4-PIN SOP 400 V BREAK DOWN VOLTAGE NORMALLY CLOSE TYPE 1-ch Optical Coupled MOS FET

Size: px

Start display at page:

Download "4-PIN SOP 400 V BREAK DOWN VOLTAGE NORMALLY CLOSE TYPE 1-ch Optical Coupled MOS FET"

Felix Curtis
5 years ago
Views:

1 Solid State Relay OCMOS FET 4-PIN SOP 4 V BREAK DOWN VOLTAGE NORMALLY CLOSE TYPE 1-ch Optical Coupled MOS FET DESCRIPTION The is a solid state relay containing GaAs LEDs on the light emitting side (input side) and normally close (N.C.) contact MOS FETs on the output side. It is suitable for analog signal control because of its low offset and high linearity. FEATURES Small and thin package (4-pin SOP, Height = 2.1 mm) 1 channel type (1 b output) Low LED operating current (IF = 2 ma) Designed for AC/DC switching line changer Low offset voltage Ordering number of taping product: -E3, E4, E5, F3, F4 UL approved: File No. E72422 (S) BSI approved: No. 8241/8242 CSA approved: No. CA VDE approved: No ÜG APPLICATIONS Laptop PC, PDA Modem card Telephone, FAX Measurement equipment Document No. PN132EJ1V1DS (1st edition) (Previous No. P13439EJ5VDS) Date Published February 23 CP(K) The mark shows major revised points.

2 ± M PACKAGE DIMENSIONS in millimeters Data Sheet PN132EJ1V1DS TOP VIEW ± LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET.5±.3 2

3 ORDERING INFORMATION (Solder Contains Lead) Part Number Package Packing Style Application Part Number *1 4-pin SOP Magazine case 1 pcs -E3 -E4 -E5 -F3 -F4 Embossed Tape 9 pcs/reel Embossed Tape 1 pcs/reel Embossed Tape 3 5 pcs/reel *1 For the application of the Safety Standard, following part number should be used. ORDERING INFORMATION (Pb-Free) Part Number Package Packing Style Application Part Number *1 -A 4-pin SOP Magazine case 1 pcs -E3-A -E4-A -E5-A -F3-A -F4-A Embossed Tape 9 pcs/reel Embossed Tape 1 pcs/reel Embossed Tape 3 5 pcs/reel *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified) Parameter Symbol Ratings Unit Diode Forward Current (DC) IF 5 ma Reverse Voltage VR 5. V Power Dissipation PD 5 mw Peak Forward Current *1 IFP 1 A MOS FET Break Down Voltage VL 4 V Continuous Load Current IL 12 ma Pulse Load Current *2 (AC/DC Connection) ILP 24 ma Power Dissipation PD 3 mw Isolation Voltage *3 BV 1 5 Vr.m.s. Total Power Dissipation PT 35 mw Operating Ambient Temperature TA 4 to +85 C Storage Temperature Tstg 4 to +1 C *1 PW = 1 µs, Duty Cycle = 1 % *2 PW = 1 ms, 1 shot *3 AC voltage for 1 minute at TA = 25 C, RH = 6 % between input and output Data Sheet PN132EJ1V1DS 3

4 RECOMMENDED OPERATING CONDITIONS (TA = 25 C) Parameter Symbol MIN. TYP. MAX. Unit LED Operating Current IF ma LED Off Voltage VF.5 V ELECTRICAL CHARACTERISTICS (TA = 25 C) Parameter Symbol Conditions MIN. TYP. MAX. Unit Diode Forward Voltage VF IF = 1 ma V MOS FET Reverse Current IR VR = 5 V 5. µa Off-state Leakage Current ILoff IF = 1 ma, VD = 4 V.3 1. µa Output Capacitance Cout IF = 1 ma, VD = V, f = 1 MHz 17 pf Coupled LED Off-state Current IFoff IL = 12 ma 2. ma On-state Resistance Ron1 IF = ma, IL = 1 ma Ω Ron2 IF = ma, IL = 12 ma, t 1 ms 2 3 Turn-on Time *1 ton IF = 1 ma,, RL = 5 Ω,.7.2 ms Turn-off Time *1 toff PW 1 ms.8 2. Isolation Resistance RI-O VI-O = 1. kvdc 1 9 Ω Isolation Capacitance CI-O V = V, f = 1 MHz.5 pf *1 Test Circuit for Switching Time Pulse Input Input monitor IF Rin RL VL Input VO monitor Output Data Sheet PN132EJ1V1DS 4 toff ton 5 % 9 % 1 %

5 TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise specified) Maximum Forward Current IF (ma) Forward Voltage VF (V) Off-state Leakage Current ILoff (A) MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE Ambient Temperature TA ( C) FORWARD VOLTAGE vs. AMBIENT TEMPERATURE Ambient Temperature TA ( C) IF = 5 ma 3 ma 2 ma 1 ma 5 ma 1 ma OFF-STATE LEAKAGE CURRENT vs. APPLIED VOLTAGE IF = 1 ma TA = 85 C 25 C Applied Voltage VD (V) 5 Maximum Load Current IL (ma) Output Capacitance Cout (pf) Load Current IL (ma) MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE Ambient Temperature TA ( C) OUTPUT CAPACITANCE vs. APPLIED VOLTAGE 1 LOAD CURRENT vs. LOAD VOLTAGE Load Voltage VL (V) f = 1 MHz Applied Voltage VD (V) IF = ma Data Sheet PN132EJ1V1DS 5

6 Normalized On-state Resistance Ron Turn-on Time ton (ms) Number (pcs) NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE TURN-ON TIME DISTRIBUTION Turn-on Time ton (ms) Normalized to 1. at TA = 25 C, IF = ma, IL = 1 ma 75 Ambient Temperature TA ( C) n = 5 pcs, IF = 1 ma, 1 TURN-ON TIME vs. FORWARD CURRENT Forward Current IF (ma) 25 3 Number (pcs) Turn-off Time toff (ms) Number (pcs) ON-STATE RESISTNACE DISTRIBUTION TURN-OFF TIME DISTRIBUTION n = 5 pcs, IF = 1 ma, Turn-off Time toff (ms) n = 5 pcs, IF = ma, IL = 1 ma On-state Resistance Ron (Ω) TURN-OFF TIME vs. FORWARD CURRENT Forward Current IF (ma) 6 Data Sheet PN132EJ1V1DS 25 3

7 Normalized Turn-on Time ton NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE Normalized to 1. at TA = 25 C, IF = 1 ma, Ambient Temperature TA ( C) 1 Remark The graphs indicate nominal characteristics. Normalized Turn-off Time toff NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE Normalized to 1. at TA = 25 C, IF = 1 ma, Ambient Temperature TA ( C) 1 Data Sheet PN132EJ1V1DS 7

8 TAPING SPECIFICATIONS (in millimeters) Outline and Dimensions (Tape) Tape Direction 2.±.5 4.± ±.1 -E3 8.±.1 Outline and Dimensions (Reel) R ±.1 2.±.5 φ13.±.2 φ21.± ±.1 5.5±.5 12.±.2 7.4±.1.3 -E4 2.9 MAX. 2.4±.1 2.± ± ± to 15.4 Outer edge of Packing: 9 pcs/reel flange Data Sheet PN132EJ1V1DS 8 φ φ 6

9 Outline and Dimensions (Tape) Tape Direction 2.±.1 4.±.1 1.6±.1 12.±.3 Outline and Dimensions (Reel) 6 2.± Packing: 1 pcs/reel 1.55± ±.1 5.5±.1 7.4±.1 -E ±.3 255±2. 2.4±.3 4.4±.1.3±.5 8±1. 13.± ±1. Data Sheet PN132EJ1V1DS 9

10 Outline and Dimensions (Tape) 2.±.5 4.± ±.1 Tape Direction 8.±.1 -F Outline and Dimensions (Reel) R ± ±.1 5.5±.5 12.±.2 2.±.5 φ13.±.2 φ21.±.8 7.4± MAX. 2.4±.1 -F4 φ33±2. φ1±1. 2.± ± ± to 15.4 Outer edge of Packing: 3 5 pcs/reel flange Data Sheet PN132EJ1V1DS 1 φ13.±.2

11 RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering Peak reflow temperature 26 C or below (package surface temperature) Time of peak reflow temperature Time of temperature higher than 22 C Time to preheat temperature from 12 to 18 C Number of reflows Flux Package Surface Temperature T ( C) (2) Wave soldering Temperature Time Preheating conditions Number of times Flux (3) Cautions Fluxes 1 seconds or less 6 seconds or less 12±3 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of.2 Wt% is recommended.) Recommended Temperature Profile of Infrared Reflow 12 C 12±3 s (preheating) 18 C Time (s) 26 C or below (molten solder temperature) 1 seconds or less (heating) to 1 s to 6 s 12 C or below (package surface temperature) One 26 C MAX. 22 C Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of.2 Wt% is recommended.) Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. Data Sheet PN132EJ1V1DS 11

12 Subject: Compliance with EU Directives 459 Patrick Henry Drive Santa Clara, CA Telephone: (48) Facsimile: (48) CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 22/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 23/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix A indicates that the device is Pb-free. The AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Lead (Pb) Concentration Limit per RoHS (values are not yet fixed) < 1 PPM Concentration contained in CEL devices -A -AZ Not Detected (*) Mercury < 1 PPM Not Detected Cadmium < 1 PPM Not Detected Hexavalent Chromium < 1 PPM Not Detected PBB < 1 PPM Not Detected PBDE < 1 PPM Not Detected If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.

6-PIN DIP, 0.08 Ω LOW ON-STATE RESISTANCE 2.0 A CONTINUOUS LOAD CURRENT 1-ch Optical Coupled MOS FET

6-PIN DIP, 0.08 Ω LOW ON-STATE RESISTANCE 2.0 A CONTINUOUS LOAD CURRENT 1-ch Optical Coupled MOS FET Solid State Relay OCMOS FET 6-PIN DIP,.8 Ω LOW ON-STATE RESISTANCE 2. A CONTINUOUS LOAD CURRENT 1-ch Optical Coupled MOS FET NEPOC Series DESCRIPTION The PS71E-1A and PS71EL-1A are solid state relays containing