The CMS Silicon Strip Tracker Overview and Status

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1 Overview and Status 1.Physikalisches Institut B, RWTH Aachen DCMS Meeting Hamburg, January 20th, 2006

2 Overview Requirements for tracking at the LHC Expected performance of the CMS tracker The design of the CMS silicon strip tracker Experience from mass production and detector integration Challenges and issues Measurements, e.g. from test beam experiments and integration Some bias towards end caps (German contribution) 2/43

Silicon Strip Detectors Reverse biased diode MIP ionizes detector material: 24000 e in 300 m of silicon Electric field electrons and holes drift

3 Silicon Strip Detectors Reverse biased diode MIP ionizes detector material: e in 300 m of silicon Electric field electrons and holes drift to electrodes Segmented p implants in n type bulk spatial information AC coupled read out of induced charge Signal amplification and shaping 3/43

4 Silicon Strip Detectors First silicon strip detector: NA11 in 1983: 5 m spatial resolution Comparison of some silicon strip detectors: 4/43

5 The Large Hadron Collider (LHC) P5 : e l u d e h 07 c s 0 l 2 in c ia i s f f n O io s i l l o c t s Fir 5/43

2007 10pb 1 { 2008 5 10fb 1 05 0 2 r be m

6 pb 1 { fb r be m e ec D ), s R n D a Ev ysics T (L. Ph S CM ;

Tracking Requirements at the LHC Bunch spacing of 25ns fast detector response to resolve bunch crossings High luminosity (2 1033 1034 cm 2 s 1) up to 20 minimum bias and 1000 charged particle per

7 Tracking Requirements at the LHC Bunch spacing of 25ns fast detector response to resolve bunch crossings High luminosity ( cm 2 s 1) up to 20 minimum bias and 1000 charged particle per bunch crossing high detector granularity to keep occupancy low and resolve nearby tracks Good momentum resolution for low and high pt tracks High track reconstruction efficiency Ability to tag b jets and identify B hadrons and 's good impact parameter resolution Unprecedented irradiation level radiation hardness Small amount of material in front of electromagnetic calorimeter Cost Risk of failure (preference for known industrial technologies) Major design change in the CMS tracker in 1999 Multi strip gas chambers (MSGCs) dropped in favour of all silicon tracker 7/43

7m 4m About 200m2 of active silicon area 1440 pixel modules with 66 million pixels 15148 silicon

8 The CMS Tracker Outer barrel TOB Pixel End cap TEC Inner barrel TIB Inner disks TID 2.4m Support tube 5. 4 OPAL jet chamber m 3.7m 4m About 200m2 of active silicon area 1440 pixel modules with 66 million pixels silicon strip modules with 10 million strips Operating temperature < 10º C to minimize radiation damage (max. dose for strip tracker after 10 y 1.6 x1014 n(1mev) / cm2) 8/43

9 The CMS Pixel Detector Start with 2 barrel layers in 2008 (r = 4.4 cm & 7.3 cm) Add 3. barrel layer later (r = 10.2cm) Two turbine like endcap disks side m 53 c Active area 1m2 66 million pixels Pixel size: 100 m (r ) x 150 m (z) Charge sharing due to large Lorentz angle (23 ) + analog readout spatial resolution 10 m in r, 20 m in z 2 3 high resolution 3d measurement points 9/43

10 Schematic cross section of one quarter of the tracker: TOB: 6 layers 5208 modules single sided modules double sided modules (stereo angle = 5.7 ) position information along the strips r { thick sensors: 500 m high resistivity thin sensors: 320 m low resistivity { interaction point TIB: 4 layers 2724 modules z TID: 2 x 3 disks 816 modules TEC: 2 x 9 disks 6400 modules 10/43

11 Tracker Material Budget Conversion probability for photons almost 50% Material budget dominated by services 11/43

Performance of the CMS Tracker # of hits per track in the strip tracker: total number of hits total number of double sided hits double sided hits in thin detectors double sided hits in thick

12 Performance of the CMS Tracker # of hits per track in the strip tracker: total number of hits total number of double sided hits double sided hits in thin detectors double sided hits in thick detectors At least 10 measurement points, except for region between barrel and end cap Transverse momentum resolution for muons with pt = 1 GeV, 10 GeV, 100 GeV: Resolution dominated by tracker lever arm Barrel: resolution of 1.5% for pt=100 GeV 12/43

13 Performance of the CMS Tracker Transverse impact parameter res. for muons with pt = 1, 10, 100 GeV: Longitudinal impact parameter res. for muons with pt = 1, 10, 100 GeV: Dominated by hit resolution and, for pt < 10 GeV, multiple scattering For tracks with pt = 100 GeV: 10 m transverse and m longitudinal impact parameter resolution 13/43

14 Comparison: the Atlas Tracker 2.2m 7m Pixel: B=2T (pt)/pt 2 x [ (pt)/pt]cms 3 barrel layers, 2 x 3 disks three 3 d space points for 98% of tracks Spatial resolution 12 m in r, 60 m in z Semi conductor tracker (SCT): 2 4 barrel layers, 2 x 9 disks; 4088 modules, 61m All modules are double sided (2.3 ) Transition radiation tracker (TRT): drift tubes; spatial res. from drift time: 170 m per straw Continuous tracking ( > 30 hits per track), low cost, less material per point Electron/pion separation Concerns: occupancy, speed (maximal drift time: 40ns) ce n a er! m r k o c f a r e tr p S g n M i C k c o a Tr ilar t sim 14/43

15 The CMS Silicon Strip Modules 1 or 2 silicon sensors support frame graphite and carbon fiber (CF) front end (FE) hybrid 10cm direction of strips Kapton circuit wire bonds delivers bias voltage back plane isolation thermistors 15/43

16 The CMS Silicon Strip Modules Module design optimised for geometrical coverage, radiation hardness & cost 27 different module types: r < 60cm: 320 m thin low resistivity sensors (lower depletion voltage after irradiation); shorter strips (occupancy) r > 60cm: longer strips (cost); 500 m thick (high resistivity) sensors to maintain signal / noise 1 or 2 silicon sensors 512 or 768 strips rectangular sensors in the barrel, wedge shaped sensors on the disks ules ; d o f m caps) o s ype in end t 4 s: a l l, 3 t e r A r ba ick h n t i (1 m 5 8 all 2 16/43

17 Design of the CMS Silicon Sensors Single sided sensors with p+ type strips in an n type bulk 6" wafer technology (Atlas: 4") AC coupled readout Pitch ranges from m Constant width/pitch ( constant strip capacitance) Readout strip and guard ring geometries optimised to increase breakdown voltage 17/43

18 Design of the CMS Silicon Sensors 18/43

Silicon Sensor Production 24 244 silicon sensors have been delivered by two companies: 320 m thick sensors by Hamamatsu Photonics K.

19 Silicon Sensor Production silicon sensors have been delivered by two companies: 320 m thick sensors by Hamamatsu Photonics K.K. (HPK); 500 m thick sensors: 96% by HPK and 4% by ST Microelectronics (STM) STM HPK CERN distribution quality control 5%: IV, CV, pinholes, Istrip, Rpoly, Ccoup,... 1% 5% radiation tests (p, n) process control longterm behaviour module production Many problems with STM sensors encountered, e.g.: Electrochemical changes (corrosion) on bias and guard rings after few hours in high humidity quality test of 100% of STM sensors necessary, long term behaviour and evolution unknown bulk of production of thick sensors was transferred to HPK Sensor production is completed! 19/43

20 The Front end Hybrid 4 layer Kapton substrate (flex) laminated onto ceramic carrier 4 or 6 APV25 readout chips radiation hard commercial 0.25 m CMOS technology 128 strips per APV, multiplexed to one analog output per channel: pre amplifier, CR RC shaper, 4.8 s pipeline memory 2 readout modes: Peak mode: 1 sample ( ns) Deconvolution mode (high lumi): weighted sum of 3 samples: 25ns better bunch crossing identification, but higher noise Detector Control Unit (DCU) 12 bit ADC 8 channels: hybrid and sensor 2:1 Multiplexer 2 APVs multiplexed to one readout channel temperatures low voltages leakage current PLL chip decodes clock & trigger signals 20/43

21 Why to use analog readout? CMS: analog readout information on deposited charge + Multi strip clusters: center of gravity method leads to improved position resolution + de/dx measurement (?) Larger data volume Needs analog optical* links (not standard few years ago) Atlas: binary readout only hit/no hit information Strip with charge above adjustable threshold fires discriminator on front end chip + Reduced data volume (cost effective) + Works with standard digital optical links Spatial resolution = pitch/ 12 (pitch=80 m (r )=23 m) Thresholds, discriminator, noise must be well controlled *Advantage of optical readout: low mass, no electrical pick up 21/43

Front end Hybrid Production Very long R & D phase with many different technologies developed in parallel

.. 2003 technology choice & start of mass production Flex circuits produced by Cicorel SA, assembly done by

22 Front end Hybrid Production Very long R & D phase with many different technologies developed in parallel Problems: flatness ( assembly), rigidity ( bonding), thermal exp. coeff. mismatch, feature size technology choice & start of mass production Flex circuits produced by Cicorel SA, assembly done by Hybrid SA Several problems during production phase, e.g.: 100 m vias developed bad contact solved by improved design (8 months delay) old design bad via old design good via new design good via Kapton glue Kapton glue Kapton { Kapton glue Kapton 100 m Finally a production rate of hybrids/week was achieved Production nearly completed 22/43

23 Module Production: Assembly Module assembly = precision gluing of sensor(s) and hybrid to the support frame modules need to be assembled with high precision: e.g. maximum allowed deviation in coordinate strips: 65 m, coordinate strips: 39 m fully automatic pick and place robots: gantry 9 m 8 m 6 gantries in operation Issues: precision, calibration 99% of modules are within specification Throughput: up to 20 modules / gantry / day Vienna Brussels Lyon Perugia Bari UCSB FNAL Vienna Brussels Lyon Perugia Bari UCSB FNAL y(measured) y(nom.) ( to strips) x(measured) x(nom.) ( to strips) 23/43

Module Production: Wire Bonding 23 automatic commercial wire bonding machines (AC 1B/3B, KA, HH) Throughput: > 5 modules / machine / day Readout tests before

24 Module Production: Wire Bonding 23 automatic commercial wire bonding machines (AC 1B/3B, KA, HH) Throughput: > 5 modules / machine / day Readout tests before and after bonding Pull tests to monitor bond strength 5g Counts Mean force [g] 20% Counts Sigma/mean of pull force Mean force [g] Sigma/mean of pull force 24/43

Module Production Status Excellent module quality: typically 1 3 of bad strips per module However: backplane contact (conductive epoxy glue) not reliable

25 Module Production Status Excellent module quality: typically 1 3 of bad strips per module However: backplane contact (conductive epoxy glue) not reliable (TOB, TEC) "Retro fitting" of significant number of modules ongoing In total, 90% of modules are built End of module production expected for spring /43

Readout and Control Architecture Readout: analog optical link FE hybrid opto electrical conversion AOH optical link I2C protocol front end 10 bit ADC (Front End

26 Readout and Control Architecture Readout: analog optical link FE hybrid opto electrical conversion AOH optical link I2C protocol front end 10 bit ADC (Front End Driver) back end trigger clock control chips on substructures DOH Front End Controller Trigger, clock, control signals: digital optical link (token ring implementation) 26/43

27 Modularity in the Tracker TIB/TID: modules are mounted directly onto half shells and carbon fiber ring structures TOB: modules are assembled onto "rods", rods are mounted into the "wheel" TEC: modules are assembled onto carbon fiber "petals", petals are mounted into the end caps Advantage of TOB/TEC approach: single substructures can be exchanged during shutdowns Disadvantage: no access to modules once substructures are integrated into wheel / end cap 27/43

28 Example: TEC Petal production ca. 400 assembly pieces of 32 diff. types: "bridges", 288 petals to be built until mid 2006 washers, screws, distance pieces up to 28 silicon modules up to 10 different types bare petal up to 28 AOHs up to 13 types frame + Kapton strip hybrid + pitch adapter sensor petal mechanics motherboards (ICBs) 28/43

Petal Mechanics & Electronics Mechanical petal structure: petal body with inserts

Modules mounted on 4 aluminum precision inserts (precision of thread positions: 5 m)

pipe (coolant: C6F14) Motherboards (InterConnect Boards, ICB): "Backbone" of the petal:

29 Petal Mechanics & Electronics Mechanical petal structure: petal body with inserts Honeycomb structure with CF skins: light but stiff (developed and built in AC 1B) Modules mounted on 4 aluminum precision inserts (precision of thread positions: 5 m) Modules cooled to T < 10 C (revearse annealing) via 7m long thin walled titanium cooling pipe (coolant: C6F14) Motherboards (InterConnect Boards, ICB): "Backbone" of the petal: 6 layer PCBs ICBs are developed, tested and mounted in AC 1B Petal production until February /43

Petal Assembly Two petal types: front and back petals front side of a front petal

overlap in the radial direction, modules overlap in R7 R5 R3 R1 Mounting of optical

30 Petal Assembly Two petal types: front and back petals front side of a front petal Modules are mounted on both sides of the petals in (up to) 7 radial rings Rings overlap in the radial direction, modules overlap in R7 R5 R3 R1 Mounting of optical converters (AOHs), routing of fibers, functional test (HH) Assembly of modules and functional test (7 prod. lines in 5 centers, AC 3B & KA) Difficulties: handling application of thermal grease Achieved assembly rate: > 2 petals / week / production line 30/43

31 Petal Longterm Test "Burn in" of components & connections at level of petal 6 cooling cycles between room temp. and 20 C 3 days in total In depth qualification of petals Grading Quality of petals produced is very good: 1 3 of bad strips Norm. common mode subtracted noise of all modules of 1 petal: 49 petals warm cold Status: 5 lines operational with a capability of 1 petal / setup / week 100 / 300 petals already longterm tested Rework of 30 (?) petals because of back plane contact 31/43

32 Petal Performance May 2004 test beam setup: 1 front and 1 back petal ( 1% of the TEC), operated at CMS temperature ( 10 C) 320 m thick 500 m thick S/N > 19 for all rings at CMS operating temp. Decrease by at most 25% due to radiation damage S/N > 10 guarantees hit finding efficiency above 95% and low fake rate Peak ( =50ns) cold Peak ( =50ns) warm Deconv. ( =25ns) cold Deconv. ( =25ns) warm Variation between rings as expected from capacitance Agrees within 17% with expectation from APV noise Noise about 10% smaller at CMS operating temp. Peak cold Peak warm Deconv. cold Deconv. warm 32/43

Tracker Outer Barrel (TOB) Rod Production Modules mounted onto 688 rods 100% of rod frames produced 3 single or double sided modules per side Redesign of motherboards due to electrical problem Rod

33 Tracker Outer Barrel (TOB) Rod Production Modules mounted onto 688 rods 100% of rod frames produced 3 single or double sided modules per side Redesign of motherboards due to electrical problem Rod assembly & 1 2 days longterm test Motherboard at Fermilab & UCSB 1.1m CF frame (rod) Status: Rod assembly delayed by problems with module bias contact & motherboard redesign About 30 production rods assembled and shipped to CERN Rod assembly much easier than petal assembly Expected production rate: 4 rods assembled & longterm tested per day and site all TOB rods can be built within 4 5 months 33/43

TEC Integration Overview 8 petals mounted on each side

mechanical structures built by AC 1B, precision (CERN

(KA) One end cap ("TEC+": +z direction) to be integrated

34 TEC Integration Overview 8 petals mounted on each side of the carbon fiber disks, 9 disks per end cap Both mechanical structures built by AC 1B, precision (CERN photogrammetry) < 200 m All optical ribbons integrated (KA) One end cap ("TEC+": +z direction) to be integrated in AC 1B Second end cap to be integrated at CERN by Lyon group 34/43

35 TEC Integration Overview front petals back petals 1 sector (=18 petals): 1 tower of back petals (9 petals) 1 tower of front petals (9 petals) Petals are integrated sector wise Integration with TEC in upright position 35/43

Integration of the First Sector During December, the first sector has

tools have been commissioned Petal insertion: tool was developed to

time consuming task: plugging of optical fibers ( 50 per petal) petal

36 Integration of the First Sector During December, the first sector has been integrated in Aachen All procedures have been validated and tools have been commissioned Petal insertion: tool was developed to handle petals safely insertion of 1 petal needs about 40 minutes most time consuming task: plugging of optical fibers ( 50 per petal) petal insertion tool petal being inserted connectivity of optical fibers 36/43

37 First TEC+ Sector Very dense environment Difficult access to fibers, no access to silicon modules In situ debugging & repair is difficult and in many cases impossible 37/43

38 First TEC+ Sector: Status System of 400 modules = 1092 optical channels = strips (half of CDF SVX II) almost fully debugged Many problems found and fixed, e.g. fibers with bad optical contact Remaining problems that are not fixable: 3 modules lost I2C access, all on ring 2 (back petals) 2 APVs are faulty the tracker will not be perfect: 1% of clustered dead strips in sector 1 (see also talk of Dirk Heydhausen) 38/43

39 First TEC+ Sector: Noise TEC integration is the first opportunity for measurements of petals in close to final environment with many final components (cables, power supplies, DAQ, grounding,...) Many system problems had to be understood and solved: Raw noise Cms noise Noise [ADC counts] Noise [ADC counts] thermal effects (pedestal drift) power supply noise DAQ problems leading to corrupted data Strip number Strip number 39/43

40 Ring number (1 7) Noise of Front Petal on disk1 Module position 40/43

Mean APV Noise Noise is uniform between petals Noise increases with ring number (= strip length) Mean noise [ADC counts] Front petals 1 8 Rin Back petals 1 8

41 Mean APV Noise Noise is uniform between petals Noise increases with ring number (= strip length) Mean noise [ADC counts] Front petals 1 8 Rin Back petals 1 8 Mean raw noise Mean cms noise 7 1 g APV number Many more measurements to come: cosmic muon runs, laser alignment tests, cold test, grounding studies,... 41/43

) of TIB+ fully integrated TIB+/TID+ shall be brought to CERN in March # of strips # of strips Single sided layers have been

42 TIB/TID Integration Strings of 3 single or double sided modules mounted on inner & outer surfaces of half shells Functional test of strings, longterm test of entire half shells Three layers (two single s., one double s.) of TIB+ fully integrated TIB+/TID+ shall be brought to CERN in March # of strips # of strips Single sided layers have been longterm tested ( 300 modules per layer): 1 of bad channels Peak mode Deconvolution mode significant tail; noise vs. strip # not shown! Noise [ADC counts] Noise [ADC counts] 42/43

Summary The CMS tracker is a very complex subdetector with many challenges Measurements performed up to now show excellent performance 90% of modules are built Integration of TIB/TID and TEC has

43 Summary The CMS tracker is a very complex subdetector with many challenges Measurements performed up to now show excellent performance 90% of modules are built Integration of TIB/TID and TEC has started, TOB integration starts in March Integration into the CMS detector foreseen for early 2007 On time delivery of the tracker seems still possible Looking forward to do interesting physics with a performant tracker ~ ~ 02 Z /43

The CMS Silicon Strip Tracker Overview and Status

The CMS Silicon Strip Tracker Overview and Status Overview and Status 1.Physikalisches Institut B, RWTH Aachen Seminar über Teilchen und Hadronenphysik, Bonn, 26. Januar 2006 Overview Requirements for tracking at the LHC & expected performance of the