Ultra-Fast Silicon Detector
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1 Ultra-Fast Silicon Detector Nicolo Cartiglia With INFN Gruppo V, LGAD group of RD50, FBK and Trento University, Micro-Electronics Turin group Rome2 - INFN. 1
2 Ultra-Fast Silicon Detector The 4D challenge A parameterization of time resolution The Low Gain Avalanche Detectors project Laboratory measurements UFSD: LGAD optimized for timing measurements WeightField2: a simulation program to optimize UFSD First measurements Future directions 2
3 The 4D challenge Is it possible to build a detector with concurrent excellent time and position resolution? Can we provide in the same detector and readout chain: Ultra-fast timing resolution [ ~ 10 ps] Precision location information [10 s of µm] 3
4 State-of-the-art Timing Detectors Timing detectors exploit very fast physics processes such as Cherenkov light emission or electronic avalanches to create prompt signals σ t ~ ps CMS/ATLAS σ x ~ 1-2 mm ALICE These detectors measure time very accurately but locate particles with the precision of ~ 1 mm Good timing is obtain by using a gain mechanism, either in the detector or in the electronics 4
5 State-of-the-art Position Detectors Extremely good position detectors are currently in use in every major high energy physics experiment: Millions of channels Very reliable Very radiation hard The timing capability is however limited to ~ ps σ t ~ ps σ x ~ µm 5
6 Our path: Ultra-fast Silicon Detectors Is it possible to build a silicon detector with concurrent excellent timing and position resolutions? Why silicon? It already has excellent position resolution Very well supported in the community Finely segmented Thin Light A-magnetic Small Radiation resistant But can it be precise enough? 6
7 A time-tagging detector (a simplified view) Time is set when the signal crosses the comparator threshold The timing capabilities are determined by the characteristics of the signal at the output of the pre-amplifier and by the TDC binning: σ Total 2 = σ Jitter 2 + σ Time Walk 2 + σ TDC 2 7
8 Time walk and Time jitter Time walk: the voltage value V th is reached at different times by signals of different amplitude! σ TW t = t V $ r th # & " S % Due to the physics of signal formation Due to Landau fluctuations RMS Jitter: the noise is summed to the signal, causing amplitude variations Mostly due to electronic noise Sum of noise sources σ t J = N S/t r 8
9 A parameterization of σ t σ 2 t = t 2! $ rise # & + t V 2!' * $! rise th ), " S / N # % "( S & + TDC $ bin # & + % " 12 % Jitter d: detector thickness [micron] l: pitch [micron] C: Detector capacitance [ff] Depends on the pitch and thickness N: Noise at preamp. Dominated by the voltage term S: Signal Time Walk t rise : Pre-Amp Shaping time V th : Comparator threshold Depends on the noise level TDC:Width of the TDC LSB [ps] l RMS d C Det = εε o l *l d N C Det t rise V th =10* N LSB = 20 2 (1) TDC + 0.2*4l +50 9
10 Time Resolution and slew rate Using the expressions in the previous page, we can write where: - S/t r = dv/dt = slew rate - N = system noise - V th = 10 N σ t 2 = ([ V th S/t r ] RMS ) 2 + ( N S/t r ) 2 + ( TDC bin 12 )2 Assuming constant noise, to minimize time resolution we need to maximize the S/t r term (i.e. the slew rate dv/dt of the signal) è We need large and short signals ç 10
11 Silicon Detectors Direct bias W = x p + x n = 2ε q " $ # N A + N D N A N D % 'V & p-n Junction When silicon doped p & n are in contact they generate a small depletion layer. Appling a reverse bias V, this area grows Reverse bias W 11
12 Energy deposition in Silicon Detectors A charged particle looses energy in silicon, with a mean energy of ~ 80 kev in 300 micron. The energy to create an e/h pair is 3.6 ev 80 kev/3.6 = 22,000 e/h pair è 75 e/h pair per micron 12
13 Signal formation in silicon detectors We know we need a large signal, but how is the signal formed? What is controlling the slew rate? dv dt? A particle creates charges, then: - The charges start moving under the influence of an external field - The motion of the charges induces a current on the electrodes - The signal ends when the charges reach the electrodes 13
14 How to make a good signal Signal shape is determined by Ramo s Theorem: i qve w Weighting field Drift velocity A key to good timing is the uniformity of signals: Drift velocity and Weighting field need to be as uniform as possible 14
15 Drift Velocity i qve w è Highest possible E field to saturate velocity è Highest possible resistivity for velocity uniformity We want to operate in this regime 15
16 Weighting Field: coupling the charge to the electrode i qve w Strip: 100 µm pitch, 40 µm width Pixel: 300 µm pitch, 290 µm width Bad: almost no coupling away Good: strong coupling almost from the electrode all the way to the backplane The weighting field needs to be as uniform as possible, so that the coupling is always the same, regardless of the position of the charge 16
17 Non-Uniform Energy deposition Landau Fluctuations cause two major effects: - Amplitude variations, that can be corrected with time walk compensation - For a given amplitude, the charge deposition is non uniform. These are 3 examples of this effect: 17
18 What is the signal of one e/h pair? However the shape of the signal depends on the thickness d: thinner detectors have higher slew rate i(t) (Simplified model for pad detectors) Let s consider one single electron-hole pair. The integral of their currents is equal to the electric charge, q: Thin detector è One e/h pair generates higher current in thin detectors [i el (t)+i h (t)]dt = q Thick detector t i qv 1 d d + - D + - Weighting field 18
19 Large signals from thick detectors? (Simplified model for pad detectors) Thick detectors have higher number of charges: Q tot ~ 75 q*d However each charge contributes to the initial current as: The initial current for a silicon detector does not depend on how thick (d) the sensor is: Number of e/h = 75/micron i qv 1 d i = Nq k d v = (75dq) k d v = 75kqv ~ 1 2*10 6 A Weighting field velocity d D è Initial current = constant 19
20 Thin vs Thick detectors (Simplified model for pad detectors) i(t) tr S Thin detector Thick detector dv dt ~ S t r ~ const d D Thick detectors have longer signals, not higher signals We need to add gain 20
21 The Low-Gain Avalanche Detector project Is it possible to manufacture a silicon detector that looks like a normal pixel or strip sensor, but with a much larger signal (RD50)? e/h pair per micron instead of 75 e/h? - Finely Segmented - Radiation hard - No dead time - Very low noise (low shot noise) - No cross talk - Insensitive to single, low-energy photon Many applications: Low material budget (30 micron == 300 micron) Excellent immunity to charge trapping (larger signal, shorter drift path) Very good S/N: 5-10 times better than current detectors Good timing capability (large signal, short drift time) 21
22 Gain in Silicon detectors Gain in silicon detectors is commonly achieved in several types of sensors. It s based on the avalanche mechanism that starts in high electric fields: V ~ 300 kv/cm Charge multiplication Silicon devices with gain: APD: gain SiPM: gain ~ 10 4 N ( l)= N e! l 0 b Gain: G = e α l α ( ) ( ), E = α * exp E α = strong E dependance α ~ 0.7 pair/μm for electrons, α ~ 0.1 for holes Concurrent multiplication of electrons and holes generate very high gain e h e, h ΔV ~ 300 kv/cm e, h 22
23 Low Gain Avalanche Detectors (LGADs) The LGAD sensors, as proposed and manufactured by CNM (National Center for Micro-electronics, Barcelona): High field obtained by adding an extra doping layer E ~ 300 kv/cm, closed to breakdown voltage Gain layer High field 23
24 LGADs Pads, Pixels and Strips The LGAD approach can be extended to any silicon structure, not just pads. This is an example of LGAD strips 24
25 CNM LGADs mask CNM, within the RD50 project, manufactured several runs of LGAD, trying a large variety of geometries and designs Wafer Number This implant controls the value of the gain P-layer Implant (E = 100 kev) Substrate features cm -2 HRP 300 (FZ; ρ>10 KΩ cm; <100>; T = 300±10 µm) cm -2 HRP 300 (FZ; ρ>10 KΩ cm; <100>; T = 300±10 µm) cm -2 HRP 300 (FZ; ρ>10 KΩ cm; <100>; T = 300±10 µm) 7 (---) PiN Wafer HRP 300 (FZ; ρ>10 KΩ cm; <100>; T = 300±10 µm) Expected Gain No Gain 25
26 Laboratory Hardware CV system Keithley 2410 Agilent E4980A DUT Laser λ = 1064 nm (MIP) λ = 400 nm (Alpha) Picosecond diode Laser DUT LeCroy 625Zi QV System Keithley
27 Acquisition system Labview controlled acquisition system. It allows selecting the type of measurement and fully automatized operation. Tabs to select the measurementes I - V C - f C - V Q - V 27
28 Doping profile from CV measurement - I N = Doping 2 ( ) qε 0 ε r A d 2 1/C2 dv 1 C = 1 2 N ( 2 )*V A 2 qε 0 ε r Doping profile No-gain sensor 28
29 Doping profile from CV measurement - II 1 C = 2 2 A 2 qε 0 ε r N *V Doping profile This bump creates the high field needed for the gain Gain sensor Ideal doping profile 29
30 Signal amplitude Using laser signals we are able to measure the different responses of LGAD and traditional sensors Reference sensor Gain ~ 10 30
31 Gain The gain is estimated as the ratio of the output signals of LGAD detectors to that of traditional one The gain increases linearly with Vbias (not exponentially!) 800V 400V ~2 Digitizer 2 sensors Laser split into 2 Gain ~ 20 Gain ~ 10 31
32 Sensor: Simulation We developed a full sensor simulation to optimize the sensor design WeightField2, F. Cenna, N. Cartiglia 9 th Trento workshop, Genova 2014 Available at It includes: Custom Geometry Calculation of drift field and weighting field Currents signal via Ramo s Theorem Gain Diffusion Temperature effect Non-uniformdeposition Electronics 32
33 WeightField2: a program to simulate silicon detectors 33
34 WeightField2: a program to simulate silicon detectors 34
35 WeightField2: a program to simulate silicon detectors 35
36 WeightField2: a program to simulate silicon detectors 36
37 WeightField2: a program to simulate silicon detectors 37
38 WeightField2: response of the read-out electronics 38
39 The effect of gain - MIP 39
40 The effect of gain - Alpha 40
41 Comparison Data Simulation Current (A) MIP Alpha from Top Alpha from bottom V bias MIP 200 V MIP 200 V Itot Ih 1 Ie Ie_gain Ih_gain WF 0.8 Current (A) Alpha_bottom 200 V Alpha_bottom 200 V Itot Ih Ie Ie_gain Ih_gain WF Current (A) Current (A) Current (A) Current (A) time (ns) -6 MIP 300 V 10 MIP 300 V Itot 1.4 Ih Ie Ie_gain 1.2 Ih_gain WF time (ns) -6 MIP 400 V MIP 400 V Itot 1.6 Ih Ie Ie_gain 1.4 Ih_gain WF time (ns) -6 MIP 500 V 10 2 MIP 500 V Itot Ih Ie Ie_gain 1.5 Ih_gain WF time (ns) -6 MIP 600 V 10 MIP 600 V 2 Itot Ih Ie Ie_gain Ih_gain 1.5 WF time (ns) Current (A) Current (A) Current (A) Current (A) -6 Alpha_top 300 V 10 Alpha_top 300 V 2 Itot Ih Ie Ie_gain Ih_gain WF time (ns) -6 Alpha_top 400 V 10 Alpha_top 400 V Itot Ih 2 Ie Ie_gain Ih_gain WF time (ns) -6 Alpha_top 500 V Alpha_top 500 V Itot Ih Ie 2 Ie_gain Ih_gain WF time (ns) -6 Alpha_top 600 V 10 Alpha_top 600 V 2.5 Itot Ih Ie Ie_gain 2 Ih_gain WF time (ns) Current (A) Current (A) Current (A) Current (A) time (ns) Alpha_bottom 300 V Alpha_bottom 300 V Itot Ih Ie Ie_gain Ih_gain WF time (ns) Alpha_bottom 400 V Alpha_bottom 400 V Itot Ih Ie Ie_gain Ih_gain WF time (ns) Alpha_bottom 500 V Alpha_bottom 500 V Itot Ih Ie Ie_gain Ih_gain WF time (ns) Alpha_bottom 600 V -6 Alpha_bottom 600 V Itot Ih Ie Ie_gain Ih_gain WF time (ns)
42 Wrapping things up so far Time resolution depends on the signal slew rate LGAD are silicon detectors with enhanced signals LGAD prototypes works very well, with gain ~ 10, and no added noise We developed a simulation program able to correctly reproduce LGAD features Now we need to optimize the design to obtain the best possible silicon sensor for timing applications 42
43 How gain shapes the signal Initial electron, holes Gain electron: absorbed immediately Gain holes: long drift home Electrons multiply and produce additional electrons and holes. Gain electrons have almost no effect Gain holes dominate the signal è No holes multiplications 43
44 Interplay of gain and detector thickness Gain The rate of particles produced by the gain does not depend on d (assuming saturated velocity v sat ) + - è Constant rate of production v di gain dn Gain qv sat ( k d ) Particles per micron dn Gain 75(v sat dt)g However the initial value of the gain current depends on d (via the weighing field) Gain è Gain current ~ 1/d A given value of gain has much more effect on thin detectors 44
45 Sensor thickness and slim edge Rule: when the depletion volume reaches the edge, you have electrical breakdown. It s customary to assume that the field extends on the side by ~ 1/3 of the thickness. edge = k* thickness k = 1 very safe k = 0.5 quite safe K = 0.3 limit ~ 0.3 d non depleted depleted By construction, thin detectors (~ 100 micron) might have therefore slim edge 45
46 Gain current vs Initial current di gain i dn Gain qv sat k d kqv sat = 75(v sat dt)gqv sat k d kqv sat G d dt!!! è Go thin!! (Real life is a bit more complicated, but the conclusions are the same) Full simulation (assuming 2 pf detector capacitance) 300 micron: ~ 2-3 improvement with gain = 20 Significant improvements in time resolution require thin detectors 46
47 Gain and Maximum current dv dt G d i(t) thin medium The rise time depends only on the sensor thickness ~ 1/d thick t 1 t 2 t 3 i Max Gain t 47
48 Ultra Fast Silicon Detectors UFSD are LGAD detectors optimized to achieve the best possible time resolution Specifically: 1. Thin to maximize the slew rate (dv/dt) 2. Parallel plate like geometries (pixels..) for most uniform weighting field 3. High electric field to maximize the drift velocity 4. Highest possible resistivity to have uniform E field 5. Small size to keep the capacitance low 6. Small volumes to keep the leakage current low (shot noise) 48
49 First Timing Measurement on CNM LGAD First test organized at CERN: a very fruitful collaboration among TOTEM, ATLAS and CMS, aimed at evaluating the timing performance of UFSD, diamond detector and a custom read-out chip (SAMPIC). Two LGAD sensors have been illuminated with a split laser signal (wl =1064 nm), and the time difference has been measured estimate of time jitter The setup comprised of: - 2 UFSD sensors (LGAD pad 5x5 mm micron thick ) - 2 CIVIDEC broadband amplifiers, 2 GHz (180 ps rise time), 2 mv of noise - waveform digitizer: SAMPIC a SAMpler for PICosecond time measurement 49
50 Experimental Setup Digitizer 2 sensors Laser split into 2 50
51 Jitter Measurement on CNM LGAD In collaboration with Roma2, we went to Frascati for a testbeam using 500 MeV electrons Tested different types of electronics (Rome2 SiGe, Cividec) 300 micron thick, 5 x5 mm pads Jitter measurements: σ t ~ Volts Nice agreement between laboratory laser and testbeam electrons results. 51
52 Pulse amplitude as a function of Vbias 400 V 600 V 800 V 500 MeV electrons As measured in the lab, the gain ~ doubles going from 400 -> 800 Volt. Very good gain mechanism: 800V 400V ~ ~ 1.7 the signal amplitude follows a Landau distribution at every gain value 52
53 Irradiation tests The gain decreases with irradiations: at n/cm 2 is 20% lower è Due to boron disappearance What-to-do next: Digitizer Planned new irradiation runs (neutrons, protons), new sensor geometries Use Gallium instead of Boron for gain layer (in production now) 53
54 Gain in finely segmented sensors Segmentation makes the effect of gain more difficult to predict, and most likely very dependent on the hit position Moving the junction on the deep side allows having a very uniform multiplication, regardless of the electrode segmentation 54
55 Splitting gain and position measurements 55
56 Electronics To fully exploit UFSDs, dedicated electronics needs to be designed. The signal from UFSDs is different from that of traditional sensors 300 µm 300 µm Initial Gain Oscilloscope Simulated Weightfield2 Pads with no gain Pads with gain Charges generated uniquely by Current due to gain holes creates a longer the incident particle 2 sensors and higher signal 56
57 Interplay of Τ Col and τ = R in C Det Detector Capacitance C Det Input impedance R in Collection R in C Det time Τ Col There are two time constants at play: Τ Col : the signal collection time (or equivalently the rise time) τ = R in C Det : the time needed for the charge to move to the electronics τ < Τ Col τ ~ Τ Col τ/τ Col increases è dv/dt decreases è Smoother current τ > Τ Col Signal Electronics Need to find the optimum balance 57
58 Electronics: What is the best pre-amp choice? Energy deposition in Current Amplifier a 50 mm sensor Fast slew rate Higher noise Sensitive to Landau bumps Current signal in a 50 mm sensor Charge Sensitive Amplifier Slower slew rate Quieter Integration helps the signal smoothing 58
59 What is the best time measuring circuit? V V V 10% t 1 t 2 V th t t t Constant Fraction Discriminator The time is set when a fixed fraction of the amplitude is reached Time over Threshold The amount of time over the threshold is used to correct for time walk Multiple sampling Most accurate method, needs a lot of computing power 59
60 Noise Real life Noise Model Bias Resistor Detector C det Detector Bias R Bias C Bias C Det Detector in_det Bias Resistor R Digitizer C C R Bias S This term, the detector current shot noise, depends on the gain R S i N_Bias Series Resistor 2 sensors Q 2 n = (2eI Laser Det + 4kT + i 2 split into 2 R )FT + (4kTR + e 2 )F N _ Amp i s s N _ Amp v Bias 2eI Det * Gain Shot noise: low gain ENF = kg + (2 1 )(1 k) G k = ratio h/e gain Excess noise factor: low gain, very small k e N_S C 2 Det T S Amplifier i N_Amp e N_Amp + F vf A f C 2 Det This term dominates for short shaping time 60
61 Short term future Let s suppose we keep the same set-up as we had in the past testbeam ~ one year ~ now Traditional sensors Current testbeam conditions Goals (using ~ available electronics): σ t < 150 ps with the current 300-micron thick sensors è Demonstrate that 300-micron thick UFSD do significantly better than traditional sensor σ t ~ 100 ps with the 200-micron thick sensors σ t < 50 ps with the 50- and 100-micron thick sensors 61
62 Electronics Groups u u u u Rome2 (AFP) is proposing to develop a Si-Ge based timing system. Testbeam done in September to asses current precision and how to develop the system. Saclay (AFP): read-out based on multi-sampling (SAMPIC) techniques (or the equivalent DRS4 from PSI) Digitizer Bologna (ALICE): NINO based read-out (as in the Alice RPC) 2 sensors Laser split into 2 Torino is interested in furthering the experience gained with NA62 Ultimate performance reachable only with fully custom ASIC electronics 62
63 Next Steps 1. Wafer Production 200 micron thick sensors by fall and 50 micron thick sensors by early Production of UFSD doped with Gallium instead of Boron. 3. Study of reversed-ufsd started for the production of pixelated UFSD sensors (FBK, Trento). 4. UFSD are included in the CMS TDR CT-PPS as a solution for forward proton tagging 5. Use of UFSD in beam monitoring for hadron beam. INFN patent and work on-going 6. Interest in UFSD for 4D tracking at high luminosity 7. Testbeam analyses just started. Results coming soon 63
64 UFSD Summary We are just starting to understand the timing capability of UFSD Low-gain avalanche diodes offer silicon sensors with an enhanced signal amplitude The internal gain makes them ideal for accurate timing studies We developed a program, Weightfield2 to simulate the behaviors of LGAD and optimized them for fast timing (available at Use Gallium to explore a more radiation hard doping layer Thin detectors enhance the effect of gain, several productions in progress We measured: A jitter of 40 ps for a 300-micron thick pad LGAD detectors Very good gain stability, amplitude follows Landau distribution Timescale: 1 year to asses UFSD timing capabilities 64
65 Acknowledgement This research was carried out with the contribution of the Ministero degli Affari Esteri, Direzione Generale per la Promozione del Sistema Paese of Italy. This work is currently supported by INFN Gruppo V, UFSD project. This work was developed in the framework of the CERN RD50 collaboration and partially financed by the Spanish Ministry of Education and Science through the Particle Physics National Program (F P A C and FPA C02 02). The work at SCIPP was partially supported by the United States Department of Energy, grant DE-FG02-04ER
66 References Several talks at the 22 nd, 23 rd and 24th RD50 Workshops: 23 rd RD50: 22 nd RD50: 9 Th Trento Workshop, Genova, Feb F. Cenna Simulation of Ultra-Fast Silicon Detectors N. Cartiglia Timing capabilities of Ultra-Fast Silicon Detector Papers: [1] N. Cartiglia, Ultra-Fast Silicon Detector, 13th Topical Seminar on Innovative Particle and Radiation Detectors (IPRD13), 2014 JINST 9 C02001, [2] H.F.-W. Sadrozinski, N. Cartiglia et al., Sensors for ultra-fast silicon detectors, Proceedings "Hiroshima" Symposium HSTD9, DOI: /j.nima (2014). 66
67 Backup 67
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