Atlas 46 novel negative tone photoresist which combines the good properties of the established SU-8 and CAR 44
|
|
- Arlene Barker
- 5 years ago
- Views:
Transcription
1 EIPBN, 30 th Mai 2018 Atlas 46 novel negative tone photoresist which combines the good properties of the established SU-8 and CAR 44 Dr. Christian Kaiser, Matthias Schirmer Allresist GmbH, Germany
2 Outline Short Introduction of Allresist GmbH Well-established CAR 44 for i-line and g-line Motivation/ Goal New development Atlas S and Atlas R PAG-variation to ensure h-line and g-line sensitivity 3D structures by variation of photoacid generator (PAG) 3D structures via double imprint lithography (University of Wuppertal) Fluorescent Atlas 46 S layers
3 Short Introduction of Allresist GmbH Founded 16th October in 1992, located in Strausberg, Germany Quality management system ISO 9001:2008 and ISO 14001:2004 Since 2006 on the way of business of excellence Global player with competent support (> 50 % export) Full equipment of resist characterization and modern analytic methodes Intense scientific cooperations with universities, institutes and industrial partners 32 scientific projects completed successfully Customer specific, taylor-made resists, short lead times
4 Well-established CAR 44 for i-line and g-line Turbine wheel produced with AR-N , thickness: 100 µm via double coating 3 µm resolution, pattern with AR-N , thickness: 15 µm Vertical profiles, AR-N , thickness: 55 µm Art work, pattern with AR-N Benefits High sensitivity, excellent resolution Suitable for g-line and X-ray as well Excellent properties for galvanic applications, vertical profiles, easy to remove Good plasma etching stability Drawbacks Compared to SU-8 lower stability Highest single layer up to 50 µm, SU-8: 200 µm
5 Motivation / Goal CAR 44 is a high quality negative resist but stability is insufficient for some applications Limitation of well-known SU-8: difficult to remove, low sensitivity at i-line Creating a resist with good properties similar to SU-8 with higher sensitivty at i-line and easy to remove Herein we like to present different versions of new Atlas 46: AR-N (Atlas 46 S) properties very similar to SU-8 (plug&play resist) AR-N (Atlas 46 R) removable resist version (e.g. for galvanic applications) SX AR-N /1 version with significantly enhanced sensitivity at i-line SX AR-N /1 h/g-line sensitive (e.g. for two-layer applications)
6 New development: Atlas 46 S / Atlas 46 R Suitable for applications with layers which need to remain permanently & resistively on substrate Sensitivity (broad band UV) 120 mj/cm² Depending on exposure dosage and PEB individually adjustable removability Sensitivity (broad band UV) 140 mj/cm² Resist thicknesses: 5 µm up to 200 µm (single coating step, temperature ramp recommended for thicker layers) Tg: 35 C 45 C, thermal stability (cross-linked): up to 300 C Developers for Atlas 46 S; strong: AR , weak: AR Developers for Atlas 46 R; strong: AR , weak: AR
7 New development: Atlas 46 S and Atlas 46 R Atlas 46 S: 40 s exposure, 5 95 C PEB hotplate, 60 s AR , (university of Halle) Atlas 46 R: 100 s exposure, 5 95 C PEB hotplate, 60 s AR (university of Halle) Resist thickness vs. solid content Correlation between film thickness and solid content comparable to SU-8 Well-defined line pattern with vertical walls
8 PAG-variation to ensure h-line and g-line sensitivity Red line: SX AR-N /1, enhanced i-line sensitivity (PAG3) Blue line: mercury lamp spectra PAG4 in SX AR-N /1 for h-/g-line sensitivity Atlas S/R and SU-8 relative low sensitivity at i-line (365nm) New PAG s suitable to enhance sensitivity at i-line: SX AR-N /1 PAG 4, for the first time h-/g-line (405 nm/436 nm) sensitivity established SX AR-N /1 provides access to new applications for 3d-patterning
9 3D structures by variation of PAG General process: substrate substrate substrate substrate substrate Coating layer 1, Soft bake Exposure 1 Cross-linking (PEB) Coating layer 2, Soft bake Exposure 2 Cross-linking (PEB) development First results for 2-layer system trenches; bottom: AR-N , top: SX AR-N /1 (i-line sensitive) First results for 2-layer system, trenches; bottom: SX AR-N , top: SX AR-N /1 (h-line / g-line sensitive) Atlas 46 S on bottom, SX AR-N /1 or SX AR-N /1 on top No significant intermixing between the different resists Combination of different resist versions allows generation of 3d architectures (e.g. bridged structures)
10 3D structures via double imprint lithography (University of Wuppertal) Process sequence suitable for different negative photoresists: a) definition of nano-structures in a negative tone photoresist via thermal imprint b) surface-near VUV flood exposure of the pre-patterned surface c) second imprint with microstructures Comparison NIL properties of SU-8, Atlas 46 S and CAR 44 - Double imprint lithography allowed a combination of nano- and micro structures - Requirement of different chemically amplified photoresists for pre-preparation of hierarchical structures: hardened nanostructures are most stable during second imprint - Comparable nanostructure stability between SU-8 and Atlas 46 S - Insufficient thermal stability with CAR [1] C. Steinberg; M. Papenheim; S. Wang; H.-C. Scheer, Microelectronic Engineering, 2016, 155, [2] C. Steinberg; M. Rumler; M. Runkel; M. Papenheim, S. Wang, A. Mayer; M. Becker; M. Rommel; H.-C. Scheer, Microelectronic Engineering, 2017, 176,
11 Fluorescent Atlas 46 S layers Different fluorescent layers of Atlas 46 S Various brilliant fluorescence dyes embedded in polymer matrix Suitable for photo resists (Atlas 46 S) and as well for ebeam resists (PMMA, CSAR 62) Lithographic application allow generation of fluorescent pattern (e.g. for microscopy) Multi-layer process for combination of different dyed architectures: overlapping or adjacent pattern Two different path ways: a) combination of ATLAS 46 versions optimized for different exposure wavelengths b) processing bottom layer (spin coating, exposure, PEB and development) following by patterning a top resist showing a different fluorescence Different fluorescence of the AR-Logo & lines (Atlas 46 S)
12 Many thanks for your attention!
MeRck. nlof 2000 Series. technical datasheet. Negative Tone Photoresists for Single Layer Lift-Off APPLICATION TYPICAL PROCESS
MeRck technical datasheet AZ Negative Tone Photoresists for Single Layer Lift-Off APPLICATION AZ i-line photoresists are engineered to simplify the historically complex image reversal and multilayer lift-off
More informationMeRck. AZ nlof technical datasheet. Negative Tone Photoresist for Single Layer Lift-Off APPLICATION TYPICAL PROCESS. SPIN CURVE (150MM Silicon)
MeRck technical datasheet AZ nlof 5510 Negative Tone Photoresist for Single Layer Lift-Off APPLICATION AZ nlof 5510 i-line photoresist is engineered to simplify the historically complex image reversal
More informationPHGN/CHEN/MLGN 435/535: Interdisciplinary Silicon Processing Laboratory. Simple Si solar Cell!
Where were we? Simple Si solar Cell! Two Levels of Masks - photoresist, alignment Etch and oxidation to isolate thermal oxide, deposited oxide, wet etching, dry etching, isolation schemes Doping - diffusion/ion
More informationLithography. 3 rd. lecture: introduction. Prof. Yosi Shacham-Diamand. Fall 2004
Lithography 3 rd lecture: introduction Prof. Yosi Shacham-Diamand Fall 2004 1 List of content Fundamental principles Characteristics parameters Exposure systems 2 Fundamental principles Aerial Image Exposure
More informationSection 2: Lithography. Jaeger Chapter 2 Litho Reader. The lithographic process
Section 2: Lithography Jaeger Chapter 2 Litho Reader The lithographic process Photolithographic Process (a) (b) (c) (d) (e) (f) (g) Substrate covered with silicon dioxide barrier layer Positive photoresist
More informationSection 2: Lithography. Jaeger Chapter 2 Litho Reader. EE143 Ali Javey Slide 5-1
Section 2: Lithography Jaeger Chapter 2 Litho Reader EE143 Ali Javey Slide 5-1 The lithographic process EE143 Ali Javey Slide 5-2 Photolithographic Process (a) (b) (c) (d) (e) (f) (g) Substrate covered
More informationPhotolithography I ( Part 1 )
1 Photolithography I ( Part 1 ) Chapter 13 : Semiconductor Manufacturing Technology by M. Quirk & J. Serda Bjørn-Ove Fimland, Department of Electronics and Telecommunication, Norwegian University of Science
More informationSection 2: Lithography. Jaeger Chapter 2. EE143 Ali Javey Slide 5-1
Section 2: Lithography Jaeger Chapter 2 EE143 Ali Javey Slide 5-1 The lithographic process EE143 Ali Javey Slide 5-2 Photolithographic Process (a) (b) (c) (d) (e) (f) (g) Substrate covered with silicon
More informationObducat NIL 6. Nanoimprinting with NRF s NIL 6
Obducat NIL 6 Substrates: pieces to 6 inch, hard or soft Thermal cure with PMMA, MR I 7010 etc Alignment to about 3 microns Temperature to 300 HC Pressure 15 to 80 bars Resolution < 50 nm possible Up to
More informationSemiconductor Manufacturing Technology. Semiconductor Manufacturing Technology. Photolithography: Resist Development and Advanced Lithography
Semiconductor Manufacturing Technology Michael Quirk & Julian Serda October 2001 by Prentice Hall Chapter 15 Photolithography: Resist Development and Advanced Lithography Eight Basic Steps of Photolithography
More informationPart 5-1: Lithography
Part 5-1: Lithography Yao-Joe Yang 1 Pattern Transfer (Patterning) Types of lithography systems: Optical X-ray electron beam writer (non-traditional, no masks) Two-dimensional pattern transfer: limited
More informationModule 11: Photolithography. Lecture11: Photolithography - I
Module 11: Photolithography Lecture11: Photolithography - I 1 11.0 Photolithography Fundamentals We will all agree that incredible progress is happening in the filed of electronics and computers. For example,
More informationMICRO AND NANOPROCESSING TECHNOLOGIES
MICRO AND NANOPROCESSING TECHNOLOGIES LECTURE 4 Optical lithography Concepts and processes Lithography systems Fundamental limitations and other issues Photoresists Photolithography process Process parameter
More informationEE143 Fall 2016 Microfabrication Technologies. Lecture 3: Lithography Reading: Jaeger, Chap. 2
EE143 Fall 2016 Microfabrication Technologies Lecture 3: Lithography Reading: Jaeger, Chap. 2 Prof. Ming C. Wu wu@eecs.berkeley.edu 511 Sutardja Dai Hall (SDH) 1-1 The lithographic process 1-2 1 Photolithographic
More informationDOE Project: Resist Characterization
DOE Project: Resist Characterization GOAL To achieve high resolution and adequate throughput, a photoresist must possess relatively high contrast and sensitivity to exposing radiation. The objective of
More informationMajor Fabrication Steps in MOS Process Flow
Major Fabrication Steps in MOS Process Flow UV light Mask oxygen Silicon dioxide photoresist exposed photoresist oxide Silicon substrate Oxidation (Field oxide) Photoresist Coating Mask-Wafer Alignment
More informationPhotolithography II ( Part 2 )
1 Photolithography II ( Part 2 ) Chapter 14 : Semiconductor Manufacturing Technology by M. Quirk & J. Serda Saroj Kumar Patra, Department of Electronics and Telecommunication, Norwegian University of Science
More informationContrast Enhancement Materials CEM 365HR
INTRODUCTION In 1989 Shin-Etsu Chemical acquired MicroSi, Inc. including their Contrast Enhancement Material (CEM) technology business*. A concentrated effort in the technology advancement of a CEM led
More informationDevelopment of a LFLE Double Pattern Process for TE Mode Photonic Devices. Mycahya Eggleston Advisor: Dr. Stephen Preble
Development of a LFLE Double Pattern Process for TE Mode Photonic Devices Mycahya Eggleston Advisor: Dr. Stephen Preble 2 Introduction and Motivation Silicon Photonics Geometry, TE vs TM, Double Pattern
More informationECSE 6300 IC Fabrication Laboratory Lecture 3 Photolithography. Lecture Outline
ECSE 6300 IC Fabrication Laboratory Lecture 3 Photolithography Prof. James J. Q. Lu Bldg. CII, Rooms 6229 Rensselaer Polytechnic Institute Troy, NY 12180 Tel. (518)276 2909 e mails: luj@rpi.edu http://www.ecse.rpi.edu/courses/s18/ecse
More informationProcess Optimization
Process Optimization Process Flow for non-critical layer optimization START Find the swing curve for the desired resist thickness. Determine the resist thickness (spin speed) from the swing curve and find
More informationi- Line Photoresist Development: Replacement Evaluation of OiR
i- Line Photoresist Development: Replacement Evaluation of OiR 906-12 Nishtha Bhatia High School Intern 31 July 2014 The Marvell Nanofabrication Laboratory s current i-line photoresist, OiR 897-10i, has
More informationOptical Bus for Intra and Inter-chip Optical Interconnects
Optical Bus for Intra and Inter-chip Optical Interconnects Xiaolong Wang Omega Optics Inc., Austin, TX Ray T. Chen University of Texas at Austin, Austin, TX Outline Perspective of Optical Backplane Bus
More informationPolymer optical waveguide based bi-directional optical bus architecture for high speed optical backplane
Polymer optical waveguide based bi-directional optical bus architecture for high speed optical backplane Xiaohui Lin a, Xinyuan Dou a, Alan X. Wang b and Ray T. Chen 1,*, Fellow, IEEE a Department of Electrical
More informationFabrication of suspended micro-structures using diffsuser lithography on negative photoresist
Journal of Mechanical Science and Technology 22 (2008) 1765~1771 Journal of Mechanical Science and Technology www.springerlink.com/content/1738-494x DOI 10.1007/s12206-008-0601-8 Fabrication of suspended
More informationPhotolithography Technology and Application
Photolithography Technology and Application Jeff Tsai Director, Graduate Institute of Electro-Optical Engineering Tatung University Art or Science? Lind width = 100 to 5 micron meter!! Resolution = ~ 3
More informationDesign Rules for Silicon Photonics Prototyping
Design Rules for licon Photonics Prototyping Version 1 (released February 2008) Introduction IME s Photonics Prototyping Service offers 248nm lithography based fabrication technology for passive licon-on-insulator
More informationPositive-Tone Photosensitive Polyimide Coatings for Lens Layer in image sensors. Introduction of the characteristic of CS-series
Positive-Tone Photosensitive Polyimide Coatings for Lens Layer in image sensors Photoneece CS-series Introduction of the characteristic of CS-series Toray Industries, Inc. 1 1 CS-7500 basic properties
More informationLecture 7. Lithography and Pattern Transfer. Reading: Chapter 7
Lecture 7 Lithography and Pattern Transfer Reading: Chapter 7 Used for Pattern transfer into oxides, metals, semiconductors. 3 types of Photoresists (PR): Lithography and Photoresists 1.) Positive: PR
More informationEE 143 Microfabrication Technology Fall 2014
EE 143 Microfabrication Technology Fall 2014 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 EE 143: Microfabrication
More informationPOLYMER MICROSTRUCTURE WITH TILTED MICROPILLAR ARRAY AND METHOD OF FABRICATING THE SAME
POLYMER MICROSTRUCTURE WITH TILTED MICROPILLAR ARRAY AND METHOD OF FABRICATING THE SAME Field of the Invention The present invention relates to a polymer microstructure. In particular, the present invention
More informationMICROBUMP LITHOGRAPHY FOR 3D STACKING APPLICATIONS
MICROBUMP LITHOGRAPHY FOR 3D STACKING APPLICATIONS Patrick Jaenen, John Slabbekoorn, Andy Miller IMEC Kapeldreef 75 B-3001 Leuven, Belgium millera@imec.be Warren W. Flack, Manish Ranjan, Gareth Kenyon,
More informationInnovation Creativity Customer-specific solutions. Product information. Positive E-Beam Resists AR-P 6200 (CSAR 62)
Product information Positive E-Beam Resists 6200 (CSAR 62) 1 THE ALLRESIST GMBH Company for chemical Products The executive board The company is represented worldwide with an extensive product range. In
More informationFabrication Techniques of Optical ICs
Fabrication Techniques of Optical ICs Processing Techniques Lift off Process Etching Process Patterning Techniques Photo Lithography Electron Beam Lithography Photo Resist ( Microposit MP1300) Electron
More informationUV LED ILLUMINATION STEPPER OFFERS HIGH PERFORMANCE AND LOW COST OF OWNERSHIP
UV LED ILLUMINATION STEPPER OFFERS HIGH PERFORMANCE AND LOW COST OF OWNERSHIP Casey Donaher, Rudolph Technologies Herbert J. Thompson, Rudolph Technologies Chin Tiong Sim, Rudolph Technologies Rudolph
More informationModule 11: Photolithography. Lecture 14: Photolithography 4 (Continued)
Module 11: Photolithography Lecture 14: Photolithography 4 (Continued) 1 In the previous lecture, we have discussed the utility of the three printing modes, and their relative advantages and disadvantages.
More informationKMPR 1010 Process for Glass Wafers
KMPR 1010 Process for Glass Wafers KMPR 1010 Steps Protocol Step System Condition Note Plasma Cleaning PVA Tepla Ion 10 5 mins Run OmniCoat Receipt Dehydration Any Heat Plate 150 C, 5 mins HMDS Coating
More informationMicro- and Nano- Fabrication and Replication Techniques
Micro- and Nano- Fabrication and Replication Techniques Why do we have to write thing small and replicate fast? Plenty of Room at the Bottom Richard P. Feynman, December 1959 How do we write it? We have
More informationIon Beam Lithography next generation nanofabrication
Ion Beam Lithography next generation nanofabrication EFUG Bordeaux 2011 ion beams develop Lloyd Peto IBL sales manager Copyright 2011 by Raith GmbH ionline new capabilities You can now Apply an ion beam
More information(Ar [ Si O Si O] m )n
The widespread adoption of advanced packaging techniques is primarily driven by electrical device performance and chip form factor considerations. Flip chip packaging is currently growing at a 27% compound
More informationThe Department of Advanced Materials Engineering. Materials and Processes in Polymeric Microelectronics
The Department of Advanced Materials Engineering Materials and Processes in Polymeric Microelectronics 1 Outline Materials and Processes in Polymeric Microelectronics Polymeric Microelectronics Process
More informationEG2605 Undergraduate Research Opportunities Program. Large Scale Nano Fabrication via Proton Lithography Using Metallic Stencils
EG2605 Undergraduate Research Opportunities Program Large Scale Nano Fabrication via Proton Lithography Using Metallic Stencils Tan Chuan Fu 1, Jeroen Anton van Kan 2, Pattabiraman Santhana Raman 2, Yao
More informationNanostencil Lithography and Nanoelectronic Applications
Microsystems Laboratory Nanostencil Lithography and Nanoelectronic Applications Oscar Vazquez, Marc van den Boogaart, Dr. Lianne Doeswijk, Prof. Juergen Brugger, LMIS1 Dr. Chan Woo Park, Visiting Professor
More informationHermetic Packaging Solutions using Borosilicate Glass Thin Films. Lithoglas Hermetic Packaging Solutions using Borosilicate Glass Thin Films
Hermetic Packaging Solutions using Borosilicate Glass Thin Films 1 Company Profile Company founded in 2006 ISO 9001:2008 qualified since 2011 Headquarters and Production in Dresden, Germany Production
More information(ksaligner & quintel resolution)
Process [4.10] (ksaligner & quintel resolution) 1.0 Process Summary 1.1 Since Karl Suss ksaligner is heavily used and Quintel aligner is not, nanolab decided to compare the 2 micron line resolution from
More informationA study on the fabrication method of middle size LGP using continuous micro-lenses made by LIGA reflow
Korea-Australia Rheology Journal Vol. 19, No. 3, November 2007 pp. 171-176 A study on the fabrication method of middle size LGP using continuous micro-lenses made by LIGA reflow Jong Sun Kim, Young Bae
More informationModule - 2 Lecture - 13 Lithography I
Nano Structured Materials-Synthesis, Properties, Self Assembly and Applications Prof. Ashok. K.Ganguli Department of Chemistry Indian Institute of Technology, Delhi Module - 2 Lecture - 13 Lithography
More informationOrganic Antireflective Coatings for Photomask Fabrication using Optical Pattern Generators
Organic Antireflective Coatings for Photomask Fabrication using Optical Pattern Generators Benjamen M. Rathsack 1, Cyrus E. Tabery 1, Cece Philbin 2, and C. Grant Willson 1 September 15, 1999 1 Department
More informationMICROSTRUCTURING OF METALLIC LAYERS FOR SENSOR APPLICATIONS
MICROSTRUCTURING OF METALLIC LAYERS FOR SENSOR APPLICATIONS Vladimír KOLAŘÍK, Stanislav KRÁTKÝ, Michal URBÁNEK, Milan MATĚJKA, Jana CHLUMSKÁ, Miroslav HORÁČEK, Institute of Scientific Instruments of the
More informationNovel EUV Resist Development for Sub-14nm Half Pitch
EUV Workshop 2015 Maui, HI P64 Novel EUV Resist Development for Sub-14nm Half Pitch Yoshi Hishiro JSR Micro Inc. EUV Workshop, June 17, 2015 1 Contents Requirement for sub-14nm HP EUV resist JSR strategy
More informationOn-chip 3D air core micro-inductor for high-frequency applications using deformation of sacrificial polymer
header for SPIE use On-chip 3D air core micro-inductor for high-frequency applications using deformation of sacrificial polymer Nimit Chomnawang and Jeong-Bong Lee Department of Electrical and Computer
More informationModeling and simulation of surface profile forming process of microlenses and their application in optical interconnection devices
Louisiana State University LSU Digital Commons LSU Doctoral Dissertations Graduate School 2013 Modeling and simulation of surface profile forming process of microlenses and their application in optical
More informationChapter 3 Fabrication
Chapter 3 Fabrication The total structure of MO pick-up contains four parts: 1. A sub-micro aperture underneath the SIL The sub-micro aperture is used to limit the final spot size from 300nm to 600nm for
More informationDevelopments, Applications and Challenges for the Industrial Implementation of Nanoimprint Lithography
Developments, Applications and Challenges for the Industrial Implementation of Nanoimprint Lithography Martin Eibelhuber, Business Development Manager m.eibelhuber@evgroup.com Outline Introduction Imprint
More informationSupplementary Materials for
www.sciencemag.org/cgi/content/full/science.1234855/dc1 Supplementary Materials for Taxel-Addressable Matrix of Vertical-Nanowire Piezotronic Transistors for Active/Adaptive Tactile Imaging Wenzhuo Wu,
More information3-5μm F-P Tunable Filter Array based on MEMS technology
Journal of Physics: Conference Series 3-5μm F-P Tunable Filter Array based on MEMS technology To cite this article: Wei Xu et al 2011 J. Phys.: Conf. Ser. 276 012052 View the article online for updates
More informationFabrication Methodology of microlenses for stereoscopic imagers using standard CMOS process. R. P. Rocha, J. P. Carmo, and J. H.
Fabrication Methodology of microlenses for stereoscopic imagers using standard CMOS process R. P. Rocha, J. P. Carmo, and J. H. Correia Department of Industrial Electronics, University of Minho, Campus
More informationAZ 1512 RESIST PHOTOLITHOGRAPHY
AZ 1512 RESIST PHOTOLITHOGRAPHY STANDARD OPERATIONAL PROCEDURE Faculty Supervisor: Prof. R. Bruce Darling Students: Katherine Lugo Danling Wang Department of Electrical Engineering Spring, 2009 TABLE OF
More informationClean Room Technology Optical Lithography. Lithography I. takenfrombdhuey
Clean Room Technology Optical Lithography Lithography I If the automobile had followed the same development cycle as the computer, a Rolls Royce would today cost $100, get a million miles per gallon, and
More informationTowards a fully integrated optical gyroscope using whispering gallery modes resonators
Towards a fully integrated optical gyroscope using whispering gallery modes resonators T. Amrane 1, J.-B. Jager 2, T. Jager 1, V. Calvo 2, J.-M. Leger 1 1 CEA, LETI, Grenoble, France. 2 CEA, INAC-SP2M
More informationDevice Fabrication: Photolithography
Device Fabrication: Photolithography 1 Objectives List the four components of the photoresist Describe the difference between +PR and PR Describe a photolithography process sequence List four alignment
More informationFeature-level Compensation & Control
Feature-level Compensation & Control 2 Sensors and Control Nathan Cheung, Kameshwar Poolla, Costas Spanos Workshop 11/19/2003 3 Metrology, Control, and Integration Nathan Cheung, UCB SOI Wafers Multi wavelength
More informationLecture 22 Optical MEMS (4)
EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie Lecture 22 Optical MEMS (4) Agenda: Refractive Optical Elements Microlenses GRIN Lenses Microprisms Reference: S. Sinzinger and J. Jahns,
More informationContrast Enhancement Materials CEM 365iS
INTRODUCTION In 1989 Shin-Etsu Chemical acquired MicroSi, Inc. and the Contrast Enhancement Material (CEM) technology business from General Electric including a series of patents and technologies*. A concentrated
More informationLecture 13 Basic Photolithography
Lecture 13 Basic Photolithography Chapter 12 Wolf and Tauber 1/64 Announcements Homework: Homework 3 is due today, please hand them in at the front. Will be returned one week from Thursday (16 th Nov).
More informationSU-8 Post Development Bake (Hard Bake) Study
University of Pennsylvania ScholarlyCommons Protocols and Reports Browse by Type 10-16-2017 Ram Surya Gona University of Pennsylvania, ramgona@seas.upenn.edu Eric D. Johnston Singh Center for Nanotechnology,
More informationInfinitely Precise. micrometal. excellence in etching
Infinitely Precise micrometal excellence in etching A High-Tech Profile Superfine structures and ultra-tight tolerances: precision is our business You give us the specs, and we etch to ultra-tight tolerances.
More informationPhotoresist Absorbance and Bleaching Laboratory
MCEE 505 Lithography Materials and Processes Page 1 of 5 Photoresist Absorbance and Bleaching Laboratory Microelectronic Engineering Rochester Institute of Technology 1. OBJECTIVE The objective of this
More informationFundamental Characterizations of Diamond Disc, Pad, and Retaining Ring Wear in Chemical Mechanical Planarization Processes
Fundamental Characterizations of Diamond Disc, Pad, and Retaining Ring Wear in Chemical Mechanical Planarization Processes Yun Zhuang 1,2, Len Borucki 1, Ara Philipossian 1,2 1. Araca, Inc., Tucson, Arizona
More informationPlan Optik AG. Plan Optik AG PRODUCT CATALOGUE
Plan Optik AG Plan Optik AG PRODUCT CATALOGUE 2 In order to service the high demand of wafers more quickly, Plan Optik provides off the shelf products in sizes from 2 up to 300mm diameter. Therefore Plan
More informationAcceleration of EUV Resist Development with EB Tool
C/N:1220710068 Acceleration of Resist Development with Tool Takeyoshi Mimura, Takako Suzuki, Makiko Irie, Takeshi Iwai TOKYO OHKA KOGYO CO., LTD. Advanced Material Development Division 1 2007 L Symposium
More informationUltra-violet lithography of thick photoresist for the applications in BioMEMS and micro optics
Louisiana State University LSU Digital Commons LSU Doctoral Dissertations Graduate School 2006 Ultra-violet lithography of thick photoresist for the applications in BioMEMS and micro optics Ren Yang Louisiana
More informationMidaz Micro-Slab DPSS Lasers:
Midaz Micro-Slab DPSS Lasers: Higher power & pulse rate for higher speed micromachining Professor Mike Damzen Midaz Laser Ltd 4 June 2008 AILU Meeting Industrial opportunities in laser micro and nano processing
More informationUV-dose indicator formulations as paint-onphotodetectors: way to optimize the UV curing process
UV-dose indicator formulations as paint-onphotodetectors: A convenient and quantitative way to optimize the UV curing process Katia Studer, Caroline Lordelot, Tunja Jung, Kurt Dietliker, Urs Lehmann, Peter
More informationCharacterization of a Thick Copper Pillar Bump Process
Characterization of a Thick Copper Pillar Bump Process Warren W. Flack, Ha-Ai Nguyen Ultratech, Inc. San Jose, CA 95126 Elliott Capsuto, Craig McEwen Shin-Etsu MicroSi, Inc. Phoenix, AZ 85044 Abstract
More informationOn-chip interrogation of a silicon-on-insulator microring resonator based ethanol vapor sensor with an arrayed waveguide grating (AWG) spectrometer
On-chip interrogation of a silicon-on-insulator microring resonator based ethanol vapor sensor with an arrayed waveguide grating (AWG) spectrometer Nebiyu A. Yebo* a, Wim Bogaerts, Zeger Hens b,roel Baets
More informationFabrication of micro injection mold with modified LIGA micro-lens pattern and its application to LCD-BLU
Vol. 19, No. 3, November 2007 pp. 165-169 Fabrication of micro injection mold with modified LIGA micro-lens pattern and its application to LCD-BLU Jong Sun Kim, Young Bae Ko, Chul Jin Hwang, Jong Deok
More information5. Lithography. 1. photolithography intro: overall, clean room 2. principle 3. tools 4. pattern transfer 5. resolution 6. next-gen
5. Lithography 1. photolithography intro: overall, clean room 2. principle 3. tools 4. pattern transfer 5. resolution 6. next-gen References: Semiconductor Devices: Physics and Technology. 2 nd Ed. SM
More informationExperimental measurement of photoresist modulation curves
Experimental measurement of photoresist modulation curves Anatoly Bourov *a,c, Stewart A. Robertson b, Bruce W. Smith c, Michael Slocum c, Emil C. Piscani c a Rochester Institute of Technology, 82 Lomb
More informationLaser patterning and projection lithography
Introduction to Nanofabrication Techniques: Laser patterning and projection lithography Benjamin Johnston Macquarie University David O Connor Bandwidth Foundry - USYD The OptoFab node of ANFF Broad ranging
More informationA Novel Resist Freeze Process for Double Imaging
A Novel Resist Freeze Process for Double Imaging David J. Abdallah, Eric Alemy, Srinivasan Chakrapani, Munirathna Padmanaban and Ralph R. Dammel AZ Electronic Materials Somerville, NJ USA 1 st exp 2 nd
More informationMicro- and Nano-Technology... for Optics
Micro- and Nano-Technology...... for Optics 3.2 Lithography U.D. Zeitner Fraunhofer Institut für Angewandte Optik und Feinmechanik Jena Printing on Stones Map of Munich Stone Print Shadow Printing Photomask
More informationForming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging
2017 IEEE 67th Electronic Components and Technology Conference Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging Yew Wing Leong, Hsiang Yao Hsiao, Soon
More informationQuantized patterning using nanoimprinted blanks
IOP PUBLISHING Nanotechnology 20 (2009) 155303 (7pp) Quantized patterning using nanoimprinted blanks NANOTECHNOLOGY doi:10.1088/0957-4484/20/15/155303 Stephen Y Chou 1, Wen-Di Li and Xiaogan Liang NanoStructure
More informationOptical Issues in Photolithography
OpenStax-CNX module: m25448 1 Optical Issues in Photolithography Andrew R. Barron This work is produced by OpenStax-CNX and licensed under the Creative Commons Attribution License 3.0 note: This module
More informationSupplementary Materials for
advances.sciencemag.org/cgi/content/full/2/7/e1629/dc1 Supplementary Materials for Subatomic deformation driven by vertical piezoelectricity from CdS ultrathin films Xuewen Wang, Xuexia He, Hongfei Zhu,
More informationLow aberration monolithic diffraction gratings for high performance optical spectrometers
Low aberration monolithic diffraction gratings for high performance optical spectrometers Peter Triebel, Tobias Moeller, Torsten Diehl; Carl Zeiss Spectroscopy GmbH (Germany) Alexandre Gatto, Alexander
More informationBI-LAYER DEEP UV RESIST SYSTEM. Mark A. Boehm 5th Year Microelectronic Engineering Student Rochester Institute of Technology ABSTRACT
INTRODUCTION BI-LAYER DEEP UV RESIST SYSTEM Mark A. Boehm 5th Year Microelectronic Engineering Student Rochester Institute of Technology ABSTRACT A portable conformable mask (PCM) system employing KTIS2O
More informationMLA 150 (DLA) Presentation and examples. Théophane Besson, , Heidelberg Instruments GmbH 1
MLA 150 (DLA) Presentation and examples Théophane Besson, 17.03.2015, Heidelberg Instruments GmbH 1 Presentation of the tool The MLA 150 (named DLA in the past) is a new generation Maskless Aligner developed
More informationMicro/Nanolithography
Dale E. Ewbank dale.ewbank@rit.edu unl081413_microe.ppt 2013 Dale E. Ewbank page 1 OUTLINE Masks Optical Lithography Photoresist Sensitivity Processing Exposure Tools Advanced Processes page 2 MICROLITHOGRAPHY
More informationDevelopment of Nanoimprint Mold Using JBX-9300FS
Development of Nanoimprint Mold Using JBX-9300FS Morihisa Hoga, Mikio Ishikawa, Naoko Kuwahara Tadahiko Takikawa and Shiho Sasaki Dai Nippon Printing Co., Ltd Research & Development Center Electronic Device
More informationCERIDUST. Micronized Wax for Printing Inks. Public. BU Additives BL Waxes Technical Marketing Formulators/Coatings&Inks
CERIDUST Micronized Wax for Printing Inks Public BU Additives BL Waxes Technical Marketing Formulators/Coatings&Inks 27.11.2014 2 Table of Contents Introduction Which effects are provided by CERIDUST in
More informationApplications of Maskless Lithography for the Production of Large Area Substrates Using the SF-100 ELITE. Jay Sasserath, PhD
Applications of Maskless Lithography for the Production of Large Area Substrates Using the SF-100 ELITE Executive Summary Jay Sasserath, PhD Intelligent Micro Patterning LLC St. Petersburg, Florida Processing
More informationNegative tone development process for double patterning
Negative tone development process for double patterning FUJIFILM Corporation Electronic Materials Research Laboratories P-1 Outline 1. Advantages of negative tone imaging for DP 2. Resist material progress
More informationKey Photolithographic Outputs
Exposure latitude Depth of Focus Exposure latitude Vs DOF plot Linearity and MEEF Isolated-Dense Bias NILS Contrast Swing Curve Reflectivity Curve 1 Exposure latitude:the range of exposure energies (usually
More informationIntegrated Focusing Photoresist Microlenses on AlGaAs Top-Emitting VCSELs
Integrated Focusing Photoresist Microlenses on AlGaAs Top-Emitting VCSELs Andrea Kroner We present 85 nm wavelength top-emitting vertical-cavity surface-emitting lasers (VCSELs) with integrated photoresist
More informationPolymeric waveguides with embedded micromirrors formed by Metallic Hard Mold
Polymeric waveguides with embedded micromirrors formed by Metallic Hard Mold Xinyuan Dou a, Xiaolong Wang b, Haiyu Huang a, Xiaohui Lin a, Duo Ding a, David Z. Pan a and Ray T. Chen a* a Department of
More informationNanophotonic Waveguides and Photonic Crystals in Silicon-on-Insulator
Nanophotonic Waveguides and Photonic Crystals in Silicon-on-Insulator Wim Bogaerts 19 April 2004 Photonics Research Group http://photonics.intec.ugent.be nano = small photon = elementary on a scale of
More informationplasmonic nanoblock pair
Nanostructured potential of optical trapping using a plasmonic nanoblock pair Yoshito Tanaka, Shogo Kaneda and Keiji Sasaki* Research Institute for Electronic Science, Hokkaido University, Sapporo 1-2,
More informationTHE USE OF A CONTRAST ENHANCEMENT LAYER TO EXTEND THE PRACTICAL RESOLUTION LIMITS OF OPTICAL LITHOGRAPHIC SYSTEMS
THE USE OF A CONTRAST ENHANCEMENT LAYER TO EXTEND THE PRACTICAL RESOLUTION LIMITS OF OPTICAL LITHOGRAPHIC SYSTEMS Daniel R. Sutton 5th Year Microelectronic Engineering Student Rochester Institute of Technology
More information