Characterization of SC CVD diamond detectors for heavy ions spectroscopy

Size: px
Start display at page:

Download "Characterization of SC CVD diamond detectors for heavy ions spectroscopy"

Transcription

1 Characterization of SC CVD diamond detectors for heavy ions spectroscopy Characterization of SC CVD diamond detectors for heavy and ions MIPsspectroscopy timing and MIPs timing Michal Pomorski and GSI group* *E.Berdermann, M. Ciobanu, W. Hartmann, B. Lommel, A. Martemiyanov, P. Moritz, M. Rebisz, B. Voss.

2 ABOUT SAMPLES SC CVD diamonds producer e6 SC-E x 3.5 x.48 mm 3 ; Cr(5 nm) Au (1 nm) BDS-5 5 x 5 x.325 mm 3 ; Cr(5 nm) Au (1 nm) BDS 7 5 x 5 x.318 mm 3 ; Cr(5 nm) Au (1 nm) BDS 9 5 x 5 x.32 mm 3 ; Al(1nm) guard ring BDS 1 5 x 5 x.3 mm 3 ; Al(1nm) guard ring BDS 14 5 x 5 x.49 mm 3 ; Al(1nm) guard ring Cleaning and oxidation before metallisation: If metallised before Aqua Regia H 2 SO 4 + KNO 3 boiling ~3 min rinse with ultra-pure water ultrasonic bath dry with N 2 Metallisation sputtering or evaporation at Target Laboratory of GSI Bettina Lommel talk Cr(5nm)Au(1nm) ; Ti(3nm)Pt(5nm)Au(1nm); Al(1 nm) annealing 5C for 1min Ar

3 OUTLINE Current-Voltage characteristics and surfaces influence Charge collection properties and stability Energy resolution Timing properties Summary

4 CURRENT-VOLTAGE CHARACTERISTICS Zoo of I-V characteristics bulk + surface current screened box, no light + N 2 flow dark current [A] BDS BDS 7 BDS BDS 1 BDS 9 SC-E6-4 breakdown HI LO 6517 V-source DIAMOND top electrode bottom electrode A HI LO 6517 Picoammeter E [V/µm] - not reproducible I-V for various samples - asymmetry

5 HI LO CURRENT-VOLTAGE CHARACTERISTICS bulk current screened box, no light + N 2 flow DIAMOND guarded electrode 6517 V-source top electrode guard ring electrode A HI LO 6517 Picoammeter no difference in I-V for: various metallisation (Al,Cr,Ti) (2 samples tested) guarded electrode mainly bulk leakage current (3 samples tested) dark current [A] BDS 1 1 nm Al no - guard guarded E [V/µm] dark current [A] BDS 14 1nm Al 5 Cr - 1 Au E [V/µm]

6 CURRENT-VOLTAGE CHARACTERISTICS AFM pictures of both diamond (BDS14) surfaces BDS14_7.bmp profile substrate side (?) 15 Z [nm] 1 5 roughness rms 5.6 [nm] path lenght [nm] BDS14_12o.bmp profile growth side (?) Z [nm] roughness rms 1.4 [nm] path lenght [nm]

7 CURRENT-VOLTAGE CHARACTERISTICS Asymmetry in I-V characteristic is present due to surface damage (polishing?)... scratches pop up after samples annealing... damaged surface substrate side(?) leakage current I a E I I b a >>I b Annealed in 6C, 3min growth side(?)

8 CURRENT-VOLTAGE CHARACTERISTICS dark current [A] 1-8 SC-E6-4 February May Cr;Au Long term stability bias [V]

9 CHARGE COLLECTION Vacuum 1-6 mbar CVD DD - Use of an α-source 241 Am (5.486 MeV) for charge injection - α-particle range in diamond ~12µm - detector thickness >3µm, induced charge mainly motion of one type of carriers GND e or h drift ~3 µm GND HV +/- α 239 Pu/ 241 Am/ 244 Cm Signal readout Charge sensitive electronics GND - Choosing the HV +/- drift of or - presented geometry +HV drift, -HV - drift - detector coupled to classical spectroscopy front-end electronic pramp HV MA TFA discr. ADC TDC camac PC DAQ GG

10 CHARGE COLLECTION Saturation to ~ 68.6 [fc] for both and drift. CCE=1% at low electric field <.3 V/mm collected charge [fc] E [V/µm] SC-E6-4 collected charge [fc] E[V/µm] BDS [fc] e-h Average energy for e-h pair creation 12.8 ev/e-h collected charge [fc] E[V/µm] BDS 1 collected charge [fc] E [V/µm] BDS 14

11 [a.u.] 4x1 4 3x1 4 2x1 4 1x1 4 1 SC-E Energy [MeV] SC-E6-4 E ~.8 V/µm 3 start SC-E6-4 E~.8 V/µm ADC channel [a.u.] after ~ 5h after ~ 12h 1 events in each spectrum DETECTION STABILITY Time of spectrum collecting > 12h 1.2x1 4 1.x1 4 8.x1 3 6.x1 3 4.x1 3 2.x x x1 4 1.x1 4 8.x1 3 6.x1 3 4.x1 3 2.x1 3 BDS 9 BDS 9 E~.8 V/µm collected charge [fc] BDS 9 E~.8 V/µm Collected charge [fc] 1.6x x x1 4 1.x1 4 8.x1 3 6.x1 3 4.x1 3 2.x x1 4 1.x1 4 8.x1 3 6.x1 3 4.x1 3 2.x1 3 BDS 14 BDS 14 E~.8 V/µm collected charge [fc] BDS 14 E~.8 V/µm collected charge [fc]

12 DETECTION STABILITY 5x1 3 4x1 3 BDS BDS 1 E~.8 V/µm 5 events 3x1 3 2x1 3 1x1 3 6x1 3 5x1 3 4x1 3 3x1 3 2x1 3 1x1 3 BDS 1 E~.8 V/µm collected charge [fc] 7% BDS 1 E~.8 V/µm collected charge [fc] release of previously trapped collected charge [fc] Indication of presence for : regions with 1% efficiency main peak region with lower efficiency 93%, quite uniform density of trapping centres shifted peak

13 Diamond resolution close to silicon detectors: FWHM = 17 kev (5.486 MeV) (sc-e6-4 ) measured with not dedicated CS electronics silicon e~3.6 ev/e-h; diamond e~12.8 ev/e-h We are close to statistical limits (Fano factor?) ENERGY RESOLUTION 4.x x1 4 3.x x1 4 2.x x1 4 1.x1 4 5.x Pu E/E =.31% FWHM=17keV 241 Am 244 Cm Energy [MeV] SC-E6-4 E ~.8 V/µm 6 3 3K Silicon detector HV -1V FWHM ~13 kev Ε/Ε =,23 % 1.6x x x1 4 1.x1 4 8.x1 3 6.x1 3 BDS 14 E~.8 V/µm Main peak E/E=.32% 241 Am 4.x Energy [MeV] 2.x collected charge [fq]

14 TIMING PROPERTIES Air CVD DD Time of Flight Technique Low impedance of 5 Ω voltage amplifier DBA II, bandwidth 2.3 GHz (3dB), gain 44dB Digital Scope bandwidth 3GHz, GS/s GND e or h drift ~3 µm GND HV +/- α 241 Am Signal readout BB electronic GND Voltage Amplifier Digital scope 5Ω GND

15 TIMING PROPERTIES output signal [V].1.5 E=1.23 V/µm Average signals from 5 single shots BDS 9 drift output signal [V] V/µm BDS 1 drift output signal [V] electronics oscillation 2GHz due to 5ohm mismatching SC-E6-4 sample thick.= 393[µm] drift. E=.3 V/µm. 1.x1-8 2.x1-8 3.x1-8 time [s].. 9.x x x1-8 time [s].12 V/µm.. 1.x1-8 2.x1-8 3.x1-8 time [s] output signal [V] V/µm. 1.x1-8 2.x1-8 time [s] BDS 9 drift,12 V/µm output signal [V] V/µm. 1.x1-8 2.x1-8 3.x1-8 time [s] BDS 1 drift.12 V/µm output signal [V] x1-8 2.x1-8 3.x1-8 time [s] SC-E6-4 drift sample thickness: 393µm

16 TIMING PROPERTIES electron drift signals Assuming uniform internal electric field (flat top of BB signals) and CCE=1% v ( E) = dr d t tr d detector thickness t tr transition time FWHM of BB signals error standard deviation of signals at FWHM output signal [V] t tr t tr E~1[V/µm].2.1..E+ 2.5E-9 5.E-9 7.5E-9 1.E-8 time [s]

17 TIMING PROPERTIES Drift velocities for and drift velocity [µm/ns] BDS E in <1> [V/µm] drift velocity [µm/ns] SC-E E in <1> [V/µm] drift velocity [µm/ns] BDS E in <1> [V/µm] drift velocity [µm/ns] BDS Ein <1>[V/µm] drift velocity [µm/ns] BDS E in <1> [V/µm] drift velocity [µm/ns] BDS E in <1> [V/µm]

18 V TIMING PROPERTIES µ E dr = v dr β 1/ β sat v β 1 1+ E sat 1 + µ E V = µ E µ 2 fits:.3 1 V/µm µ 1 3 V/µm v sat drift velocity [µm/ns] tested SC Diamonds from E6 3K mi ± vsat ± E in <1> [V/µm] Holes µ 2332 [cm 2 /Vs] V sat 14 [µm/ns] µ 14-31[cm 2 /Vs] V sat 19 [µm/ns]

19 SUMMARY Current voltage characteristics huge difference in leakage current for various samples no difference for guarded samples mainly bulk leakage Asymmetry in I-V probably due to damaged surface as a result of samples polishing requires overgrowth after polishing No difference for various metallisation proposal to use light elements e.g. Al

20 SUMMARY charge collection, stability, and E CCE ~ 1% at low E <.3V/µ for and most of tested samples all samples spectroscopic grade some of them resolution close to silicon detectors perfect behavior for drift no trapping (or negligible) most of them stable as well for drift

21 SUMMARY Timing properties - flat top of BB signals for all tested samples uniform internal electric field no internal space charge -common behavior --> drift velocity > drift velocity in <1> - intrinsic limit for timing application with CSA electronic drift of 1ns / 1 µm (optimistic E=2.8V/µm) - uniform rise time of ~16 ps (limited by electronics) jitter - 26 ps for BB electronic

R3B Heavy Ion Tracking

R3B Heavy Ion Tracking R3B Heavy Ion Tracking Roman Gernhäuser, TU-München High Rate Diamond Detectors for Heavy Ion Tracking and TOF material investigations detector concept (a reminder) electronics development prototype production

More information

Large area position-sensitive CVD diamond detectors for X-ray beam monitoring with extreme position resolution

Large area position-sensitive CVD diamond detectors for X-ray beam monitoring with extreme position resolution Large area position-sensitive CVD diamond detectors for X-ray beam monitoring with extreme position resolution M. Pomorski, P. Bergonzo, Ch. Mer, M. Rebisz-Pomorska D. Tromson, N. Tranchant Diamond Sensors

More information

Results from Diamond Detector tests at ELETTRA

Results from Diamond Detector tests at ELETTRA Results from Diamond Detector tests at ELETTRA Wolfgang Freund, WP74 wolfgang.freund@xfel.eu European XFEL User s Meeting 2013 Satellite Workshop on Photon Beam Diagnostics, 24 Jan 2013 Acknowledgements

More information

Why p-type is better than n-type? or Electric field in heavily irradiated silicon detectors

Why p-type is better than n-type? or Electric field in heavily irradiated silicon detectors Why p-type is better than n-type? or Electric field in heavily irradiated silicon detectors G.Kramberger, V. Cindro, I. Mandić, M. Mikuž, M. Milovanović, M. Zavrtanik Jožef Stefan Institute Ljubljana,

More information

Simulation of High Resistivity (CMOS) Pixels

Simulation of High Resistivity (CMOS) Pixels Simulation of High Resistivity (CMOS) Pixels Stefan Lauxtermann, Kadri Vural Sensor Creations Inc. AIDA-2020 CMOS Simulation Workshop May 13 th 2016 OUTLINE 1. Definition of High Resistivity Pixel Also

More information

Department of Electrical Engineering IIT Madras

Department of Electrical Engineering IIT Madras Department of Electrical Engineering IIT Madras Sample Questions on Semiconductor Devices EE3 applicants who are interested to pursue their research in microelectronics devices area (fabrication and/or

More information

Supplementary Figure 1 Schematic illustration of fabrication procedure of MoS2/h- BN/graphene heterostructures. a, c d Supplementary Figure 2

Supplementary Figure 1 Schematic illustration of fabrication procedure of MoS2/h- BN/graphene heterostructures. a, c d Supplementary Figure 2 Supplementary Figure 1 Schematic illustration of fabrication procedure of MoS 2 /hon a 300- BN/graphene heterostructures. a, CVD-grown b, Graphene was patterned into graphene strips by oxygen monolayer

More information

Strip Detectors. Principal: Silicon strip detector. Ingrid--MariaGregor,SemiconductorsasParticleDetectors. metallization (Al) p +--strips

Strip Detectors. Principal: Silicon strip detector. Ingrid--MariaGregor,SemiconductorsasParticleDetectors. metallization (Al) p +--strips Strip Detectors First detector devices using the lithographic capabilities of microelectronics First Silicon detectors -- > strip detectors Can be found in all high energy physics experiments of the last

More information

Simulation and test of 3D silicon radiation detectors

Simulation and test of 3D silicon radiation detectors Simulation and test of 3D silicon radiation detectors C.Fleta 1, D. Pennicard 1, R. Bates 1, C. Parkes 1, G. Pellegrini 2, M. Lozano 2, V. Wright 3, M. Boscardin 4, G.-F. Dalla Betta 4, C. Piemonte 4,

More information

cividec PORTFOLIO Instrumentation CIVIDEC Instrumentation GmbH Vienna België / Belgique Nederland

cividec PORTFOLIO Instrumentation CIVIDEC Instrumentation GmbH Vienna België / Belgique Nederland cividec Instrumentation PORTFOLIO Nederland België / Belgique T +31 (0)24 648 86 88 T +32 (0)3 309 32 09 info@gotopeo.com www.gotopeo.com CIVIDEC Instrumentation GmbH Vienna CONTENTS Preface...3 A Monitors

More information

The SIRAD irradiation facility at the INFN - Legnaro National Laboratory

The SIRAD irradiation facility at the INFN - Legnaro National Laboratory The SIRAD irradiation facility at the INFN - Legnaro National Laboratory I. Introduction 2 The INFN - Legnaro National Laboratory (LNL) SIRAD beamline http://www.lnl.infn.it 3 What is SIRAD? SIRAD is the

More information

Integrated Circuit Amplifiers. Comparison of MOSFETs and BJTs

Integrated Circuit Amplifiers. Comparison of MOSFETs and BJTs Integrated Circuit Amplifiers Comparison of MOSFETs and BJTs 17 Typical CMOS Device Parameters 0.8 µm 0.25 µm 0.13 µm Parameter NMOS PMOS NMOS PMOS NMOS PMOS t ox (nm) 15 15 6 6 2.7 2.7 C ox (ff/µm 2 )

More information

CVD diamond sensors. 6.1 Properties of CVD diamond CVD process

CVD diamond sensors. 6.1 Properties of CVD diamond CVD process 6 CVD diamond sensors In this Chapter general properties of CVD diamond are introduced. Characterisation using radioactive sources is presented and the charge-carrier lifetime is determined for our scvd

More information

Novel MPGD based Detectors of Single Photons for COMPASS RICH-1 Upgrade

Novel MPGD based Detectors of Single Photons for COMPASS RICH-1 Upgrade Outline Basics Why this upgrade and how R&D and Detector commissioning Results Conclusions Novel MPGD based Detectors of Single Photons for COMPASS RICH-1 Upgrade Shuddha Shankar Dasgupta INFN Sezzione

More information

Nano-structured superconducting single-photon detector

Nano-structured superconducting single-photon detector Nano-structured superconducting single-photon detector G. Gol'tsman *a, A. Korneev a,v. Izbenko a, K. Smirnov a, P. Kouminov a, B. Voronov a, A. Verevkin b, J. Zhang b, A. Pearlman b, W. Slysz b, and R.

More information

Development of Large Area and of Position Sensitive Timing RPCs

Development of Large Area and of Position Sensitive Timing RPCs Development of Large Area and of Position Sensitive Timing RPCs A.Blanco, C.Finck, R. Ferreira Marques, P.Fonte, A.Gobbi, A.Policarpo and M.Rozas LIP, Coimbra, Portugal. GSI, Darmstadt, Germany Univ. de

More information

Construction of the silicon tracker for the R3B experiment.

Construction of the silicon tracker for the R3B experiment. Construction of the silicon tracker for the R3B experiment. M.Borri (STFC) on behalf of the teams at Daresbury Laboratory, Edinburgh and Liverpool Universities. Outline: FAIR and R3B. Overview of Si tracker.

More information

Development of a sampling ASIC for fast detector signals

Development of a sampling ASIC for fast detector signals Development of a sampling ASIC for fast detector signals Hervé Grabas Work done in collaboration with Henry Frisch, Jean-François Genat, Eric Oberla, Gary Varner, Eric Delagnes, Dominique Breton. Signal

More information

NAME: Last First Signature

NAME: Last First Signature UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences EE 130: IC Devices Spring 2003 FINAL EXAMINATION NAME: Last First Signature STUDENT

More information

Performance of Microchannel Plates Fabricated Using Atomic Layer Deposition

Performance of Microchannel Plates Fabricated Using Atomic Layer Deposition Performance of Microchannel Plates Fabricated Using Atomic Layer Deposition Andrey Elagin on behalf of the LAPPD collaboration Introduction Performance (timing) Conclusions Large Area Picosecond Photo

More information

Production of HPDs for the LHCb RICH Detectors

Production of HPDs for the LHCb RICH Detectors Production of HPDs for the LHCb RICH Detectors LHCb RICH Detectors Hybrid Photon Detector Production Photo Detector Test Facilities Test Results Conclusions IEEE Nuclear Science Symposium Wyndham, 24 th

More information

CADMIUM Telluride (CdTe) and Cadmium Zinc Telluride

CADMIUM Telluride (CdTe) and Cadmium Zinc Telluride Evaluation of 5 mm-thick CdTe Detectors from the Company Acrorad Alfred Garson III 1, Ira V. Jung 1, Jeremy Perkins 1, and Henric Krawczynski 1 arxiv:astro-ph/511577v1 18 Nov 25 Abstract Using 2 2.5 cm

More information

The HGTD: A SOI Power Diode for Timing Detection Applications

The HGTD: A SOI Power Diode for Timing Detection Applications The HGTD: A SOI Power Diode for Timing Detection Applications Work done in the framework of RD50 Collaboration (CERN) M. Carulla, D. Flores, S. Hidalgo, D. Quirion, G. Pellegrini IMB-CNM (CSIC), Spain

More information

Noise Performance Analysis for the Silicon Tracking System Detector and Front-End Electronics

Noise Performance Analysis for the Silicon Tracking System Detector and Front-End Electronics Noise Performance Analysis for the Silicon Tracking System Detector and Front-End Electronics Weronika Zubrzycka, Krzysztof Kasiński zubrzycka@agh.edu.pl, kasinski@agh.edu.pl Department of Measurement

More information

Session 10: Solid State Physics MOSFET

Session 10: Solid State Physics MOSFET Session 10: Solid State Physics MOSFET 1 Outline A B C D E F G H I J 2 MOSCap MOSFET Metal-Oxide-Semiconductor Field-Effect Transistor: Al (metal) SiO2 (oxide) High k ~0.1 ~5 A SiO2 A n+ n+ p-type Si (bulk)

More information

Prepared by: Dr. Rishi Prakash, Dept of Electronics and Communication Engineering Page 1 of 5

Prepared by: Dr. Rishi Prakash, Dept of Electronics and Communication Engineering Page 1 of 5 Microwave tunnel diode Some anomalous phenomena were observed in diode which do not follows the classical diode equation. This anomalous phenomena was explained by quantum tunnelling theory. The tunnelling

More information

Monolithic Pixel Sensors in SOI technology R&D activities at LBNL

Monolithic Pixel Sensors in SOI technology R&D activities at LBNL Monolithic Pixel Sensors in SOI technology R&D activities at LBNL Lawrence Berkeley National Laboratory M. Battaglia, L. Glesener (UC Berkeley & LBNL), D. Bisello, P. Giubilato (LBNL & INFN Padova), P.

More information

Pixel hybrid photon detectors

Pixel hybrid photon detectors Pixel hybrid photon detectors for the LHCb-RICH system Ken Wyllie On behalf of the LHCb-RICH group CERN, Geneva, Switzerland 1 Outline of the talk Introduction The LHCb detector The RICH 2 counter Overall

More information

cividec DIAMOND DETECTORS & SYSTEMS FOR X-RAYS Instrumentation CIVIDEC Instrumentation GmbH Vienna The Netherlands +31 (0)

cividec DIAMOND DETECTORS & SYSTEMS FOR X-RAYS Instrumentation CIVIDEC Instrumentation GmbH Vienna The Netherlands +31 (0) cividec Instrumentation DIAMOND DETECTORS & SYSTEMS FOR X-RAYS CIVIDEC Instrumentation GmbH Vienna +32 (0)3 309 32 09 info@gotopeo.com www.gotopeo.com CONTENTS Introduction... 3 Monitors Diamond XBPM System...

More information

Recent Development and Study of Silicon Solid State Photomultiplier (MRS Avalanche Photodetector)

Recent Development and Study of Silicon Solid State Photomultiplier (MRS Avalanche Photodetector) Recent Development and Study of Silicon Solid State Photomultiplier (MRS Avalanche Photodetector) Valeri Saveliev University of Obninsk, Russia Vienna Conference on Instrumentation Vienna, 20 February

More information

MGA GHz 3 V, 17 dbm Amplifier. Data Sheet

MGA GHz 3 V, 17 dbm Amplifier. Data Sheet MGA-853.1 GHz 3 V, 17 dbm Amplifier Data Sheet Description Avago s MGA-853 is an economical, easy-to-use GaAs MMIC amplifier that offers excellent power and low noise figure for applications from.1 to

More information

UFSD: Ultra-Fast Silicon Detector

UFSD: Ultra-Fast Silicon Detector UFSD: Ultra-Fast Silicon Detector Basic goals of UFSD A parameterization of time resolution State of the art How to do better Overview of the sensor design First Results Nicolo Cartiglia with M. Baselga,

More information

Gigahertz Ambipolar Frequency Multiplier Based on Cvd Graphene

Gigahertz Ambipolar Frequency Multiplier Based on Cvd Graphene Gigahertz Ambipolar Frequency Multiplier Based on Cvd Graphene The MIT Faculty has made this article openly available. Please share how this access benefits you. Your story matters. Citation As Published

More information

Specification of the kicker Measurement of the magnetic field inside the kicker Optimisation of the kicker impedance to 50 Status and picture of the

Specification of the kicker Measurement of the magnetic field inside the kicker Optimisation of the kicker impedance to 50 Status and picture of the Specification of the kicker Measurement of the magnetic field inside the kicker Optimisation of the kicker impedance to 50 Status and picture of the kicker The Specification of the Feedbackkicker technical

More information

InGaAs SPAD freerunning

InGaAs SPAD freerunning InGaAs SPAD freerunning The InGaAs Single-Photon Counter is based on a InGaAs/InP SPAD for the detection of near-infrared single photons up to 1700 nm. The module includes a front-end circuit for fast

More information

Physics of Waveguide Photodetectors with Integrated Amplification

Physics of Waveguide Photodetectors with Integrated Amplification Physics of Waveguide Photodetectors with Integrated Amplification J. Piprek, D. Lasaosa, D. Pasquariello, and J. E. Bowers Electrical and Computer Engineering Department University of California, Santa

More information

MGA GHz 3 V, 17 dbm Amplifier. Data Sheet. Features. Description. Applications. Surface Mount Package. Simplified Schematic

MGA GHz 3 V, 17 dbm Amplifier. Data Sheet. Features. Description. Applications. Surface Mount Package. Simplified Schematic MGA-853.1 GHz 3 V, 17 dbm Amplifier Data Sheet Description Avago s MGA-853 is an economical, easy-to-use GaAs MMIC amplifier that offers excellent power and low noise figure for applications from.1 to

More information

XRF Instrumentation. Introduction to spectrometer

XRF Instrumentation. Introduction to spectrometer XRF Instrumentation Introduction to spectrometer AMPTEK, INC., Bedford, MA 01730 Ph: +1 781 275 2242 Fax: +1 781 275 3470 sales@amptek.com 1 Instrument Excitation source Sample X-ray tube or radioisotope

More information

High-Ohmic Resistors using Nanometer-Thin Pure-Boron Chemical-Vapour-Deposited Layers

High-Ohmic Resistors using Nanometer-Thin Pure-Boron Chemical-Vapour-Deposited Layers High-Ohmic Resistors using Nanometer-Thin Pure-Boron Chemical-Vapour-Deposited Layers Negin Golshani, Vahid Mohammadi, Siva Ramesh, Lis K. Nanver Delft University of Technology The Netherlands ESSDERC

More information

Role of guard rings in improving the performance of silicon detectors

Role of guard rings in improving the performance of silicon detectors PRAMANA c Indian Academy of Sciences Vol. 65, No. 2 journal of August 2005 physics pp. 259 272 Role of guard rings in improving the performance of silicon detectors VIJAY MISHRA, V D SRIVASTAVA and S K

More information

Development of Double-sided Silcon microstrip Detector. D.H. Kah*, H. Park, H.J. Kim (BAERI JikLee (SNU) E. Won (Korea U)

Development of Double-sided Silcon microstrip Detector. D.H. Kah*, H. Park, H.J. Kim (BAERI JikLee (SNU) E. Won (Korea U) Development of Double-sided Silcon microstrip Detector D.H. Kah*, H. Park, H.J. Kim (BAERI JikLee (SNU) E. Won (Korea U), KNU) 2005 APPI dhkah@belle.knu.ac.kr 1 1. Motivation 2. Introduction Contents 1.

More information

Application of CMOS sensors in radiation detection

Application of CMOS sensors in radiation detection Application of CMOS sensors in radiation detection S. Ashrafi Physics Faculty University of Tabriz 1 CMOS is a technology for making low power integrated circuits. CMOS Complementary Metal Oxide Semiconductor

More information

SPECTROMETRIC DETECTION PROBE Model 310. Operator's manual

SPECTROMETRIC DETECTION PROBE Model 310. Operator's manual SPECTROMETRIC DETECTION PROBE Model 310 Operator's manual CONTENTS 1. INTRODUCTION... 3 2. SPECIFICATIONS... 4 3. DESIGN FEATURES... 6 4. INSTALLATION... 10 5. SAFETY AND PRECAUTIONS... 13 6. THEORY OF

More information

Semiconductor Detector Systems

Semiconductor Detector Systems Semiconductor Detector Systems Helmuth Spieler Physics Division, Lawrence Berkeley National Laboratory OXFORD UNIVERSITY PRESS ix CONTENTS 1 Detector systems overview 1 1.1 Sensor 2 1.2 Preamplifier 3

More information

Contents. The AMADEUS experiment at the DAFNE collider. The AMADEUS trigger. SiPM characterization and lab tests

Contents. The AMADEUS experiment at the DAFNE collider. The AMADEUS trigger. SiPM characterization and lab tests Contents The AMADEUS experiment at the DAFNE collider The AMADEUS trigger SiPM characterization and lab tests First trigger prototype; tests at the DAFNE beam Second prototype and tests at PSI beam Conclusions

More information

FAST RF KICKER DESIGN

FAST RF KICKER DESIGN FAST RF KICKER DESIGN David Alesini LNF-INFN, Frascati, Rome, Italy ICFA Mini-Workshop on Deflecting/Crabbing Cavity Applications in Accelerators, Shanghai, April 23-25, 2008 FAST STRIPLINE INJECTION KICKERS

More information

Radiation hardness and precision timing study of Silicon Detectors for the CMS High Granularity Calorimeter (HGC)

Radiation hardness and precision timing study of Silicon Detectors for the CMS High Granularity Calorimeter (HGC) Radiation hardness and precision timing study of Silicon Detectors for the CMS High Granularity Calorimeter (HGC) Esteban Currás1,2, Marcos Fernández2, Christian Gallrapp1, Marcello Mannelli1, Michael

More information

Diamond sensors as beam conditions monitors in CMS and LHC

Diamond sensors as beam conditions monitors in CMS and LHC Diamond sensors as beam conditions monitors in CMS and LHC Maria Hempel DESY Zeuthen & BTU Cottbus on behalf of the BRM-CMS and CMS-DESY groups GSI Darmstadt, 11th - 13th December 2011 Outline 1. Description

More information

IOLTS th IEEE International On-Line Testing Symposium

IOLTS th IEEE International On-Line Testing Symposium IOLTS 2018 24th IEEE International On-Line Testing Symposium Exp. comparison and analysis of the sensitivity to laser fault injection of CMOS FD-SOI and CMOS bulk technologies J.M. Dutertre 1, V. Beroulle

More information

UFSD: Ultra-Fast Silicon Detector

UFSD: Ultra-Fast Silicon Detector UFSD: Ultra-Fast Silicon Detector Basic goals of UFSD (aka Low-Gain Avalanche Diode) A parameterization of time resolution State of the art How to do better Overview of the sensor design Example of application

More information

easypll UHV Preamplifier Reference Manual

easypll UHV Preamplifier Reference Manual easypll UHV Preamplifier Reference Manual 1 Table of Contents easypll UHV-Pre-Amplifier for Tuning Fork 2 Theory... 2 Wiring of the pre-amplifier... 4 Technical specifications... 5 Version 1.1 BT 00536

More information

Data Sheet. MGA GHz 3 V, 14 dbm Amplifier. Description. Features. Applications. Simplified Schematic

Data Sheet. MGA GHz 3 V, 14 dbm Amplifier. Description. Features. Applications. Simplified Schematic MGA-8153.1 GHz 3 V, 1 dbm Amplifier Data Sheet Description Avago s MGA-8153 is an economical, easy-to-use GaAs MMIC amplifier that offers excellent power and low noise figure for applications from.1 to

More information

Surface Mount SOT-363 (SC-70) Package. Pin Connections and Package Marking 4 V CC. Note: Package marking provides orientation and identification.

Surface Mount SOT-363 (SC-70) Package. Pin Connections and Package Marking 4 V CC. Note: Package marking provides orientation and identification. 1.5 GHz Low Noise Silicon MMIC Amplifier Technical Data INA-52063 Features Ultra-Miniature Package Single 5 V Supply (30 ma) 22 db Gain 8 dbm P 1dB Unconditionally Stable Applications Amplifier for Cellular,

More information

Development of Integration-Type Silicon-On-Insulator Monolithic Pixel. Detectors by Using a Float Zone Silicon

Development of Integration-Type Silicon-On-Insulator Monolithic Pixel. Detectors by Using a Float Zone Silicon Development of Integration-Type Silicon-On-Insulator Monolithic Pixel Detectors by Using a Float Zone Silicon S. Mitsui a*, Y. Arai b, T. Miyoshi b, A. Takeda c a Venture Business Laboratory, Organization

More information

Rigorous Analysis of Traveling Wave Photodetectors

Rigorous Analysis of Traveling Wave Photodetectors Rigorous Analysis of Traveling Wave Photodetectors Damir Pasalic Prof. Dr. Rüdiger Vahldieck Laboratory for Electromagnetic Fields and Microwave Electronics (IFH) ETH Zurich Gloriastrasse 35, CH-8092 Zurich

More information

R AMP TEK Landed on Mars July 4, 1997 All Solid State Design No Liquid Nitrogen Be Window FET Detector Temperature Monitor Cooler Mounting Stud FEATURES Si-PIN Photodiode Thermoelectric Cooler Beryllium

More information

Broadband Electronics for CVD-Diamond Detectors

Broadband Electronics for CVD-Diamond Detectors Broadband Electronics for CVD-Diamond Detectors P. Moritz, E. Berdermann, K. Blasche, H. Stelzer, B. Voss GSI - Gesellschaft für Schwerionenforschung mbh, Planckstr. 1, D-64291 Darmstadt, Germany Abstract

More information

ECSE-6300 IC Fabrication Laboratory Lecture 9 MOSFETs. Lecture Outline

ECSE-6300 IC Fabrication Laboratory Lecture 9 MOSFETs. Lecture Outline ECSE-6300 IC Fabrication Laboratory Lecture 9 MOSFETs Prof. Rensselaer Polytechnic Institute Troy, NY 12180 Office: CII-6229 Tel.: (518) 276-2909 e-mails: luj@rpi.edu http://www.ecse.rpi.edu/courses/s18/ecse

More information

Results of cold charge sensitive preamplifiers tests with SUB detector. D. Budjas, A. D Andragora, C. Cattadori, A. Pullia, S. Riboldi, F.

Results of cold charge sensitive preamplifiers tests with SUB detector. D. Budjas, A. D Andragora, C. Cattadori, A. Pullia, S. Riboldi, F. Results of cold charge sensitive preamplifiers tests with SUB detector. D. Budjas, A. D Andragora, C. Cattadori, A. Pullia, S. Riboldi, F. Zocca Outline Purpose of the work: Test of FE circuits in the

More information

Electronics The basics of semiconductor physics

Electronics The basics of semiconductor physics Electronics The basics of semiconductor physics Prof. Márta Rencz, Gábor Takács BME DED 17/09/2015 1 / 37 The basic properties of semiconductors Range of conductivity [Source: http://www.britannica.com]

More information

A New Single-Photon Avalanche Diode in 90nm Standard CMOS Technology

A New Single-Photon Avalanche Diode in 90nm Standard CMOS Technology A New Single-Photon Avalanche Diode in 90nm Standard CMOS Technology Mohammad Azim Karami* a, Marek Gersbach, Edoardo Charbon a a Dept. of Electrical engineering, Technical University of Delft, Delft,

More information

A new Vertical JFET Technology for Harsh Radiation Applications

A new Vertical JFET Technology for Harsh Radiation Applications A New Vertical JFET Technology for Harsh Radiation Applications ISPS 2016 1 A new Vertical JFET Technology for Harsh Radiation Applications A Rad-Hard switch for the ATLAS Inner Tracker P. Fernández-Martínez,

More information

Trigger Rate Dependence and Gas Mixture of MRPC for the LEPS2 Experiment at SPring-8

Trigger Rate Dependence and Gas Mixture of MRPC for the LEPS2 Experiment at SPring-8 Trigger Rate Dependence and Gas Mixture of MRPC for the LEPS2 Experiment at SPring-8 1 Institite of Physics, Academia Sinica 128 Sec. 2, Academia Rd., Nankang, Taipei 11529, Taiwan cyhsieh0531@gmail.com

More information

TPC Readout with GEMs & Pixels

TPC Readout with GEMs & Pixels TPC Readout with GEMs & Pixels + Linear Collider Tracking Directional Dark Matter Detection Directional Neutron Spectroscopy? Sven Vahsen Lawrence Berkeley Lab Cygnus 2009, Cambridge Massachusetts 2 Our

More information

Status of ITC-irst activities in RD50

Status of ITC-irst activities in RD50 Status of ITC-irst activities in RD50 M. Boscardin ITC-irst, Microsystem Division Trento, Italy Outline Materials/Pad Detctors Pre-irradiated silicon INFN Padova and Institute for Nuclear Research of NASU,

More information

The CLEO-III Drift Chamber Vienna Conference on Instrumentation, 19-February-2001 Daniel Peterson, Cornell University

The CLEO-III Drift Chamber Vienna Conference on Instrumentation, 19-February-2001 Daniel Peterson, Cornell University The CLEO-III Drift Chamber Vienna Conference on Instrumentation, 19-February-2001 Daniel Peterson, Cornell University K. Berkelman R. Briere G. Chen D. Cronin-Hennessy S. Csorna M. Dickson S. von Dombrowski

More information

CHAPTER 11 HPD (Hybrid Photo-Detector)

CHAPTER 11 HPD (Hybrid Photo-Detector) CHAPTER 11 HPD (Hybrid Photo-Detector) HPD (Hybrid Photo-Detector) is a completely new photomultiplier tube that incorporates a semiconductor element in an evacuated electron tube. In HPD operation, photoelectrons

More information

ATLAS Upgrade SSD. ATLAS Upgrade SSD. Specifications of Electrical Measurements on SSD. Specifications of Electrical Measurements on SSD

ATLAS Upgrade SSD. ATLAS Upgrade SSD. Specifications of Electrical Measurements on SSD. Specifications of Electrical Measurements on SSD ATLAS Upgrade SSD Specifications of Electrical Measurements on SSD ATLAS Project Document No: Institute Document No. Created: 17/11/2006 Page: 1 of 7 DRAFT 2.0 Modified: Rev. No.: 2 ATLAS Upgrade SSD Specifications

More information

EJERCICIOS DE COMPONENTES ELECTRÓNICOS. 1 er cuatrimestre

EJERCICIOS DE COMPONENTES ELECTRÓNICOS. 1 er cuatrimestre EJECICIOS DE COMPONENTES ELECTÓNICOS. 1 er cuatrimestre 2 o Ingeniería Electrónica Industrial Juan Antonio Jiménez Tejada Índice 1. Basic concepts of Electronics 1 2. Passive components 1 3. Semiconductors.

More information

MICROELECTRONIC CIRCUIT DESIGN Third Edition

MICROELECTRONIC CIRCUIT DESIGN Third Edition MICROELECTRONIC CIRCUIT DESIGN Third Edition Richard C. Jaeger and Travis N. Blalock Answers to Selected Problems Updated 1/25/08 Chapter 1 1.3 1.52 years, 5.06 years 1.5 1.95 years, 6.46 years 1.8 113

More information

Dynamic Engineers Inc.

Dynamic Engineers Inc. Features and Benefits Standard and custom frequencies up to 2100 MHz Femto-second (f sec.) RMS phase jitter Short lead time Typical Applications Low noise synthesizer VCO reference Optical Communication

More information

Supporting Information

Supporting Information Solution-processed Nickel Oxide Hole Injection/Transport Layers for Efficient Solution-processed Organic Light- Emitting Diodes Supporting Information 1. C 1s high resolution X-ray Photoemission Spectroscopy

More information

Signal Integrity Design of TSV-Based 3D IC

Signal Integrity Design of TSV-Based 3D IC Signal Integrity Design of TSV-Based 3D IC October 24, 21 Joungho Kim at KAIST joungho@ee.kaist.ac.kr http://tera.kaist.ac.kr 1 Contents 1) Driving Forces of TSV based 3D IC 2) Signal Integrity Issues

More information

Alternative Channel Materials for MOSFET Scaling Below 10nm

Alternative Channel Materials for MOSFET Scaling Below 10nm Alternative Channel Materials for MOSFET Scaling Below 10nm Doug Barlage Electrical Requirements of Channel Mark Johnson Challenges With Material Synthesis Introduction Outline Challenges with scaling

More information

Beam Loss monitoring R&D. Arden Warner Fermilab MPS2014 Workshop March 5-6, 2014

Beam Loss monitoring R&D. Arden Warner Fermilab MPS2014 Workshop March 5-6, 2014 Beam Loss monitoring R&D Arden Warner Fermilab MPS2014 Workshop March 5-6, 2014 Outline PXIE Technical Concerns PXIE Study plans Preliminary scvd R&D Cold Ionization chambers 2 MPS2014; Arden Warner Loss

More information

Single Sided and Double Sided Silicon MicroStrip Detector R&D

Single Sided and Double Sided Silicon MicroStrip Detector R&D Single Sided and Double Sided Silicon MicroStrip Detector R&D Tariq Aziz Tata Institute, Mumbai, India SuperBelle, KEK December 10-12, 2008 Indian Effort Mask Design at TIFR, Processing at BEL Single Sided

More information

HA-2600, HA Features. 12MHz, High Input Impedance Operational Amplifiers. Applications. Pinouts. Ordering Information

HA-2600, HA Features. 12MHz, High Input Impedance Operational Amplifiers. Applications. Pinouts. Ordering Information HA26, HA26 September 998 File Number 292.3 2MHz, High Input Impedance Operational Amplifiers HA26/26 are internally compensated bipolar operational amplifiers that feature very high input impedance (MΩ,

More information

Surface Mount Package SOT-363 (SC-70) Pin Connections and Package Marking GND 1 5 GND. Note: Package marking provides orientation and identification.

Surface Mount Package SOT-363 (SC-70) Pin Connections and Package Marking GND 1 5 GND. Note: Package marking provides orientation and identification. .1 6 GHz 3 V, 1 dbm Amplifier Technical Data MGA-81563 Features +1.8 dbm P 1dB at. GHz +17 dbm P sat at. GHz Single +3V Supply.8 db Noise Figure at. GHz 1. db Gain at. GHz Ultra-miniature Package Unconditionally

More information

Development of silicon detectors for Beam Loss Monitoring at HL-LHC

Development of silicon detectors for Beam Loss Monitoring at HL-LHC Development of silicon detectors for Beam Loss Monitoring at HL-LHC E. Verbitskaya, V. Eremin, A. Zabrodskii, A. Bogdanov, A. Shepelev Ioffe Institute, St. Petersburg, Russian Federation B. Dehning, M.

More information

irst: process development, characterization and first irradiation studies

irst: process development, characterization and first irradiation studies 3D D detectors at ITC-irst irst: process development, characterization and first irradiation studies S. Ronchin a, M. Boscardin a, L. Bosisio b, V. Cindro c, G.-F. Dalla Betta d, C. Piemonte a, A. Pozza

More information

Fundamentals of CMOS Image Sensors

Fundamentals of CMOS Image Sensors CHAPTER 2 Fundamentals of CMOS Image Sensors Mixed-Signal IC Design for Image Sensor 2-1 Outline Photoelectric Effect Photodetectors CMOS Image Sensor(CIS) Array Architecture CIS Peripherals Design Considerations

More information

Chap14. Photodiode Detectors

Chap14. Photodiode Detectors Chap14. Photodiode Detectors Mohammad Ali Mansouri-Birjandi mansouri@ece.usb.ac.ir mamansouri@yahoo.com Faculty of Electrical and Computer Engineering University of Sistan and Baluchestan (USB) Design

More information

FAST KICKERS LNF-INFN

FAST KICKERS LNF-INFN ILC Damping Rings R&D Workshop - ILCDR06 September 26-28, 2006 at Cornell University FAST KICKERS R&D @ LNF-INFN Fabio Marcellini for the LNF fast kickers study group* * D. Alesini, F. Marcellini P. Raimondi,

More information

Surface Mount Package SOT-363 (SC-70) Pin Connections and Package Marking. OUTPUT and V d 5 GND 4 V CC

Surface Mount Package SOT-363 (SC-70) Pin Connections and Package Marking. OUTPUT and V d 5 GND 4 V CC 3. GHz Low Noise Silicon MMIC Amplifier Technical Data INA-5463 Features Ultra-Miniature Package Single 5 V Supply (29 ma) 21.5 db Gain (1.9 GHz) 8. dbm P 1dB (1.9 GHz) Positive Gain Slope Unconditionally

More information

DEVELOPMENT OF CAPACITIVE LINEAR-CUT BEAM POSITION MONITOR FOR HEAVY-ION SYNCHROTRON OF KHIMA PROJECT

DEVELOPMENT OF CAPACITIVE LINEAR-CUT BEAM POSITION MONITOR FOR HEAVY-ION SYNCHROTRON OF KHIMA PROJECT DEVELOPMENT OF CAPACITIVE LINEAR-CUT BEAM POSITION MONITOR FOR HEAVY-ION SYNCHROTRON OF KHIMA PROJECT Ji-Gwang Hwang, Tae-Keun Yang, Seon Yeong Noh Korea Institute of Radiological and Medical Sciences,

More information

Characterization of a prototype matrix of Silicon PhotoMultipliers (SiPM s)

Characterization of a prototype matrix of Silicon PhotoMultipliers (SiPM s) Characterization of a prototype matrix of Silicon PhotoMultipliers (SiPM s) N. Dinu, P. Barrillon, C. Bazin, S. Bondil-Blin, V. Chaumat, C. de La Taille, V. Puill, JF. Vagnucci Laboratory of Linear Accelerator

More information

Cosmic Rays induced Single Event Effects in Power Semiconductor Devices

Cosmic Rays induced Single Event Effects in Power Semiconductor Devices Cosmic Rays induced Single Event Effects in Power Semiconductor Devices Giovanni Busatto University of Cassino ITALY Outline Introduction Cosmic rays in Space Cosmic rays at Sea Level Radiation Effects

More information

Effect of Aging on Power Integrity of Digital Integrated Circuits

Effect of Aging on Power Integrity of Digital Integrated Circuits Effect of Aging on Power Integrity of Digital Integrated Circuits A. Boyer, S. Ben Dhia Alexandre.boyer@laas.fr Sonia.bendhia@laas.fr 1 May 14 th, 2013 Introduction and context Long time operation Harsh

More information

The current density at a forward bias of 0.9 V is J( V) = 8:91 10 ;13 exp 0:06 = 9: :39=961:4 Acm ; 1: 10 ;8 exp 0:05 The current is dominated b

The current density at a forward bias of 0.9 V is J( V) = 8:91 10 ;13 exp 0:06 = 9: :39=961:4 Acm ; 1: 10 ;8 exp 0:05 The current is dominated b Prof. Jasprit Singh Fall 000 EECS 30 Solutions to Homework 6 Problem 1 Two dierent processes are used to fabricate a Si p-n diode. The rst process results in a electron-hole recombination time via impurities

More information

236 IEEE TRANSACTIONS ON NUCLEAR SCIENCE, VOL. 59, NO. 1, FEBRUARY 2012

236 IEEE TRANSACTIONS ON NUCLEAR SCIENCE, VOL. 59, NO. 1, FEBRUARY 2012 236 IEEE TRANSACTIONS ON NUCLEAR SCIENCE, VOL. 59, NO. 1, FEBRUARY 2012 Characterization of the H3D ASIC Readout System and 6.0 cm 3-D Position Sensitive CdZnTe Detectors Feng Zhang, Cedric Herman, Zhong

More information

X-ray Scanners* for ATLAS Barrel TRT Modules

X-ray Scanners* for ATLAS Barrel TRT Modules X-ray Scanners* for ATLAS Barrel TRT Modules ** Hampton University * This work was funded by the National Science Foundation Award No. 0072686 ** On the behalf of ATLAS TRT Collaboration 1 Abstract X-ray

More information

UV/EUV CONTINUOUS POSITION SENSOR

UV/EUV CONTINUOUS POSITION SENSOR UV/EUV CONTINUOUS POSITION SENSOR ODD-SXUV-DLPSD FEATURES Submicron position resolution Stable response after exposure to UV/EUV 5 mm x 5 mm active area TO-8 windowless package RoHS ELECTRO-OPTICAL CHARACTERISTICS

More information

Laboratory #5 BJT Basics and MOSFET Basics

Laboratory #5 BJT Basics and MOSFET Basics Laboratory #5 BJT Basics and MOSFET Basics I. Objectives 1. Understand the physical structure of BJTs and MOSFETs. 2. Learn to measure I-V characteristics of BJTs and MOSFETs. II. Components and Instruments

More information

Investigation of a Cs137 and Ba133 runs. Michael Dugger and Robert Lee

Investigation of a Cs137 and Ba133 runs. Michael Dugger and Robert Lee Investigation of a Cs137 and Ba133 runs Michael Dugger and Robert Lee 1 Cs137 Using run 149 One million triggers Doing a quick analysis with fits: Not using Kei s noise corrections at the moment 2 ADC

More information

Surface Mount SOT-363 (SC-70) Package. Pin Connections and Package Marking GND 1 4 V CC

Surface Mount SOT-363 (SC-70) Package. Pin Connections and Package Marking GND 1 4 V CC GHz Low Noise Silicon MMIC Amplifier Technical Data INA-63 Features Ultra-Miniature Package Internally Biased, Single 5 V Supply (12 ma) db Gain 3 db NF Unconditionally Stable Applications Amplifier for

More information

Forward bias operation of irradiated silicon detectors A.Chilingarov Lancaster University, UK

Forward bias operation of irradiated silicon detectors A.Chilingarov Lancaster University, UK 1 st Workshop on Radiation hard semiconductor devices for very high luminosity colliders, CERN, 28-30 November 2001 Forward bias operation of irradiated silicon detectors A.Chilingarov Lancaster University,

More information

PC Pandey: Lecture notes PCB Design, EE Dept, IIT Bombay, rev. April 03. Topics

PC Pandey: Lecture notes PCB Design, EE Dept, IIT Bombay, rev. April 03. Topics PC Pandey: Lecture notes PCB Design, EE Dept,, rev. April 03 1 PC Pandey: Lecture notes PCB Design, EE Dept,, rev. April 03 2 PCB DESIGN Dr. P. C. Pandey EE Dept, Revised Aug 07 Topics 1.General Considerations

More information

Instruction manual and data sheet ipca h

Instruction manual and data sheet ipca h 1/15 instruction manual ipca-21-05-1000-800-h Instruction manual and data sheet ipca-21-05-1000-800-h Broad area interdigital photoconductive THz antenna with microlens array and hyperhemispherical silicon

More information

TRINAT Amplifier-Shaper for Silicon Detector (TASS)

TRINAT Amplifier-Shaper for Silicon Detector (TASS) Sept. 8, 20 L. Kurchaninov TRINAT Amplifier-Shaper for Silicon Detector (TASS). General description Preamplifier-shaper for TRINAT Si detector (Micron model BB) is charge-sensitive amplifier followed by

More information

R a) Draw and explain VI characteristics of Si & Ge diode. (8M) b) Explain the operation of SCR & its characteristics (8M)

R a) Draw and explain VI characteristics of Si & Ge diode. (8M) b) Explain the operation of SCR & its characteristics (8M) SET - 1 1. a) Define i) transient capacitance ii) Diffusion capacitance (4M) b) Explain Fermi level in intrinsic and extrinsic semiconductor (4M) c) Derive the expression for ripple factor of Half wave

More information