Silicon Tracking System Status of Development
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1 Silicon Tracking System Status of Development Johann M. Heuser, CBM Collaboration Meeting, Dresden, STS Workgroup Activities Workshop on Silicon Detector Systems Detector Concept & Status of Simulations Beginning Prototyping of Detector Components Work Packages, R&D Cooperations, Project Planning I [µa] J.M. Heuser STS Development 1 U[V]
2 STS Workgroup Goal: Follow up and discuss regularly the different activities on the STS, both simulations and hardware projects. Weekly meetings: Thursdays afternoon at GSI and via Video Conferencing System (EVO). Please participate! Mailing lists: Workgroup web pages on CBM_Wiki: STS J.M. Heuser STS Development 2
3 Workgroup Meetings 2007 Thursdays 14:00-16:00 O O O O Goal: Regular joint meeting ~ (bi)monthly with the MVD Workgroup, now active at Frankfurt Univ. To be put into practice! J.M. Heuser STS Development 3
4 Workgroup meeting one week ago J.M. Heuser STS Development 4
5 Workshop on Silicon Detector Systems for the CBM experiment GSI, April 18-20, 2007 www-aix.gsi.de/conferences/cbm_si_2007 Goal: "Review the concepts of STS and MVD, assess studies on their expected performance, develop strategies for detector R&D and system prototyping." CBM overview talks Presentations from other FAIR groups (PANDA, Nustar) Presentations from external experts. More than 80 participants. Discussions, input, important event. Base for continued/new activities. More (focused) workshops planned. J.M. Heuser STS Development 5
6 J.M. Heuser STS Development 6
7 STS Concept Layout studies Performance evaluation Realistic sensors, support, material Detector system R&D J.M. Heuser STS Development 7
8 Where are we? Open questions Insight that the minimal detector system of earlier studies has been far too idealistic and insufficient: 6 tracking/vertexing stations 2 vertexing + 8 tracking stations GEANT silicon discs + digitized sectors realistic detector stations made from microstrip/pixel detectors. Microstrip sensors optimized. Tracking algorithms optimized. Gaps and support structures added. Material budget studied. Tools created: e.g. (STS) event display Realistic setup in CbmRoot Aug07. detailed presentation by R. Karabowicz In particular: What material budget per tracking or vertexing station is really realistic? And tolerable for physics? "Microscopic" details important : Microstrips: Signal creation, strip cluster formation when do we win in spatial resolution, when do we loose due to high occupancy. Are pixel detector stations required in the upstream STS? Station design not yet optimal: too many channels in outer regions. To be addressed in simulation studies and hardware R&D J.M. Heuser STS Development 8
9 Hits per unit area in MVD + STS stations MVD STS STS all STS stations too granular (plot: I. Kisel) J.M. Heuser STS Development 9
10 Beginning Detector Prototyping Mechanical design study at ITEP Microstrip detectors at GSI-CIS Microstrip detectors at MSU Microcables from Kharkov Mechanical module support/ testing station from Kiev J.M. Heuser STS Development 10
11 Mechanical Design Study CAD conceptional study, S. Belogurov et al., ITEP, Fall 2006 Two options for microstrip detector modules considered then. Study finalized with one particular readout cable option. Starting point for our beginning R&D on the detector system. Iterations when more details on sensors/components are known. J.M. Heuser STS Development 11
12 Microstrip detector prototype, GSI-CIS, 8/2007 4" wafer CBM01, 285 µm Si Test sensors Double-sided, single-metal, strips, orthogonal, 50(80) µm pitch, size: (22 22) mm 2 Main sensor Double-sided, double-metal, 1024 strips per side, 50 µm pitch, 15º stereo angle, full-area sensitive, contacts at top + bottom edge, size: mm 2 Presentation by L. Long, CIS, on this project and new developements J.M. Heuser STS Development 12
13 CBM01 detectors, 8/2007 GSI CIS Erfurt J.M. Heuser STS Development 13
14 Characterization CBM01 (I) Current-Voltage on-wafer CIS, July 2007 "low voltage range" "find breakdown voltage" I [µa] 8 of 9 are in line with specs. I [µa] ~>300V U [V] U [V] J.M. Heuser STS Development 14
![Characterization CBM01 (II) Capacity-Voltage on-wafer results @ CIS, July 2007 1/C 2 [pf -2 ] Full depletion](/docs-images/95/124909571/images/15-0.jpg "voltage: 50V. substrate ~5 kωcm. Operation at 100V or less. in line with specs: U [V] J.M.")
15 Characterization CBM01 (II) Capacity-Voltage on-wafer CIS, July /C 2 [pf -2 ] Full depletion voltage: 50V. substrate ~5 kωcm. Operation at 100V or less. in line with specs: U [V] J.M. Heuser STS Development 15
16 Characterization CBM01 "Baby" sensors I [µa] wafer 1 wafer 2 wafer 3 wafer 4 most in line with specs U [V] wafer 5 wafer 6 wafer 8 wafer 7 wafer 9 J.M. Heuser STS Development 16
17 Microstrip detector prototyping in Moscow (team M. Merkin et al., MSU) R&D program: Double-sided sensors, ~6 2 cm. n-side design p-side design Single-sided sensors produced Spring Current-voltage characteristik OK. Produced 9/2007. Not operational. Under investigation. J.M. Heuser STS Development 17
18 New MSU design à la GSI-CIS, based on discussions at MSU in 6/2007 Double-sided sensor, 6 6 cm 2, 1024 ch/side, 58 µm pitch, 7.5 stereo angle, poly-silicon biassing, 2 nd metal connection of corner region strips. J.M. Heuser STS Development 18
19 R&D on readout cable Input from V. Borshchov (State Enterprise Scientific Research Technological Institute of Instrument Engineering, Kharkov Ukraine) 2 kinds of readout cables may be needed: b) to chain sensors Sensors a) as long analog readout cables Read out electronics One thinkable option: Chain sensors with a thin cable: "daisy-chain cable" Other possibility: wire bonding. Cable lengths, line pitch: 1) sensor:cable 1:1 50 µm line pitch: Cable length limited. to <10 cm. Candidate for daisy chain cable. 2) >100 µm line pitch: L up to 56 cm. Two-layer cable, 100 µm (50 µm eff). pitch for readout. J.M. Heuser STS Development 19
20 "Daisy-chain" Cable a first sample produced V. Borshchov J.M. Heuser STS Development 20
21 Analog readout cable possible layouts? 1) Single-layer 50µm pitch 2) Double-layer 100 µm pitch (50 µm eff.) 3) Double-layer with shielding to be investigated. Insulator foam PI-40 Aluminum Polyimide J.M. Heuser STS Development 21
22 Electrical simulations (L. Long, CIS) C13 C24 C35 C12 C23 C34 C C11 C22 C33 C44 C55 Five strip lines are considered. Middle strip 1V, all other strips 0V. Cij Inter-strip capacitance represented by C23: pf/cm. Total inter strip capacitance: ~ x 2 noise load for FE electronics. J.M. Heuser STS Development 22
23 R&D on Module mechanical support Cooperation with V. Pugatch, Kiev Institute for Nuclear Physics First models of support frames for STS modules have been produced in Kiev at Aeroplast ( 2 types of support frames: A solid rectangular plate of carbon fiber, light foams (density g/cm 3 ) with small empty glass spheres, other materials with density g/cm 3. Size: (60x200) mm 2. Thickness: 1.65 mm A hollow plate with channels for cooling agent inside and a fork at its end. Size: (60x160) mm 2, relatively large thickness (3 mm). Place for Si sensor 23
24 Pick-up measurements with microcables Two samples of microcables provided by the Institute for Micro Devices micro cables lavsan Pulse generator Oscilloscope 50 Ohm + ground V. Pugatch et al V One particular configuration: 10µs 3µs 0.011V pickup signal ~ 1% J.M. Heuser STS Development 24
25 Quality assurance setup for Si detectors Goal: Laser test stand for detector module characterization XY scanning table, microscope, LabView control software V. Pugatch et al. 25
26 Towards a Project Planning and Milestones Milestones now phase I until mid 2008 sensor design sensor production CBM01 CBM01-Baby CBM01-Baby sensor tests CBM01 sensor tests CBM01 sensor laser/source tests cosmic tests beam tests N-XYTER test board N-XYTER production FEB/ROC design + production FEB/ROC readout system firmware + controls + analysis software r/o cables, module mechanics CBM-XYTER design STS mechanical support CBM DAQ phase II until 2010 CBM0x sensor design + production + test CBM0x prototype detector module ("ladder") CBM-XYTER test board CBM-XYTER FEB/ROC phase III until 2011 prototype silicon tracking system - beam test Technical Design Report J.M. Heuser STS Development 26
27 Translated into tasks Draft (I) J.M. Heuser STS Development 27
28 Translated into tasks Draft (II) J.M. Heuser STS Development 28
29 R&D projects ongoing, approved or proposed find partners, funding, establish work packages, explore technologies GSI-launced R&D cooperations: e.g. GSI-Moscow State Univ. GSI-Polish Institutes GSI-Kiev Inst. for Nucl. Research International Science and Technology Center (ISTC): Project CBM Silicon Tracker (GSI, KRI St. Petersburg, MSU Moscow, IPHC Strasbourg) Details to be discussed, Dubna 11/2007 Hadronphysics2 I3 JRA: 9/2007 Proposal: Ultra-thin silicon tracking and vertex detection systems 3 sub-projects, 10 teams Low-mass silicon microstrip tracking Low-mass pixel tracking system Ultra-low mass pixel vertex detector Finnland: FAIR member, in-kind contribution to CBM with microstrip detectors. Discussions at CERN 2/2007 (J. Heuser, A. Heikkilä, J. Harkonen) Presentation at CBM_Si_2007 FAIR-BMBF-Finnland negotiations 8/07 Figure out how to make use of it. J.M. Heuser STS Development 29
30 Summary on the status of STS development Simulation of detector system on a good way. Persistent work in STS Workgroup pays off. Dedicated people essential. Detector R&D is now important. Also dedicated teams required here. Sufficient funding required. We see beginning activities here but not strong enough yet. Clear roadmap and consequent check of milestones essential. I ask the Collaboration & partners to join in a serious, strong effort. J.M. Heuser STS Development 30
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