OPTICAL DEVICES. Optical Devices

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1 OPTICAL DEVICES Optical Devices

2 : Distributed Feedback Laser Diode s are semiconductor lasers that enable further and faster signal transmission than conventional FPs through maintaining the oscillation spectrum in a single longitudinal mode (a single wavelength component). This is achieved by installing a minute periodic structure (diffraction grating) within the internal elements of the laser diode. s are also available, featuring an electroabsorption modulator (EAM) integrated in front of the, even further transmission. Laser Diodes and Photo Diodes Fiber to the Home (FTTH) Faster PON technology has led to the development of BPON, GPON and GEPON in response to demands increased speed and capacity in optical communication systems. Backed by the leading photo diode FTTH in the BPON field, s and As are designed different types of access network optical fiber grids, providing a flexible approach to changes in customer specifications and packages. These parts are used extensively in GPON, which has rapidly become increasingly popular around the world. FP Active layer PON (Passive Optical Network) Active layer Diffraction grating OLT Upstream EAM 1.µm band or 1.3µm band FP or A Mitsubishi Electric Optical Devices: The Key to Connecting Inmation Networks in the Future. 43Gbps Modulatorintegrated Laser Diode and Photo Diode Modules Compliant with industry standards (XLMDMSA), both the laser diode module with builtin driver modulator and the large, dynamic range TIA module deliver exceptional permance using Mitsubishi Electric's own optical elements (s, s) and an original highfrequency circuit design. As transponders over VSR (short communications up to 2 km), they provide faster optical communications between routers, SONET/SDH devices and DWDM devices, and contribute to more compact devices that use less power and less cost. 638nm Highoutput Laser Diode Industry and Displays Compared to LEDs, semiconductor lasers have lower power consumption, higher output and can be used with optical systems having a higher maximum aperture. These considerable advantages mean that they can be used projectors that do not require focal adjustment. Mitsubishi Electric has a range of lasers available, including a multimode semiconductor laser with a 638nm wavelength and 1W output (when pulsedriven) that provides highly visible, vibrant red colors color projectors y Laser Display 60 srgb D6 700 CMY x

3 LASER DIODES FOR INDUSTRY & DISPLAY Selection map of Red Laser Diodes RED [638nm] (Display System etc.) ML01P73 High Luminance [Lateral Multimode] ML01P73 [638nm, 1W(Pulse)] Luminous Flux [lm] Selection map of High Power Short Laser Diodes (Except Red ) INFRARED [830nm] (Sensor etc.) ML60171C High Beam Quality [Lateral Singlemode] ML60171C [830nm,260mW] : Under Development Lineup of Laser Diodes Type Number Application Output Power@CW [mw] Output [mw] Temperature [ C] Package ML01P73 Display ф.6mm Capless ML60171C Sensor, Printing ф.6mm TOCAN : Under Development Terminology APC A A TIA BPON CPRI CWDM DWDM EAM ER FP FR FTTH GPON GEPON LC LED LR LRM Angled Physical Contact Avalanche Photo Diode Avalanche Photo Diode Trans Impedance Amplifier Broadband Passive Optical Network Common Public Radio Interface Coarse Division Multiplexing Distributed FeedBack Laser Diode Dense Division Multiplexing Electro Absorption Modulator Electro absorption Modulator integrated Laser diode Extended Reach FabryPerot Laser Diode Fiber Reach Fiber To The Home Gigabit Passive Optical Network Gigabit EthernetPassive Optical Network Lucent Connector Light Emitting Diode Long Reach Long Reach Multimode OLT P2P PC TIA RoF ROSA SC SDH SONET TOSA VSR X2 XENPAK XFP XGPON XLMDMSA XMDMSA Optical Line Terminal Optical Network Unit Optical Time Domain Reflectometer Peer to Peer Physical Contact Photo Diode with TransImpedance Amplifier Radio over Fiber Receiver Optical SubAssembly Single fiber Connector Synchronous Digital Hierarchy Synchronous Optical NETwork Transmitter Optical SubAssembly Very Short Reach 2nd Generation XENPAK 10 Gigabit Ethernet Transceiver Package 10 Gigabit small Formfactor Pluggable 10 Gigabit Passive Optical Network 40 Gbps Miniature Device Multi Source Agreement 10 Gbps Miniature Device Multi Source Agreement SAFETY CAUTIONS FOR USE OR DISPOSAL OF LISTED PRODUCTS The warnings below apply to all products listed in this pamphlet. WARNING Laser Beam Injury GaAs While the laser diode is on, its gives a laser beam. Even if we can't see a laser beam by its wavelengt, penetration into the eye by a laser beam or its reflected light may cause eye injury. Prevent the irradiating part or its reflected light from entering the eyes. Fiber fragments may cause injury. In cases of fiber bending or breakage, never touch the fragment. Gallium arsenide (GaAs) is used in these products. To avoid danger, strictly observe the following cautions. Never place the products in your mouth. Never burn or break the products, or use any type of chemical treatment to reduce them to gas or powder. When disposing of the products, always follow the laws which apply, as well as your own company's internal waste treatment regulations. Disposal of FlameRetarded Fiber Core Wire Flame retardant resin must be disposed of according to law of industrial waste in disposal place. This product is a bromine type flameretarded resin, containing bromine compounds and antimony trioxide. All disposal operations should be conducted with full consideration of this content. 2

4 OPTICAL DEVICES FOR OPTICAL COMMUNICATION SYSTEM Selection map of / Modules Bit Rate 10Gbps 28Gbps 43Gbps FU46RDF 1.μm 1.3μm 1.3μm FU46RDF FU612REA 40,80km TDM 40km DWDM FU613REA 40km TDM FU412REA 100GBASELR4, ER4, OTU4 FU497SEA FU697SEA VSR2000 FU69REA FR FU412REA/FU612REA FU613REA FU697SEA FU397SPP pin FU397SPP VSR2000 FU39RPP FR FU37RPA FU470SHL/ FU670SHL A FU37RPA FU37SPA FU470SHL 1.3μm FP For FU670SHL 1.μm FP FU40SDF 1.3μm For Analog FU60SDF 1.μm FU40SDF/ FU60SDF : New Product : Under Development 3

5 Line up of Modules Type Number Chip Type Package Output Power Features FU497SEA LC/SC Pigtail 1.dBm 43Gbps 10km, XLMDMSA Compliant 43G FU697SEA LC/SC Pigtail 10 1.dBm 43Gbps, VSR2000, XLMDMSA Compliant FU69REA 10 1.dBm 43Gbps, FR, XLMD2MSA Compliant FU412REA LANWDM 2.0dBm 28Gbps x 4ch FU612REA dBm XFP 40,80km, 40km DWDM, XMDMSA Compliant 10G FU613REA dBm SFP+ 40km, XMDMSA Compliant FU46RDF 2.0dBm XFP 2km, XMDMSA Compliant FU470SHL FU670SHL FP FP Coaxial Pigtail Coaxial Pigtail 10 ~120mW(Pulse) ~90mW(Pulse) Pulse width=10μs, Duty=1% Pulse width=10μs, Duty=1% FU40SDF Coaxial Pigtail 4mW CATV Return Path, RoF Analog FU60SDF Coaxial Pigtail 1470, 1490, 110, 130, 10, 170, 190, mW CATV Return Path, RoF : New Product : Under Development Line up of Modules Type Number Chip Type Package Application Features 43G FU397SPP FU39RPP pin pin LC/SC Pigtail ROSA, LC Receptacle VSR2000 FR XLMDMSA Compliant XLMD2MSA Compliant 10G FU37RPA FU37SPA A A ROSA, LC Receptacle ROSA, LC Receptacle XFP 80km 300pin 80km A TIA, XMDMSA Compliant A, TIA : Under Development Type Name Definition of Optical Devices Optical Communication System FU 6 0 S DF FW1M1 Optical Module Module No µm 6 1.µm /A Module No. 3 Long Model of product Shows using optical fiber S : Singlemode fiber P : Polarization Maintaining fiber none : Multimode fiber R : LC receptacle Shows kind of chip FP laser diode Photo diode DF DFB laser diode AP Avalanche photo diode HL High power FP Laser diode PP Photo diode with preamp EA EAM Laser diode PA Avalanche photo diode with preamp Shows connector type, pinconnection type, level of optical output, customer code and specification's number, Swavelength cord, etc. 4

6 OPTICAL DEVICES FOR OPTICAL COMMUNICATION SYSTEM Selection map of / Bit Rate ~622Mbps 1.2Gbps 2.Gbps 10Gbps ML720K4S/ML720K19S FP 1.49μm 1.3μm 1.μm 1.3μm ML7xx4 / ML7xx49 P2P ML7xx10 1.3μm GEPON P2P For ML9xx4 / ML9xx3 ML9xx10 1.μm ML7xx11 / ML7xx47 GPON (High Power) GPON (Easy Alignment) ML9xx16 GEPON OLT CSFP ML7xx19 ML7xx39 / ML7xx0 P2P XGPON ML9xx46 GPON OLT ML7xx42 10G Application 40GBASELR4 ML720Y49S ML776H10/ML976H10 ML720AA47S ML768K42T ML920LA46S/ML920LA43S ML9xx11 1.μm ML9xx43 TDM (1.μm) CWDM (8λ) 831AB20 A 8xx3 / 8xx20 (with TIA) GPON 8xx24 (with TIA) 10GEPON 831W24 : New Product

7 Line up of Type Number Output [mw] Temp. [ C] Features ML7xx4 1M, 622M, 1.2Gbps ML7xx49 11 GEPON, 1.2Gbps, High Coupling Efficiency FP ML7xx19 2.Gbps ML9xx M, 622M, 1.2Gbps ML9xx M, 622M, 1.2Gbps FP ML7xx10 ML9xx (Pulse) 200(Pulse) ML7xx11 1M, 622M, 1.2Gbps, High Coupling Efficiency ML7xx47 GPON, 1.2Gbps, Easy Alignment ML7xx39 40~+9 1.2G, 2.Gbps ML7xx ~+9 XGPON, 2.Gbps ML7xx42 ML768T42T ~+7 10GEPON, 10Gbps ML768K42T 40~+9 10GBASELR, SONET/SDH, 10Gbps ML768LA42T ML768AA42T ML768J42T 1270, , 1290,, ~+9 ~+80 CPRI, 10Gbps x 2λ 40GBASELR4, 10Gbps x 4λ ML9xx M, 622M, 1.2Gbps ML9xx GEPON OLT, 1.2Gbps ML9xx GPON OLT, 2.Gbps 10 20~+9 2.Gbps ML9xx , 1490, 110, 130, 10, 170, 190, ~+8 1.2Gbps, 2.Gbps, 8λ CWDM : New Product Line up of Type Number Active Diameter Temp. [ C] Features 8xx3 1260~ G, 2.Gbps A 8xx GPON, 2.Gbps, Builtin TIA 8xx ~+7 10GEPON, 10Gbps, Builtin TIA Type Name Definition of Laser and Photo Diodes ML 7 20K 4 S Device Type [ML: Laser Diode : Photo Diode] Package* Chip Series Pin Assignment Available Monitor Contained Package Categories Device Type Range (nm) ML <λ <λ <λ <λ 1000<λ 1600 Type N C R F E S T Anode Common Anode Common Anode Common Anode Common *Please contact our sales office about the selection packages. 6

8 OPTICAL DEVICES Please visit our website further details. Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum eft into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. Mitsubishi Electric Corporation assumes no responsibility any damage, or infringement of any thirdparty s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. All inmation contained in these materials, including product data, diagrams, charts, programs and algorithms represents inmation on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is theree recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor the latest product inmation bee purchasing a product listed herein. The inmation described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to inmation published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page ( When using any or all of the inmation contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all inmation as a total system bee making a final decision on the applicability of the inmation and products. Mitsubishi Electric Corporation assumes no responsibility any damage, liability or other loss resulting from the inmation contained herein. Mitsubishi Electric Corporation semiconductors are not designed or manufactured use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein any specific purposes, such as apparatus or systems transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor further details on these materials or the products contained therein. HEAD OFFICE: TOKYO BG., 273, MARUNOUCHI, CHIYODAKU, TOKYO , JAPAN HCX606R KI1302 Printed in Japan (TOT) 2013 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED. New publication effective Feb Specifications subject to change without notice.

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