Silicon Photonics and Skorpios Technology Platform. Market Watch ECOC Cannes - September 22, 2014 A. Viglienzoni
|
|
- Ernest Smith
- 6 years ago
- Views:
Transcription
1 Silicon Photonics and Skorpios Technology Platform Market Watch ECOC Cannes - September 22, 2014 A. Viglienzoni
2 Agenda Preamble Need for Photonics and Integrated Optics Why Current Models Cannot Deliver on Promises Why CMOS Photonics Why Skorpios Delivers on The Promises of Silicon Photonics Conclusions 2
3 CMOS Industry Advantage Process Maturity Worldwide Annual Processed Wafer (in 1,000 sq. m) Silicon 7,000 Silicon GaAs 7, LiNbO 3 13 InP 0.65 SiO 2 = Sand. Source: SEMI, HHI, isupply, Crystal Technology Inc. 3
4 Silicon Foundry Volume Courtesy of Martin Schell, HHI -- ECOC 2012 Total Output: 13 M Wafers (2011, 8 equ.) Average Revenue: ~1,000 USD/Wafer Smallest Fab: 440k Wafers per Year Source: TSMC business report
5 InP and Si: Comparison Courtesy of Martin Schell, HHI -- ECOC 2012 Telekom Small Datacom / FTTH Large Datacom / FTTH Really large, e.g. chip-to-chip pcs p.a. 50k 500k 5M 50M Si InP Si InP Si InP Si InP R&D ($/pc) CoS ($/pc) Total ($/pc) % Small Fab 0.01% 10% 0.12 % 100% 1.2 % 10x 12 % 100x Small/Large: Cost Side Gives Clear Advantage for Silicon Low Volume on Silicon fab Scale Does not Allow for a Single Modification of Existing Processes martin.schell@hhi.fraunhofer.de Sep 18,
6 Photonics: Major Impact On Our Lives Readout units for fiber sensors Smart Lighting Systems Skin Analysis NG Sensors Fiber Systems: Telecom, Datacom,. Avionics Metrology: Compact Frequency-Comb Generator Optical Coherence Tomography 6
7 Enable NG Consumer Applications 7
8 Silicon Photonics Applications Applications Examples Data rate Telecom Datacom Consumer HPC Commercial - Video Metrology and Sensors Medical Military/Aerospace/ Scientific From Edge Access to Ultra Long Haul Applications; Coherent Metro Enablement Intra Data Centers (2Km+) and Inter Data Centers (100Km); Mega Cloud SMF Duplex 100G/400G Spine-Leaf-Core Switching Connecting Objects e.g. Console, PC, HDTVs. Gaming. Augmented Reality, Peer-to-Peer One High Performance Computer Supercomputer May Consume 40,000 AOCs or 250,000 Mid-Board Modules Digital Signage, Digital Cinemas, Video Recording and Studios; 4Kx2K Displays and Recording Equipment; 100m to 1Km+ Measurements of Time, Temperature, Sound, Frequency, Stress, DNA, Glucose, Molecular and Cellular Analysis, Optical Coherence Tomography Scientific Instruments, Optical Aircraft Networks, Radar, Imaging and Intelligence Applications 10G, 40G, 100G, 400G Systems 40G, 100G, 400G Interconnects; Multi- Terabit Line Cards, Dense Form-Factors Like QSFP28 5G 50G 100G 100G IB, 100 GbE 10G 50G Interconnects HDMI, Display Port, USB 3.0, Thunderbolt Typically Low Data Rates but Using Special Silicon Photonics Based Sensors Typically Low Data Rates but Using Special Silicon Photonics Sensors 10G, 40G, 100G, Capacity Similar to a Small Data Center, with More Difficult Environmental Conditions 8
9 Photonics Connectivity: Application Domains and Challenges Chip Inter-Connects 1mW/Gbps cm Optical Engines 5mW/Gbps m Active Optical Cables 20mW/Gbps m Optical Transceivers Modules 50mW/Gbps 1 W/Gbps 2 40km 100G+ DWDM Intra Chip Inter Chip Back Plane Board to Board Rack to Rack WAN, Access, Front/Back Haul Metro and LH WDM Electrical Consumer Electronics Interconnect Optical Optical Short Reach Interconnects Copper hitting severe physical limitations with increasing bit rates Telecom and Datacom Client Interconnects 40G/100G per Fiber Increasing Processing Capacity & Density of System ASICs DWDM Transport More capacity per single fiber Less $/bit 100G/400G/1T Generalized Need for Footprint and Power Reduction 9
10 Performance (EMC/EMI, Speed,..) Size - Power Dissipation Performance, Miniaturization Power Dissipation Silicon Photonics Value Innovate in Current Markets Optical Component Industry Viability Enable New Markets & Products Very High Volumes and Low Cost Current Markets & Products Volume Right Size and Cost 10
11 Some Non Telecom Markets 250, , , ,000 50,000 - Total M2M Revenues ($M) Other Transportation Vehicles Remote / Green Technology Retail Outlets Building Automation Maintenance Office Metering / utilities Office Security Home Automation Consumer Electronics Smart Metering / Utilities Home Security Basic Healthcare Point & Distributed Fiber Sensor Market, Distributed Fiber Optic Sensor Markets
12 Revenues $B Silicon Photonics TAM New Applications Non Telco Applications ROADM, Filters Transceivers (All Bit Rates, NO 10G, 40G, 100G) 10G, 40G, 100G (incl.nem) Discretes for Transceivers Current SiPh Revenues (AOC, Discretes) 0 Calandar Year
13 Optical Market Opportunity Sources: Infonetics 2013, Lightcounting 2013 $4B Transceiver Market in Sep 7-Sep 2Q14 1Q14 Market Cap Market Cap Revs GM Net M Market Cap Revs GM Net M A $1,700 $ % 4.2% $2,636 $ % 7.0% B+C $2,570 $ % 0.0% $3,220 $ % -0.3% D $347 $ % -8.0% $333 $ % -1.4% E $176 $ % -24.0% $342 $ % -23.0% F $131 $ % -7.0% $155 $ % -12.0% G $83 $ % -9.0% $257 $ % -18.5% Sources: SEK Filings and Yahoo Finance The Fundamental Problem: Large Market, No Profits 13
14 Traditional Optical Integration Processed Laser Chip Optical Module Circuit Board III/V Wafer Hermetic Gold Box Optical Package Assembled Optical Module Linecard Multiple Serial Steps Expensive to Manufacture High Excess Optical Loss 14
15 Silicon Photonics 1.0 Integration Hermetic Gold Box Optical Package III/V Wafer Processed Laser Chip Output Fiber SOI Wafer External Laser Sources Processed Silicon Photonics Chip Separate Off-Chip Laser Sources Expensive to Implement WDM Many Serial Alignments and Processes 15
16 Si-Photonics 1.0 Silicon Photonics 1.0: A Closer Look Where do the Photons Come From? Need to Buy Completed Lasers How do You Get the Heat Out? Margin Stacking Not Wafer Scale Labor Intensive Alignments Non-Hermetic Bulk Optics Silicon Modulators Physically Large Large Drive Voltages High Insertion Loss Source: EE Times January 28, 2013 Is This a Wafer-Scale Process? Is This Si-Photonics or Si Optical Bench? Cross Section Silicon Photonics But Where are the Photons? 16
17 Skorpios STAB Integration III/V Wafer III/V Population Process Processed Silicon Photonics Chip with Integrated III/V Output Fiber SOI Wafer Integrated Laser Sources & Other III/V Devices (Detector, Modulator, non-optical High-Speed RF HBTs ) Parallel Fabrication - An Inherently WDM Platform Single Alignment Step - Low Optical Loss and Low Power 17
18 Si-Photonics 2.0 Silicon Photonics 2.0: A Closer Look LASERS Integrated in a Wafer-Scale Process No Need to Buy Completed Lasers No Margin Stacking Wafer Scale No Labor Intensive Alignments Hermetic No Bulk Optics Skorpios STAB-Silicon Modulators Physically Small Low Drive Voltages Low Insertion Loss Skorpios Single Chip Solution Skorpios: Silicon Photonics With the Photons 18
19 Skorpios: Fabless Model CMOS Process Flow Skorpios Si-Ph CMOS Flow Passive Element Definition Passive Si-Photonic Element Definition FEOL Active Element Definition (CMOS) Active Si-Photonic Element Definition (CMOS) Skorpios Proprietary MOL Processes Device Wiring Device Wiring Wafer Test BEOL Wafer Test All MOL Processes are 100% CMOS Compatible All Processes Developed on Commercial CMOS Fab Tools No Gold Photolithographic Alignments Only Dice and Test Dice and Test Process Innovation in a Fab-Less Business Model 19
20 Technology Advantages 1) Combines Benefits of Both III-V and Si Lasers, Modulators, Waveguides, Density 2) Metal Bonding Between III-V and Substrate Excellent Heat Sinking Path 3) Similar Modes Connected by Butt-Joint Low Coupling Loss 4) Thick (1.5um) Si Platform Polarization Insensitive and Fabrication Tolerant WDM 5) Wafer-Scale Co-Processed III-V and Si Low-Cost CMOS Manufacturing 6) Natively Hermetic for III-V Materials No Expensive Gold Box Packaging 7) Similar Substrate to SiGe-on-SOI Monolithic Integration With 25G and 40G SiGe ICs 20
21 Best In Class ITLA Laser Engine Traditional Approach Skorpios Approach Thermistor Gain Chip Back Miror (EO Xtal) Prism Lens 1 & 2 Tunable Filter Assy (2x) Filter Electrical IO Lens Mount Lens 3 Isolator MP D ~ 4mm Fiber Flexure ~ 40mm ~ 4mm Multiple Manual Serial Assembly Steps Low Yield Dedicated Custom Tools Expensive to Manufacture Single Fiber Alignment Parallel Wafer Fabrication Processes Single Chip, Minimal BOM Inexpensive to Manufacture 21
22 QSFP28 Module RX Chip TX Chip 22
23 Qualitative Cost Comparison III-V Based LR4 Skorpios QSFP Sourced Electronics Photonics (TX & RX) Electronics (Populated PCB) Mechanics & Packaging Test Photonics (TX & RX) Electronics (Populated PCB) Mechanics & Packaging Test Skorpios with Own ASICs Photonics (TX & RX) Electronics (Populated PCB) Mechanics & Packaging Test 23
24 Conclusions Near Term Drivers for Silicon Photonics: Toolkits for Transceivers, Active Optical Cables and Backplanes for Both Telecom and Datacom - Optical Component Industry Cannot Keep Up With the Pace of Applications and Price/Cost Trends - ASICs Can Process More Information Than Optical I/O s Can Handle Data Rates Keep Increasing - Electrical Links are Loss-Limited at High Data Rates - Photonic Links Will Progressively Displace Electrical Ones - Optical Links Have Now Entered a New Phase: CMOS Photonics Now Competes Directly with Copper/VCSELs for Short Reach Applications: No Longer Limited to LAN/MAN/WAN Volumes Growth - Telecom: 10k-100k Units/Yr - Datacom/HPC: >1M Units/Yr Silicon is the Best and Only Mature Platform: - New Architectures Can be Enabled by Silicon Photonics - Low Cost - Need a Process Compatible with CMOS Foundries Skorpios Can Deliver All Such Requirements 24
25 Conclusions Future is not what it used to be. - Arthur C. Clarke
26 Thanks! 26
Silicon Photonics Transceivers for Hyper Scale Datacenters: Deployment and Roadmap
Silicon Photonics Transceivers for Hyper Scale Datacenters: Deployment and Roadmap Peter De Dobbelaere Luxtera Inc. 09/19/2016 Luxtera Proprietary www.luxtera.com Luxtera Company Introduction $100B+ Shift
More informationSi Photonics Technology Platform for High Speed Optical Interconnect. Peter De Dobbelaere 9/17/2012
Si Photonics Technology Platform for High Speed Optical Interconnect Peter De Dobbelaere 9/17/2012 ECOC 2012 - Luxtera Proprietary www.luxtera.com Overview Luxtera: Introduction Silicon Photonics: Introduction
More informationNEXT GENERATION SILICON PHOTONICS FOR COMPUTING AND COMMUNICATION PHILIPPE ABSIL
NEXT GENERATION SILICON PHOTONICS FOR COMPUTING AND COMMUNICATION PHILIPPE ABSIL OUTLINE Introduction Platform Overview Device Library Overview What s Next? Conclusion OUTLINE Introduction Platform Overview
More informationConvergence Challenges of Photonics with Electronics
Convergence Challenges of Photonics with Electronics Edward Palen, Ph.D., P.E. PalenSolutions - Optoelectronic Packaging Consulting www.palensolutions.com palensolutions@earthlink.net 415-850-8166 October
More informationNew Wave SiP solution for Power
New Wave SiP solution for Power Vincent Lin Corporate R&D ASE Group APEC March 7 th, 2018 in San Antonio, Texas. 0 Outline Challenges Facing Human Society Energy, Environment and Traffic Autonomous Driving
More informationSi photonics for the Zettabyte Era. Marco Romagnoli. CNIT & TeCIP - Scuola Superiore Sant Anna
Si photonics for the Zettabyte Era Marco Romagnoli CNIT & TeCIP - Scuola Superiore Sant Anna Semicon 2013 Dresden 8-10 October 2013 Zetabyte era Disaggregation at system level Integration at chip level
More informationIntegrated Photonics using the POET Optical InterposerTM Platform
Integrated Photonics using the POET Optical InterposerTM Platform Dr. Suresh Venkatesan CIOE Conference Shenzhen, China Sept. 5, 2018 POET Technologies Inc. TSXV: PUBLIC POET PTK.V Technologies Inc. PUBLIC
More informationLow Power DSP and Photonic Integration in Optical Networks. Atul Srivastava CTO, NTT Electronics - America. Market Focus ECOC 2014
Low Power DSP and Photonic Integration in Optical Networks Atul Srivastava CTO, NTT Electronics - America Market Focus ECOC 2014 Outline 100G Deployment Rapid Growth in Long Haul Role of Modules New Low
More information100G Coherent Transceiver Technologies for DWDM Metro Applications: Key Requirements and Design Trends
100G Coherent Transceiver Technologies for DWDM Metro Applications: Key Requirements and Design Trends Benny Mikkelsen benny.mikkelsen@acacia-inc.com ECOC, 2012 Market Focus Optical Networks Advances Outline
More informationEmerging Highly Compact Amplification Solutions for Coherent Transmission
Emerging Highly Compact Amplification Solutions for Coherent Transmission Market Focus ECOC 2017 Sep 20, 2017 Dr. Sanjai Parthasarathi Vice President, Product Marketing & Strategy II-VI Photonics Outline
More informationElectronic-Photonic ICs for Low Cost and Scalable Datacenter Solutions
Electronic-Photonic ICs for Low Cost and Scalable Datacenter Solutions Christoph Theiss, Director Packaging Christoph.Theiss@sicoya.com 1 SEMICON Europe 2016, October 27 2016 Sicoya Overview Spin-off from
More informationOpportunities and challenges of silicon photonics based System-In-Package
Opportunities and challenges of silicon photonics based System-In-Package ECTC 2014 Panel session : Emerging Technologies and Market Trends of Silicon Photonics Speaker : Stéphane Bernabé (Leti Photonics
More informationCommunications. Mitchell Fields, Ph. D. Director of Strategic Marketing
Optical Navigation Division Optical Interconnects for Chip-to-Chip Communications Mitchell Fields, Ph. D. Director of Strategic Marketing mitch.h.fields@avagotech.comh com Contributors: Avago: Christine
More informationLecture: Integration of silicon photonics with electronics. Prepared by Jean-Marc FEDELI CEA-LETI
Lecture: Integration of silicon photonics with electronics Prepared by Jean-Marc FEDELI CEA-LETI Context The goal is to give optical functionalities to electronics integrated circuit (EIC) The objectives
More informationIBM T. J. Watson Research Center IBM Corporation
Broadband Silicon Photonic Switch Integrated with CMOS Drive Electronics B. G. Lee, J. Van Campenhout, A. V. Rylyakov, C. L. Schow, W. M. J. Green, S. Assefa, M. Yang, F. E. Doany, C. V. Jahnes, R. A.
More informationSi CMOS Technical Working Group
Si CMOS Technical Working Group CTR, Spring 2008 meeting Markets Interconnects TWG Breakouts Reception TWG reports Si CMOS: photonic integration E-P synergy - Integration - Standardization - Cross-market
More informationNew silicon photonics technology delivers faster data traffic in data centers
Edition May 2017 Silicon Photonics, Photonics New silicon photonics technology delivers faster data traffic in data centers New transceiver with 10x higher bandwidth than current transceivers. Today, the
More informationZukunftstechnologie Dünnglasbasierte elektrooptische. Research Center of Microperipheric Technologies
Zukunftstechnologie Dünnglasbasierte elektrooptische Baugruppenträger Dr. Henning Schröder Fraunhofer IZM, Berlin, Germany Today/Overview Motivation: external roadmaps High Bandwidth and Channel Density
More informationSilicon Photonics Photo-Detector Announcement. Mario Paniccia Intel Fellow Director, Photonics Technology Lab
Silicon Photonics Photo-Detector Announcement Mario Paniccia Intel Fellow Director, Photonics Technology Lab Agenda Intel s Silicon Photonics Research 40G Modulator Recap 40G Photodetector Announcement
More informationCisco PONC Pavan Voruganti Senior Product Manager. March 2015
Cisco PONC 2015 Pavan Voruganti Senior Product Manager March 2015 Bandwidth Explosion With a progressive uptake of video, IP, audio and cloud the compound annual growth rate (CAGR) of IP traffic is above
More informationEnvisioning the Future of Optoelectronic Interconnects:
Envisioning the Future of Optoelectronic Interconnects: The Production Economics of InP and Si Platforms for 100G Ethernet LAN Transceivers Shan Liu Dr. Erica Fuchs Prof. Randolph Kirchain MIT Microphotonics
More informationLight source approach for silicon photonics transceivers September Fiber to the Chip
Light source approach for silicon photonics transceivers September 2014 Fiber to the Chip Silicon Photonics Silicon Photonics Technology: Silicon material system & processing techniques to manufacture
More informationHigh Speed Detectors. Andreas Umbach ECOC 2009, Workshop 7 Monolithic and Hybrid Photonic Integrated Transceivers for Advanced Modulation Formats
High Speed Detectors Andreas Umbach ECOC 2009, Workshop 7 Monolithic and Hybrid Photonic Integrated Transceivers for Advanced Modulation Formats 100 Gbit/s Long-Haul Transport Optical networks use "standardized"
More informationSilicon Photonics: A Platform for Integration, Wafer Level Assembly and Packaging
Silicon Photonics: A Platform for Integration, Wafer Level Assembly and Packaging M. Asghari Kotura Inc April 27 Contents: Who is Kotura Choice of waveguide technology Challenges and merits of Si photonics
More informationInP-based Photonic Integration: Learning from CMOS
InP-based Photonic Integration: Learning from CMOS Meint Smit Roel Baets Mike Wale COBRA TU Eindhoven IMEC U Gent Oclaro Receive Transmit Transponder-based DWDM FOE 2009, LS InP PIC in Dig Comm Networks,
More informationSilicon photonics integration roadmap for applications in computing systems
Silicon photonics integration roadmap for applications in computing systems Bert Jan Offrein Neuromorphic Devices and Systems Group 2016 IBM Corporation Outline Photonics and computing? The interconnect
More informationSilicon Photonics for Mid-Board Optical Modules Marc Epitaux
Silicon Photonics for Mid-Board Optical Modules Marc Epitaux Chief Architect at Samtec, Inc Outline Interconnect Solutions Mid-Board Optical Modules Silicon Photonics o Benefits o Challenges DragonFly
More informationInnovations in Photonic Integration Platforms
Innovations in Photonic Integration Platforms September 20, 20 Burgeoning Growth Demand Disruptive Technology Video content is fast becoming a larger percentage of total internet traffic 50% Video services
More informationPhotonics Integration and Evolution of the Optical Transceiver Presented by: Giacomo Losio ProLabs
Photonics Integration and Evolution of the Optical Transceiver Presented by: Giacomo Losio ProLabs Optical Transceivers architecture is challenged Electrical Driver TIA Laser Photodiode Optical Optical
More informationIEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 2010 Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 2010 Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging Christophe Kopp, St ephane Bernab e, Badhise Ben Bakir,
More informationSilicon Photonics Opportunity, applications & Recent Results
Silicon Photonics Opportunity, applications & Recent Results Dr. Mario Paniccia Intel Fellow Director, Photonics Technology Lab Intel Corporation www.intel.com/go/sp Purdue University Oct 5 2007 Agenda
More information160-Gb/s Bidirectional Parallel Optical Transceiver Module for Board-Level Interconnects
160-Gb/s Bidirectional Parallel Optical Transceiver Module for Board-Level Interconnects Fuad Doany, Clint Schow, Jeff Kash C. Baks, D. Kuchta, L. Schares, & R. John IBM T. J. Watson Research Center doany@us.ibm.com
More informationMarkets for On-Chip and Chip-to-Chip Optical Interconnects 2015 to 2024 January 2015
Markets for On-Chip and Chip-to-Chip Optical Interconnects 2015 to 2024 January 2015 Chapter One: Introduction Page 1 1.1 Background to this Report CIR s last report on the chip-level optical interconnect
More informationTrends in Optical Transceivers:
Trends in Optical Transceivers: Light sources for premises networks Peter Ronco Corning Optical Fiber Asst. Product Line Manager Premises Fibers January 24, 2006 Outline: Introduction: Transceivers and
More informationSilicon photonics with low loss and small polarization dependency. Timo Aalto VTT Technical Research Centre of Finland
Silicon photonics with low loss and small polarization dependency Timo Aalto VTT Technical Research Centre of Finland EPIC workshop in Tokyo, 9 th November 2017 VTT Technical Research Center of Finland
More informationChip Scale Package Fiber Optic Transceiver Integration for Harsh Environments
Chip Scale Package Fiber Optic Transceiver Integration for Harsh Environments Chuck Tabbert and Charlie Kuznia Ultra Communications, Inc. 990 Park Center Drive, Suite H Vista, CA, USA, 92081 ctabbert@
More information450mm and Moore s Law Advanced Packaging Challenges and the Impact of 3D
450mm and Moore s Law Advanced Packaging Challenges and the Impact of 3D Doug Anberg VP, Technical Marketing Ultratech SOKUDO Lithography Breakfast Forum July 10, 2013 Agenda Next Generation Technology
More informationIntegrated electro-optical waveguide based devices with liquid crystals on a silicon backplane
Integrated electro-optical waveguide based devices with liquid crystals on a silicon backplane Florenta Costache Group manager Smart Micro-Optics SMO/AMS Fraunhofer Institute for Photonic Microsystems,
More informationGlobal Cloud Network Evolution
Global Cloud Network Evolution Peter Lam Senior Director of Systems Engineering, APAC 1 2015 Infinera The Tremendous Growth of Cloud Source: Computerworld 2015 Forecast Study 2 2015 Infinera ICP s are
More informationScalable Electro-optical Assembly Techniques for Silicon Photonics
Scalable Electro-optical Assembly Techniques for Silicon Photonics Bert Jan Offrein, Tymon Barwicz, Paul Fortier OIDA Workshop on Manufacturing Trends for Integrated Photonics Outline Broadband large channel
More information3D Integration Using Wafer-Level Packaging
3D Integration Using Wafer-Level Packaging July 21, 2008 Patty Chang-Chien MMIC Array Receivers & Spectrographs Workshop Pasadena, CA Agenda Wafer-Level Packaging Technology Overview IRAD development on
More informationRecent Developments in Multifunctional Integration. Stephan Guttowski, Head of Technology Park»Heterointegration«, Fraunhofer FMD
Recent Developments in Multifunctional Integration Stephan Guttowski, Head of Technology Park»Heterointegration«, Fraunhofer FMD Founding Participants 2 One-Stop-Shop for developments from wafer technologies
More informationProgress Towards Computer-Aided Design For Complex Photonic Integrated Circuits
Department of Electrical and Computer Engineering Progress Towards Computer-Aided Design For Complex Photonic Integrated Circuits Wei-Ping Huang Department of Electrical and Computer Engineering McMaster
More informationPutting PICs in Products A Practical Guideline. Katarzyna Ławniczuk
Putting PICs in Products A Practical Guideline Katarzyna Ławniczuk k.lawniczuk@brightphotonics.eu Outline Product development considerations Selecting PIC technology Design flow and design tooling considerations
More informationA Miniaturized Multi-Channel TR Module Design Based on Silicon Substrate
Progress In Electromagnetics Research Letters, Vol. 74, 117 123, 2018 A Miniaturized Multi-Channel TR Module Design Based on Silicon Substrate Jun Zhou 1, 2, *, Jiapeng Yang 1, Donglei Zhao 1, and Dongsheng
More informationSilicon Photonics in Optical Communications. Lars Zimmermann, IHP, Frankfurt (Oder), Germany
Silicon Photonics in Optical Communications Lars Zimmermann, IHP, Frankfurt (Oder), Germany Outline IHP who we are Silicon photonics Photonic-electronic integration IHP photonic technology Conclusions
More informationPamidighantam V Ramana, Li Jing, Jayakrishnan Chandrappan, Lim Teck Guan, Zhang Jing, John Lau Hon Shing, Dim Lee Kwong, Optical design of a miniature semi-integrated tunable laser on a Silicon Optical
More informationMEDIA RELEASE FOR IMMEDIATE RELEASE 26 JULY 2016
MEDIA RELEASE FOR IMMEDIATE RELEASE 26 JULY 2016 A*STAR S IME KICKS OFF CONSORTIA TO DEVELOP ADVANCED PACKAGING SOLUTIONS FOR NEXT-GENERATION INTERNET OF THINGS APPLICATIONS AND HIGH-PERFORMANCE WIRELESS
More informationBCD Smart Power Roadmap Trends and Challenges. Giuseppe Croce NEREID WORKSHOP Smart Energy Bertinoro, October 20 th
BCD Smart Power Roadmap Trends and Challenges Giuseppe Croce NEREID WORKSHOP Smart Energy Bertinoro, October 20 th Outline 2 Introduction Major Trends in Smart Power ASICs An insight on (some) differentiating
More informationEPIC: The Convergence of Electronics & Photonics
EPIC: The Convergence of Electronics & Photonics K-Y Tu, Y.K. Chen, D.M. Gill, M. Rasras, S.S. Patel, A.E. White ell Laboratories, Lucent Technologies M. Grove, D.C. Carothers, A.T. Pomerene, T. Conway
More informationOptical Integration and DSP in Next Generation Networks. Atul Srivastava CTO, NTT Electronics - America. Market Focus ECOC 2013
Optical Integration and DSP in Next Generation Networks Atul Srivastava CTO, NTT Electronics - America Market Focus ECOC 2013 Outline 100G Deployment Rapid Growth in Long Haul Role of Modules 100G Module
More informationOptical Networks emerging technologies and architectures
Optical Networks emerging technologies and architectures Faculty of Computer Science, Electronics and Telecommunications Department of Telecommunications Artur Lasoń 100 Gb/s PM-QPSK (DP-QPSK) module Hot
More informationThe Intimate Integration of Photonics and Electronics for Computing and Switching Systems
The Intimate Integration of Photonics and Electronics for Computing and Switching Systems A. V. Krishnamoorthy Acknowledgements: - My colleagues at: - Bell Laboratories - AraLight - Sun Microsytems 1 Outline
More informationHow material engineering contributes to delivering innovation in the hyper connected world
How material engineering contributes to delivering innovation in the hyper connected world Paul BOUDRE, Soitec CEO Leti Innovation Days - July 2018 Grenoble, France We live in a world of data In perpetual
More informationIntegration of Optoelectronic and RF Devices for Applications in Optical Interconnect and Wireless Communication
Integration of Optoelectronic and RF Devices for Applications in Optical Interconnect and Wireless Communication Zhaoran (Rena) Huang Assistant Professor Department of Electrical, Computer and System Engineering
More informationLong-wavelength VCSELs ready to benefit 40/100-GbE modules
Long-wavelength VCSELs ready to benefit 40/100-GbE modules Process technology advances now enable long-wavelength VCSELs to demonstrate the reliability needed to fulfill their promise for high-speed module
More informationPackaged mm-wave GaN, GaAs and Si ICs for 5G and automotive radar
Packaged mm-wave GaN, GaAs and Si ICs for 5G and automotive radar Eric Leclerc UMS 1 st Nov 2018 Outline Why heterogenous integration? About UMS Technology portfolio Design tooling: Cadence / GoldenGate
More informationSiGe BiCMOS and Photonic technologies for high frequency and communication applications Andreas Mai
SiGe BiCMOS and Photonic technologies for high frequency and communication applications Andreas Mai Department Head Technology Outline Introduction & Motivation SiGe HBT device developments for high RF
More informationFiber-Optic Transceivers for High-speed Digital Interconnects in Satellites
Photo: ESA Fiber-Optic Transceivers for High-speed Digital Interconnects in Satellites ICSO conference, 9 Oct 2014 Mikko Karppinen (mikko.karppinen@vtt.fi), V. Heikkinen, K. Kautio, J. Ollila, A. Tanskanen
More informationMEMS Sensors: From Automotive. CE Applications. MicroNanoTec Forum Innovations for Industry April 19 th Hannover, Germany
MEMS Sensors: From Automotive to CE Applications MicroNanoTec Forum Innovations for Industry 2010 April 19 th Hannover, Germany Oliver Schatz, CTO 1 Engineering April 2010 GmbH 2009. All rights reserved,
More informationSATURNE Microsystems Based on Wide Band Gap Materials for Future Space Transmitting Ultra Wideband Receiving Systems
SATURNE Microsystems Based on Wide Band Gap Materials for Future Space Transmitting Ultra Wideband Receiving Systems A. ZIAEI THALES Research & Technology Research & Technology www.saturne-project.com
More informationHOW TO CONTINUE COST SCALING. Hans Lebon
HOW TO CONTINUE COST SCALING Hans Lebon OUTLINE Scaling & Scaling Challenges Imec Technology Roadmap Wafer size scaling : 450 mm 2 COST SCALING IMPROVED PERFORMANCE 3 GLOBAL TRAFFIC FORECAST Cloud Traffic
More informationRecherche en verre sur la télécommunication
Science & Technology Recherche en verre sur la télécommunication Dr. Aleksandra Boskovic Directrice, Corning European Technology Center A Culture of Innovation 1879 Glass envelope for Thomas Edison s light
More informationChallenges in Imaging, Sensors, and Signal Processing
Challenges in Imaging, Sensors, and Signal Processing Raymond Balcerak MTO Technology Symposium March 5-7, 2007 1 Report Documentation Page Form Approved OMB No. 0704-0188 Public reporting burden for the
More informationHybrid Integration Technology of Silicon Optical Waveguide and Electronic Circuit
Hybrid Integration Technology of Silicon Optical Waveguide and Electronic Circuit Daisuke Shimura Kyoko Kotani Hiroyuki Takahashi Hideaki Okayama Hiroki Yaegashi Due to the proliferation of broadband services
More informationThe Future of Packaging ~ Advanced System Integration
The Future of Packaging ~ Advanced System Integration Enabling a Microelectronic World R. Huemoeller SVP, Adv. Product / Platform Develop June 2013 Product Segments End Market % Share Summary 2 New Product
More informationWhite Paper. 100G beyond 10km A global study coherent and PAM4 Technology. Date: By Ambroise Thirion
White Paper Date: 100G beyond 10km A global study coherent and PAM4 Technology By Ambroise Thirion Contents I. II. III. IV. The challenge of going beyond 10km on 100G links...3 Long reach technologies
More informationQSFP+ / QSFP28 application guide 2017/20/04
QSFP+ / QSFP28 application guide 2017/20/04 40G QSFP+ QSFP+ to QSFP+ connectivity QSFP+ to 4x10G SFP+ aggregation SFP+ SFP+ SFP+ QSFP+ QSFP+ QSFP+ SFP+ Four technologies Direct Attached Cable Active Optical
More informationSilicon photonics on 3 and 12 μm thick SOI for optical interconnects Timo Aalto VTT Technical Research Centre of Finland
Silicon photonics on 3 and 12 μm thick SOI for optical interconnects Timo Aalto VTT Technical Research Centre of Finland 5th International Symposium for Optical Interconnect in Data Centres in ECOC, Gothenburg,
More informationSi and InP Integration in the HELIOS project
Si and InP Integration in the HELIOS project J.M. Fedeli CEA-LETI, Grenoble ( France) ECOC 2009 1 Basic information about HELIOS HELIOS photonics ELectronics functional Integration on CMOS www.helios-project.eu
More informationOverview and Roadmap for European projects in Optical Interconnects
Overview and Roadmap for European projects in Optical Interconnects Dptm. of Informatics, Aristotle Univ. of Thessaloniki, Greece http://phos-net.csd.auth.gr/ Why is an overview needed? To identify possible
More informationIntegration of Photonics Technology for Communication Systems
Integration of Photonics Technology for Communication Systems Sudhakar Sekar Abstract Video is an important revenue generating platform for both cable and telecom service providers and will also impact
More informationOptical Transceivers. May
Optical Transceivers May 2018 carritech.com @Carritech Contents Carritech Optical Transceivers Our Products 100G QSFP28 40G QSFP+ 25G SFP28 10G SFP+ SFP XFP CFP Quality Assurance Ordering from Carritech
More informationX5 and Z5 Modulator. Telcordia 468. Key Features. Applications. Compliance AGILE OPTICAL COMPONENTS NORTH AMERICA: JDSU (5378)
AGILE OPTICAL COMPONENTS X5 and Z5 Modulator Key Features Small size: 65 x 12 x 5 mm Surface mountable with gull wing DC pins GPO RF connector Integrated PD (photodiode) for bias and power control 200
More informationWWDM Transceiver Module for 10-Gb/s Ethernet
WWDM Transceiver Module for 10-Gb/s Ethernet Brian E. Lemoff Hewlett-Packard Laboratories lemoff@hpl.hp.com IEEE 802.3 HSSG Interim Meeting Coeur d Alene, Idaho June 1-3, 1999 Why pursue WWDM for the LAN?
More informationRevolutionary Communications
Revolutionary Communications Will Stewart Chief Scientist, Marconi Communications Traffic Forecast (1996)-2005 Terabytes/Day 14000 12000 10000 8000 6000 4000 2000 0 CAGR 1996-2005 Internet 95.8% Voice
More informationRoss Saunders GM, Next-gen Transport Opnext Subsystems Inc. 100G Cost/Performance Optimization
Ross Saunders GM, Next-gen Transport Opnext Subsystems Inc. 100G Cost/Performance Optimization Contents Historical vs Future Optical Transport Challenges What we did at 40G lessons learned Electronic and
More informationFiber-optic transceivers for multi-gigabit interconnects in space systems
VTT TECHNICAL RESEARCH CENTRE OF FINLAND LTD Photo: ESA Fiber-optic transceivers for multi-gigabit interconnects in space systems at EPIC Tech Watch of Micro Photonics Expo, Berlin, 11 Oct 2016 Mikko Karppinen(mikko.karppinen@vtt.fi)
More informationAbstract: Phone performance using CDMA protocals (CDMA-2000 and WCDMA) is strongly dominated by the choice of those components closest to the
DUPLEXERS Abstract: Phone performance using CDMA protocals (CDMA-2000 and WCDMA) is strongly dominated by the choice of those components closest to the antenna. The first component after the antenna (on
More informationFiber Optics for Harsh Environments ICSO Chuck Tabbert
Fiber Optics for Harsh Environments ICSO 2016 Chuck Tabbert VP Sales & Marketing Ultra Communications (505) 823-1293 ctabbert@ultracomm-inc.com www.ultracomm-inc.com If anyone would like copy of briefing
More informationT/R Modules. Version 1.0
T/R Modules Version 1.0 Date: Jun 1, 2015 CONTENT Product Overview... 3 FACTS ON THE TECHNOLOGY... 4 ABOUT NANOWAVE... 6 RF Components and Subsystems NANOWAVE Technologies Inc. is a privately owned Canadian
More informationFabricating 2.5D, 3D, 5.5D Devices
Fabricating 2.5D, 3D, 5.5D Devices Bob Patti, CTO rpatti@tezzaron.com Tezzar on Semiconduct or 04/15/2013 1 Gen4 Dis-Integrated 3D Memory DRAM layers 42nm node 2 million vertical connections per lay per
More informationWavelength Division Multiplexing (WDM) Technology for Naval Air Applications
Wavelength Division Multiplexing (WDM) Technology for Naval Air Applications Drew Glista Naval Air Systems Command Patuxent River, MD glistaas@navair.navy.mil 301-342-2046 1 Report Documentation Page Form
More informationChip-Scale Package Fiber Optic Transceiver Integration for Harsh Environments. Chuck Tabbert
Chip-Scale Package Fiber Optic Transceiver Integration for Harsh Environments Chuck Tabbert ctabbert@ultracomm-inc.com (505) 823-1293 Agenda Corporate Overview Motivation Background Technology Wide Temperature
More informationSilicon nitride based TriPleX Photonic Integrated Circuits for sensing applications
Silicon nitride based TriPleX Photonic Integrated Circuits for sensing applications Arne Leinse a.leinse@lionix-int.com 2 Our chips drive your business 2 What are Photonic ICs (PICs)? Photonic Integrated
More informationFuture Optical Network Architecture for Phased Array Antenna
Future Optical Network Architecture for Phased Array Antenna Mathias PEZ D-Lightsys 101 Rue Philibert Hoffmann F-93116 Rosny Sous Bois, France Mathias.pez@d-lightsys.com Abstract This white paper describes
More informationMARCH mmw-sprawl photonic integrated circuits for microwave photonics Martijn Heck
MARCH 25. 2016 mmw-sprawl photonic integrated circuits for microwave photonics Martijn Heck 1 2 playing field PIC technology The case for photonic integration Pros Cons system performance: speed, sensitivity
More informationinemi OPTOELECTRONICS ROADMAP FOR 2004 Dr. Laura J. Turbini University of Toronto SMTA International September 26, 2005
inemi OPTOELECTRONICS ROADMAP FOR 2004 0 Dr. Laura J. Turbini University of Toronto SMTA International September 26, 2005 Outline Business Overview Traditional vs Jisso Packaging Levels Optoelectronics
More informationA 3.9 ns 8.9 mw 4 4 Silicon Photonic Switch Hybrid-Integrated with CMOS Driver
A 3.9 ns 8.9 mw 4 4 Silicon Photonic Switch Hybrid-Integrated with CMOS Driver A. Rylyakov, C. Schow, B. Lee, W. Green, J. Van Campenhout, M. Yang, F. Doany, S. Assefa, C. Jahnes, J. Kash, Y. Vlasov IBM
More informationPresentation Overview
Low-cost WDM Transceiver Technology for 10-Gigabit Ethernet and Beyond Brian E. Lemoff, Lisa A. Buckman, Andrew J. Schmit, and David W. Dolfi Agilent Laboratories Hot Interconnects 2000 Stanford, CA August
More informationPhotonique sur silicium: Tendances et perspectives de marché
From Technologies to Market Photonique sur silicium: Tendances et perspectives de marché Eric MOUNIER, YOLE DEVELOPPEMENT 2017 FIELDS OF EXPERTISE Yole Développement s 30 analysts operate in the following
More informationGood Things Come in Small Cubes. Cube Optics 100G Metro Evolution TREX14 01/06/14
Good Things Come in Small Cubes Cube Optics 100G Metro Evolution TREX14 01/06/14 VO0030_5.0 01.06.2014 Page 2 Before we start talking about 100Gig Lets go back to basics and understand what we mean by
More informationTransceiver Compatibility and Interoperability
Overview Transceiver Compatibility and Interoperability The Arista optical transceivers and cables product range offer maximum deployment flexibility and cost optimized network connectivity. The Arista
More informationManufacturing Development of a New Electroplated Magnetic Alloy Enabling Commercialization of PwrSoC Products
Manufacturing Development of a New Electroplated Magnetic Alloy Enabling Commercialization of PwrSoC Products Trifon Liakopoulos, Amrit Panda, Matt Wilkowski and Ashraf Lotfi PowerSoC 2012 CONTENTS Definitions
More informationA tunable Si CMOS photonic multiplexer/de-multiplexer
A tunable Si CMOS photonic multiplexer/de-multiplexer OPTICS EXPRESS Published : 25 Feb 2010 MinJae Jung M.I.C.S Content 1. Introduction 2. CMOS photonic 1x4 Si ring multiplexer Principle of add/drop filter
More informationCellular Antenna Switches for Multimode Applications Based on a Silicon-On-Insulator (S-O-I) Technology
Cellular Antenna Switches for Multimode Applications Based on a Silicon-On-Insulator (S-O-I) Technology Ali Tombak, Christian Iversen, Jean-Blaise Pierres, Dan Kerr, Mike Carroll, Phil Mason, Eddie Spears
More informationMay 21-23, 2012 Białystok, Poland
6 th International Forum May 21-23, 2012 Białystok, Poland Photonic integrated circuits and generic integration concept. Photonic solutions for research institutes, SME's and large companies Katarzyna
More informationPhotonic Integrated Circuits for 400 Gigabit and 1 Terabit Coherent Transport
Photonic Integrated Circuits for 400 Gigabit and 1 Terabit Coherent Transport September 25, 2013 OUTLINE Overview of Optical Transport Market Evolution of Coherent Optical Module PICs for Line-Side 400G
More informationDual Parallel Mach-Zehnder (DPMZ) Modulator
AGILE OPTICAL COMPONENTS Dual Parallel Mach-Zehnder (DPMZ) Modulator Key Features Monolithically integrated, parallel, high-speed MZ modulators, with a phase modulator superstructure High-speed MZ modulators
More informationE. A. MENDOZA, J. PROHASKA, C. KEMPEN, S. SUN and Y. ESTERKIN
Fully Integrated Miniature Multi-Point Fiber Bragg Grating Sensor Interrogator (FBG-Transceiver TM ) System for Applications where Size, Weight, and Power are Critical for Operation E. A. MENDOZA, J. PROHASKA,
More information