Towards a fully integrated optical gyroscope using whispering gallery modes resonators
|
|
|
- Jennifer Boone
- 5 years ago
- Views:
Transcription
1 Towards a fully integrated optical gyroscope using whispering gallery modes resonators T. Amrane 1, J.-B. Jager 2, T. Jager 1, V. Calvo 2, J.-M. Leger 1 1 CEA, LETI, Grenoble, France. 2 CEA, INAC-SP2M / SiNaPS, Grenoble, France October 9th, 2014.
2 Outline 1. Introduction 2. The Whispering Gallery Modes Resonators design optimization for the gyroscope application 3. Development of a specific packaging to be able to rotate the device 4. The detection steps towards rotation rate measurements 5. Conclusion
3 Motivations Best performances of optical gyroscope (RLG, IFOG): Resolution < /h Sensitive part size ~ 200 cm 3 IFOG, IXblue How to reach smaller dimensions with optical gyroscopes? Resonators with high Q D factor are requested to develop an IORG with high performances Tassadit AMRANE - ICSO2014 Tenerife, Spain. 3
4 A promising resonator for the development of an IORG The SiO 2 Whispering Gallery Modes Resonator (WGMR) on Si 100 µm Distinctive features : High Q (up to already demonstrated) Integrated on silicon substrate (CMOS compatible) Our preliminary objectives: Resolution performances 1 /h Small size ~ 2 cm 3 Tassadit AMRANE - ICSO2014 Tenerife, Spain. 4
5 Transmission Transmission The WGMR and the Sagnac effect n air = 1 CW Ω n SiO2 = 1.45 Resonant modes localization CCW 100 µm n Si = 3.5 Stationary system Ω = 0 Rotating system Ω 0 CCW CW CCW CW Resonance modes frequencies Tassadit AMRANE - ICSO2014 Tenerife, Spain. 5
6 Outline 1. Introduction 2. The Whispering Gallery Modes Resonators design optimization for the gyroscope application 3. Development of a specific packaging to be able to rotate the Whispering Gallery Modes Resonators 4. The detection steps towards rotation rate measurements 5. Conclusion
7 The WGMR fabrication: the initial process flow 3 µm SiO 2 Si substrate 1) Thermal SiO 2 on Si substrate Photoresist 2) Photolithography step 3) SiO 2 wet etching 4) Silicon Reactive Ion Etching by SF 6 gas 5) Photoresist removing alcohol bath Tassadit AMRANE - ICSO2014 Tenerife, Spain. 7
8 Normalized transmission The resonator quality resulting from the initial process flow 0,98 0, µm 0,94 0,92 0,90 Q = , , , ,36 Wavelength (nm) The roughness at the edge impacts the Q factor 5 µm Tassadit AMRANE - ICSO2014 Tenerife, Spain. 8
9 The new process flow: the additional steps 3 µm SiO 2 Si substrate 1) Thermal SiO 2 on Si substrat 2) Dry oxidation (24h at 1000 C) remove the impurities in the SiO 2 layer Diffusion Q Photoresist 3) Photolithography step 4) Oxygen plasma and a post bake at 120 C enhance the photoresist pads definition 5) SiO 2 wet etching Interface roughness Q 6) Acid cleaning + oxygen plasma avoid particles contaminants on the resonator Diffusion sources Q 7) Silicon Reactive Ion Etching by SF 6 gas Tassadit AMRANE - ICSO2014 Tenerife, Spain. 9
10 Normalized transmission The resonator resulting from the new process flow 0,70 0, µm 0,64 0,62 0,60 Q = , , , ,43 Wavelength (nm) Smoother surface 5 µm Higher Q factor Tassadit AMRANE - ICSO2014 Tenerife, Spain. 10
11 Normalized transmission Normalized transmission The characterization results 5 µm 5 µm 0,98 0,70 0,96 0,68 0,94 0,92 Q = ,64 0,62 Q = , , , , ,36 Wavelength (nm) 0, , , , ,43 Wavelength (nm) The Q factor is multiplied by ~ 10 Tassadit AMRANE - ICSO2014 Tenerife, Spain. 11
12 Normalized transmission Our current performances vs objectives 2 mm 0,95 0,94 0,93 5 mm diameter resonators Latest First results with updated process 0,92 0,91 0,90 Q = , , , ,572 Wavelength (nm) Objective Thicker SiO 2 layer with less impurities To further gain a factor of 10 Tassadit AMRANE - ICSO2014 Tenerife, Spain. 12
13 Outline 1. Introduction 2. The Whispering Gallery Modes Resonators design optimization for the gyroscope application 3. Development of a specific packaging to be able to rotate the Whispering Gallery Modes Resonators 4. The detection steps towards rotation rate measurements 5. Conclusion
14 The initial coupling system The spectral response depends on the gap distance between the resonator and the suspended tapered fiber Evanescent coupling g = 2 µm g = 1 µm gap distance Any vibration will impact the measurements It is not possible to rotate the device Tassadit AMRANE - ICSO2014 Tenerife, Spain. 14
15 The coupling system adaptation for the gyroscope application The unpackaged coupling system Open environment The tapered fiber is suspended and dissociated from the resonator The optical properties are not stable when the device is moving Encapsulation in a low refractive index polymer Polymer Fix the gap distance Keep the light confinement The device can be rotated without modifying the coupling characteristics Tassadit AMRANE - ICSO2014 Tenerife, Spain. 15
16 Normalized transmission The influence of the encapsulation Polymer MY132 A, n = 1.32 n = 1.32 instead of 1 Stronger coupling Slight decrease of the Q factor (~40%) Wavelength (nm) The device can now be characterized in rotation in a proof of concept test setup Tassadit AMRANE - ICSO2014 Tenerife, Spain. 16
17 Outline 1. Introduction 2. The Whispering Gallery Modes Resonators design optimization for the gyroscope application 3. Development of a specific packaging to be able to rotate the Whispering Gallery Modes Resonators 4. The detection steps towards rotation rate measurements 5. Conclusion
18 Towards Sagnac detection measurements 1. Obtain identical resonant modes characteristics for CW and CCW lightwaves Implement a setup to obtain simultaneous and identical CW and CCW spectral responses 2. Follow the resonance frequencies evolution resulting from the rotation (Sagnac shift) Lock-on CW and CCW resonances frequencies 3. Define and test a closed-loop system architecture Define compensation of all the noise sources Define final measurement protocole Tassadit AMRANE - ICSO2014 Tenerife, Spain. 18
19 Identical CW and CCW mode characteristics is mandatory 5 mm 3 µm Tapered fiber WGMR Identical CW and CCW lightwaves spectral responses characteristics have been simultaneously obtained Tassadit AMRANE - ICSO2014 Tenerife, Spain. 19
20 Towards lock-on the CW and CCW resonance frequencies SG Laser Oscilloscope The positioning stage The sample LIA PMs Tassadit AMRANE - ICSO2014 Tenerife, Spain. 20
21 Transmitted signal (V) Towards lock-on the CW and CCW resonance frequencies f m = 10 MHz V pp = 2.45 V Resonant peaks CW Error signals CCW D = 5 mm Q = The CW and CCW resonances error signals have been obtained: Locking on CW and CCW resonances is now possible and relative Sagnac frequency shift measurement resulting from a rotation can be achieved ΔV Δf The detection sensitivity ΔV/Δf: 5 60 Hz/ /s Tassadit AMRANE - ICSO2014 Tenerife, Spain. 21
22 Summary Towards using SiO 2 WGMR in IORG, we have successfully : Adapted WGMR characteristics to the application constraints, i.e. increased the Q D product with and upgraded process flow Initial results First results with upgraded process Current results with upgraded process Final objective QxD , > 10 6 Ω SN 5x10 4 /h 125 /h 25 /h < 1 /h We are currently at the same order of magnitude as the state of the art for IORG but with a smaller sensitive part (d=5 mm vs 2.5 cm for H. Ma and 4 cm for M. Lei) Developped a dedicated packaging to be able to rotate the device for a proof of concept demonstration Implemented the first steps for a dedicated setup to measure the Sagnac shift Tassadit AMRANE - ICSO2014 Tenerife, Spain. 22
23 Thanks for your attention
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 2010 Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 2010 Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging Christophe Kopp, St ephane Bernab e, Badhise Ben Bakir,
Numerical Analysis and Optimization of a Multi-Mode Interference Polarization Beam Splitter
Numerical Analysis and Optimization of a Multi-Mode Interference Polarization Beam Splitter Y. D Mello*, J. Skoric, M. Hui, E. Elfiky, D. Patel, D. Plant Department of Electrical Engineering, McGill University,
Part 5-1: Lithography
Part 5-1: Lithography Yao-Joe Yang 1 Pattern Transfer (Patterning) Types of lithography systems: Optical X-ray electron beam writer (non-traditional, no masks) Two-dimensional pattern transfer: limited
64 Channel Flip-Chip Mounted Selectively Oxidized GaAs VCSEL Array
64 Channel Flip-Chip Mounted Selectively Oxidized GaAs VCSEL Array 69 64 Channel Flip-Chip Mounted Selectively Oxidized GaAs VCSEL Array Roland Jäger and Christian Jung We have designed and fabricated
FABRICATION OF CMOS INTEGRATED CIRCUITS. Dr. Mohammed M. Farag
FABRICATION OF CMOS INTEGRATED CIRCUITS Dr. Mohammed M. Farag Outline Overview of CMOS Fabrication Processes The CMOS Fabrication Process Flow Design Rules Reference: Uyemura, John P. "Introduction to
A thin foil optical strain gage based on silicon-on-insulator microresonators
A thin foil optical strain gage based on silicon-on-insulator microresonators D. Taillaert* a, W. Van Paepegem b, J. Vlekken c, R. Baets a a Photonics research group, Ghent University - INTEC, St-Pietersnieuwstraat
CHAPTER 2 POLARIZATION SPLITTER- ROTATOR BASED ON A DOUBLE- ETCHED DIRECTIONAL COUPLER
CHAPTER 2 POLARIZATION SPLITTER- ROTATOR BASED ON A DOUBLE- ETCHED DIRECTIONAL COUPLER As we discussed in chapter 1, silicon photonics has received much attention in the last decade. The main reason is
Module 11: Photolithography. Lecture 14: Photolithography 4 (Continued)
Module 11: Photolithography Lecture 14: Photolithography 4 (Continued) 1 In the previous lecture, we have discussed the utility of the three printing modes, and their relative advantages and disadvantages.
EE C245 ME C218 Introduction to MEMS Design
EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 21: Gyros
Nano-structured superconducting single-photon detector
Nano-structured superconducting single-photon detector G. Gol'tsman *a, A. Korneev a,v. Izbenko a, K. Smirnov a, P. Kouminov a, B. Voronov a, A. Verevkin b, J. Zhang b, A. Pearlman b, W. Slysz b, and R.
Mode analysis of Oxide-Confined VCSELs using near-far field approaches
Annual report 998, Dept. of Optoelectronics, University of Ulm Mode analysis of Oxide-Confined VCSELs using near-far field approaches Safwat William Zaki Mahmoud We analyze the transverse mode structure
Photonic Crystal Slot Waveguide Spectrometer for Detection of Methane
Photonic Crystal Slot Waveguide Spectrometer for Detection of Methane Swapnajit Chakravarty 1, Wei-Cheng Lai 2, Xiaolong (Alan) Wang 1, Che-Yun Lin 2, Ray T. Chen 1,2 1 Omega Optics, 10306 Sausalito Drive,
Development of a LFLE Double Pattern Process for TE Mode Photonic Devices. Mycahya Eggleston Advisor: Dr. Stephen Preble
Development of a LFLE Double Pattern Process for TE Mode Photonic Devices Mycahya Eggleston Advisor: Dr. Stephen Preble 2 Introduction and Motivation Silicon Photonics Geometry, TE vs TM, Double Pattern
Supplementary Figure 1 Reflective and refractive behaviors of light with normal
Supplementary Figures Supplementary Figure 1 Reflective and refractive behaviors of light with normal incidence in a three layer system. E 1 and E r are the complex amplitudes of the incident wave and
CMOS Digital Integrated Circuits Lec 2 Fabrication of MOSFETs
CMOS Digital Integrated Circuits Lec 2 Fabrication of MOSFETs 1 CMOS Digital Integrated Circuits 3 rd Edition Categories of Materials Materials can be categorized into three main groups regarding their
Design and fabrication of indium phosphide air-bridge waveguides with MEMS functionality
Design and fabrication of indium phosphide air-bridge waveguides with MEMS functionality Wing H. Ng* a, Nina Podoliak b, Peter Horak b, Jiang Wu a, Huiyun Liu a, William J. Stewart b, and Anthony J. Kenyon
Horizontal single and multiple slot waveguides: optical transmission at λ = 1550 nm
Horizontal single and multiple slot waveguides: optical transmission at λ = 1550 nm Rong Sun 1 *, Po Dong 2 *, Ning-ning Feng 1, Ching-yin Hong 1, Jurgen Michel 1, Michal Lipson 2, Lionel Kimerling 1 1Department
Fabrication of Silicon Master Using Dry and Wet Etching for Optical Waveguide by Thermal Embossing Technique
Sensors and Materials, Vol. 18, No. 3 (2006) 125 130 MYU Tokyo 125 S & M 0636 Fabrication of Silicon Master Using Dry and Wet Etching for Optical Waveguide by Thermal Embossing Technique Jung-Hun Kim,
CHIRPED FIBER BRAGG GRATING (CFBG) BY ETCHING TECHNIQUE FOR SIMULTANEOUS TEMPERATURE AND REFRACTIVE INDEX SENSING
CHIRPED FIBER BRAGG GRATING (CFBG) BY ETCHING TECHNIQUE FOR SIMULTANEOUS TEMPERATURE AND REFRACTIVE INDEX SENSING Siti Aisyah bt. Ibrahim and Chong Wu Yi Photonics Research Center Department of Physics,
Fabrication Techniques of Optical ICs
Fabrication Techniques of Optical ICs Processing Techniques Lift off Process Etching Process Patterning Techniques Photo Lithography Electron Beam Lithography Photo Resist ( Microposit MP1300) Electron
Supplementary information for Stretchable photonic crystal cavity with
Supplementary information for Stretchable photonic crystal cavity with wide frequency tunability Chun L. Yu, 1,, Hyunwoo Kim, 1, Nathalie de Leon, 1,2 Ian W. Frank, 3 Jacob T. Robinson, 1,! Murray McCutcheon,
This writeup is adapted from Fall 2002, final project report for by Robert Winsor.
Optical Waveguides in Andreas G. Andreou This writeup is adapted from Fall 2002, final project report for 520.773 by Robert Winsor. September, 2003 ABSTRACT This lab course is intended to give students
Section 2: Lithography. Jaeger Chapter 2 Litho Reader. The lithographic process
Section 2: Lithography Jaeger Chapter 2 Litho Reader The lithographic process Photolithographic Process (a) (b) (c) (d) (e) (f) (g) Substrate covered with silicon dioxide barrier layer Positive photoresist
OPTI510R: Photonics. Khanh Kieu College of Optical Sciences, University of Arizona Meinel building R.626
OPTI510R: Photonics Khanh Kieu College of Optical Sciences, University of Arizona kkieu@optics.arizona.edu Meinel building R.626 Announcements Homework #3 is due today No class Monday, Feb 26 Pre-record
The HGTD: A SOI Power Diode for Timing Detection Applications
The HGTD: A SOI Power Diode for Timing Detection Applications Work done in the framework of RD50 Collaboration (CERN) M. Carulla, D. Flores, S. Hidalgo, D. Quirion, G. Pellegrini IMB-CNM (CSIC), Spain
Section 2: Lithography. Jaeger Chapter 2 Litho Reader. EE143 Ali Javey Slide 5-1
Section 2: Lithography Jaeger Chapter 2 Litho Reader EE143 Ali Javey Slide 5-1 The lithographic process EE143 Ali Javey Slide 5-2 Photolithographic Process (a) (b) (c) (d) (e) (f) (g) Substrate covered
Deliverable D5.2 DEMO chip processing option 3
Deliverable D5.2 DEMO chip processing option 3 Deliverable D5.2 DEMO chip processing Option 3 Date: 22-03-2017 PiezoMAT 2017-03-22_Delivrable_D5.2 Author(s): E.Saoutieff; M.Allain (CEA) Participant(s):
Influence of dielectric substrate on the responsivity of microstrip dipole-antenna-coupled infrared microbolometers
Influence of dielectric substrate on the responsivity of microstrip dipole-antenna-coupled infrared microbolometers Iulian Codreanu and Glenn D. Boreman We report on the influence of the dielectric substrate
A-CUBE-Series High Sensitivity APD Detector Modules
Series Description Laser Components new A-CUBE range of APD modules has been designed for customers interested in experimenting with APDs. Featuring a low-noise silicon (or InGaAs) APD with matched preamplifier
Improved Output Performance of High-Power VCSELs
Improved Output Performance of High-Power VCSELs 15 Improved Output Performance of High-Power VCSELs Michael Miller This paper reports on state-of-the-art single device high-power vertical-cavity surfaceemitting
Major Fabrication Steps in MOS Process Flow
Major Fabrication Steps in MOS Process Flow UV light Mask oxygen Silicon dioxide photoresist exposed photoresist oxide Silicon substrate Oxidation (Field oxide) Photoresist Coating Mask-Wafer Alignment
New advances in silicon photonics Delphine Marris-Morini
New advances in silicon photonics Delphine Marris-Morini P. Brindel Alcatel-Lucent Bell Lab, Nozay, France New Advances in silicon photonics D. Marris-Morini, L. Virot*, D. Perez-Galacho, X. Le Roux, D.
Design of Clamped-Clamped Beam Resonator in Thick-Film Epitaxial Polysilicon Technology
Design of Clamped-Clamped Beam Resonator in Thick-Film Epitaxial Polysilicon Technology D. Galayko, A. Kaiser, B. Legrand, L. Buchaillot, D. Collard, C. Combi IEMN-ISEN UMR CNRS 8520 Lille, France ST MICROELECTRONICS
NEXT GENERATION SILICON PHOTONICS FOR COMPUTING AND COMMUNICATION PHILIPPE ABSIL
NEXT GENERATION SILICON PHOTONICS FOR COMPUTING AND COMMUNICATION PHILIPPE ABSIL OUTLINE Introduction Platform Overview Device Library Overview What s Next? Conclusion OUTLINE Introduction Platform Overview
EE143 Fall 2016 Microfabrication Technologies. Lecture 3: Lithography Reading: Jaeger, Chap. 2
EE143 Fall 2016 Microfabrication Technologies Lecture 3: Lithography Reading: Jaeger, Chap. 2 Prof. Ming C. Wu wu@eecs.berkeley.edu 511 Sutardja Dai Hall (SDH) 1-1 The lithographic process 1-2 1 Photolithographic
High-efficiency, high-speed VCSELs with deep oxidation layers
Manuscript for Review High-efficiency, high-speed VCSELs with deep oxidation layers Journal: Manuscript ID: Manuscript Type: Date Submitted by the Author: Complete List of Authors: Keywords: Electronics
Si and InP Integration in the HELIOS project
Si and InP Integration in the HELIOS project J.M. Fedeli CEA-LETI, Grenoble ( France) ECOC 2009 1 Basic information about HELIOS HELIOS photonics ELectronics functional Integration on CMOS www.helios-project.eu
On-chip Si-based Bragg cladding waveguide with high index contrast bilayers
On-chip Si-based Bragg cladding waveguide with high index contrast bilayers Yasha Yi, Shoji Akiyama, Peter Bermel, Xiaoman Duan, and L. C. Kimerling Massachusetts Institute of Technology, 77 Massachusetts
Miniature Mid-Infrared Thermooptic Switch with Photonic Crystal Waveguide Based Silicon-on-Sapphire Mach Zehnder Interferometers
Miniature Mid-Infrared Thermooptic Switch with Photonic Crystal Waveguide Based Silicon-on- Mach Zehnder Interferometers Yi Zou, 1,* Swapnajit Chakravarty, 2,* Chi-Jui Chung, 1 1, 2, * and Ray T. Chen
High Power RF MEMS Switch Technology
High Power RF MEMS Switch Technology Invited Talk at 2005 SBMO/IEEE MTT-S International Conference on Microwave and Optoelectronics Conference Dr Jia-Sheng Hong Heriot-Watt University Edinburgh U.K. 1
Section 2: Lithography. Jaeger Chapter 2. EE143 Ali Javey Slide 5-1
Section 2: Lithography Jaeger Chapter 2 EE143 Ali Javey Slide 5-1 The lithographic process EE143 Ali Javey Slide 5-2 Photolithographic Process (a) (b) (c) (d) (e) (f) (g) Substrate covered with silicon
Microphotonics Readiness for Commercial CMOS Manufacturing. Marco Romagnoli
Microphotonics Readiness for Commercial CMOS Manufacturing Marco Romagnoli MicroPhotonics Consortium meeting MIT, Cambridge October 15 th, 2012 Passive optical structures based on SOI technology Building
Convergence Challenges of Photonics with Electronics
Convergence Challenges of Photonics with Electronics Edward Palen, Ph.D., P.E. PalenSolutions - Optoelectronic Packaging Consulting www.palensolutions.com palensolutions@earthlink.net 415-850-8166 October
EE C245 / ME C218 INTRODUCTION TO MEMS DESIGN FALL 2011 PROBLEM SET #2. Due (at 7 p.m.): Tuesday, Sept. 27, 2011, in the EE C245 HW box in 240 Cory.
Issued: Tuesday, Sept. 13, 2011 PROBLEM SET #2 Due (at 7 p.m.): Tuesday, Sept. 27, 2011, in the EE C245 HW box in 240 Cory. 1. Below in Figure 1.1 is a description of a DRIE silicon etch using the Marvell
Realization of Polarization-Insensitive Optical Polymer Waveguide Devices
644 Realization of Polarization-Insensitive Optical Polymer Waveguide Devices Kin Seng Chiang,* Sin Yip Cheng, Hau Ping Chan, Qing Liu, Kar Pong Lor, and Chi Kin Chow Department of Electronic Engineering,
On-chip interrogation of a silicon-on-insulator microring resonator based ethanol vapor sensor with an arrayed waveguide grating (AWG) spectrometer
On-chip interrogation of a silicon-on-insulator microring resonator based ethanol vapor sensor with an arrayed waveguide grating (AWG) spectrometer Nebiyu A. Yebo* a, Wim Bogaerts, Zeger Hens b,roel Baets
Figure 7 Dynamic range expansion of Shack- Hartmann sensor using a spatial-light modulator
Figure 4 Advantage of having smaller focal spot on CCD with super-fine pixels: Larger focal point compromises the sensitivity, spatial resolution, and accuracy. Figure 1 Typical microlens array for Shack-Hartmann
LETI S SOLUTIONS FOR TERAHERTZ REAL-TIME IMAGING. Leti Photonics Workshop Simoens François February 1st, 2017
LETI S SOLUTIONS FOR TERAHERTZ REAL-TIME IMAGING OUTLINE What & why Terahertz? THz imaging technologies developed at Leti Examples of real-time imaging applications Leti s offer to industrials Conclusion
A Low-cost Through Via Interconnection for ISM WLP
A Low-cost Through Via Interconnection for ISM WLP Jingli Yuan, Won-Kyu Jeung, Chang-Hyun Lim, Seung-Wook Park, Young-Do Kweon, Sung Yi To cite this version: Jingli Yuan, Won-Kyu Jeung, Chang-Hyun Lim,
OptiSPICE applications: Ring Resonator Gyroscope 22 February 2017 (Version 1.1) Cem Bonfil
OptiSPICE applications: Ring Resonator Gyroscope 22 February 2017 (Version 1.1) Cem Bonfil 7 Capella Court Nepean, ON, Canada K2E 7X1 +1 (613) 224-4700 www.optiwave.com 2009 Optiwave Systems, Inc. Fiber
Supporting Information: Plasmonic and Silicon Photonic Waveguides
Supporting Information: Efficient Coupling between Dielectric-Loaded Plasmonic and Silicon Photonic Waveguides Ryan M. Briggs, *, Jonathan Grandidier, Stanley P. Burgos, Eyal Feigenbaum, and Harry A. Atwater,
Lecture: Integration of silicon photonics with electronics. Prepared by Jean-Marc FEDELI CEA-LETI
Lecture: Integration of silicon photonics with electronics Prepared by Jean-Marc FEDELI CEA-LETI Context The goal is to give optical functionalities to electronics integrated circuit (EIC) The objectives
Nanophotonic trapping for precise manipulation of biomolecular arrays
SUPPLEMENTARY INFORMATION DOI: 10.1038/NNANO.2014.79 Nanophotonic trapping for precise manipulation of biomolecular arrays Mohammad Soltani, Jun Lin, Robert A. Forties, James T. Inman, Summer N. Saraf,
Optics Communications
Optics Communications 283 (2010) 3678 3682 Contents lists available at ScienceDirect Optics Communications journal homepage: www.elsevier.com/locate/optcom Ultra-low-loss inverted taper coupler for silicon-on-insulator
6.777J/2.372J Design and Fabrication of Microelectromechanical Devices Spring Term Massachusetts Institute of Technology
6.777J/2.372J Design and Fabrication of Microelectromechanical Devices Spring Term 2007 Massachusetts Institute of Technology PROBLEM SET 2 (16 pts) Issued: Lecture 4 Due: Lecture 6 Problem 4.14 (4 pts):
Lecture 7. Lithography and Pattern Transfer. Reading: Chapter 7
Lecture 7 Lithography and Pattern Transfer Reading: Chapter 7 Used for Pattern transfer into oxides, metals, semiconductors. 3 types of Photoresists (PR): Lithography and Photoresists 1.) Positive: PR
Supporting Information. Filter-free image sensor pixels comprising silicon. nanowires with selective color absorption
Supporting Information Filter-free image sensor pixels comprising silicon nanowires with selective color absorption Hyunsung Park, Yaping Dan,, Kwanyong Seo,, Young J. Yu, Peter K. Duane, Munib Wober,
IOLTS th IEEE International On-Line Testing Symposium
IOLTS 2018 24th IEEE International On-Line Testing Symposium Exp. comparison and analysis of the sensitivity to laser fault injection of CMOS FD-SOI and CMOS bulk technologies J.M. Dutertre 1, V. Beroulle
PHGN/CHEN/MLGN 435/535: Interdisciplinary Silicon Processing Laboratory. Simple Si solar Cell!
Where were we? Simple Si solar Cell! Two Levels of Masks - photoresist, alignment Etch and oxidation to isolate thermal oxide, deposited oxide, wet etching, dry etching, isolation schemes Doping - diffusion/ion
Adaptive Optics for LIGO
Adaptive Optics for LIGO Justin Mansell Ginzton Laboratory LIGO-G990022-39-M Motivation Wavefront Sensor Outline Characterization Enhancements Modeling Projections Adaptive Optics Results Effects of Thermal
Coherent Laser Measurement and Control Beam Diagnostics
Coherent Laser Measurement and Control M 2 Propagation Analyzer Measurement and display of CW laser divergence, M 2 (or k) and astigmatism sizes 0.2 mm to 25 mm Wavelengths from 220 nm to 15 µm Determination
Planarization and Regrowth of Self-Aligned Ohmic Contacts on InGaAs
MBE 2008, Vancouver, B.C. Planarization and Regrowth of Self-Aligned Ohmic Contacts on InGaAs Mark Wistey, Greg Burek, Uttam Singisetti, Austin Nelson, Brian Thibeault, Joël Cagnon, Susanne Stemmer, Arthur
Development of Vertical Spot Size Converter (SSC) with Low Coupling Loss Using 2.5%Δ Silica-Based Planar Lightwave Circuit
Development of Vertical Spot Size Converter (SSC) with Low Coupling Loss Using 2.5%Δ Silica-Based Planar Lightwave Circuit Yasuyoshi Uchida *, Hiroshi Kawashima *, and Kazutaka Nara * Recently, new planar
INTEGRATED ACOUSTO-OPTICAL HETERODYNE INTERFEROMETER FOR DISPLACEMENT AND VIBRATION MEASUREMENT
INTEGRATED ACOUSTO-OPTICAL HETERODYNE INTERFEROMETER FOR DISPLACEMENT AND VIBRATION MEASUREMENT AGUS RUBIYANTO Abstract A complex, fully packaged heterodyne interferometer has been developed for displacement
Waveguiding in PMMA photonic crystals
ROMANIAN JOURNAL OF INFORMATION SCIENCE AND TECHNOLOGY Volume 12, Number 3, 2009, 308 316 Waveguiding in PMMA photonic crystals Daniela DRAGOMAN 1, Adrian DINESCU 2, Raluca MÜLLER2, Cristian KUSKO 2, Alex.
Luminous Equivalent of Radiation
Intensity vs λ Luminous Equivalent of Radiation When the spectral power (p(λ) for GaP-ZnO diode has a peak at 0.69µm) is combined with the eye-sensitivity curve a peak response at 0.65µm is obtained with
A BASIC EXPERIMENTAL STUDY OF CAST FILM EXTRUSION PROCESS FOR FABRICATION OF PLASTIC MICROLENS ARRAY DEVICE
A BASIC EXPERIMENTAL STUDY OF CAST FILM EXTRUSION PROCESS FOR FABRICATION OF PLASTIC MICROLENS ARRAY DEVICE Chih-Yuan Chang and Yi-Min Hsieh and Xuan-Hao Hsu Department of Mold and Die Engineering, National
Low-loss singlemode PECVD silicon nitride photonic wire waveguides for nm wavelength window fabricated within a CMOS pilot line
Low-loss singlemode PECVD silicon nitride photonic wire waveguides for 532-900 nm wavelength window fabricated within a CMOS pilot line A.Z. Subramanian, A. Dhakal, F. Peyskens, S. Selvaraja *,Member,
Nanofluidic Diodes based on Nanotube Heterojunctions
Supporting Information Nanofluidic Diodes based on Nanotube Heterojunctions Ruoxue Yan, Wenjie Liang, Rong Fan, Peidong Yang 1 Department of Chemistry, University of California, Berkeley, CA 94720, USA
HIGH POWER LASERS FOR 3 RD GENERATION GRAVITATIONAL WAVE DETECTORS
HIGH POWER LASERS FOR 3 RD GENERATION GRAVITATIONAL WAVE DETECTORS P. Weßels for the LZH high power laser development team Laser Zentrum Hannover, Germany 23.05.2011 OUTLINE Requirements on lasers for
MICRO AND NANOPROCESSING TECHNOLOGIES
MICRO AND NANOPROCESSING TECHNOLOGIES LECTURE 4 Optical lithography Concepts and processes Lithography systems Fundamental limitations and other issues Photoresists Photolithography process Process parameter
EE 143 Microfabrication Technology Fall 2014
EE 143 Microfabrication Technology Fall 2014 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 EE 143: Microfabrication
2.8 - CMOS TECHNOLOGY
CMOS Technology (6/7/00) Page 1 2.8 - CMOS TECHNOLOGY INTRODUCTION Objective The objective of this presentation is: 1.) Illustrate the fabrication sequence for a typical MOS transistor 2.) Show the physical
PROBLEM SET #7. EEC247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2015 C. Nguyen. Issued: Monday, April 27, 2015
Issued: Monday, April 27, 2015 PROBLEM SET #7 Due (at 9 a.m.): Friday, May 8, 2015, in the EE C247B HW box near 125 Cory. Gyroscopes are inertial sensors that measure rotation rate, which is an extremely
Integrated Optical Transceiver for Inertial Sensors Using Polymer Waveguide Technology
Integrated Optical Transceiver for Inertial Sensors Using Polymer Waveguide Technology Mark Temmen*, William Diffey, and Paul Ashley U.S. Army RDECOM Aviation and Missile Research, Development, and Engineering
EE C245 ME C218 Introduction to MEMS Design
EE C45 ME C18 Introduction to MEMS Design Fall 008 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 9470 Lecture 7: Noise &
Semiconductor Manufacturing Technology. Semiconductor Manufacturing Technology. Photolithography: Resist Development and Advanced Lithography
Semiconductor Manufacturing Technology Michael Quirk & Julian Serda October 2001 by Prentice Hall Chapter 15 Photolithography: Resist Development and Advanced Lithography Eight Basic Steps of Photolithography
OPTICAL SENSORS-CONSTRUCTION ALTERNATIVES
OPTICAL SENSORS-CONSTRUCTION ALTERNATIVES Mariana ENACHE, Cristina ŢUINEA BOBE Universitatea Valahia Târgovişte, Facultatea Ştiinta si Ingineria Materialelor, B-dul Regele Carol I, Nr.2, 0200, Târgovişte,
Christian Boit TUB Berlin University of Technology Sect. Semiconductor Devices. 1
Semiconductor Device & Analysis Center Berlin University of Technology Christian Boit TUB Berlin University of Technology Sect. Semiconductor Devices Christian.Boit@TU-Berlin.DE 1 Semiconductor Device
2007-Novel structures of a MEMS-based pressure sensor
C-(No.16 font) put by office 2007-Novel structures of a MEMS-based pressure sensor Chang-Sin Park(*1), Young-Soo Choi(*1), Dong-Weon Lee (*2) and Bo-Seon Kang(*2) (1*) Department of Mechanical Engineering,
High speed silicon-based optoelectronic devices Delphine Marris-Morini Institut d Electronique Fondamentale, Université Paris Sud
High speed silicon-based optoelectronic devices Delphine Marris-Morini Institut d Electronique Fondamentale, Université Paris Sud Data centers Optical telecommunications Environment Interconnects Silicon
MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications
MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications Part I: RF Applications Introductions and Motivations What are RF MEMS? Example Devices RFIC RFIC consists of Active components
High-Coherence Wavelength Swept Light Source
Kenichi Nakamura, Masaru Koshihara, Takanori Saitoh, Koji Kawakita [Summary] Optical technologies that have so far been restricted to the field of optical communications are now starting to be applied
Atlas 46 novel negative tone photoresist which combines the good properties of the established SU-8 and CAR 44
EIPBN, 30 th Mai 2018 Atlas 46 novel negative tone photoresist which combines the good properties of the established SU-8 and CAR 44 Dr. Christian Kaiser, Matthias Schirmer Allresist GmbH, Germany Outline
STUDY OF ARROW WAVEGUIDE FABRICATION PROCESS FOR IMPROVING SCATTERING LOSSES
STUDY OF ARROW WAVEGUIDE FABRICATION PROCESS FOR IMPROVING SCATTERING LOSSES D. O. Carvalho, S. L. Aristizábal, K. F. Albertin, H. Baez and M. I. Alayo PSI, University of São Paulo CP 61548, CEP 05424-970,
True Three-Dimensional Interconnections
True Three-Dimensional Interconnections Satoshi Yamamoto, 1 Hiroyuki Wakioka, 1 Osamu Nukaga, 1 Takanao Suzuki, 2 and Tatsuo Suemasu 1 As one of the next-generation through-hole interconnection (THI) technologies,
System demonstrator for board-to-board level substrate-guided wave optoelectronic interconnections
Header for SPIE use System demonstrator for board-to-board level substrate-guided wave optoelectronic interconnections Xuliang Han, Gicherl Kim, Hitesh Gupta, G. Jack Lipovski, and Ray T. Chen Microelectronic
Ultra-Low-Loss Athermal AWG Module with a Large Number of Channels
Ultra-Low-Loss Athermal AWG Module with a Large Number of Channels by Junichi Hasegawa * and Kazutaka Nara * There is an urgent need for an arrayed waveguide grating (AWG), the device ABSTRACT that handles
Gigahertz Ambipolar Frequency Multiplier Based on Cvd Graphene
Gigahertz Ambipolar Frequency Multiplier Based on Cvd Graphene The MIT Faculty has made this article openly available. Please share how this access benefits you. Your story matters. Citation As Published
Dr. Dirk Meyners Prof. Wagner. Wagner / Meyners Micro / Nanosystems Technology
Micro/Nanosystems Technology Dr. Dirk Meyners Prof. Wagner 1 Outline - Lithography Overview - UV-Lithography - Resolution Enhancement Techniques - Electron Beam Lithography - Patterning with Focused Ion
EPIC: The Convergence of Electronics & Photonics
EPIC: The Convergence of Electronics & Photonics K-Y Tu, Y.K. Chen, D.M. Gill, M. Rasras, S.S. Patel, A.E. White ell Laboratories, Lucent Technologies M. Grove, D.C. Carothers, A.T. Pomerene, T. Conway
MICROFABRICATION TECHNOLOGY FOR LARGE LEKID ARRAYS: FROM NIKA2 TO FUTURE APPLICATIONS
MICROFABRICATION TECHNOLOGY FOR LARGE LEKID ARRAYS: FROM NIKA2 TO FUTURE APPLICATIONS J. Goupy 1, A. Adane 2, A. Benoit 1, O. Bourrion 3, M. Calvo 1, A. Catalano 3-1, G. Coiffard 2, C. Hoarau 1, S. Leclercq
Low Thermal Resistance Flip-Chip Bonding of 850nm 2-D VCSEL Arrays Capable of 10 Gbit/s/ch Operation
Low Thermal Resistance Flip-Chip Bonding of 85nm -D VCSEL Arrays Capable of 1 Gbit/s/ch Operation Hendrik Roscher In 3, our well established technology of flip-chip mounted -D 85 nm backside-emitting VCSEL
Silicon-based photonic crystal nanocavity light emitters
Silicon-based photonic crystal nanocavity light emitters Maria Makarova, Jelena Vuckovic, Hiroyuki Sanda, Yoshio Nishi Department of Electrical Engineering, Stanford University, Stanford, CA 94305-4088
A gravitational wave is a differential strain in spacetime. Equivalently, it is a differential tidal force that can be sensed by multiple test masses.
A gravitational wave is a differential strain in spacetime. Equivalently, it is a differential tidal force that can be sensed by multiple test masses. Plus-polarization Cross-polarization 2 Any system
Silicon wafer thickness monitor
Silicon wafer thickness monitor SIT-200 Alnair Labs Corporation 2016.04.20 Principle of Measurement Silicon wafer Optical fiber Sensor head Wavelength tunable laser PD PD Interference signal Power monitor
Superconducting Nanowire Single Photon Detector (SNSPD) integrated with optical circuits
Superconducting Nanowire Single Photon Detector (SNSPD) integrated with optical circuits Marcello Graziosi, ESR 3 within PICQUE (Marie Curie ITN project) and PhD student marcello.graziosi@ifn.cnr.it Istituto
3D flow focusing chips
Unit 1, Anglian Business Park, Orchard Road, Royston, Hertfordshire, SG8 5TW, UK T: +44 (0)1763 242491 F: +44 (0)1763 246125 E: sales@dolomite-microfluidics.com W: www.dolomite-microfluidics.com Dolomite
Loss Reduction in Silicon Nanophotonic Waveguide Micro-bends Through Etch Profile Improvement
Loss Reduction in Silicon Nanophotonic Waveguide Micro-bends Through Etch Profile Improvement Shankar Kumar Selvaraja, Wim Bogaerts, Dries Van Thourhout Photonic research group, Department of Information
10 Gb/s Radiation-Hard VCSEL Array Driver
10 Gb/s Radiation-Hard VCSEL Array Driver K.K. Gan 1, H.P. Kagan, R.D. Kass, J.R. Moore, D.S. Smith Department of Physics The Ohio State University Columbus, OH 43210, USA E-mail: gan@mps.ohio-state.edu