THBTxxx11D TRIPOLAR OVERVOLTAGE PROTECTION FOR TELECOM LINE. Application Specific Discretes A.S.D. 8 TIP 7 GND 6 GND 5 RING GND 3 RING FEATURES

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1 Application Specific Discretes A.S.D. THBTxxx11D TRIPOLAR OEROLTAGE PROTECTION FOR TELECOM LINE FEATURES n BIDIRECTIONAL CROWBAR PROTECTION BETWEEN TIP AND, AND AND BETWEEN TIP AND. n PEAK PULSE CURRENT : I PP = 30A for 10/1000µs surge. n HOLDING CURRENT : I H = 150mA. n AAILABLE IN SO8 PACKAGES. n LOW DYNAMIC BREAKOER OLTAGE. DESCRIPTION Dedicated to telecommunication equipment protection, these devices provide a triple bidirectional protection function. They ensure the same protection capability with the same breakdown voltage both in longitudinal mode and transversal mode. A particular attention has been given to the internal wire bonding. The 4-point configuration ensures a reliable protection, eliminating overvoltages introduced by the parasitic inductances of the wiring (Ldi/dt), especially for very fast transient overvoltages. Dynamic characteristics have been defined for several types of surges, in order to meet the SLIC maximum ratings. SO-8 SCHEMATIC DIAGRAM TIP TIP 7 6 COMPLIES WITH BELLCORE STANDARDS : TR-NWT : 10/1000µs /10µs 2500 (first level) 2/10µs (second level) with line series resistors of 56Ω TM: ASD is trademarks of STMicroelectronics. October Ed: 7A 1/9

2 ABSOLUTE MAXIMUM RATINGS (T amb =25 C) Symbol Parameter alue Unit I PP Peak pulse current (see note 1) 10/1000 µs 30 A I TSM T stg T j Non repetitive surge peak on-state current (F=50Hz) Storage temperature range Maximum operating junction temperature tp=10ms t=1s to T L Maximum lead temperature for soldering during 10s 260 C A C C Note 1 : Pulse waveform : 10/1000µs t r =10µs t p =1000µs %I PP tr tp t TEST CIRCUITS FOR I PP Longitudinal mode TIP IPP/2 R P See test circuit 3 IPP/2 R P THBT Transversal mode TIP or I PP R P THBT See test circuit 3 THERMAL RESISTANCES Symbol Parameter alue Unit R th (j-a) Junction to ambient 170 C/W 2/9

3 ELECTRICAL CHARACTERISTICS (T amb = 25 C) Symbol Parameter RM I RM R BR BO I H I BO F I PP C Stand-off voltage Leakage current at stand-off voltage Continuous Reverse voltage Breakdown voltage Breakover voltage Holding current Breakover current Forward voltage drop Peak pulse current Capacitance I PP I BO I H I R I THBTxxx11D RM BR BO STATIC PARAMETERS Type I RM I R I BO I H C max. max. note 1 max. note 2 min. max. min note 3 max note 4 µa µa ma ma ma pf THBT15011D THBT16011D THBT20011D THBT27011D Note 1: I R mesuared at R guarantees BR > R Note 2: Measured at 50 Hz (1 cycle) test circuit 1. Note 3: See the reference test circuit 2. Note 4: R = 1, F = 1MHz. DYNAMIC BREAKOER OLTAGES (Transversal mode) Type Symbol Test conditions (see note 5) Maximum Unit THBT15011D BO 10/700µs 1.5k R p =10Ω I PP =30A 1.2/50µs 1.5k R p =10Ω I PP =30A 2/10µs 2.5k R p =62Ω I PP =38A THBT16011D BO 10/700 µ s 1.5k R p =10Ω I PP =30A 1.2/50µs 1.5k R p =10Ω I PP =30A 2/10µs 2.5k R p =62Ω I PP =38A THBT20011D BO 10/700 µ s 1.5k R p =10Ω I PP =30A 1.2/50µs 1.5k R p =10Ω I PP =30A 2/10µs 2.5k R p =62Ω I PP =38A THBT27011D BO 10/700 µ s 1.5k R p =10Ω I PP =30A 1.2/50µs 1.5k R p =10Ω I PP =30A 2/10µs 2.5k R p =62Ω I PP =38A Note 5 : See test circuit 3 for BO dynamic parameters; R p is the protection resistor located on the line card /9

4 TEST CIRCUIT 1 for I BO and BO parameters : Auto Transformer 220/2A static relay. tp =20ms R1 140 R out K I BO measure D.U.T BO measure Transformer 220/800 5A TEST PROCEDURE : n n Pulse Test duration (tp = 20ms): - For Bidirectional devices = Switch K is closed - For Unidirectional devices = Switch K is open. OUT Selection - Device with BO < 200 olt - OUT = 250 RMS,R 1 = 140 Ω. - Device with BO 200 olt - OUT = 480 RMS,R 2 = 240 Ω. TEST CIRCUIT 2 for I H parameter. R BAT =-48 D.U.T. - P Surge generator This is a GO-NOGO test which allows to confirm the holding current (I H ) level in a functional test circuit. TEST PROCEDURE : n 1) Adjust the current level at the I H value by short circuiting the AK of the D.U.T. 2) Fire the D.U.T with a surge Current : Ipp = 10A, 10/1000 µs. 3) The D.U.T will come back off-state within 50 ms max. 4/9

5 TEST CIRCUIT 3 for I PP and BO parameters : (P is defined in no load condition) L R 2 R4 TIP R3 P C1 R 1 C2 Pulse (µs) p C 1 C 2 L R 1 R 2 R 3 R 4 I PP R p t r t p () (µf) (nf) (µh) (Ω) (Ω) (Ω) (Ω) (A) (Ω) /9

6 Fig. 1: Surge peak current versus overload duration. I TSM(A) F=50Hz Tj initial=25 C t(s) 0 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3 APPLICATION NOTE 1 Connect pins 2, 3, 6 and 7 to Ground in order to guarantee a good surge current capability for long duration disturbances. TIP 1 8 TIP 2 In order to take advantage of the" 4-point structure of the THBT, the TIP and lines have to cross the device. In this case, the device will eliminate the overvoltages generated by the parasitic inductances of the wiring (Ldi/dt), especially for very fast transients /9

7 APPLICATION CIRCUIT : 1 - Line card protection THBTxxx11D GENERATOR - BAT LINE A PTC T E S T R E L A Y S THBTxxxD RELAY 220 nf SLIC LINE B PTC LCP1511D 2 - Protection for telephone set with ground key LA HOOK SPEECH DIALING ER LB E THBTxxxD GROUND KEY 7/9

8 ORDER CODE BIDIRECTIONAL TRISIL BREAKDOWN OLTAGE THBT D RL ERSION PACKAGING: RL = tape and reel. = tube. LOW DYNAMIC CHARACTERISTICS. PACKAGE: 1 = SO8 Plastic. MARKING Types Package Marking THBT15011D SO-8 BT151D THBT16011D SO-8 BT161D THBT20011D SO-8 BT201D THBT27011D SO-8 BT271D MARKING : Logo, Date Code, Part Number. 8/9

9 PACKAGE MECHANICAL DATA. SO-8 Plastic b e e3 D 8 1 L c1 C a2 A a1 S E M 5 F 4 FOOT PRINT DIMENSIONS (in millimeters) a3 b1 REF. DIMENSIONS Millimetres Inches Min. Typ. Max. Min. Typ. Max. A a a b b C c1 45 (typ) D E e e F L M S 8 (max) Packaging : Products supplied in antistatic tubes or tape and reel. Weight : g Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners STMicroelectronics - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States 9/9

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