Photonics Integration and Evolution of the Optical Transceiver Presented by: Giacomo Losio ProLabs
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1 Photonics Integration and Evolution of the Optical Transceiver Presented by: Giacomo Losio ProLabs
2 Optical Transceivers architecture is challenged Electrical Driver TIA Laser Photodiode Optical Optical transceivers can t continue to be a simple electro-optical converter Bandwidth increases, but cost, dimension and power need to go down Electrical interface beyond 10Gbit/s: need to compensate copper loss and distortion Electrical bottleneck: keep low pin count, boost lane speed Optics at 25Gbit/s and more: reduce cost, complexity and power 2
3 Electronics comes to the rescue Constant scaling of size and power of ICs now allows integration of new functions inside the transceiver Transmission impairments can be compensated at low cost in the electronic domain, permitting to relax optics performance Source: Intel 3
4 EDC Electrical and optical signal distortion can be compensated in the electrical domain Extends reach and relaxes component requirements Low power solutions are already possible in consolidated technologies A 25Gb/s 5.8mW CMOS Equalizer J.W. Jung et al. ISSCC2014 4
5 Forward error correction Forward error correction has been one of the key drivers of optical communication progress For cost and power reasons it has been used only in transport networks Current silicon node is compatible with transceiver real estate/power consumption FEC with >6dB gain,<100ns latency are feasible in less than (*) 1mm2 silicon area Can trade-off correction capability with latency Very important for multilevel modulation where SNR is reduced (*) Wang et al. IEEE 802.3BM contribution, SEP
6 Analog to Digital Converters Enable multi-level signalling Digital signal processing at receiver Low power implementation possible 10GS/s 6 bit ADC in 28nm FDSOI, STM(*) Power: 32mW Area: 80x115 [μm] 90GS/s 8 bit ADC in 32nm SOI CMOS, IBM(**) Power: 667mW@90GS/s Area: 1.25x1.5 [mm] Source: Globaltek (*) A 20GHz-BW 6b 10GS/s 32mW Time-Interleaved SAR ADC with Master T&H in 28nm UTBB FDSOI Technology Le Tual et al., ISSCC2014 (**) A 90GS/s 8b 667mW 64x Interleaved SAR ADC in 32nm Digital SOI CMOS Kull et al., ISSCC2014 6
7 The old and the new transceiver Every functional block will be impacted Electrical TX IC Cu equalization FEC Encoder Advanced Modulation TX signal conditioning Drivers Driver TX optical Laser IC Optical circuits Mux Multichannel WDM Optical RX IC ADC EDC/DSP FEC decoder TIA RX optical Photodiode IC Demux Integrated PD TIA Integrate μcontroller and EEPROM in ICs to reduce transceiver real estate ARM Cortex -M3 consumes 7μW/MHz, 0.03mm 2 die area 7
8 Electronics success factors Progress of electronics has been incredible, optics lagged behind in a divided camp Enabling Technology Building block Optics Many (LD, PD, driver, modulator, etc.) Semiconductor IC Transistor Material Prevalent MFG process Many (InP, GaAs, InGaAs, Si, LiNbO 3, ) Many Siliconize Photonics to leverage CMOS investments Silicon CMOS Economy of scale NO YES 8
9 Datacenter Optics can be Silicon Photonics killer app Multimode transceivers ruled Campus and Datacenter optics, but struggle to keep up with speed and distance 1000BASE-SX 550m on OM2 fiber 10GBASE-SR 300m on OM3 fiber 100GBASE-SR10 100m on OM3 fiber, 150m on OM4 Datacenters are becoming huge installations: need 500m reach ore more Bandwidth inside Datacenter is unimaginable One http request (1KB) can generate 1MB internal traffic (*) Big Data and IoT applications still haven t unleashed all their potential Datacenters need affordable, fast interconnects (*) Facebook s Data Center Network Architecture Farrington et al
10 Transceiver Evolution to meet the Data Center challenge Push Bandwidth in every dimension Lane Speed (Gbs) * Parallel Channels * WDM on each fiber Increase the throughput (Ports*BW) over front, mid- and backplanes Evolving pluggable form factors: SFP+(1.6Tb) -> QSFP+(3.6T) > CDFP(9.6Tb) Transceiver will become pluggable ASICs to enable optical front-, mid- and backplanes with higher throughput Lower the cost of the transceiver: Integration of electronics and optics Eliminate sub-assembly and sub-components Automate assembly and wafer scale semiconductor-like manufacturing 10
11 Pushing Bandwidth in every Dimensions Line Rate (Gb/s) /56G SR Transceiver Mellanox is pushing the boundary on every dimension to increase the bandwidth of the transceiver 100G Transceiver (4x25G) G Transceiver 100G (4x25G) WDM Transceiver, 2Km 300G MBOM (12X25G) Wavelength Channel 24 Physical Channel 11
12 Photonics Integration eliminates 100s of piece parts SIP Tx Heat Sink Block Microprocessor TX (Modulator) RX (Detector) Fiber Ribbon Holder SIP Rx Driver / TIA Silicon Photonics Integration One laser drives multiple parallel channels Monolithic integration of detectors and waveguides Integrated WDM capabilities No subassembly i.e. No TOSA/ROSA No lenses, no isolator, no TEC Making 100Gb/s Deployments as Easy as 10Gb/s 12
13 Photonics Integration: one laser for four channels Splitter Lasers Modulators Scalable and efficient silicon photonics platform: Simple FTTH style laser drives multiple channels Flip-chip bonded die Passive alignment No isolator, no laser subassembly Splitter to make four separate channels Tap and power monitor Easily accommodates arrays 13
14 Photonics Integration: Tiny FK modulators scale to >50 GHz 25Gb/s Eye Franz-Keldysh modulator is >>10x smaller than MZI Only 40 um long Provides 5dB ER Integrates well with WDM section 14
15 Photonics Integration: germanium detectors scale to >50 Gb/s 1.2 TE TM Limit Responsivity(A/W) PDR(dB) Wavelength(nm) Wavelength(nm) Frequency (GHz) 15
16 WDM on each fiber WDM allows for many wavelengths over a single fiber 100 s of wavelengths can be applied input Reflective facet Slab output The 1550nm band provide the best density With gratings WDM can be integrated into silicon photonics Scale from 4 to 40+ wavelength Mellanox has demonstrated > 1Tb/s WDM devices... 10x smaller than AWGs Very low cross talk 16
17 Higher throughput over Front-, Mid- and Backplanes... by using pluggable transceivers inside Servers and Swithes Front panel QSFP LC or MPO CPU Switch Node Switch Compute Node NIC Mid- or Back plane Switch-to-NIC/Server over optical backplane The pluggable transceiver enables: Front panels with passive optical connectors (LC or MPO) with higher port density than QSFP Mid- and Back planes with optical, scalable and denser connectivity. Higher speed and longer distances Better signal integrity. Electrical high speed signals are shorter and get offloaded by the transceiver close to the ASIC or CPU Memory Electrical connections Optical connections Transceiver (pluggable and board mount) 17
18 Transceiver as a pluggable ASIC Transceiver Characteristics: Bandwidth 16mm 336Gbps bidirectional (up to 28G/ch) 12ch full duplex optical engine Advanced features: 24mm Retiming and equalizer Intelligent link features 24mm Reach BERT 60m (MMF, 850nm) 500m (SMF, 1550nm) Power consumption 5.2 mw/gbps (w/o retiming) 18
19 The intelligent link
20 Low Speed Communication Features Low speed communication Beacons and morse when not running full speed Laser safety for MBOM Sub band modulation System level Primary 28G modulation Sub band modulation Application Test and locate Green cable Fiber testing and TX power adjust Link authentication OAM High speed standard compliant signal path Control Path µc µc 20
21 Application examples: automatic link adjustment Receiver evaluates performance Most receivers are equipped with eye monitoring, can estimate BER Can be inferred by taps of RX filters FEC counters Information is back-propagated to Transmitter Simple in-band protocol Transmitter optimizes performance Regulate TX power and eye to overcome transmission impairments Optimize FEC correction capability vs. power/latency Benefits Better utilization of link resources Lowest power consumption/cooling needs OPEX reduction 21
22 Transceiver will no longer be a dumb electro-optical converters Optical transceivers will Incorporate more electronics Have more optical circuits/ components Protect investment in networking equipment Transceivers will become a pluggable ASIC Solve ICs bandwidth bottleneck Increase port density Optics & electronics integration helps to reduce cost Silicon Photonics puts optics on the same trajectory of ICs 22
23 Thank you! 23
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