin (jackwclin@sigrity.com) Tariq Abou-Jeyab (tariqa@sigrity.com) Sigrity Inc.,

More information

System Power Distribution Network Theory and Performance with Various Noise Current Stimuli Including Impacts on Chip Level Timing

System Power Distribution Network Theory and Performance with Various Noise Current Stimuli Including Impacts on Chip Level Timing System Power Distribution Network Theory and Performance with Various Noise Current Stimuli Including Impacts on Chip Level Timing Larry Smith, Shishuang Sun, Peter Boyle, Bozidar Krsnik Altera Corp. Abstract-Power

More information

Design, Modeling and Characterization of Embedded Capacitor Networks for Mid-frequency Decoupling in Semiconductor Systems

Design, Modeling and Characterization of Embedded Capacitor Networks for Mid-frequency Decoupling in Semiconductor Systems Design, Modeling and Characterization of Embedded Capacitor Networks for Mid-frequency Decoupling in Semiconductor Systems Prathap Muthana, Madhavan Swaminathan, Rao Tummala, P.Markondeya Raj, Ege Engin,Lixi

More information

LVDS Owner s Manual. A General Design Guide for National s Low Voltage Differential Signaling (LVDS) Products. Moving Info with LVDS

LVDS Owner s Manual. A General Design Guide for National s Low Voltage Differential Signaling (LVDS) Products. Moving Info with LVDS LVDS Owner s Manual A General Design Guide for National s Low Voltage Differential Signaling (LVDS) Products Moving Info with LVDS Revision 2.0 January 2000 LVDS Evaluation Boards Chapter 6 6.0.0 LVDS

More information

10 Mb/s Single Twisted Pair Ethernet PHY Coupling Network Steffen Graber Pepperl+Fuchs

10 Mb/s Single Twisted Pair Ethernet PHY Coupling Network Steffen Graber Pepperl+Fuchs 10 Mb/s Single Twisted Pair Ethernet PHY Coupling Network Steffen Graber Pepperl+Fuchs IEEE P802.3cg 10 Mb/s Single Twisted Pair Ethernet Task Force 6/21/2017 1 Overview Coupling Network Coupling Network

More information

BASIS OF ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUIT Chapter VI - MODELLING PCB INTERCONNECTS Corrections of exercises

BASIS OF ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUIT Chapter VI - MODELLING PCB INTERCONNECTS Corrections of exercises BASIS OF ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUIT Chapter VI - MODELLING PCB INTERCONNECTS Corrections of exercises I. EXERCISE NO 1 - Spot the PCB design errors Spot the six design errors in

More information

TECHNICAL REPORT: CVEL Parasitic Inductance Cancellation for Filtering to Chassis Ground Using Surface Mount Capacitors

TECHNICAL REPORT: CVEL Parasitic Inductance Cancellation for Filtering to Chassis Ground Using Surface Mount Capacitors TECHNICAL REPORT: CVEL-14-059 Parasitic Inductance Cancellation for Filtering to Chassis Ground Using Surface Mount Capacitors Andrew J. McDowell and Dr. Todd H. Hubing Clemson University April 30, 2014

More information

MP2225 High-Efficiency, 5A, 18V, 500kHz Synchronous, Step-Down Converter

MP2225 High-Efficiency, 5A, 18V, 500kHz Synchronous, Step-Down Converter The Future of Analog IC Technology DESCRIPTION The MP2225 is a high-frequency, synchronous, rectified, step-down, switch-mode converter with built-in power MOSFETs. It offers a very compact solution to

More information

Design a SEPIC Converter

Design a SEPIC Converter Design a SEPIC Converter Introduction In a SEPIC (Single Ended Primary Inductance Converter) design, the output voltage can be higher or lower than the input voltage. The SEPIC converter shown in Figure

More information

n Application l Notebook Systems and I/O Power l Digital Set Top Boxes l LCD Display, TV l Networking, XDSL Modem n Typical Application VIN 4.

n Application l Notebook Systems and I/O Power l Digital Set Top Boxes l LCD Display, TV l Networking, XDSL Modem n Typical Application VIN 4. 5297 n General Description The 5297 is a high frequency synchronous stepdown DC-DC converter with built internal power MOSFETs. That provides wide 4.5 to 18 input voltage range and 3A continuous load current

More information

Three-Channel, 5th Order, Standard Definition Video Filter Driver BL1513

Three-Channel, 5th Order, Standard Definition Video Filter Driver BL1513 Three-Channel, 5th Order, Standard Definition Video Filter Driver Description The is a low-voltage, three-channel video amplifier with integrated reconstruction and s. Specially suited for standard definition

More information

Chapter 2 Displaying Characteristics

Chapter 2 Displaying Characteristics Chapter 2 Displaying Characteristics Impedance Characteristics of Chip Beads Chip beads are parts used to prevent EMI and control decoupling of LSI power source lines and to control over/under shooting

More information

Homework Assignment 05

Homework Assignment 05 Homework Assignment 05 Question (2 points each unless otherwise indicated)(20 points). Estimate the parallel parasitic capacitance of a mh inductor with an SRF of 220 khz. Answer: (2π)(220 0 3 ) = ( 0

More information

Passive Components around ADAS Applications By Ron Demcko, AVX Fellow, AVX Corporation

Passive Components around ADAS Applications By Ron Demcko, AVX Fellow, AVX Corporation Passive Components around ADAS Applications By Ron Demcko, AVX Fellow, AVX Corporation The importance of high reliability - high performance electronics is accelerating as Advanced Driver Assistance Systems

More information

Internal Model of X2Y Chip Technology

Internal Model of X2Y Chip Technology Internal Model of X2Y Chip Technology Summary At high frequencies, traditional discrete components are significantly limited in performance by their parasitics, which are inherent in the design. For example,

More information

4.5V to 32V Input High Current LED Driver IC For Buck or Buck-Boost Topology CN5816. Features: SHDN COMP OVP CSP CSN

4.5V to 32V Input High Current LED Driver IC For Buck or Buck-Boost Topology CN5816. Features: SHDN COMP OVP CSP CSN 4.5V to 32V Input High Current LED Driver IC For Buck or Buck-Boost Topology CN5816 General Description: The CN5816 is a current mode fixed-frequency PWM controller for high current LED applications. The

More information

Design and Layout Guidelines for the CDCVF2505 Clock Driver

Design and Layout Guidelines for the CDCVF2505 Clock Driver Application Note SCAA045 - November 2000 Design and Layout Guidelines for the CDCVF2505 Clock Driver Kal Mustafa Bus Solutions ABSTRACT This application note describes tuning techniques, line termination

More information

High-Voltage, Internally Powered ISOLATION AMPLIFIER

High-Voltage, Internally Powered ISOLATION AMPLIFIER ISO17 High-Voltage, Internally Powered ISOLATION AMPLIFIER FEATURES SIGNAL AND POWER IN ONE TRIPLE-WIDE PACKAGE 8Vpk TEST VOLTAGE 5Vrms CONTINUOUS AC BARRIER RATING WIDE INPUT SIGNAL RANGE: 1V to 1V WIDE

More information

3A, 23V, 380KHz Step-Down Converter

3A, 23V, 380KHz Step-Down Converter 3A, 23V, 380KHz Step-Down Converter General Description The is a buck regulator with a built in internal power MOSFET. It achieves 3A continuous output current over a wide input supply range with excellent

More information

1MHz, 3A Synchronous Step-Down Switching Voltage Regulator

1MHz, 3A Synchronous Step-Down Switching Voltage Regulator FEATURES Guaranteed 3A Output Current Efficiency up to 94% Efficiency up to 80% at Light Load (10mA) Operate from 2.8V to 5.5V Supply Adjustable Output from 0.8V to VIN*0.9 Internal Soft-Start Short-Circuit

More information

LP2994 DDR Termination Regulator

LP2994 DDR Termination Regulator LP2994 DDR Termination Regulator General Description The LP2994 regulator is designed to provide a linear solution to meet the JEDEC SSTL-2 and SSTL-3 specifications (Series Stub Termination Logic) for

More information

An Initial Case Study for BIRD95: Enhancing IBIS for SSO Power Integrity Simulation

An Initial Case Study for BIRD95: Enhancing IBIS for SSO Power Integrity Simulation An Initial Case Study for BIRD95: Enhancing IBIS for SSO Power Integrity Simulation Also presented at the January 31, 2005 IBIS Summit SIGRITY, INC. Sam Chitwood Raymond Y. Chen Jiayuan Fang March 2005

More information

Power Distribution Network Design for Stratix IV GX and Arria II GX FPGAs

Power Distribution Network Design for Stratix IV GX and Arria II GX FPGAs Power Distribution Network Design for Stratix IV GX and Arria II GX FPGAs Transceiver Portfolio Workshops 2009 Question What is Your PDN Design Methodology? Easy Complex Historical Full SPICE simulation

More information

Verifying Simulation Results with Measurements. Scott Piper General Motors

Verifying Simulation Results with Measurements. Scott Piper General Motors Verifying Simulation Results with Measurements Scott Piper General Motors EM Simulation Software Can be easy to justify the purchase of software packages even costing tens of thousands of dollars Upper

More information

LP2997 DDR-II Termination Regulator

LP2997 DDR-II Termination Regulator LP2997 DDR-II Termination Regulator General Description The LP2997 linear regulator is designed to meet the JEDEC SSTL-18 specifications for termination of DDR-II memory. The device contains a high-speed

More information

Electromagnetic Analysis and Verification of Probe Card Performance for First Pass System Success

Electromagnetic Analysis and Verification of Probe Card Performance for First Pass System Success San Diego, CA Electromagnetic Analysis and Verification of Probe Card Performance for First Pass System Success Cristian Gozzi Application Engineer Manager Introduction Today in Multi Probe wafer level,

More information

General Description Normalized Gain (db) V OUT = 2V pp Normalized Gain (db)

General Description Normalized Gain (db) V OUT = 2V pp Normalized Gain (db) Comlinear CLC Triple, Standard Definition Video Amplifier FEATURES n Integrated 4th-order, MHz filters n Integrated db video drivers n.ma total supply current n.%/.4 differential gain/phase error n DC

More information

SR A, 30V, 420KHz Step-Down Converter DESCRIPTION FEATURES APPLICATIONS TYPICAL APPLICATION

SR A, 30V, 420KHz Step-Down Converter DESCRIPTION FEATURES APPLICATIONS TYPICAL APPLICATION SR2026 5A, 30V, 420KHz Step-Down Converter DESCRIPTION The SR2026 is a monolithic step-down switch mode converter with a built in internal power MOSFET. It achieves 5A continuous output current over a

More information

<Insert Picture Here> DC and AC Bias Dependence of Capacitors

<Insert Picture Here> DC and AC Bias Dependence of Capacitors DC and AC Bias Dependence of Capacitors Istvan Novak, Kendrick Barry Williams, Jason R. Miller, Gustavo Blando, Nathaniel Shannon DesignCon East 211 DCE2, September 27, 211 Outline

More information

Design of the Power Delivery System for Next Generation Gigahertz Packages

Design of the Power Delivery System for Next Generation Gigahertz Packages Design of the Power Delivery System for Next Generation Gigahertz Packages Madhavan Swaminathan Professor School of Electrical and Computer Engg. Packaging Research Center madhavan.swaminathan@ece.gatech.edu

More information

Effect of Power Distribution Network Design on RF circuit performance for 900MHz RFID Reader

Effect of Power Distribution Network Design on RF circuit performance for 900MHz RFID Reader Effect of Power Distribution Network Design on RF circuit performance for 900MHz RFID Reader Youngwon Kim, Chunghyun Ryu, Jongbae Park, and Joungho Kim Terahertz Interconnection and Package Laboratory,

More information

The Quantitative Measurement of the Effectiveness of Decoupling Capacitors in Controlling Switching Transients from Microprocessors

The Quantitative Measurement of the Effectiveness of Decoupling Capacitors in Controlling Switching Transients from Microprocessors The Quantitative Measurement of the Effectiveness of Decoupling Capacitors in Controlling Switching Transients from Microprocessors Dale L. Sanders X2Y Attenuators, LLC 37554 Hills Tech Dr. Farmington

More information

Single-Channel, 5th Order, Standard Definition Video Filter Driver BL1511B

Single-Channel, 5th Order, Standard Definition Video Filter Driver BL1511B Single-Channel, 5th Order, Standard Definition Video Filter Driver Description The is a low-voltage, single-channel video amplifier with integrated reconstruction filter and input clamps. Specially suited

More information