SN74LVC2244ADWR OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS. description/ordering information

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1 Operates From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Max t pd of 5.5 ns at 3.3 V Output Ports Have Equivalent 26-Ω Series Resistors, So No External Resistors Are Required Typical V OLP (Output Ground Bounce) <0.8 V at V CC = 3.3 V, T A = 25 C Typical V OHV (Output V OH Undershoot) >2 V at V CC = 3.3 V, T A = 25 C Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V V CC ) I off Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 250 ma Per JESD 17 ESD Protection Exceeds JESD V Human-Body Model (A114-A) 200-V Machine Model (A115-A) 1000-V Charged-Device Model (C101) SN74LVC2244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS572K APRIL 1996 REVISED AUGUST 2003 DB, DBQ, DGV, DW, NS, OR PW PACKAGE (TOP VIEW) 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND V CC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 description/ordering information This octal buffer/line driver is designed for 1.65-V to 3.6-V V CC operation. The SN74LVC2244A is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. The outputs, which are designed to sink up to 12 ma, include equivalent 26-Ω resistors to reduce overshoot and undershoot. TA ORDERING INFORMATION PACKAGE ORDERABLE PART NUMBER SN74LVC2244ADW SN74LVC2244ADWR TOP-SIDE MARKING SOIC DW Tube of 25 Reel of 2000 LVC2244A SOP NS Reel of 2000 SN74LVC2244ANSR LVC2244A SSOP DB Reel of 2000 SN74LVC2244ADBR LE244A 40 C to 85 C SSOP (QSOP) DBQ Reel of 2500 SN74LVC2244ADBQR LVC2244A Tube of 70 SN74LVC2244APW TSSOP PW Reel of 2000 SN74LVC2244APWR LE244A Reel of 250 SN74LVC2244APWT TVSOP DGV Reel of 2000 SN74LVC2244ADGVR LE244A Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 2003, Texas Instruments Incorporated POST OFFICE BOX DALLAS, TEXAS

2 SN74LVC2244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS572K APRIL 1996 REVISED AUGUST 2003 description/ordering information (continued) Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. This device is fully specified for partial-power-down applications using I off. The I off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE (each buffer) INPUTS OUTPUT OE A Y L H H L L L H X Z logic diagram (positive logic) 1OE 1 2OE 19 1A Y1 2A Y1 1A Y2 2A Y2 1A Y3 2A Y3 1A Y4 2A Y4 2 POST OFFICE BOX DALLAS, TEXAS 75265

3 SN74LVC2244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS572K APRIL 1996 REVISED AUGUST 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, V CC V to 6.5 V Input voltage range, V I (see Note 1) V to 6.5 V Voltage range applied to any output in the high-impedance or power-off state, V O (see Note 1) V to 6.5 V Voltage range applied to any output in the high or low state, V O (see Notes 1 and 2) V to V CC V Input clamp current, I IK (V I < 0 ) ma Output clamp current, I OK (V O < 0) ma Continuous output current, I O ±50 ma Continuous current through V CC or GND ±100 ma Package thermal impedance, θ JA (see Note 3): DB package C/W DBQ package C/W DGV package C/W DW package C/W NS package C/W PW package C/W Storage temperature range, T stg C to 150 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The value of VCC is provided in the recommended operating conditions table. 3. The package thermal impedance is calculated in accordance with JESD POST OFFICE BOX DALLAS, TEXAS

4 SN74LVC2244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS572K APRIL 1996 REVISED AUGUST 2003 recommended operating conditions (see Note 4) VCC Supply voltage MIN MAX UNIT Operating Data retention only 1.5 VCC = 1.65 V to 1.95 V 0.65 VCC VIH High-level input voltage VCC = 2.3 V to 2.7 V 1.7 V VCC = 2.7 V to 3.6 V 2 VCC = 1.65 V to 1.95 V 0.35 VCC VIL Low-level input voltage VCC = 2.3 V to 2.7 V 0.7 V VCC = 2.7 V to 3.6 V 0.8 VI Input voltage V VO IOH IOL Output voltage High-level output current Low-level output current High or low state 0 VCC 3-state VCC = 1.65 V 2 VCC = 2.3 V 4 VCC = 2.7 V 8 VCC = 3 V 12 VCC = 1.65 V 2 VCC = 2.3 V 4 VCC = 2.7 V 8 VCC = 3 V 12 t/ v Input transition rise or fall rate 10 ns/v TA Operating free-air temperature C V V ma ma NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA POST OFFICE BOX DALLAS, TEXAS 75265

5 SN74LVC2244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS572K APRIL 1996 REVISED AUGUST 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT VOH VOL IOH = 100 µa 1.65 V to 3.6 V VCC 0.2 IOH = 2 ma 1.65 V 1.2 IOH = 4 ma 2.3 V 1.7 IOH = 6 ma 3 V 2.4 IOH = 8 ma 2.7 V 2 IOH = 12 ma 3 V V 2.2 V IOL = 100 µa 1.65 V to 3.6 V 0.2 IOL = 2 ma 1.65 V 0.45 IOL = 4 ma 2.3 V V 0.4 V IOL = 6 ma 3 V 0.55 IOL = 8 ma 2.7 V 0.6 IOL = 12 ma 3 V 0.8 II VI = 0 to 5.5 V 3.6 V ±5 µa Ioff VI or VO = 5.5 V 0 ±10 µa IOZ VO = 0 to 5.5 V 3.6 V ±10 µa ICC VI = VCC or GND 3.6 V VI 5.5 V IO = V ICC One input at VCC 0.6 V, Other inputs at VCC or GND 2.7 V to 3.6 V 500 µa Ci VI = VCC or GND 3.3 V 4 pf Co VO = VCC or GND 3.3 V 5.5 pf All typical values are at VCC = 3.3 V, TA = 25 C. This applies in the disabled state only. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) µa VCC = 1.8 V VCC = 2.5 V ± 0.15 V ± 0.2 V VCC = 2.7 V VCC = 3.3 V ± 0.3 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX tpd A Y ns ten OE Y ns tdis OE Y ns This information was not available at the time of publication. operating characteristics, T A = 25 C PARAMETER Power dissipation capacitance Outputs enabled Cpd per buffer/driver Outputs disabled This information was not available at the time of publication. TEST VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V CONDITIONS TYP TYP TYP 46 f = 10 MHz 2 UNIT pf POST OFFICE BOX DALLAS, TEXAS

6 SN74LVC2244A OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCAS572K APRIL 1996 REVISED AUGUST 2003 PARAMETER MEASUREMENT INFORMATION From Output Under Test CL (see Note A) RL RL S1 VLOAD Open GND TEST tplh/tphl tplz/tpzl tphz/tpzh S1 Open VLOAD GND LOAD CIRCUIT VCC VI INPUTS tr/tf VLOAD CL RL V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VCC VCC 2.7 V 2.7 V 2 ns 2 ns 2.5 ns 2.5 ns VCC/2 VCC/2 1.5 V 1.5 V 2 VCC 2 VCC 6 V 6 V 30 pf 30 pf 50 pf 50 pf 1 kω 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V VI tw Timing Input 0 V VI tsu th Input 0 V Data Input VI 0 V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES Input VI 0 V Output Control VI 0 V Output tplh tphl VOH VOL Output Waveform 1 S1 at VLOAD (see Note B) tpzl tplz VOL + V VLOAD/2 VOL Output tphl tplh VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOH VOL Output Waveform 2 S1 at GND (see Note B) tpzh tphz VOH V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING VOH 0 V NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time with one transition per measurement. E. tplz and tphz are the same as tdis. F. tpzl and tpzh are the same as ten. G. tplh and tphl are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX DALLAS, TEXAS 75265

7 MECHANICAL DATA MPDS006C FEBRUARY 1996 REVISED AUGUST 2000 DGV (R-PDSO-G**) 24 PINS SHOWN PLASTIC SMALL-OUTLINE 0,40 0,23 0,13 0,07 M ,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 1 12 A 0 8 0,25 0,75 0,50 1,20 MAX 0,15 0,05 Seating Plane 0,08 DIM PINS ** A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11, /E 08/00 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins MO /16/20/56 Pins MO-194 POST OFFICE BOX DALLAS, TEXAS 75265

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10 MSOI004E JANUARY 1995 REVISED MAY 2002 DBQ (R PDSO G**) PLASTIC SMALL OUTLINE PACKAGE (0,64) (0,30) (0,20) (0,13) (3,99) (6,20) (0,20) NOM (3,81) (5,80) 1 12 Gauge Plane A (0,25) (1,75) MAX (0,89) (0,40) Seating Plane (0,25) (0,10) (0,10) DIM PINS ** A MAX (5,00) (8,74) (8,74) (10,01) A MIN (4,80) (8,56) (8,56) (9,80) D M0 137 VARIATION AB AD AE AF /F 02/2002 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed (0,15). D. Falls within JEDEC MO 137. POST OFFICE BOX DALLAS, TEXAS

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12 MECHANICAL DATA MSSO002E JANUARY 1995 REVISED DECEMBER 2001 DB (R-PDSO-G**) 28 PINS SHOWN PLASTIC SMALL-OUTLINE 0,65 0,38 0,22 0,15 M ,60 5,00 8,20 7,40 0,25 0,09 Gage Plane ,25 A 0 8 0,95 0,55 2,00 MAX 0,05 MIN Seating Plane 0,10 DIM PINS ** A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12, /E 12/01 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150 POST OFFICE BOX DALLAS, TEXAS 75265

13 MECHANICAL DATA MTSS001C JANUARY 1995 REVISED FEBRUARY 1999 PW (R-PDSO-G**) 14 PINS SHOWN PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,65 0,10 M 0, ,50 4,30 6,60 6,20 0,15 NOM Gage Plane 1 A ,25 0,75 0,50 1,20 MAX 0,15 0,05 Seating Plane 0,10 DIM PINS ** A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9, /F 01/97 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153 POST OFFICE BOX DALLAS, TEXAS 75265

14 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio Data Converters dataconverter.ti.com Automotive DSP dsp.ti.com Broadband Interface interface.ti.com Digital Control Logic logic.ti.com Military Power Mgmt power.ti.com Optical Networking Microcontrollers microcontroller.ti.com Security Telephony Video & Imaging Wireless Mailing Address: Texas Instruments Post Office Box Dallas, Texas Copyright 2004, Texas Instruments Incorporated

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