Fieldlab Multi-material 3D Printing 3D printed structural electronics at TNO AMSYSTEMS Center

Transcription

1 Fieldlab Multi-material 3D Printing 3D printed structural electronics at TNO AMSYSTEMS Center Dr. Wijnand Germs

2 3DP STRUCTURAL ELECTRONICS DEMO STATUS TODAY

3 3DP STRUCTURAL ELECTRONICS DEMO STATUS TODAY 0.8 Mbps data 8Mhz microcontroller SOIC8 Direct SMD component embedding 3V Coin Cell RGB LED with integrated driver Demonstrator parts made in high resolution printing, with embedded electronic components.

4 3DP STRUCTURAL ELECTRONICS IN SLA

5 3DP STRUCTURAL ELECTRONICS IN SLS Conductive tracks printed on a 3D printed PA12 (SLS) part

6 3DPSE - NEW PARADIGM Conventional manufacturing is tailored to short (fat) tail product groups. 3DPSE can address long tail portfolios with decreased costs.

7 3DPSTRUCTURAL ELECTRONICS: ADVANTAGES Free form Reducing size (connectors) Potential to incorporate micro-systems PCB less design Light weight Graded functionalities Small series Personalisation at unit level No product specific tooling New functionalities, e.g. Smart products (IoT) Thermal management integration (microfluidic cooling) High level of complexity: makes reverse engineering difficult

8 3D FUNCTIONALITY

9 AVAILABILITY OF SE IN THE MARKET Combining Fused Deposition Modeling (FDM) and conductive ink printing Very suitable for prototyping How to make the step from prototyping towards manufacturing? There are still many challenges

10 3DPSTRUCTURAL ELECTRONICS: BUILDING BLOCKS Key drivers: materials Functional materials : Conductive (elec/temp), semi conductive, resistive, MEMS, sensor Structural Materials: Compliant with electronic applications/ benchmark PCB properties Reliability and long term stability Certification Key drivers: process Integration of conductive structures, thermal management structures. Integration of electronics (actives/passives/batteries). Integration of Optics/MEMS/Fluidics. Key drivers: tools Novel 3D printing tools. Pick and place on non conventional surfaces. First time right manufacturing solution (Metrology, Process control, Machine learning).

11 HOW WE WANT TO MAKE THE DIFFERENCE Advanced AM equipment Industrial partners

12 RUNNING PROJECTS FIELDLAB MULTIM3D 3D Printing with integrated electronics for Lighting Stereolithography (SLA)

13 ONGOING & FUTURE RESEARCH Demonstrators Fluidics Optics Sensors Actuators Start of EU Project Hybman in April

14 RUNNING PROJECTS Smart exoskeletons Selective laser sintering This project has received funding from the European Union s Horizon 2020 research and innovation programme under grant agreement No

15 RUNNING PROJECTS - PRINTVALLEY 2020 Brainport Industries Campus Continuous SLS Smart build chambers Local temperature control Local layer height control Multi-material integration with SLS Structural Electronics Multi-powder SLS Design started Sept 2016

16 3DP STRUCTURAL ELECTRONICS PRINCIPLE Printing object with cavities (& channels) Pick & place components Direct write conductive tracks Continue printing of the object The fabrication freedom offered by 3D printing techniques, such as stereolithography and fused deposition modeling have recently been explored in the context of 3D electronics integration referred to as 3D structural electronics or 3D printed electronics Eric MacDonald et al, 3D printing for the rapid prototyping of structural electronics, IEEE Access, Volume 2, ,March 2014

17 ANALYSIS Cross sectional analysis of component / track interface

18 3DP STRUCTURAL ELECTRONICS IN SLS Conductive tracks printed on a 3D printed PA12 (SLS) part

19 ONGOING & FUTURE RESEARCH (1) Tool integration, automation Mechanics & control Pick & place Integrated multi CAD workflow Yield Speed Hausdorff based template matching Adaptive track design

20 ONGOING & FUTURE RESEARCH (2) Reliability Resolution & accuracy Non-flat surfaces Material developments Conductivity (Electrical and thermal) Structural properties

21 ONGOING & FUTURE RESEARCH (3) Thermal management Convection & conduction Thermal conductivity = 0,2 W/m.K Heat capacity = 1500 J/kg.K ATMega32U4 8bit RISC 16 MIPS 0.1 W SOURCE SIMULATION, TC = 0,2 W/M.K

22 THE NEXT STEP How to make the step from prototyping towards manufacturing? How long will this take? What is the risk? Depends on: The product THE TEAM - ECOSYSTEM

23 HOW LONG WILL IT TAKE AN EXAMPLE Three years from start to FDA approved resins 3D Printen in de Dentale wereld

24 THE NEXT STEP How to make the step from prototyping towards manufacturing? How long will this take? What is the risk? Depends on: The product THE TEAM - ECOSYSTEM

25 PROGRAM 3DP STRUCTURAL ELECTRONICS We invite you to participate in our program Key partners:

26 ACKNOWLEDGMENTS Program manager : Dr. Wijnand Germs Team members: EU projects: Key partners: Fabien Bruning Hessel Maalderink Mathijs de Schipper John van der Werff Leon Brouwers Henk Buining Jeroen Smeltink Bas de Kruif This project has received funding from the European Union s Horizon 2020 research and innovation programme under grant agreement No

27 3D printed structural electronics at TNO AMSYSTEMS Center Dr. Wijnand Germs

28 LEPUS NEXT GEN - Hybrid technology - Composites - High resolution (20µm) - Upscalable - Fast Multi LD Illuminator head Samples printed Temperature resistant & Impact resistant SLA resin (thermal cure at >120 C!)