The Institute for Special Textiles and Flexible Materials

Transcription

1 The Institute for Special Textiles and Flexible Materials

2 Automated Manufacturing of Textiles with Integrated Electronic Components Uwe Möhring, Kay Ullrich Textile International Forum and Exhibition October 2015 Taipei, Taiwan 2

3 Outline Short Introduction of TITV Textiles and Electronics on the Market Background of Interconnection Types of Interconnection Automated Mounting of Components - Perspective of Electronics - Perspective of Textiles Summary 3

4 Short Introduction of TITV Founded Team 1992 in Greiz, Germany 60 experts (e.g. textile engineers, physics, chemistry, medical engineering, electro technology) Funded research projects approx. 25 p.a. - BMBF (growth cores, supporting programmes) - BMWi (IGF-AiF, Inno-Watt, Inno-Kom-Ost, ZIM) - EU - Federal state Tailor-made research and development activities on request of clients Topics of research - Smart textiles - Functional surfaces - Special textiles Accredited testing laboratory 4

5 Technology available at the TITV Greiz Textile Construction Special thread technology Weaving including narrow fabrics Spacer fabrics, Warp Knitting Braiding Surface technology Physical / Chemical Vapour Deposition (PVD/CVD) Modular coating, laminating Electroplating of textile materials Dying / finishing Digital printing 5

6 Technology available at the TITV Greiz Embroidery Multi-head and large-scale embroidery Special embroidery technology for the production of circuit boards and the assembly of components Laser technology Sewing technology, CAD Electronics Measurement and control technology Testing technology for smart textiles Technology for the assembly of components on textile surfaces and threads Bonding technology for textiles 6

7 Accredited testing laboratory Accredited acc. to DIN EN ISO/IEC 17025:2005 Physical tests for textiles Material testing Pollutant analysis Testing of reliability of smart textiles 7

8 Research Focus

9 Outline Short Introduction of TITV Textiles and Electronics on the Market Background of Interconnection Types of Interconnection Automated Mounting of Components - Perspective of Electronics - Perspective of Textiles Summary 9

10 Electronic Components for Luminous Textiles GERMENS; TITV Greiz FORSTER ROHNER AG Interactiv Wear AG TITV Greiz Grupo Antolino IAC Group GmbH Nike Adam Opel AG PHILIPS 10

11 Electronic Componentes for Textile Heating warmx GmbH Alpenheat Porsche AG 11

12 Electronic componentes for Textile - Human - Interaction TITV Greiz Hexoskin Wearable Body Metrics Studio (n-1) Architects Touch Glove Ally Seeley Swany BMW 12

13 Electronic Components in Textiles for Pain Therapy Bomedus GmbH PHILIPS PHILIPS TITV Greiz 13

14 Smart Textiles Market The global smart textile market was estimated to be USD million in 2012 and expected to exceed USD 1,500 million by The main growth sector in the last 3 years has been in the protection and military clothing sector and it is estimated to remain the largest market segment in the next six years. Sport and fitness applications are predicted to see the fastest growth along with health and medical applications. References: What are the barriers and opportunities in the smart textiles market? 14

15 Outline Short Introduction of TITV Textiles and Electronics on the Market Background of Interconnection Types of Interconnection Automated Mounting of Components - Perspective of Electronics - Perspective of Textiles Summary 15

16 Please note the lock flag according to DIN ISO Interconnection / Assembly of Electronic Components State of the art The established connection technology is highly tailored to conventional systems and solutions, like cabling. Main application Main application at the moment is the assembly of electronic components. Challenge Extension and adaptation on textile requirements. 16

17 Please note the lock flag according to DIN ISO New interconnection technologies are necessary for textile applications Intelligent clothing (luminescent textiles, energy- and data transmission) Heating textiles (heatable fabrics, medical devices) Electronic machinery (flexible interconnections in household applications, security systems, instrumentation etc.) Automotive (integration of heating systems and miniaturized electronic components) Sports-, leisure and wellness products 17

18 Please note the lock flag according to DIN ISO Requirements - Low Cost - Time efficient - Compact design - Safe and reliable under using conditions - Permanence of the properties - Textile like properties (e.g. Flexibility) - Process capability 18

19 Outline Short Introduction of TITV Textiles and Electronics on the Market Background of Interconnection Types of Interconnection Automated Mounting of Components - Perspective of Electronics - Perspective of Textiles Summary 19

20 Please note the lock flag according to DIN ISO Types of Interconnection Crimping Piercing Winding technology Velcro / metallized burdock Snap fastener Embroidery Weaving Soldering / gluing in combination with textile processes 20

21 Please note the lock flag according to DIN ISO Types of Interconnection Crimping 4 mm Interconnection thread / wire Interconnection ELITEX-I / wire Interconnection ELITEX-I / ELITEX-I For compounds of thread-like structures and components with linear expansion is the crimping technique well suited as a base technology and ensures high reliability and effectiveness. 21

22 Please note the lock flag according to DIN ISO Types of Interconnection Crimping Interconnection thread or wire / surface For wires, cords, conductive threads and wired components the method can be regarded in principle. For interconnections in areas where both contact points are already fixed (for example stitching by Soutage-technology) there are fundamental problems. The damage of the textile by the crimping tool can not be avoided (upper and lower tool meet in a mechanical way). 22

23 Please note the lock flag according to DIN ISO Types of Interconnection Piercing Piercing: Usually in one step a cutting tip is generated by a preform, punched in the contact area and then closed at the bottom of the structure by an anvil. Used in microelectronics for embossing of connector pins, connecting flexible printed circuit boards or other conductive foil, linking between flexible and rigid circuit boards Allows the penetration of a contact in conductive (textile) areas and fits well with textile behaviour. There are conventional technologies available Machines and processes still need to be adapted for textile use. Source: Catalogue Nicomatic Interconnects only on one side 23

24 Please note the lock flag according to DIN ISO Types of Interconnection Piercing Textile bus-system with 4 conductive lines 24

25 Please note the lock flag according to DIN ISO Types of Interconnection Winding Preparation with conductive varnish winding, Cut off remains Secure the connection Winding and Wire-Wrap technology was used in automation and computer technology in the 1960s and 1980s. Corresponds very well to the conditions of conductive textile fibers (soft, gentle and flexible connection) High manual effort if any small machinery (wrap gun) is not available and high demands on the skill and practice of the performer Superseded in favor of soldering For the connection of conductive threads each other or threads with metallic strands there are almost no reliable alternatives 25

26 Please note the lock flag according to DIN ISO Types of interconnection Metallized burdock Metallized burdocks are newly developed and still an issue in research. They were originally intended for the mechanical fastening of sheet metal parts for quick assembly. Two-piece construction similar to Velcro (hook and loop), but much more stable than Velcro source: Christoph Hein The hooks (about 2 mm in height) reach into the metallic Velcro. By pressing the two joint partners they get hooked up there. 26

27 Please note the lock flag according to DIN ISO Types of Interconnection Velcro Interconnection between conductive surfaces < 0,5 W 2 27

28 Please note the lock flag according to DIN ISO Types of Interconnection Snap Fastener Embroidery / weaving of conductive area for attachment of snap fasteners Therapy glove for electromyostimulation conductive yarn ELITEX 235 dtex / ELITEX 110 dtex x 2 is used 28

29 Please note the lock flag according to DIN ISO Type of Interconnection - Weaving Textile Circuits Woven Circuits Woven textile multilayer structure for a RFID antenna Integration of circuit layout source: 29

30 Please note the lock flag according to DIN ISO Types of Interconnection Embroidery 30

31 Please note the lock flag according to DIN ISO Types of Interconnection Embroidery Various layouts 31

32 Please note the lock flag according to DIN ISO Types of Interconnection Embroidery Textile Circuits Embroidered Circuits Sample measuring of skin resistance by textile electrodes measuring of skin temperature by common electronic devices 32

33 Outline Short Introduction of TITV Textiles and Electronics on the Market Background of Interconnection Types of Interconnection Automated Mounting of Components - Perspective of Electronics - Perspective of Textiles Summary 33

34 Pick and Place Technique for Electronic Components on Textiles Standard machines in the electrical industry Optical recognition Accuracy Reproducibility Textile has different dimensions Defined shapes flexibility Textile handling Reel to reel 34

35 TITV s Pick and Place for Textile Ribbons Realized ribbon handling Mounting on textile substrate Cutable Easy assembly into textiles 35

36 Outline Short Introduction of TITV Textiles and Electronics on the Market Background of Interconnection Types of Interconnection Automated Mounting of Components - Perspective of Electronics - Perspective of Textiles Summary 36

37 Pick and Place and Embroidery Mounting Devices and interconnection by using solder / conductive glue at a embroidery machine From the vision To our solution solutions for mounting devices on textile fabrics 1. Integrating pick and place 2. Using standard embroidery technology Tajima TCWM TRIPPLE-QUATTRO 37

38 Pick and Place and Embroidery Mounting devices on textile fabrics using 4 different heads 1. Embroidery with conductive thread material 2. Dispensing of solder 3. Pick and Place of components 4. Hot air / laser soldering 5. Functionality test Embroidery- head 38

39 Pick and Place and Embroidery 1. Embroidery with conductive thread material 2. Dispensing of solder 3. Pick and Place of components 4. Hot air / laser soldering 5. Functionality test Dispenser-head 39

40 Pick and Place and Embroidery 1. Embroidery with conductive thread material 2. Dispensing of solder 3. Pick and Place of components 4. Hot air / laser soldering 5. Functionality test Pick and Place-head 40

41 Pick and Place and Embroidery 1. Embroidery with conductive thread material 2. Dispensing of solder 3. Pick and Place of components 4. Hot air / laser soldering 5. Functionality test Laser-head 41

42 Pick and Place and Embroidery Mounting devices on textile fabrics is a combination of electronic and textile technology. 1. Embroidery with conductive thread material 2. Dispensing of solder 3. Pick and Place of components 4. Hot air / laser soldering 5. Functionality test 42

43 Outline Short Introduction of TITV Textiles and Electronics on the Market Background of Interconnection Types of Interconnection Automated Mounting of Components - Perspective of Electronics - Perspective of Textiles Summary 43

44 44 Mounting components Sequin Technology

45 Functional Sequin Device Technology Functional Sequin Device - FSD 45

46 FSD - Functional Sequin Device Technology Mounting devices on textile fabrics using 1 head and 1 process step 1. Fixation of sequins including the component with normal thread 2. Interconnection with conductive thread 3. Functionality test 46

47 FSD - Functional Sequin Device Technology 1. Fixation of sequins including the component with normal thread 2. Interconnection with conductive thread 3. Functionality test 47

48 FSD- Functional Sequin Device Technology 1. Fixation of sequins including the component with normal thread 2. Interconnection with conductive thread 3. Functionality test 48

49 Outline Short Introduction of TITV Textiles and Electronics on the Market Background of Interconnection Types of Interconnection Automated Mounting of Components - Perspective of Electronics - Perspective of Textiles Summary 49

50 Pick and Place machine with textile handling Investment: Industrial Benefits: Flexibility: Machine Additional module for textile handling (prototype) Optical recognition is a challenge Quantity and quality Very high due to a variety of components many textile substrates (thread, ribbon, fabric) 50

51 Pick and Place with an embroidery machine Adaptation of Pick and Place in to textile machines Investment: Industrial Benefits: Flexibility: Novel embroidery head (prototype) Software modification Combination of two effective technologies For large-scale circuit boards Very high due to a variety of components Modular expandable 51

52 Conventional Embroidery Machine to mounted electronic Components Use of components mounted to FSD`s Investment: Industrial Benefits: Flexibility: processing head with minimal modifications depending of the embroidery machine First applications deducible Standard textile process Lower (one component on FSD reel) Quick exchangeable FSD reel 52

53 Thank you for your attention! We clear the way for the automated manufacturing of textiles & electronics! Textilforschungsinstitut Thüringen Vogtland e. V. (TITV) Zeulenrodaer Straße Greiz Phone.: +49 (0) Fax: +49 (0) u.moehring@titv-greiz.de 53

54 Trade Fair For All Funktional Textiles mtex + 6 th International Trade Fair For Technical Textiles 31. May to 02. June 2016 Chemnitz, Germany 54