Agilent HLMP-LD15, HLMP-LM15, HLMP-LB15 4mm Precision Optical Performance Red, Green and Blue Standard Oval LEDs Data Sheet

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1 Description These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message Agilent HLMP-LD15, HLMP-LM15, HLMP-LB15 4mm Precision Optical Performance Red, Green and Blue Standard Oval LEDs Data Sheet Features uniformity across the viewing angle of the sign. High efficiency LED material is used in these lamps: Aluminum Indium Gallium Phosphide (AlInGaP II) for red and Indium Gallium Nitride for blue and green. Each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both UV-a and UV-b inhibitors to reduce the effects of long-term exposure to direct sunlight. Well defined spatial radiation pattern High brightness material Available in red, green and blue color. Red AlInGaP 63mm Green InGaN 525nm Blue InGaN 47nm Superior resistance to moisture Benefits Viewing angle designed for wide filed of view applications Superior performance for outdoor environments Applications Full color signs Commercial outdoor advertising. Package Dimension 6.3±.2.248± MIN MIN. 9.65±.2.38± ±.2.49±.8 CATHODE LEAD 2.9±.2.114±.8 3.7±.2.146± ±.3.1± MAX. EPOXY MENISCUS.45±.1.18±.4.4±.1.16±.4 Notes: 1. Dimension in millimeters (inches). Caution: InGaN devices are Class I ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.

2 Device Selection Guide Color and Dominant Luminous Intensity Iv (mcd) Wavelength λd (nm) at 2 ma Part Number Typ. Min. Max Tinting Type HLMP-LD15-NRTxx Red Red HLMP-LM15-QTxx Green Green HLMP-LB15-KNxx Blue Blue Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package 2. The tolerance for intensity limit is ±15% 3. The optical axis is closely aligned with the package mechanical axis 4. The dominant wavelength, λ d, is derived from the Chromaticity Diagram and represents the color of the lamp. Part Numbering System H L M P - L X 15 - X X X XX Mechanical Option : Bulk ZZ: Flexi-Bin, Ammo pack Color Bin Options : No color bin limitation T: Red Color with max VF of 2.6V Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Color B: 47nm Blue M: 525nm Green D: 63nm Red Package L: 4mm standard Oval 2

3 Absolute Maximum Rating T A = 25 o C Parameter Red Blue and Green Unit DC Forward Current [1] 5 3 ma Peak Forward Current 1 [2] 1 [3] ma Power Dissipation mw Reverse Voltage 5 (I R = 1 µa) 5 (I R = 1 µa) V LED Junction Temperature o C Operating Temperature Range -4 to +1-4 to +8 o C Storage Temperature Range -4 to to +1 o C Notes: 1. Derate linearly as shown in Figure 4 and Figure Duty Factor 3%, frequency 1Khz. 3. Duty Factor 1%, frequency 1kHz. Electrical/Optical Characteristics Parameter Symbol Min. Typ. Max. Units Test Condition Forward Voltage Red (λ d = 63nm) [1] Blue (λ d = 47nm) Reverse Voltage Red (λ d = 63nm) Blue (λ d = 47nm) Peak Wavelength Red (λ d = 63nm) Blue (λ d = 47nm) Spectral Half width Red (λ d = 63nm) Blue (λ d = 47nm) Capacitance Red (λ d = 63nm) Blue (λ d = 47nm) V F Notes: 1. Refer to VF bin table. 2. The radiant intensity, I e in watts per steradian, may be found from the equation I e = I v /η v where I v is the luminous intensity in candelas and η v is the luminous efficacy in lumens/watt V R 5 V λ peak λ 1/ C V nm nm pf I F = 2 ma I R = 1 µa I R = 1 µa I R = 1 µa Peak of wavelength of spectral distribution at I F = 2 ma Wavelength width at spectral distribution power point at I F = 2 ma V F =, F = 1 MHz Thermal Resistance Rθ J-PIN 24 o C/W LED Junction to cathode lead Luminous Efficacy [2] η v lm/w Emitted luminous power/emitted Red (λ d = 63nm) Blue (λ d = 47nm) radiant power 3

4 AlInGaP Red 63nm 1. RELATIVE INTENSITY WAVELENGTH nm Figure 1. Relative intensity vs. wavelength DC FORWARD CURRENT - ma RELATIVE INTENSITY (NORMALIZED AT 2 ma) FORWARD VOLTAGE - V 3. Figure 2. Forward current vs. forward voltage FORWARD CURRENT - ma Figure 3. Relative luminous intensity vs. forward current 5 IF - FORWARD CURRENT - ma Rθ JA = 585 C/W Rθ JA = 78 C/W T A - AMBIENT TEMPERATURE - C Figure 4. Forward current vs. ambient temperature 4

5 InGaN Blue and Green RELATIVE LUMINOUS INTENSITY 1. BLUE GREEN WAVELENGTH - nm Figure 5. Relative intensity vs. wavelength FORWARD CURRENT - ma RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2 ma) FORWARD VOLTAGE - V Figure 6. Forward current vs. forward voltage FORWARD CURRENT - ma Figure 7. Relative luminous intensity vs. forward current. 3 MAXIMUM FORWARD CURRENT - ma Rθ JA = 78 C/W Rθ JA = 585 C/W AMBIENT TEMPERATURE - C Figure 8. Forward current vs. ambient temperature. RELATIVE DOMINANT WAVELENGTH GREEN BLUE FORWARD CURRENT - ma Figure 9. Relative dominant wavelength vs. forward current 5

6 1 RELATIVE INTENSITY ANGULAR DISPLACEMENT - DEGREE Figure 1a. Spatial radiation pattern major axis for RBG 1 RELATIVE INTENSITY ANGULAR DISPLACEMENT - DEGREE Figure 1b. Spatial radiation pattern minor axis for RGB Intensity Bin Limit Table Intensity (mcd) at 2 ma Bin Min Max K 31 4 L 4 52 M N P Q R S T U Tolerance for each bin limit is ± 15% VF bin Table [2] (V at 2mA) Bin ID Min. Max. VA VB VC Tolerance for each bin limit is ±.5V. 6

7 Blue Color Bin Table Bin Min Dom Max Dom Xmin Ymin Xmax Ymax Tolerance for each bin limit is ±.5nm Green Color Bin Table Bin Min Dom Max Dom Xmin Ymin Xmax Ymax Tolerance for each bin limit is ±.5 nm Red Color Range Bin Min Dom Max Dom Xmin Ymin Xmax Ymax Tolerance for each bin limit is ±.5 nm Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Agilent representative for further information. 2. VF bin table only available for those AlInGaP Red devices with options xxtxx. 7

8 Precautions: Lead Forming: The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: Care must be taken during PCB assembly and soldering process to prevent damage to LED component. The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. Recommended soldering condition: Manual Solder Wave Soldering Dipping Pre-heat temperature 15 C Max. Preheat time 3 sec Max Peak temperature 25 C Max. 26 C Max. Dwell time 3 sec Max. 5 sec Max Recommended Wave Soldering Profile Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25 C before handling. Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. Recommended PC board plated through holes size for LED component leads. LED component ead size.457 x.457mm (.18 x.18inch).58 x.58mm (.2 x.2inch) Diagonal.646 mm (.25 inch).718 mm (.28 inch) Plated through hole diameter.976 to 1.78 mm (.38 to.42 inch) 1.49 to 1.15mm (.41 to.45 inch) Note: Refer to application note AN127 for more information on soldering LED components. 25 TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE 2 BOTTOM SIDE OF PC BOARD TEMPERATURE - C FLUXING TOP SIDE OF PC BOARD CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 15 C (1 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 39 C AIR KNIFE DISTANCE = 1.91 mm (.25 IN.) AIR KNIFE ANGLE = 4 SOLDER: SN63; FLUX: RMA 3 PREHEAT TIME - SECONDS NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE.

9 semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (8) or (48) Europe: +49 () China: Hong Kong: (+65) India, Australia, New Zealand: (+65) Japan: (+81 3) (Domestic/International), or (Domestic Only) Korea: (+65) Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) Taiwan: (+65) Data subject to change. Copyright 25 Agilent Technologies, Inc. October 27, 25 Obsoletes EN EN

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