Agilent T-1 3 / 4 (5 mm), T-1 (3 mm) Blue LED Lamps Data Sheet

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Agilent T-1 3 / 4 (5 mm), T-1 (3 mm) Blue LED Lamps Data Sheet HLMP-DB25-Bxx, HLMP-KB45-Axx Features Popular T-1 3 / 4 and T-1 diameter packages General purpose leads Reliable and rugged Available on

1 Agilent T-1 3 / 4 (5 mm), T-1 (3 mm) Blue LED Lamps Data Sheet HLMP-DB25-Bxx, HLMP-KB45-Axx Features Popular T-1 3 / 4 and T-1 diameter packages General purpose leads Reliable and rugged Available on tape and reel Binned for color and intensity Description These blue LEDs are designed in industry standard T-1 and T-1 3 / 4 package with clear and non diffused optics. They are also available in tape and reel, and ammo-pack option for ease of handling and use. Package Dimensions These blue lamps are ideal for use as indicators and for general purpose lighting. Blue lamps offer color differentiation as blue is attractive and not widely available. 5.8 (.2) 4.57 (.18) 9.19 (.352) 8.43 (.332) Applications Status indicators Small message panel Running and decorative lights for commercial use 6.35 (.25) 5.58 (.22) 3.18 (.125) 2.67 (.15) 3.43 (.135) 2.92 (.115) 4.7 (.185) 4.19 (.165).89 (.35).64 (.25) 2 (.4) 23. (.9) MIN..45 (.18) SQUARE NOMINAL 23. (.9) MIN. CATHODE.45 (.18) SQUARE 1.27 (.5) CATHODE 6.1 (.24) 5.59 (.22) 1.27 (.5) 2.54 (.1) 2.54 (.1) HLMP-DB25 NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (.4") DOWN THE LEADS. HLMP-KB45 CAUTION: Devices are Class II ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.

2 Selection Guide Luminous Intensity Iv (mcd) Part Number Package Viewing Angle Min. Max. HLMP-KB45-Axx T HLMP-DB25-Bxx T-1 3/ Part Numbering System HLMP - x x xx - x x x xx Mechanical Option : Bulk 2: Tape & Reel, Straight Leads DD: Ammo Pack Color Bin Options : Full Color Bin Distribution Maximum Iv Bin Options : Open (no max. limit) Minimum Iv Bin Options Please refer to the Iv Bin Table Viewing Angle 25: 25 degrees 45: 4 degrees Color Options B: Blue 462 nm Package Options D: T-1 3/4 (5 mm) K: T-1 (3 mm) Absolute Maximum Ratings at T A = 25 C Parameter Blue Units Peak Forward Current 7 ma DC Current [1] 3 ma Reverse Voltage (I R = 1 µa) 5 V Transient Forward Current [2] (1 µsec Pulse) 35 ma LED Junction Temperature 115 C Operating Temperature 2 to +8 C Storage Temperature 3 to +1 C Notes: 1. Derate linearly from 5 C as shown in Figure The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that this device be operated at peak currents above the Absolute Maximum Peak Forward Current. 2

3 Optical Characteristics at T A = 25 C Color, Dominant Luminous Intensity Wavelength Peak Wavelength Viewing Angle I V I F = 2 ma l d [1] (nm) l PEAK (nm) 2q 1/2 [2] Degrees Part Number Min. Typ. Typ. Typ. Typ. HLMP-DB25-Bxx HLMP-KB45-Axx Notes: 1. The dominant wavelength, l d, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 2. q 1/2 is the off-axis angle at which the luminous intensity is half of the axial luminous intensity. Electrical Characteristics at T A = 25 C Thermal Resistance Forward Voltage Reverse Breakdown Speed Capacitance Rq J-PIN ( C/W) V F (Volts) V R (Volts) Response C (pf), V F =, Junction I F = 2 I R = 1 µa t s (ns) f = 1 MHz Cathode Lead Part Number Typ. Max. Min. Typ. Typ. Typ. Typ. HLMP-DB25-Bxx HLMP-KB45-Axx RELATIVE INTENSITY I F FORWARD CURRENT ma RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2 ma) WAVELENGTH nm V F FORWARD VOLTAGE V I P PEAK FORWARD CURRENT ma Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. Figure 3. Relative intensity vs. peak forward current (3 µs pulse width, 1 ms period). 3

4 RATIO OF PEAK CURRENT TO TEMPERATURE DERATED DC CURRENT 1 1 E-6 1 KHz 3 KHz E-5 1 KHz 3 Hz E-4 1 Hz REFRESH RATE E-3 E-2 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2 ma) I F FORWARD CURRENT ma DC PULSE WIDTH (SECONDS) I F DC FORWARD CURRENT ma T A AMBIENT TEMPERATURE C Figure 4. Forward current vs. forward voltage. Figure 5. Relative luminous intensity vs. forward current. Figure 6. Maximum DC forward current vs. ambient temperature. Derating based on T J max. = 115 C Figure 7. Relative luminous intensity vs. angular displacement for HLMP-DB Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloroethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts. Figure 8. Relative luminous intensity vs. angular displacement for HLMP-KB45. For information on soldering LEDs, please refer to Application Note

5 Intensity Bin Limits Intensity Range (mcd) Bin Min. Max. A B C D E F G H J K L M N Color Bin Limits (nm at 2 ma) Blue 2 ma Bin ID Min. Max Tolerance for each bin limit will be ±.5 nm. Mechanical Option Matrix Mechanical Option Code Definition Bulk Packaging, minimum increment 5 pcs/bag 2 Tape & Reel, straight leads, minimum increment 13 pcs/bag DD Ammo Pack, straight leads with minimum increment Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information. 5

6 Precautions Lead Forming The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions Care must be taken during PCB assembly and soldering process to prevent damage to LED component. The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. Recommended soldering conditions: Manual Solder Wave Soldering Dipping Pre-heat Temperature 15 C Max. Pre-heat Time 3 sec Max. Peak Temperature 25 C Max. 26 C Max. Dwell Time 3 sec Max. 5 sec Max. Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25 C, before handling. Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. Recommended PC board plated through hole sizes for LED component leads: LED Component Plated Through Lead Size Diagonal Hole Diameter.457 x.457 mm.646 mm.976 to 78 mm (.18 x.18 inch) (.25 inch) (.38 to.42 inch).58 x.58 mm.718 mm 49 to 1.15 mm (.2 x.2 inch) (.28 inch) (.41 to.45 inch) Note: Refer to application note AN127 for more information on soldering LED components. TEMPERATURE C TURBULENT WAVE FLUXING PREHEAT LAMINAR WAVE HOT AIR KNIFE BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 15 C (1 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 39 C AIR KNIFE DISTANCE = 1.91 mm (.25 IN.) AIR KNIFE ANGLE = 4 SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE TIME SECONDS Figure 9. Recommended wave soldering profile. 6

7 For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (8) or (916) Europe: +49 () China: Hong Kong: (+65) India, Australia, New Zealand: (+65) Japan: (+81 3) (Domestic/International), or (Domestic Only) Korea: (+65) Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) Taiwan: (+65) Data subject to change. Copyright Agilent Technologies, Inc. Obsoletes EN November 14, EN

Agilent HLMP-3301 T-1 3 / 4 (5 mm) Diffused LED Lamps

Agilent HLMP-3301 T-1 3 / 4 (5 mm) Diffused LED Lamps Data Sheet HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 Description This family of T-1 3 / 4 tinted, diffused LED lamps