Multilayer Organic (MLO TM )

Transcription

1 HOW TO ORDER DP 03 C 1580 Type Size Design Frequency (MHz) QUALITY INSPECTION MLO TM TECHNOLOGY Finished parts are 100% tested for electrical parameters and visual characteristics. OPERATING TEMPERATURE -40ºC to +85ºC TERMINATION Finishes available in NiSn and immersion Au coatings which are compatible with automatic soldering technologies which include reflow, wave soldering, vapor phase and manual. ORIENTATION IN TAPE POWER CAPACITY 4.5W Maximum Top View T Finish 7 = Au T = NiSn Mechanical 25ºC Size [mm(inches)] 1.65 x 0.88 (0.065 x 0.035) Height [mm(inches)] 0.54 (0.021) Volume (mm^3) 0.77 The 0603 diplexer is a best in class low profile multilayer organic passive device that is based on AVX s patented multilayer organic high density interconnect technology. The MLO diplexer uses high dielectric constant and low loss materials to realize high Q passive printed elements such as inductors, and capacitors in a multilayer stack up. The MLO diplexers can support multiple wireless standards such as WCDMA, CDMA, WLAN, GSM, GPS and BT. These diplexers are less than 0.5mm in height and are ideally suited for band switching for dual band systems. All diplexers are expansion matched to printed circuit boards thereby resulting in improved reliability vs. ceramic and Si components. TR Packaging Tape & Reel Bottom View APPLICATIONS Multiband applications including WiFi, WiMax, GPS, and cellular bands LAND GRID ARRAY ADVANTAGES Inherent Low Profile Excellent Solderability Low Parasitics High Heat Dissipation COMPONENT DIMENSIONS AND FUNCTIONS 0.20± ± ± ±0.10 (0.008±0.004) (0.012±0.004) (0.025±0.002) (0.009±0.005) ±0.20 (0.035±0.008) 0.04± ± ±0.10 (0.002±0.002) 0.06±0.10 (0.050±0.008)(0.014±0.004) (0.002±0.004) 0.51± ±0.10 (0.020±0.002) 0.95±0.05 (0.010±0.004) (0.037±0.002) Side Side View 0.15± ± ± (0.006±0.001) 0.55±0.10 (0.018±0.004) (0.020±0.002) 0.20± ± ±0.10 (0.022±0.004) (0.008±0.004) (0.017±0.004) (0.008±0.004) 2.12± ±0.20 (0.065±0.008) (0.083±0.008) Unit: mm (inches) Unit: mm (inches) Terminal No. Terminal Name 1 GND 2 Common 3 GND 4 Low Frequency Port 5 GND 6 High Frequency Port PART NUMBER: DP03C1580TTR GPS/WLAN Electrical 25ºC Low-Band Parameter Freq. Spec Typ. Unit 25ºC max 0.3 db Insertion Loss max 1.0 db max 1.0 db max VSWR max max Isolation min 16 db min 20 db min 30 db min 30 db Attenuation min 30 db min 22 db min 22 db High-Band Parameter Freq. Spec 25ºC Typ. Unit max 0.70 db max 0.55 db Insertion max 0.45 db Loss max 0.20 db max 0.35 db max 0.30 db max max VSWR max max max max Isolation min 28 db min 25 db db Attenuation db db 1

2 S PARAMETER MEASUREMENTS LOW BAND PORT ATTENUATION HIGH BAND ATTENUATION Low-Band Attenaution High-Band Attenaution LOW BAND INSERTION LOSS HIGH BAND INSERTION LOSS Low-Band Insertion Loss High-Band Insertion Loss

3 S PARAMETER MEASUREMENTS COMMON PORT RETURN LOSS ISOLATION Common Port Return Loss LOW BAND RETURN LOSS Isolation HIGH BAND RETURN LOSS Low-Band Return Loss High-Band Return Loss

4 Temperature Multilayer Organic (MLO TM ) AUTOMATED SMT ASSEMBLY The following section describes the guidelines for automated SMT assembly of MLO TM RF devices which are typically Land Grid Array (LGA) packages or side termination SMT pacages. Control of solder and solder paste volume is critical for surface mount assembly of MLO TM RF devices onto the PCB. SMT REFLOW PROFILE Common IR or convection reflow SMT processes shall be used for the assembly. Standard SMT reflow profiles, for eutectic and Pb free solders, can be used to surface mount the MLO TM devices onto the PCB. In all cases, a temperature gradient of 3 C/sec, or less, should be maintained to prevent warpage of the package and to ensure that all joints reflow properly. Additional soak time and slower preheating time Stencil thickness and aperture openings should be adjusted according to the optimal solder volume. The following are general recommendations for SMT mounting of MLO TM devices onto the PCB. may be required to improve the out-gassing of solder paste. In addition, the reflow profile depends on the PCB density and the type of solder paste used. Standard no-clean solder paste is generally recommended. If another type of flux is used, complete removal of flux residual may be necessary. Example of a typical lead free reflow profile is shown below. Tp Ramp-up tp Critical Zone TL to Tp TL Ts max t L Ts min ts Preheat Ramp-down 25 t 25ºC to Peak Time Figure A. Typical Lead Free Profile and Parameters Profile Parameter Pb free, Convection, IR/Convection Ramp-up rate (Tsmax to Tp 3ºC/second max. Preheat temperature (Ts min to Ts max) 150ºC to 200ºC Preheat time (ts) seconds Time above TL, 217ºC (tl) seconds Peak temperature (Tp) 260 C Time within 5ºC of peak temperature (tp) seconds Ramp-down rate 4ºC/second max. Time 25ºC to peak temperature 6 minutes max. 4

5 RECOMMENDED PAD LAYOUT 0.28 (0.011) All dimensions are in mm (inches) unless otherwise specified. 5