27C128. Obsolete Device. 128K (16K x 8) CMOS EPROM FEATURES PACKAGE TYPES DESCRIPTION DIP/SOIC

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28K (6K x 8) CMS EPRM bsolete Device 27C28 FEATURES PACKAGE TYPES High speed performance - 2 ns access time available CMS Technology for low power consumption - 2 ma Active current - µa Standby

1 28K (6K x 8) CMS EPRM bsolete Device 27C28 FEATURES PACKAGE TYPES High speed performance - 2 ns access time available CMS Technology for low power consumption - 2 ma Active current - µa Standby current Factory programming available Auto-insertion-compatible plastic packages Auto ID aids automated programming Separate chip enable and output enable controls High speed express programming algorithm rganized 6K x 8: JEDEC standard pinouts - 28-pin Dual-in-line package - 32-pin PLCC Package - 28-pin SIC package - Tape and reel Available for the following temperature ranges: - Commercial: C to +7 C - Industrial: -4 C to +85 C - Automotive: -4 C to +25 C DESCRIPTIN The Microchip Technology Inc. 27C28 is a CMS 28K bit (electrically) Programmable Read nly Memory. The device is organized as 6K words by 8 bits (6K bytes). Accessing individual bytes from an address transition or from power-up (chip enable pin going low) is accomplished in less than 2 ns. CMS design and processing enables this part to be used in systems where reduced power consumption and high reliability are requirements.a complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, SIC, or TSP packaging is available. Tape and reel packaging is also available for PLCC or SIC packages. U erasable versions are also available. A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC or SIC packaging is available. Tape and reel packaging is also available for PLCC or SIC packages. DIP/SIC PLCC PP A2 A7 A6 A5 A4 A3 A2 A A 2 SS A6 5 A5 6 A4 7 A3 8 A2 9 A A NC A7 A PP NU cc PGM A3 2 27C28 27C SS NU CC PGM A3 A8 A9 A E A CE A8 28 A9 27 A 26 NC 25 E 24 A 23 CE Microchip Technology Inc. DS3L-page

2 27C28. ELECTRICAL CHARACTERISTICS. Maximum Ratings* CC and input voltages w.r.t. SS to PP voltage w.r.t. SS during programming to +4 oltage on A9 w.r.t. SS to +3.5 utput voltage w.r.t. SS to CC +. Storage temperature C to +5 C Ambient temp. with power applied C to +25 C *Notice: Stresses above those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE -: Name A-A3 CE E PGM PP - 7 CC SS NC NU PIN FUNCTIN TABLE Address Inputs Chip Enable utput Enable Program Enable Function Programming oltage Data utput +5 Power Supply Ground No Connection; No Internal Connections Not Used; No External Connection Is Allowed TABLE -2: READ PERATIN DC CHARACTERISTICS CC = +5 (±%) Commercial: Tamb = C to +7 C Industrial: Tamb = -4 C to +85 C Extended (Automotive): Tamb = -4 C to +25 C Parameter Part* Status Symbol Min. Max. Units Conditions Input oltages all Logic "" Logic "" IH IL CC+.8 Input Leakage all ILI - µa IN = to CC utput oltages all Logic "" Logic "" H L IH = -4 µa IL = 2. ma utput Leakage all IL - µa UT = to CC Input Capacitance all CIN 6 pf IN = ; Tamb = 25 C; f = MHz utput Capacitance all CUT 2 pf UT = ; Tamb = 25 C; f = MHz Power Supply Current, Active C I,E TTL input TTL input ICC ICC ma ma CC = 5.5; PP = CC f = MHz; E = CE = IL; IUT = ma; IL = -. to.8; IH = 2. to CC; Note Power Supply Current, Standby C I, E all TTL input TTL input CMS input ICC(S) 2 3 ma ma µa CE = CC ±.2 IPP Read Current PP Read oltage all all Read Mode Read Mode IPP PP CC-.7 CC µa PP = 5.5 * Parts: C=Commercial Temperature Range; I, E=Industrial and Extended Temperature Ranges Note : Typical active current increases.75 ma per MHz up to operating frequency for all temperature ranges. DS3L-page 2 24 Microchip Technology Inc.

3 27C28 TABLE -3: READ PERATIN AC CHARACTERISTICS AC Testing Waveform: IH = 2.4 and IL =.45; H = 2. L =.8 utput Load: TTL Load + pf Input Rise and Fall Times: ns Ambient Temperature: Commercial: Tamb = C to +7 C Industrial: Tamb = -4 C to +85 C Extended (Automotive): Tamb = -4 C to +25 C Parameter Sym 27C C C C C28-25 Min Max Min Max Min Max Min Max Min Max Units Conditions Address to utput Delay tacc ns CE=E=IL CE to utput Delay tce ns E=IL E to utput Delay te ns CE=IL CE or E to /P High Impedance utput Hold from Address CE or E, whichever occurs first tff ns th ns FIGURE -: READ WAEFRMS 24 Microchip Technology Inc. DS3L-page 3

4 27C28 TABLE -4: PRGRAMMING DC CHARACTERISTICS Ambient Temperature: Tamb = 25 C ± 5 C CC = 6.5 ±.25, PP = 3. ±.25 Parameter Status Symbol Min Max. Units Conditions Input oltages Logic Logic IH IL CC+.8 Input Leakage ILI - µa IN = to CC utput oltages Logic Logic H L IH = -4 µa IL = 2. ma CC Current, program & verify ICC2 2 ma Note PP Current, program IPP2 25 ma Note A9 Product Identification H Note : CC must be applied simultaneously or before PP and removed simultaneously or after PP TABLE -5: PRGRAMMING AC CHARACTERISTICS for Program, Program erify AC Testing Waveform: IH=2.4 and IL=.45; H=2.; L=.8 and Program Inhibit Modes Ambient Temperature: Tamb=25 C± 5 C CC= 6.5 ±.25, PP = H = 3. ±.25 Parameter Symbol Min Max Units Remarks Address Set-Up Time tas 2 µs Data Set-Up Time tds 2 µs Data Hold Time tdh 2 µs Address Hold Time tah µs Float Delay (2) tdf 3 ns CC Set-Up Time tcs 2 µs Program Pulse Width () tpw 95 5 µs µs typical CE Set-Up Time tces 2 µs E Set-Up Time tes 2 µs PP Set-Up Time tps 2 µs Data alid from E te ns Note : For express algorithm, initial programming width tolerance is µs ±5%. 2: This parameter is only sampled and not % tested. utput float is defined as the point where data is no longer driven (see timing diagram). DS3L-page 4 24 Microchip Technology Inc.

5 27C28 FIGURE -2: PRGRAMMING WAEFRMS () TABLE -6: MDES peration Mode CE E PGM PP A9-7 Read IL IL IH CC X DUT Program IL IH IL H X DIN Program erify IL IL IH H X DUT Program Inhibit IH X X H X High Z Standby IH X X CC X High Z utput Disable IL IH IH CC X High Z Identity IL IL IH CC H Identity Code X = Don t Care.2 Read Mode (See Timing Diagrams and AC Characteristics) Read Mode is accessed when a) the CE pin is low to power up (enable) the chip b) the E pin is low to gate the data to the output pins For Read operations, if the addresses are stable, the address access time (tacc) is equal to the delay from CE to output (tce). Data is transferred to the output after a delay from the falling edge of E (te). 24 Microchip Technology Inc. DS3L-page 5

6 27C28.3 Standby Mode The standby mode is defined when the CE pin is high (IH) and a program mode is not defined. When these conditions are met, the supply current will drop from 2 ma to µa..4 utput Enable This feature eliminates bus contention in microprocessor-based systems in which multiple devices may drive the bus. The outputs go into a high impedance state when the following condition is true: The E and PGM pins are both high..5 Erase Mode (U.. Windowed ersions) Windowed products offer the capability to erase the memory array. The memory matrix is erased to the all s state when exposed to ultraviolet light. To ensure complete erasure, a dose of 5 watt-second/cm 2 is required. This means that the device window must be placed within one inch and directly underneath an ultraviolet lamp with a wavelength of 2537 Angstroms, intensity of 2,µW/cm 2 for approximately 2 minutes..6 Programming Mode The Express Algorithm has been developed to improve the programming throughput times in a production environment. Up to ten -microsecond pulses are applied until the byte is verified. No overprogramming is required. A flowchart of the express algorithm is shown in Figure -3. Programming takes place when: a) CC is brought to the proper voltage, b) PP is brought to the proper H level, c) the CE pin is low, d) the E pin is high, and e) the PGM pin is low. Since the erased state is in the array, programming of is required. The address to be programmed is set via pins A-A3 and the data to be programmed is presented to pins -7. When data and address are stable, E is high, CE is low and a low-going pulse on the PGM line programs that location..7 erify After the array has been programmed it must be verified to ensure all the bits have been correctly programmed. This mode is entered when all the following conditions are met: a) CC is at the proper level, b) PP is at the proper H level, c) the CE line is low, d) the PGM line is high, and e) the E line is low..8 Inhibit When programming multiple devices in parallel with different data, only CE or PGM need be under separate control to each device. By pulsing the CE or PGM line low on a particular device in conjunction with the PGM or CE line low, that device will be programmed; all other devices with CE or PGM held high will not be programmed with the data, although address and data will be available on their input pins (i.e., when a high level is present on CE or PGM); and the device is inhibited from programming..9 Identity Mode In this mode specific data is output which identifies the manufacturer as Microchip Technology Inc. and device type. This mode is entered when Pin A9 is taken to H (.5 to 2.5). The CE and E lines must be at IL. A is used to access any of the two non-erasable bytes whose data appears on through 7. Pin Input utput Identity Manufacturer Device Type* A IL IH * Code subject to change H e x DS3L-page 6 24 Microchip Technology Inc.

7 27C28 FIGURE -3: PRGRAMMING EXPRESS ALGRITHM 24 Microchip Technology Inc. DS3L-page 7

8 27C28 27C28 Product Identification System To order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory or the listed sales offices. 27C28 25 I /P Package: L = Plastic Leaded Chip Carrier (PLCC) P = Plastic DIP (6 Mil) S = Plastic SIC (3 Mil) Temperature Blank = C to +7 C Range: I = -4 C to +85 C E = -4 C to +25 C Access Time: 2 = 2 ns 5 = 5 ns 7 = 7 ns 2 = 2 ns 25 = 25 ns Device: 27C28 28K (6K x 8) CMS EPRM DS3L-page 8 24 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet.

9 Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as unbreakable. Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dspic, KEELQ, microid, MPLAB, PIC, PICmicro, PICSTART, PR MATE, PowerSmart, rfpic, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, MXDE, MXLAB, PICMASTER, SEEAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dspicdem, dspicdem.net, dspicworks, ECAN, ECNMNITR, FanSense, FlexRM, fuzzylab, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rflab, rfpicdem, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. 24, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received IS/TS-6949:22 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain iew, California in ctober 23. The Company s quality system processes and procedures are for its PICmicro 8-bit MCUs, KEELQ code hopping devices, Serial EEPRMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip s quality system for the design and manufacture of development systems is IS 9:2 certified. 24 Microchip Technology Inc. DS3L-page 9

10 WRLDWIDE SALES AND SERICE AMERICAS Corporate ffice 2355 West Chandler Blvd. Chandler, AZ Tel: Fax: Technical Support: Web Address: Atlanta 378 Mansell Road, Suite 3 Alpharetta, GA 322 Tel: Fax: Boston 2 Lan Drive, Suite 2 Westford, MA 886 Tel: Fax: Chicago 333 Pierce Road, Suite 8 Itasca, IL 643 Tel: Fax: Dallas 62 Addison Road, Suite 255 Addison Plaza Addison, TX 75 Tel: Fax: Detroit Tri-Atria ffice Building Northwestern Highway, Suite 9 Farmington Hills, MI Tel: Fax: Kokomo 2767 S. Albright Road Kokomo, IN 4692 Tel: Fax: Los Angeles 2595 Acero St., Suite 2 Mission iejo, CA 9269 Tel: Fax: San Jose 3 Terra Bella Avenue Mountain iew, CA 9443 Tel: Fax: Toronto 6285 Northam Drive, Suite 8 Mississauga, ntario L4 X5, Canada Tel: Fax: ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Unit 32 4 Rawson Street Epping 22, NSW Sydney, Australia Tel: Fax: China - Beijing Unit 76B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. Beijing, 27, China Tel: Fax: China - Chengdu Rm , 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 66, China Tel: Fax: China - Fuzhou Unit 28F, World Trade Plaza No. 7 Wusi Road Fuzhou 35, China Tel: Fax: China - Hong Kong SAR Unit 9-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: Fax: China - Shanghai Room 7, Bldg. B Far East International Plaza No. 37 Xian Xia Road Shanghai, 25 Tel: Fax: China - Shenzhen Rm. 82, 8/F, Building A, United Plaza No. 522 Binhe Road, Futian District Shenzhen 5833, China Tel: Fax: China - Shunde Room 4, Hongjian Building, No. 2 Fengxiangnan Road, Ronggui Town, Shunde District, Foshan City, Guangdong 52833, China Tel: Fax: China - Qingdao Rm. B55A, Fullhope Plaza, No. 2 Hong Kong Central Rd. Qingdao 2667, China Tel: Fax: India Divyasree Chambers Floor, Wing A (A3/A4) No., Shaugnessey Road Bangalore, 56 25, India Tel: Fax: Japan Yusen Shin Yokohama Building F 3-7-2, Shin Yokohama, Kohoku-ku, Yokohama, Kanagawa, , Japan Tel: Fax: Korea 68-, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: Fax: or Singapore 2 Middle Road #7-2 Prime Centre Singapore, 8898 Tel: Fax: Taiwan Kaohsiung Branch 3F - No. 8 Min Chuan 2nd Road Kaohsiung 86, Taiwan Tel: Fax: Taiwan Taiwan Branch F-3, No. 27 Tung Hua North Road Taipei, 5, Taiwan Tel: Fax: Taiwan Taiwan Branch 3F-3, No. 295, Sec. 2, Kung Fu Road Hsinchu City 3, Taiwan Tel: Fax: EURPE Austria Durisolstrasse 2 A-46 Wels Austria Tel: Fax: Denmark Regus Business Centre Lautrup hoj -3 Ballerup DK-275 Denmark Tel: Fax: France Parc d Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 93 Massy, France Tel: Fax: Germany Steinheilstrasse D Ismaning, Germany Tel: Fax: Italy ia Salvatore Quasimodo, Legnano (MI) Milan, Italy Tel: Fax: Netherlands Waegenburghtplein 4 NL-552 JR, Drunen, Netherlands Tel: Fax: United Kingdom 55 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG4 5TU Tel: Fax: /2/4 24 Microchip Technology Inc.

256K (32K x 8) CMOS EPROM TSOP A11 A3 14 V PP A12 A7 A6 A5 A4 A3 PLCC VSOP A13 A14 A Microchip Technology Inc.

256K (32K x 8) CMOS EPROM TSOP A11 A3 14 V PP A12 A7 A6 A5 A4 A3 PLCC VSOP A13 A14 A Microchip Technology Inc. This document was created with FrameMaker 44 256K (2K x 8) CMS EPRM 27C256 FEATURES High speed performance - 9 ns access time available CMS Technology for low power consumption - 2 ma Active current -