Design Automation in Power Electronics

Transcription

1 Design Automation in Power Electronics Design Automation in Power Electronics H. Alan Mantooth Distinguished Professor of Electrical Engineering President, IEEE Power Electronics Society Executive Director, NSF Center for GRid-Connected Advanced Power Electronics Systems (GRAPES) Deputy Director, NSF Engineering Research Center for Power Optimization of Electro-Thermal Systems (POETS) November 5, 2018

2 Outline Emerging Trends Conclusion => Wide Bandgap design is here to stay for many reasons and applications BUT, we still have technologies to put into place to produce optimal designs One of these areas of technological need is in our tooling (i.e., Design Automation) Review of DAPE Workshop in September Describe Key Gaps and Hope to Inspire New Ideas 2

3 Conclusions from Emerging Trends Talk High speed switching of WBG technology offers advantages, but comes with penalties if not carefully deployed Heterogeneous integration is required to unleash the full capability of SiC power devices Added capabilities around the SiC power device can help with integration and reliability Issues with EMI and signal integrity can be addressed through circuit and integration solutions, and with the aid of design tools 3

4 Poor Integration Leads to Failures Emerging Trends in SiC Power Electronics

5 H. Alan Mantooth, General Chair University of Arkansas Portland, Oregon September 22, 2018

6 Workshop Purpose Understand the current state-of-the-art in design automation for power electronics Describe emerging needs => driven by WBG technologies GOALS A clear identification of the common ground and synergy between power electronics and design automation An understanding of the limits of the current design automation technology and tools Capture the needs for future work 6

7 DAPE Program First Session 08:30-09:00 Alan Mantooth University of Arkansas Workshop Opening Keynote Speech 09:00-09:30 Johann Kolar ETH Zurich Power Electronics Design :30-10:00 Brian Peaslee General Motors Automotive Power Electronics Detailed Design and Analysis 10:00-10:30 Tony Lennon Mathworks Electric Powertrain Development Transitioning between Levels of Power Electronics Simulation Fidelity 10:30-11:00 Coffee Break. 11:00-11:30 Mick Tegethoff Mentor Graphics Understanding the Impact of On-Chip Power Electronics on IC Performance via Electrothermal Circuit Simulation 11:30-12:00 Steve Chwirka ANSYS Coupled Multi-Physics FEA and Circuit Solutions for Power Electronics 12:00-12:30 Panel Discussion 12:30-14:00 Lunch Break. 7

8 DAPE Program Second Session 14:00-14:30 Dushan Boroyevich Virginia Tech EDA Tools for Aerospace Power 14:30-15:00 Kamiar J. Karimi Boeing Electronics: Status, Challenges, and Barriers 15:00-15:30 Alan Courtay Synopsys Methods and Tools to Efficiently Model Power Electronics Components from Datasheets: Power Diodes, MOSFETs, IGBTs, BJTs, Fuses, Magnetics and Motors 15:30-16:00 Coffee Break. 16:30-17:00 Frede Blaabjerg Aalborg University Mission-Profile-based Reliability Design Tools - Current Status and Outlook 17:00-17:30 Ivan Čelanović Typhoon HIL Ultra-high Fidelity Real-Time Simulation for Power Electronics and Microgrids: Empowering Test Driven Development 17:30-18:00 Panel Discussion. 18:00-20:00 DAPE Reception. 8

9 Design Automation Primer Electronic Design Automation (a.k.a. Electronic Computer-Aided Design) is a category of software tools for designing electronic systems such as integrated circuits and printed circuit boards. The tools work together in a design flow that chip designers use to design and analyze entire semiconductor chips. Since a modern semiconductor chip can have billions of components, EDA tools are essential for their design. Source: Wikipedia 9

10 Workshop Topics Tool vendors spoke of the current capabilities of their tools Modeling and simulation with Saber Multi-level modeling and simulation with Matlab/Simulink Electro-thermal analysis for on-chip power supplies FEA with ANSYS tools Hardware-in-the-loop with Typhoon HIL Industry shared their current practices in automotive and aerospace (GM, Boeing) Academics described how they see things developing now and in the future (Kolar, Boroyevich, Blaabjerg) 10

11 Model-based Design was a Prevalent Theme Several versions of the V-diagram were presented The term digital twin was elaborated as a current and evolving practice Multi-objective design optimization Hierarchical Multidisciplinary The right approach? Power electronics visions Power Electronics Design 4.0 Parameter Uncertainty Quantification Design for Reliability and Robustness 11

12 MBE Design Flow 12

13 GM Flow Source: Brian Peaslee 13

14 Mathworks V Source: Tony Lennon 14

15 Digital Twins! Source: via Johann Kolar 15

16 Digital Twins! Source: US Air Force via Johann Kolar 16

17 Digital Twins! Source: Johann Kolar 17

18 Multi-Objective Optimization Approach Digital Controller Model Models for Passives Electric Circuits Model Electromagnetic Model Loss Model + Thermal Model 18

19 Abstraction of Power Converter Design Source: Johann Kolar 19

20 OEM-level Optimization Source: Brian Peaslee 20

21 Multi-physics Problem Source: Brian Peaslee 21

22 Multidisciplinary Design Optimization IEEE PEAC 2018 No Reprint Without Source: Authorization Dushan Boroyevich 22

23 from the specs we go into Power Electronics Design Flow Schematic (Matlab/Simulink, PLECS, LTSpice, Saber, ) Controls (Matlab, HIL, PHIL) Component Selection (passives, modules) Electro-thermal Circuit Analysis Board Layout PEX, DRC Thermal, Electrical, EMI, Accurate Modeling Cabinet Design Cabinet Layout (Modules, Passives, bussing) Electro-thermal Analysis Manufacturing Test 23

24 IEEE PEAC 2018 No Reprint Without Source: Authorization Dushan Boroyevich 24

25 Optimization is the Approach Multi-Objective Optimization Guarantees Best Utilization of All Degrees of Freedom Source: Johann Kolar 25

26 Power Electronics Technology S-Curve Source: Johann Kolar 26

27 PE Design 4.0 Source: Johann Kolar 27

28 Conclusions from DAPE Source: Johann Kolar 28

29 Conclusions from DAPE IEEE PEAC 2018 No Reprint Without Source: Authorization Dushan Boroyevich 29

30 Conclusions from DAPE Source: Tony Lennon 30

31 Widely-accepted design flow Power Electronics DA Gaps Extraction of PC board parasitics and back annotation onto schematics Signal integrity analysis for power electronics Support for simultaneous electro-thermal co-design PE circuit synthesis PE design optimization Module design optimization Cabinet design optimization Uncertainty quantification Design for reliability 31