GU (General Use) Type 2-Channel (Form B) Type. Part No. Surface-mount terminal Tape and reel packing style Picked from the 1/2/3-pin side.

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1 GU (General Use) Type -Channel (Form B) Type AQW PhotoMOS RELAYS UL File No.: E9 CSA File No.: LR FEATURES. Approx. / the space compared with the mounting of Two Form B PhotoMOS units Two Form B units ±..±. Form B ±..±. mm inch. Applicable for Form B use as well as two independent Form B use. Low thermal electromotive force (Approx. µv). Eliminates the need for a counter electromotive force protection diode in the drive circuits on the input side. Controls load currents up to. A with an input current of ma. High speed switching: operate time typical of µsec.. Eliminates the need for a power supply to drive the power MOSFET. Extremely low closed-circuit offset voltages to enable control of small analog signals without distortion 9. Surface-mount model available TYPICAL APPLICATIONS High-speed inspection machines Telephone equipment Computer TYPES Output rating* voltage current Through hole terminal Tube packing style Part No. Surface-mount terminal Tape and reel packing style Picked from the //-pin side Picked from the //-pin side V ma AQW AQWA AQWAX AQWAZ * Indicate the peak AC and values. Note: For space reasons, the package indicator X and Z are omitted from the seal. Packing quantity Tube tube contains pcs. batch contains pcs. Tape and reel, pcs. RATING. Absolute maximum ratings (Ambient temperature: C F) Item Symbol AQW(A) LED forward current I F ma Input LED reverse voltage V R V Peak forward current I FP A Power dissipation ma Output voltage Continuous load current Peak load current Power dissipation Total power dissipation I/O isolation voltage Temperature limits Operating Storage P in V L I L I peak P out P T V iso T opr T stg V. A. A mw mw, V AC C to C F to F C to C F to F Remarks f = HZ,Duty factor =. %, I L = Max.. A (when used for From B) ms (shot), V L = Between input and output/between contact sets Non-condensing at low temperatures

2 . Electrical characteristics (Ambient temperature: C F) Input Output Transfer characteristics Item LED operate (OFF) current LED reverse (ON) current LED dropout voltage On resistance Off state leakage current Operate (OFF) time* Reverse (ON) time* I/O capacitance Initial I/O isolation resistance Minimum Typical Maximum Minimum Typical Maximum Minimum Typical Maximum Minimum Typical Maximum Minimum Typical Maximum Minimum Typical Maximum Minimum Typical Maximum Minimum Typical Maximum Minimum Typical Maximum Symbol I Foff I Fon V F R on T off T on C iso R iso AQW(A). ma ma. ma. ma. V (. V at I F = ma). V Ω Ω µa. ms ms. ms ms. pf. pf, MΩ AQW Condition I L = ma I L = ma I F = ma I F = ma I L = ma Within s on time I F = ma V L = V I F = ma ma I L = ma I F = ma ma I L = ma f = MHZ V B = V *Operate/Reverse time Input Output % Toff Ton 9% REFERENCE DATA. current vs. ambient temperature characteristics Allowable ambient temperature: C to C F to F. On resistance vs. ambient temperature characteristics Measured portion: between terminals and, and ; LED current: ma; Continuous load current: ma (). Turn on time vs. ambient temperature characteristics LED current: ma; voltage: V (); Continuous load current: ma ().. current, ma On resistance, Ω Turn on time, ms.... Ambient temperature, C Ambient temperature, C Ambient temperature, C

3 . Turn off time vs. ambient temperature characteristics LED current: ma; voltage: V (); Continuous load current: ma ().. LED operate current vs. ambient temperature characteristics voltage: V (); Continuous load current: ma (). LED turn off current vs. ambient temperature characteristics voltage: V (); Continuous load current: ma () AQW Turn off time, ms.... LED operate current, ma LED turn off current, ma. Ambient temperature, C Ambient temperature, C Ambient temperature, C. LED dropout voltage vs. ambient temperature characteristics LED current: to ma. Voltage vs. current characteristics of output at MOS portion Measured portion: between terminals and, and ; Ambient temperature: C F 9. Off state leakage current Measured portion: between terminals and, and ; Ambient temperature: C F LED dropout voltage, V m m m m ma Ambient temperature, C Current, ma Voltage, V Off state leakage current, A 9 voltage, V. LED forward current vs. turn on time characteristics Measured portion: between terminals and, and ; voltage: V (); Continuous load current: ma (); Ambient temperature: C F.. LED forward current vs. turn off time characteristics Measured portion: between terminals and, and ; voltage: V (); Continuous load current: ma (); Ambient temperature: C F.. Applied voltage vs. output capacitance characteristics Measured portion: between terminals and, and ; Frequency: MHz; Ambient temperature: C F Turn on time, ms.... Turn off time, ms.... Output capasitance, pf.. LED forward current, ma LED forward current, ma Applied voltage, V

4 PhotoMOS Relay Technical Information How PhotoMOS Relays Operate: Optoelectronic device directly drives a power MOSFET. Semiconductor relay incorporating the advantages of both electromagnetic relays and semiconductors. OUT LED OUT Power MOSFET Optoelectronic device IN () IN () When operated When turned off When a signal current flows to the input terminals the LED on the input side emits light. When the signal current at the input terminal is cut off, the LED stops emitting light. The emitted light passes through transparent silicon and reaches the photoelectric element (solar cell) which is mounted opposite the LED. When the emitted light from the LED stops, the voltage of the photoelectric element decreases. The photoelectric element converts the received light to a voltage corresponding to the quantity of light. This voltage passes through a control circuit and charges the MOSFET gate on the output side. When the voltage supplied from photoelectric element decrease, the control circuit rapidly discharges the gate charge of MOSFET. When the MOSFET gate voltage supplied from the photoelectric element reaches a preset voltage value, the MOSFET begins to conduct and turns on the load. This control circuit makes MOSFET stop conducting and immediately turns off the load. T

5 PhotoMOS Relay Dimensions Type AQV AQV AQV AQV AQV AQV AQV AQV.±..±..9±..± ±..± ±..±... Max. Max. Terminal thickness =.. Dimensions Through hole terminal Surface mount terminal PC board pattern (Bottom view).±..±... ±. ± ±..± Max Terminal thickness =.. General tolerance: ±. ±. General tolerance: ±. ±. -. dia. -. dia... Tolerance:±. ±. Recommended mounting pad (Top view) mm inch AQW AQW AQW AQW AQW AQW AQW...9±..± Through hole terminal Surface mount terminal PC board pattern (Bottom view) Max. Max.. ±..... Max. ±. Terminal thickness = Terminal thickness = dia. -. dia... General tolerance: ±. ±. General tolerance: ±. ±. Tolerance:±. ±. Recommended mounting pad (Top view) Recommended mounting pad (Top view) AQV (SOP) AQV (SOP) AQV (SOP).±..±..±..±. ±..9± ±..± Tolerance: ±. ±. Recommended mounting pad (Top view) AQW(SOP) AQW TS (SOP).. 9.±..9± ±..±. ±..9±....±..±... Terminal thickness =.. General tolerance: ±. ± Tolerance: ±. ±. Recommended mounting pad (Top view) AQW TS (SOP) ±. ± ±. ± ±. ±..... ±. ±... Terminal thickness =.. General tolerance: ±. ± Tolerance: ±. ±. T

6 Type Dimensions mm inch max..9 max dia. -. dia. PC board pattern (Bottom view) AQX (Multi-channel ) max Tolerance: ±. ± General tolerance: ±. ±... Recommended mounting pad (Top view) AQY (SOP) AQY (SOP).. ±. ±. ±.. ± ±. ±..... ±. ± Terminal thickness =.. General tolerance: ±. ±. Tolerance: ±. ±. Through hole terminal Surface mount terminal PC board pattern (Bottom view) to Max dia. -. dia... AQY 9.. ±. ± ±...9 ±.. ±. ± ±. ±. ±. ±. to Terminal thickness =.. General tolerance: ±. ±. 9.. ±... ±..... ±... ±. ±. ±. ±. ± Terminal thickness =.. General tolerance: ±. ±. Tolerance: ±. ±. Recommended mounting pad (Top view) Tolerance: ±. ±. ±..±..±..±..±..±. PC board pattern (Bottom view) -. dia. -. dia. -. dia. -. dia. AQZ AQZ ±..± General tolerance: ±. ±... Input: Input: Output: or AC Output: or AC.... Tolerance: ±. ±. Input: Input: Output: Output: Max...9 Max dia. -.dia...9 AQZ Max... Min... General tolerance ±. ±. Mounting hole location(bottom view).9. Terminal,@ À À, À, ÀÀ,, ÀÀ,, À, ÀÀ,, À, Q.. Input: Input: Output : AC or Output : AC or Copper foil -. dia. -. Pitch tolerance: ±. ±. T

7 Terminology Term Symbol Description LED forward current I F Current that flows between the input terminals when the input diode is forward biased. LED reverse voltage V R Reverse breakdown voltage between the input terminals. Peak forward current I FP Maximum instantaneous value of the forward current. Input LED operate current I FON Current when the output switches on (by increasing the LED current) with a designated supply voltage and load connected between the output terminals. LED turn off current I Foff Current when the output switches off (by decreasing the LED current) after operating the relay with a designated supply voltage and load connected between the output terminals. LED dropout voltage V F Dropout voltage between the input terminals due to forward current. Power dissipation Pin Allowable power dissipation between the input terminals. Output voltage Continuous load current On resistance Off state leakage current V L I L Ron Ileak Supply voltage range at the output used to normally operate the PhotoMOS relay. Represents the peak value for AC voltages. Maximum current value that flows continuously between the output terminals of the PhotoMOS relay under designated ambient temperature conditions. Represents the peak value for AC current. Obtained using the equation below from dropout voltage V DS (on) between the output terminals (when a designated LED current is made to flow through the input terminals and the designated load current through the output terminals.) Ron = V DS (on)/i L Current flowing to the output when a designated supply voltage is applied between the output terminals with no LED current flow. Power dissipation Pout Allowable power dissipation between the output terminals. Turn on time Ton Delay time until the output switches on after a designated LED current is made to flow through the input terminals. Turn off time Toff Delay time until the output switches off after the designated LED current flowing through the input terminals is cut off. I/O capacitance Ciso Capacitance between the input and output terminals. Output capacitance Cout Capacitance between output terminals when LED current does not flow. Electrical characteristics I/O isolation resistance Riso Resistance between terminals (input and output) when a specified voltage is applied between the input and output terminals. Total power dissipation P T Allowable power dissipation in the entire circuit between the input and output terminals. I/O isolation voltage Critical value before dielectric breakdown occurs, when a high voltage is applied for minute between the same terminals where the I/O isolation resistance is measured. Operating temperature Storage temperature Topr Tstg Ambient temperature range in which the PhotoMOS relay can operate normally with a designated load current conditions. Ambient temperature range in which the PhotoMOS relay can be stored without applying voltage. Reliability tests Classification Item High temperature storage test Life tests Thermal environment tests Mechanical environment tests Low temperature storage test High temperature and high humidity storage test Continuous operation life test Temperature cycling test Thermal shock test Solder burning resistance Vibration test Shock test Drop test Terminal strength test Solderability Condition Tstg (Max.) Tstg (Min.) C F, R.H. % VL = Max., = Max., = LED operate current (Max.) Determines resistance to electrical stress (voltage and current). Low storage temperature (Tstg Min.) High storage temperature (Tstg Max.) Low temperature ( C) ( F), High temperature ( C) ( F) ± C ± F, s 9 m/s { G}, to, Hz* 9, m/s {, G}. ms* ;,9 m/s { G} ms Dropped at a height of cm on oak board Determined from terminal shape and cross section Purpose Determines resistance to long term storage at high temperature. Determines resistance to long term storage at low temperature. Determines resistance to long term storage at high temperature and high humidity. Determines resistance to exposure to both low temperatures and high temperatures. Determines resistance to exposure to sudden changes in temperature. Determines resistance to thermal stress occurring while soldering. Determines the resistance to vibration sustained during shipment or operation. Determines the mechanical and structural resistance to shock. Determines the mechanical resistance to drops sustained during shipment or operation. Determines the resistance to external force on the terminals of the PhotoMOS relay mounted on the PC board while wiring or operating. C F s (with soldering flux) Evaluates the solderability of the terminals. * to Hz at double amplitude of mm for Power PhotoMOS relays. *,9 m/s, ms for Power PhotoMOS relays. T

8 PhotoMOS Relay Schematic and Wiring Diagrams Type Schematic Output configuration Connection Wiring diagram A E VL (AC,) VL (AC,) AQV AQV (SOP) AQV AQV (SOP) AQV AQV a B* E E C E (AQVR only) () Two independent Form A use AQW AQW (SOP) AQW AQW a E E () Form A use E VL (AC,) VL (AC,) VL (AC,) VL (AC,) VL (AC,) VL (AC,) VL (AC,) VL (AC,) AQW TS Relay portion (,,, pins) Detector portion (,,, pins) Relay portion a Detecter portion a Relay portion Detecter portion E ()VL E VL(AC,) VL(AC,) E AQW TS 9 Relay portion (,,, pins) Detector portion (,,9, pins) (,,, pins) Relay portion a Detecter portion a Relay portion Detecter portion E ()VL ()VL 9 E E VL(AC,) 9 VL(AC,) *Can be also connected as Form A. (However, the sum of the continuous load current should not exceed the absolute maximum rating.) **Can be also connected as Form B. (However, the sum of the continuous load current should not exceed the absolute maximum rating.) Notes:. E : Power source at input side; V IN: Input voltage; I F: LED forward current; V L: voltage; I L: current; R: Current limit resistor.. Method of connecting the load at the output is devided into s. E E T

9 Type Schematic Output configuration Connection Wiring diagram A E VL (AC,) VL (AC,) AQV AQV (SOP) AQV b B** E E C E () Two independent Form A & Form B use AQW AQW N.C. N.O. ab E E () Form A Form B use E VL (AC,) VL (AC,) VL (AC,) VL (AC,) VL (AC,) VL (AC,) VL (AC,) VL (AC,) () Two independent Form B use E VL (AC,) VL (AC,) AQW AQW b E () Form B use VL (AC,) VL (AC,) E VL (AC,) VL (AC,) VL (AC,) VL (AC,) AQV Terminal cannot be used, since it is in the internal circuit of the relay. a A E *Can be also connected as Form A. (However, the sum of the continuous load current should not exceed the absolute maximum rating.) **Can be also connected as Form B. (However, the sum of the continuous load current should not exceed the absolute maximum rating.) Notes:. E : Power source at input side; V IN : Input voltage; I F : LED forward current; V L : voltage; I L : current; R: Current limit resistor.. Method of connecting the load at the output is devided into s. T

10 Type Schematic Output configuration Connection Wiring diagram A VIN VL (AC,) VL (AC,) AQV a B* VIN VIN Terminal cannot be used, since it is in the internal circuit of the relay. C VIN AQX (Multichannel ) 9 Input Common: Input : Input : Input : Input : Output (N.O.): or AC Output (N.O.): or AC Output (N.O.): or AC 9 Output (N.O.): or AC Output (N.O.): or AC Output (N.O.): or AC Output (N.O.): or AC Output (N.O.): or AC a E R R R R VL (AC,) VL 9 (AC,) VL (AC,) VL (AC,) 9 VL (AC,) VL (AC,) VL (AC,) VL (AC,) AQY (SOP) AQY a E VL (AC,) VL (AC,) AQY (SOP) b E VL (AC,) VL (AC,) *Can be also connected as Form A. (However, the sum of the continuous load current should not exceed the absolute maximum rating.) **Can be also connected as Form B. (However, the sum of the continuous load current should not exceed the absolute maximum rating.) Notes:. E : Power source at input side; V IN: Input voltage; I F: LED forward current; V L: voltage; I L: current; R: Current limit resistor.. Method of connecting the load at the output is devided into s. T

11 Type Schematic Output configuration Wiring diagram AQZ a E R VL (AC or ) VL (AC or ) AQZ a E R AQZ V a E R VL (AC or ) VL (AC or ) AQZ D a IIN VL (AC or ) VIN VL (AC or ) AQZ D a IIN VIN AQZ a E R VL (AC or ) VL (AC or ) Notes:. E : Power source at input side; V IN: Input voltage; I F: LED forward current; V L: voltage; I L: current; R: Current limit resistor.. Method of connecting the load at the output is devided into s. T

12 PhotoMOS Relay Cautions for Use SAFETY WARNINGS Do not use the product under conditions that exceed the range of its specifications. It may cause overheating, smoke, or fire. NOTES Do not touch the recharging unit while the power is on. There is a danger of electrical shock. Be sure to turn off the power when performing mounting, maintenance, or repair operations on the relay (including connecting parts such as the terminal board and socket). PhotoMOS Relays excluding Power PhotoMOS Relays. Unused terminals The No. terminal is used with the circuit inside the relay. Therefore, do not connect it to the external circuitry with either connection method A, B or C.. Short across terminals Do not short circuit between terminals when relay is energized, since there is the possibility of breaking the internal IC.. Surge voltages at the input. Ripple in the input power supply If ripple is present in the input power supply, observe the following: ) For LED operate current at E min, maintain the value mentioned in the table of Note. Recommended LED forward current (). ) Keep the LED operate current at VmA ( ma for PhotoMOS HE Relay with LED display ) or less at E max. If reverse surge voltages are present at the input terminals, connect a diode in reverse parallel across the input terminals and keep the reverse voltages be- low the reverse breakdown voltage. Emin. Emax. SMD S Type I/O isolation (, V AC) Reinforced I/O isolation (, V AC). Recommended LED forward current () It is recommended that the LED forward current () of each PhotoMOS Relay should be set according to the following table. Product name AQV, AQY * AQV (including SOP) AQV (including SOP) AQV AQV AQW (including SOP) AQW TS,TS AQW AQW AQW AQW AQW AQW AQY, AQV AQV, AQV, AQX AQZ,, Recommended LED forward current (I F) ma to ma ma ma to ma ma to ma * I/O insolation (, V AC). Output spike voltages ) If an inductive load generates spike voltages which exceed the absolute maximum rating, the spike voltage must be limited. Typical circuits are shown below. Add a clamp diode to the load Add a CR scrubber circuit to the load ) Even if spike voltages generated at the load are limited with a clamp diode if the circuit wires are long, spike voltages will occur by inductance. Keep wires as short as possible to minimize inductance. Check the connection diagrams in the catalog and be sure to connect the terminals correctly. Erroneous connections could lead to unexpected operating errors, overheating, or fire.. Cleaning solvents compatibility Dip cleaning with an organic solvent is recommended for removal of solder flux, dust, etc. Select a cleaning solvent from the following table. If ultrasonic cleaning must be used, the severity of factors such as frequency, output power and cleaning solvent selected may cause loose wires and other defects. Make sure these conditions are correct before use. For details, please consult us. Adueous Chlorinebase Alcoholbase Others Cleaning solvent I.I.I. Trichloroethlene (Chloroethlene) Trichloroethlene (Trichlene) Perchloroethlene Methlene chloride Indusco, Hollis Lonco Terg IPA Ethanol Thinner Gasoline Compatibility : Yes ( : No ). INPUT WIRING PATTERN With AQY or AQW s, avoid installing the input (LED side) wiring pattern to the bottom side of the package if you require the specified I/O isolation voltage () after mounting the PC board. Since part of the frame on the output side is exposed, it may cause fluctuations in the I/O isolation voltage. Portion of output side frame (Output terminal side) Input wiring pattern (Input terminal side) May not allow the prescribed I/O withstand voltage () to be achieved T9

13 9. Soldering ) When soldering PC board terminals, keep soldering time to within s at C F. ) When soldering surface-mount terminals, the following conditions are recommended. () IR (Infrared reflow) soldering method () Vapor phase soldering method () Double wave soldering method T T T T T T T t t t t t t t T = to C to 9 F T = C C to 9 F T = C F or less t = s or less t = s or less T = to C to 9 F T = C 9 F or less t = s t = 9 s or less( s or less for SOP ) T = to C to 9 F T = C F or less t = s or less tt = s or less () Soldering iron method Tip temperature: to C to F Wattage: to W Soldering time: within s () Others Check mounting conditions before using other soldering methods (hot-air, hot plate, pulse heater, etc.) The temperature profile indicates the temperature of the soldered terminal on the surface of the PC board. The ambient temperature may increase excessively. Check the temperature under mounting conditions. The conditions for the infrared reflow soldering apply when preheating using the VPS method.. The following shows the packaging format ) Tape and reel Type Tape dimensions SO package -pin.±..±..±..±. Device mounted on tape () When picked from /-pin side: Part No. AQY SX (Reel color: blue) (Shown above) () When picked from /-pin side: Part No. AQY SZ (Reel color: orange).±..±. Tractor feed holes.±. dia..±. dia. Tractor feed holes.±. dia..±. dia. Direction of picking ±..±. ±..±. Direction of picking ±..±..±..±..±..9±. ±..9±..±..±. ±..±..±..±..±. dia..±. dia..±..±..±..9±. ±..9±. Dimensions of paper tape reel ±..±. ± dia..±.9 dia. mm inch ± dia. 9.±.9 dia. ± dia..±.9 dia. SO package -pin.±..±. Device mounted on tape ±..±. ±..9±..±..±. ±..±..9±..±..±. dia..±. dia. () When picked from //-pin side: Part No. AQV SX (Reel color: blue) (Shown above) () When picked from //-pin side: Part No. AQV SZ (Reel color: orange) ±. dia..±. dia. ±..±.9 ±..9±. SO package -pin.±..±. Tractor feed holes.±. dia..±..±. dia..±. Device mounted on tape ±..±. Direction of picking.±..9±. ±..±. ±..9±..±..9±..±..9±. ±..±..±..±..±. dia..±. dia. () When picked from ///-pin side: Part No. AQW SX (Shown above) () When picked from ///-pin side: Part No. AQW SZ Tractor feed holes.±. dia..±..±. dia..±. Direction of picking.±..9±..±..9±. ±..9±. ±..±. ± dia..±.9 dia. ± dia. 9.±.9 dia. ± dia..±.9 dia. SO package -pin.±..±. Device mounted on tape ±..±. ±..±. ±..9±..±..9±. ±..±..±..±..±. dia..±. dia. () When picked from /////-pin side: Part No. AQW TSX (Shown above) () When picked from //9///-pin side: Part No. AQW TSZ ±. dia..±. dia..±..9±.9 ±.9±.9 T

14 mm inch Type Tape dimensions Dimensions of paper tape reel PD -pin SMD.±..±. Device mounted on tape Tractor feed holes...dia..±....dia..±. Direction of picking.±..9±..±..9±..±..±..±..9±. 9.±..±. ±..9±. ±..±. ± dia..9±.9 dia. ± dia..99±.9 dia. ± dia..9±.9 dia..±..±..±..±..±..9±..±. dia.±. dia () When picked from /-pin side: Part No. AQY AX (Shown above) () When picked from /-pin side: Part No. AQY AZ ±. dia..±. dia..±..±.9.±..±..±..±. Tractor feed holes.. dia...9 dia. Direction of picking.±..±..±..9±. -pin SMD.±..±. Device mounted on tape ±..±. ±..9±. ±..±..±..9±. ±..±. 9.±..±..±. dia..±. dia. () When picked from //-pin side: Part No. AQV AX (Shown above) () When picked from //-pin side: Part No. AQV AZ.±..±. Tractor feed holes.. dia...9 dia. Direction of picking ±..±..±..±..±..9±. ±..9±. ±..±. ± dia..±.9 dia. ± dia..±.9 dia. ± dia..±.9 dia. -pin SMD.±..±. Device mounted on tape ±..±. ±..9±..±..9±. ±..±..±..±..±. dia..±. dia. ±. dia..±. dia..±..9±.9 ±..9±. () When picked from ///-pin side: Part No. AQW AX (Shown above) () When picked from ///-pin side: Part No. AQW AZ ) Tube () Devices are packaged in a tube so pin No. is on the stopper B side. Observe correct orientation when mounting them on PC boards. (SO package, PD ) StopperB (green) (, SMD ) StopperB StopperA (gray) StopperA () Storage PhotoMOS relays implemented in SO packages are sensitive to moisture and come in sealed moisture-proof packages. Observe the following cautions on storage. After the moisture-proof package is unsealed, take the devices out of storage as soon as possible (within month at the most). If the devices are to be left in storage for a considerable period after the moisture-proof package has been unsealed, it is recommended to keep them in another moisture-proof bag containing silica gel (within months at the most).. Transportation and storage ) Extreme vibration during transport will warp the lead or damage the relay. Handle the outer and inner boxes with care. ) Storage under extreme conditions will cause soldering degradation, external appearance defects, and deterioration of the characteristics. The following storage conditions are recommended: Temperature: to C to F Humidity: Less than % R.H. Atomosphere: No harmful gasses such as sulfurous acid gas, minimal dust. Power PhotoMOS Relays.-) Input LED current ( and Internal varistor ) For rising and dropping ratio of input LED current (di/dt), maintain min. µa/s..-) Input voltage (Voltage sensitive ) For rising and dropping ratio of input voltage (dv/dt), maintain min. mv/s.. Short across terminals Do not short circuit between terminals when relay is energized, since there is possibility of breaking of the internal IC.. Surge voltages at the input If reverse surge voltages are present at the input terminals, connect a diode in reverse parallel across the input terminals and keep the reverse voltages be low the reverse breakdown voltage. T

15 . Recommended load voltage As a guide in selecting PhotoMOS Relays, please refer to the following table. ) Power photomos relays Type AQZ AQZ AQZ AQZ AQZ AQZ AQZ AQZ Type AQZD AQZD AQZD AQZD AQZD AQZD AQZD AQZD Absolute maximum rating voltage V V V V current. A. A. A. A V. A V. A V. A V. A Absolute maximum rating voltage V V V V current. A. A.9 A. A V. A V. A V. A V. A Recommended load voltage V AC;,, V V AC V V AC V V AC V,, V V V V ) Power PhotoMOS relay high capacity ) Power photomos relays (Voltage sensitive ) Type AQZ AQZ Type AQZV AQZV AQZV AQZV Absolute maximum rating voltage current,, V A, V Absolute maximum rating voltage V AC V V AC V V AC V V AC V, A current. A. A. A. A Recommended load voltage V AC,,V ACV V Recommended load voltage V AC;,, V V AC V V AC V V AC V,, V V V V ) Power photomos relays with internal varistor Recommended load voltage V AC;, V V AC V V AC V V AC V.-) Ripple in the input power supply ( and high capacity and internal varistor ) If ripple is present in the input power supply, observe the following: ) For LED operate current at E min, maintain min. ma ) Keep the LED operate current at ma or less at E max..-) Ripple in the input power supply (Voltage sensitive ) If ripple is present in the input power supply, observe the following: ) For input voltage at Emin, maintain min. V ) Keep input voltage at V or less at Emax. Emin. Emax.. Output spike voltages ) If an inductive load generates spike voltages which exceed the absolute maximum rating, the spike voltage must be limited. Typical circuits are shown below. ( ) Add a clamp diode to the load Add a CR snubber circuit to the load Add a varistor to the Power PhotoMOS Relay Does not include the internal varistor ) Even if spike voltages generated at the load are limited with a clamp diode if the circuit wires are long, spike voltages will occur by inductance. Keep wires as short as possible to minimize inductance.. Adjacent mounting ) When relays are mounted close together with the heat-generated devices, ambient temperature may rise abnormally. Mounting layout and ventilation should be considered. ) When many relays are mounted close together, load current should be reduced. (Refer to the date of current vs. ambient temperature characteristics in adjacent mounting. ). Cleaning solvents compatibility Dip cleaning with an organic solvent is recommended for removal of solder flux, dust, etc. Select a cleaning solvent from the following table. If ultrasonic cleaning must be used, the severity of factors such as frequency, output power and cleaning solvent selected may cause loose wires and other defects. Make sure these conditions are correct before use. For details, please consult us. Adueous Chlorinebase Alcoholbase Others Cleaning solvent I.I.I. Trichloroethlene (Chloroethlene) Trichloroethlene (Trichlene) Perchloroethlene Methlene chloride Indusco, Hollis Lonco Terg IPA Ethanol Thinner Gasoline 9. Soldering When soldering PC board terminals, keep soldering time to within s at C F.. Packing style Green Stopper B Compatibility : Yes ( : No ) Gray Stopper A The power photomos relays are stick packed so that the number terminal is in the direction of stopper B. One stick contains power photomos relays.. Transport and storage ) If the product is subject to extreme vibration during transport, the lead may warp or the main unit may become damaged. Handle the outer and inner boxes with care. ) If the storage environment is extremely bad, it may give rise to deterioration of the soldering, external appearance defects, and degradation the characteristics of the product. The following conditions are recommended for the storage location: Temperature: to C to F Humidity: Less than % RH Environment: No hazardous substances such as sulfurous acid gases, and little dust. T

16 PhotoMOS Relays for Various Applications Automatic meter reading Medical equipment Security Equipment The needs of centralized remote meter reading systems for water, gas and electricity in medium and high rise apartments and new subdivisions are now increasing. PhotoMOS relays are capable of controlling from low level signals up to power signals and feature low leakage current and noise from the optoelectronic device and power MOSFET combination. PhotoMOS Medical equipment which processes low level signals includes electrocardiographs, electroencephalographs, and X-ray CT scanners. PhotoMOS relays accurately transfer low level signals (less than several hundred millivolts). Furthermore, they are also convenient in driving rotary solenoids such as those used to automatically switch voltage ranges. Rotary solenoid There are many s of security systems from home and office security to building security. PhotoMOS relays are ideal for use as input interfaces for system sensors and output interfaces for alarms. Input interface: Low leakage current makes use possible for low level voltage and current input. Output interface: Outputs either AC or up to a load voltage of V. AC Telephone line Threshold and driver Modulator Receiver circuit Indicator light Centralized sensor control circuit Receiver Drive circuit Telecommunications Communications equipment OA equipment A variety of signals, with levels from millivolts (at microamperes) to tens of volts (at several hundred milliamperes), AC or, and even high bit-rate signals, can be superimposed on telephone lines, the heart of telecommunication networks. The switches in telecommunication circuits, which normally carry signals, also carry AC signals on top of the level when an intermittent signal (e.g. ringer signal) is being sent. PhotoMOS relays are capable of controlling small level (millivolts at microamperes) AC or signals. switches Line switching (normal or reverse) switches switches The future of communications is in satellite communications. Satellite-communications feature many advantages such as indifference to terrestrial disasters, wide service areas, simple circuit modification and simultaneous conversations. An important control operation in communications equipment is fast automatic tuning. PhotoMOS relays can easily be connected in parallel, difficult with conventional transistor. As a result, a variety of circuit connection are possible and power circuits can also be designed. Impedance detection circuit Ω input M M Coupler Ω input OA equipment usually contains a sensor control unit (for temperature, speed, torque, etc.), drive unit, power supply unit, and a processing unit which controls the overall system. It is organized similarly to compact factory automation machinery. PhotoMOS relays have wide application in the interfaces for signals which connect the functions of these units. Operates on a mw input to enable direct control of C-MOS devices. Signal transfer through optical coupling achieves high resistance to noise and transients, eliminating the need for adding a snubber circuit to the output to control the load voltage. Advantages in the total cost and reliability in the control system result from the absence of AC leakage current related to the snubber circuit. Subscriber test equipment Ringing and ring trip Telephone line test equipment Control unit (microcomputer) V Actuator Instrumentation Programmable controller I/O bus V AC With the spread of microcomputer chips, the latest instruments are required to measure a variety of signals at high speeds under various conditions. PhotoMOS relays are recommended for measurement scanning functions, automatic zero-point compensation to eliminate zero-point error, and measurement sequence interfaces (e.g. alarm interface.) Scanner Programmable amplifier Measurement A/D programmable converter controller MPU The output circuit of a programmable controller requires various interfaces to match the load. Recently, as the computing speed and data processing speed increase, problems may arise from noise at the input interface as well as at the output interface. PhotoMOS relays are resistant to inrush current (due to phase shift) and eliminate the need for snubber circuits as long as they are operated within the ratings. Furthermore, use of PhotoMOS relays decreases the mounting area requirements, resulting in more compact programmable controllers. LED Control Conversion circuit Output combination T

17 If you are a user experiencing difficulty with solid-state relays and triacs: If you would like to control small analog signals with a photocoupler and solid-state relays. PhotoMOS relays feature low offset voltages and on resistances of. Ω or less. (AQV Connection) If you require a device with a small leakage current (as opposed to bipolar devices having large internal leakage currents). PhotoMOS relays have leakage currents in the order of microamperes and can control up to V (peak). (AQV) If you would like to directly control analog signals and you would like a device integrating a photocoupler, driver and analog IC to simplify the circuit as much as possible. PhotoMOS relays contain all of these functions in a single package. Furthermore, circuit design is simplified as a power supply is unnecessary since the internal optoelectronic device directly drives the power MOSFET. If you require a snubber circuit with a triac or solid-state relay, but are concerned about the snubber circuit's AC leakage current. PhotoMOS relays are resistant to transients and as long as they are operated within the maximum ratings, eliminate the need for adding a snubber circuit to the output to control the rise in load voltage. Leakage current ceases to be a problem, with cost and reliability being other advantages. If you require a device for AC control that is resistant to ambient temperature changes and input signal noise. PhotoMOS relays do not employ the self-trigger mechanism used in SCRs and triacs. Therefore, they do not switch on accidentally. Furthermore, the noise suppression characteristics of optoelectronic devices make them highly resistant to ambient noise for operation at temperatures up to C F. PhotoMOS Relay Application Examples High Response Speed Microprocessor system I/O board R R V C Vcc = V R = Ω R = Ω C =. µf Measurements for AQV(V) Turn on time at ma LED current. ms Turn on time with speed-indrease capacitor (LED current ma). ms Data bus Latch OUT OUT OUT OUT COM AC,OUT AC,OUT Power output COM Four outputs are available with two relays. AC output is also provided. Increased power in parallel configuration Dial Pulse Generator Capacitor Switch Circuit Line. H Instrumentation block C Line transformer Scanner Ch Ch Ch Ch Ch n T

18 Part No. vs. Voltage Quick Reference PhotoMOS Relays Form A Type Group name HE HE Soft ON/OFF GU GU-E RF RF Low-ON HS HF PD Part No. AQV AQW AQV M AQV AQW AQX AQY S AQV S AQW S AQW TS AQW TS AQV E AQV AQV N AQW N AQV NS AQV AQV AQV AQY Form B Type Group name HE GU GU-E Part No. AQV AQW AQV AQW AQY S AQV S AQV E Package style S SOP SOP SOP Package style SOP Number of channels -channel -channels -channel -channel -channels -channels -channel ( pin) -channel ( pin) -channels -channels (MOSFET optocoupler) -channel -channel -channel -channels -channel -channel -channel -channel -channel voltage Third digit High High -channels (MOSFET optocouplers) Number of channels -channel High V V V (RF: V) V V V V V V V 9 AQV AQV AQV AQV AQV AQV AQV AQVM AQV AQV AQVR AQV AQV AQV AQV AQV AQVH AQW AQW AQW AQW AQW AQVS AQV AQV AQVS AQV AQVN AQVS AQVN AQYS AQVS AQWS AQX AQYS AQVS AQWS AQVE AQVE AQVEH AQVEH AQVN AQWN AQWN AQWN AQVNS AQVNS AQVH AQV AQV AQWTS AQWTS AQVH AQW AQVNS AQV AQV AQV AQY AQY AQY AQY voltage Third digit High -channels -channel -channels -channel (-pin) -channel (-pin) -channel High Power PhotoMOS Relays Form A Type Group name Part No. AQZ AQZ Varistor incorporated AQZ V AQZ D Voltage sensitive AQZ D High capacity AQZ Package style S Number of channels -channel V AQV V AQV AQVH AQW AQV AQW AQYS AQVS AQVE AQVEH Form A Form B Type Group name HE GU AQZ AQZ AQZV AQZD AQZD AQZ Part No. AQW AQW AQZ AQZ AQZV AQZD AQZD Package style AQZ AQZ AQZV AQZD AQZD Number of channel -channel -channel AQV AQW AQVS AQV9 voltage Third digit AQV V AQW AQW voltage V V V V V V V Third digit stands for third digit. Notes:. :, V between I/O..High :, V between I/O. AQZ AQZ AQZV AQZD AQZD AQZ Matsushita Electric Works Group Europe T