MITSUBISHI OPTICAL DEVICE Mitsubishi optical device products support our IT era Trunk Line City A Cellular Communication P4 Laser Diode P6 LD Module P

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1 OPTICAL DEVICES Application Map 1 Technology Trend 3 Laser Diode for Industry Information Processing & Instrumentation 4 Laser Diode for Communication System 4 Photo Diode for Communication System 5 LD Driver IC for Communication System 5 LD Module for Communication System 6 PD Module for Communication System 7 Selection Guide for Opto-discrete Devices 8 Selection Guide for Module 10 Great Variety of Product Line-up Wavelength: 650nm to 1600nm Product form: TO-CAN, Chip-on-Carrier, Module High Speed, High Power, High Performance Bitrate to 40 Gbps High Power to 350mW

2 MITSUBISHI OPTICAL DEVICE Mitsubishi optical device products support our IT era Trunk Line City A Cellular Communication P4 Laser Diode P6 LD Module P5 Photo Diode City B P6 LD Module P7 PD Module Tranceiver Base Station Fiber Amplifier Fiber Amplifier Station Measurement P4 Laser Diode P6 LD Module Sub Station Sub Station Distribution Center CAT V Sub Station P6 LD Module Distribution Center Node Distribution Center FA OA Ethernet P4 Laser Diode P5 Photo Diode P6 LD Module Subscriber MO PC P7 PD Module Office Connection Terminal TELEPHONE FAX Access P4 Laser Diode P5 Photo Diode P6 LD Module Information Processing P7 PD Module P4 Laser Diode CD-R/RW 1 DVD MO /MITSUBISHI 2

3 Technology Trend As use of the Internet and mobile phones expands, the fiber-optic communications system that forms the backbone of the information infrastructure is carrying ever increasing loads of data. And the development of smaller and more sophisticated photoelectric devices demanded by the system also continues unabated. Meanwhile, the optical disks that can save these huge quantities of data are evolving from CD-R/RW into recordable DVDs, creating demand for higher output and shorter wavelengths in laser diodes. Mitsubishi Electric was quickest off the mark in sensing these requirements of the broadband era. We are making a contribution to society by delivering products made with our outstanding developmental powers and quality control. We will meet the needs of all, with surefire technological prowess and meticulous support. Power Increase Trend to the Information LDs DVD±R/RW (658nm-LD) Pulsed Light Output power(mw) Year Bit rate speed trend for fiber communicatioin WDM 10G X 4 25G X 4 100G TDM 10G X 1 3G X 4 40G Bit rate (bps) 100M X 1 1G X 1 10G 1G 100M TDM : Time Division Mulplexing WDM : Wavelength Division Mulplexing Year 3

4 Laser Diode for Industry Information Processing & Instrumentation LDs for DVD R/RW ML1XX21 ML1XX23 ML1XX24 ML1XX25 ML1XX26 ML1XX27 Wavelength 658nm 658nm 658nm 658nm 658nm 660nm Power 160mW(pulse) 200mW(pulse) 230mW(pulse) 250mW(pulse) 300mW(pulse) 350mW(pulse) ML1XXX Series LDs for Industry, Display ML5XX51 ML5XX71 ML5XX54 ML5XX12 ML5CP50 ML5CP8 ML5CP9 Wavelength 638nm 638nm 638nm 808nm 638nm 808nm 808nm Power 150mW(CW) 220mW(CW) 110mW(CW) 0.5W(CW), 1.2W(pulse) 8W(CW) 40W(CW) 40W(CW) Lateral Multi-mode Lateral Multi-mode Lateral Single-mode Lateral Multi-mode Lateral Multi-mode, LD bar Lateral Multi-mode, LD bar (for AuSn-solder) Lateral Multi-mode, LD bar (for In-solder) ML5XXX Series ML5CP Series Laser Diode for Communication System FP-LDs for Subscriber and Data Communication ML7XX45 ML7XX46 ML7XX19 ML9XX45 Wavelength 1.55µm Power 13mW ~622Mbps for FTTH application ~622Mbps High optical power LD for PON application ~2.5Gbps High speed application ~622Mbps for FTTH application ML720J45S ML720K45S DFB-LDs for Trunk Line, Access Network and Data Communication Wide temperature with uncoded operation, high speed operation 8 wavelength for CWDM* is available. ML7XX11 ML7XX34 ML7XX39 ML9XX46 ML9XX11 ML9XX43 Wavelength 1.49µm 1.55µm 1.55µm Power 1 ~1.25Gbps 2.5Gbps, 1275~1350nm(25nm spacing) G-PON ONT 2.5Gbps, High optical power LD for PON application ~1.25Gbps 2.5Gbps, 1470~1610nm(20nm spacing) ML720J34S ML720LB39S *Coarse Wavelength Division Multiplexing 4

5 Laser Diode for Communication System DFB-LDs, EAM-LD for Long Haul WDM* Transmission High speed operation DWDM wavelength based on ITU-T specification are available Active Diameter Structure ML9SM11 ML9SM44 ML9XX ~1.56µm 10mW 2.5Gbps DFB-LD, ~175km reach, for C-band 47channel ML9XX µm 10Gbps EAM-LD(C band) *Wavelength Division Multiplexing High power LDs for Time Domain Reflectometer High optical power output under pulse operation Active Diameter Structure ML776H10 ML7XX10 300mW ø5.6mm CAN package ML9XX µm 200mW ø5.6mm CAN package Photo Diode for Communication System PIN-PDs and APDs for Fiber Communication Small dark current PD/APD with TIA are available Active Diameter Structure PD708C8, PD708C7 PD893K3 PD7XX8 ø80µm PIN ~1Gbps, TO-56 with ball lens, flat glass window PD7XX7 ø40µm PIN 2.5Gbps, TO-56 with ball lens, flat glass window PD7XX26 ø20µm PIN 10Gbps, chip on carrier PD8XX2 ø50µm APD ~1Gbps, TO-56/chip on carrier PD8XX3 ø35µm APD 2.5Gbps, TO-56/chip on carrier PD8XX4 ø35µm * 2.5Gbps, APD with TIA*, TO-CAN PD8XX20 ø50µm * 2.5Gbps lower voltage operating APD 3.3V with TIA*, TO-CAN PD8XX10 ø20µm APD 10Gbps, chip on carrier *Trans-Impedance Amplifier LD Driver IC for Communication System EAM-LD/ FP-LD/ DFB-LD driver IC High speed operation Data Rate ML01720A ML0XX20 ML0XX Gbps 11.3Gbps For FP-LD/DFB-LD drive, Low consumption power, APC *, 4mm SLP package For EAM-LD drive, Low consumption power, APC *, 4mm SLP package ML0XX Gbps For MZ dvice, Low consumption power, APC *, 4mm SLP package Under Development *APC : Automatic Power Control 5

6 LD Module for Communication System FP-LD Module for Subscriber Receptacle type FU-466ULD FU-466RLD 10Gbps for Xenpak/X2, XMD-MSA compliant 10Gbps for SFP+, XMD-MSA compliant FU-466RLD DFB-LD module for trunk line Multiple package and wavelength availability High speed response and reliability Receptacle type FU-40RDF FU-60RDF FU-442RDF FU-456UDF FU-456RDF 2.5Gbps for SFP 2.5Gbps 1470~1610nm(20nm spacing) for SFP 8.5Gbps for SFP+ 10Gbps for Xenpak/X2, XMD-MSA compliant 10Gbps for XFP, XMD-MSA compliant FU-456RDF type FU-450SDF FU-650SDF 2.5Gbps with isolator 2.5Gbps 1470~1610m(20nm spacing) with isolator FU-650SDF EAM-LD module for trunk line High dense long haul transmission. XMD-MSA package is available Receptacle type FU-610REA 10Gbps for XFP, XMD-MSA compliant FU-610REA type FU-697SEA Under Development 40Gbps, XLMD-MSA compliant FU-697SEA 6

7 LD Module for Communication System DFB-LD module for mobile communication and CATV application Multiple package and wavelength availability Low distortion and noise. type FU-450SDF FU-650SDF 4mW with isolator 4mW 1470~1610nm(20nm spacing) with isolator FU-450SDF PD Module for Communication System PD/APD module for subscriber and trunk line Multiple package availability Low noise, high sensitivity and response Receptacle type FU-300RPA FU-357RPP FU-357UPA FU-357RPA 2.5Gbps APD with TIA for SFP 10Gbps PD with TIA for XFP, XMD-MSA compliant 10Gbps APD with TIA for Xenpak/X2, XMD-MSA compliant 10Gbps APD with TIA for XFP, XMD-MSA compliant FU-300RPA FU-357RPA type FU-318SAP FU-319SPA FU-357SPA FU-397SPP Under Development ~1.25Gbps APD 2.5Gbs APD with TIA 10Gbps APD with TIA 40Gbps PD with TIA, XLMD-MSA compliant FU-357SPA FU-397SPP 7

8 Selection Guide for Opto-discrete Devices Category Application Wavelength Power Series Name ( Structure) Information Processing DVD±R/RW 658nm Po(P)=160mW Po(P)=200mW Po(P)=230mW Po(P)=250mW Po(P)=300mW Po(P)=350mW Po(P):Pulse Output ML1XX21 (Visible light, High Power) ML1XX23 (Visible light, High Power) ML1XX24 (Visible light, High Power) ML1XX25 (Visible light, High Power) ML1XX26 (Visible light, High Power) ML1XX27 (Visible light, High Power) Category Application Wavelength Power Series Name ( Structure) Industry, Display TO-Can 638nm 658nm Po=150mW (CW) ML5XX51 (Lateral multi-mode) Po=220mW (CW) (Lateral multi-mode) ML5XX71 Po=110mW (CW)/TBD(pulse) (Lateral single-mode) ML5XX54 808nm Po=0.5W (CW)/1.2W (pulse) (Lateral multi-mode) ML5XX12 LD-bar 658nm 638nm Po=8W (CW) ML5CP50 (Lateral multi-mode) 808nm Po=40W (CW) (Lateral multi-mode) ML5CP8 (for AuSn solder) ML5CP9 (for In solder) Category Application Wavelength Power Series Name ( Structure) Transmissions (Transmission) ~10Gbps 1550nm Po= ML9XX44 (EAM-LD) ~2.5Gbps 1550nm (1470~1610nm 20nm spacing) Po= ML9XX43 (DFB-LD) 1490nm Po=1 ML9XX46 (DFB-LD) (1275~1350nm 25nm spacing) Po= ML7XX34 (DFB-LD) ML7XX39 (DFB-LD, for G-PON ONT) ML7XX19 (FP-LD, Uncooled) ~1.25Gbps 1550nm Po= ML9XX11 (DFB-LD, Uncooled) Po= ML7XX11 (DFB-LD, Uncooled) ~622Mbps 1550nm Po= ML9XX45 (FP-LD, FTTH) Po= Po=13mW ML7XX45 (FP-LD, FTTH) ML7XX46 (FP-LD, High Power, FTTH) 8

9 Selection Guide for Opto-discrete Devices Category Application Structure Active Diameter Series Name ( Structure) Transmissions (Receive) 10Gbps InGaAs-PIN ø20µm PD7XX26 InGaAs-APD ø20µm PD8XX10 ~2.5Gbps InGaAs-PIN ø40µm PD7XX7 InGaAs-APD ø35µm ø35µm ø50µm PD8XX3 PD8XX4 PD8XX20 (lower Voltage operating APD) ~622Mbps InGaAs-PIN ø80µm PD7XX8 InGaAs-APD ø50µm PD8XX2 Category Application Wavelength Power Series Name ( Structure) Transmissions (Measurement) OTDR 1550nm Po(P)=200mW Po(P)=300mW Po(P):Pulse Output ML9XX10 (High Power Pulse LD) ML7XX10 (High Power Pulse LD) Category Application Product Series Name ( Structure) fiber communication (IC) ~10Gbps Laser driver ML0XX20 (11.3Gbps DML) ML0XX21 (11.3Gbps EML) ML0XX23 (11Gbps MZ) Under Development Name Definition Opto Discreate Devices ML 7 25B 45 F Device [ML: Laser Diode PD: Photo Diode] Wavelength Package Chip Series Pin Assignment Available for Monitor PD contained Package Categories Device Wavelength Wavelength Range ML PD λ <λ <λ <λ 1000<λ 1600 N C R F E S Case Case Case Case Case Case PD LD PD LD PD LD PD LD PD LD PD LD LD Anode Common Cathode Common Cathode Common Anode Common Cathode Common Floating PD Cathode Common Cathode Common Anode Common Floating Floating Floating 9

10 Selection Guide for Module Category Application Package Structure Wavelength Series Name transmissions (LD module) 40Gbps EAM-LD 1550nm FU-697SEA ~10Gbps Receptacle EAM-LD 1550nm (Including C band) FU-610REA (XFP) DFB-LD FU-456RDF (XFP/SFP+) FU-456UDF (Xenpak/X2) FP-LD FU-466RDF (SFP+) FU-466UDF (Xenpak/X2) ~8Gbps Receptacle DFB-LD FU-442RDF (SFP+) ~2.5Gbps Receptacle DFB-LD 1550nm (1470~1610nm) FU-60RDF (8 wavelength for CWDM) FU-40RDF DFB-LD 1550nm (1470~1610nm) FU-650SDF (8 wavelength for CWDM) Mobile communication CATV DFB-LD 1550nm (1470~1610nm) FU-450SDF FU-650SDF (8 wavelength for CWDM) FU-450SDF Category Application Package Structure Series Name transmissions (PD module) ~40Gbps ~10Gbps Receptacle PD FU-397SPP FU-357RPA (XFP) FU-357UPA (Xenpak/X2) PD-TIA FU-357RPP (XFP/SFP+) FU-357SPA ~2.5Gbps Receptacle FU-300RPA (SFP) FU-319SPA ~1.25Gbps FU-318SAP Name Definition DFB-LD/EAM-LD/FP-LD/PD-APD Module FU-650SDF-FW6M15 Module LD Module PD/APD Module No. Wavelength No. Wavelength 4 1.3µm 3 Long µm Shows kind of LD chip Safety Cautions for Use or Disposal of Listed Products The warnings below apply to all products listed in this pamphlet. Laser Beam Injury GaAs Disposal of Flame- Retarded Fiber Core Wire A proper figure of each product Shows using optical fiber S : Single-mode fiber P : PM fiber none : Multi-mode fiber R : LC receptacle U : SC receptacle LD FP laser diode PD Photo diode DF DFB laser diode AP Avalanche photo diode HL High power FP LD PP Photo diode with Trans-impedance amplifier EA EA LD PA Avalanche photo diode with Trans-impedance amplifier Shows connector type, pin-connection type, level of optical output, customer code and specification's number, wavelength cord, etc. none : without connector V : PC polished FC connector W : PC polished SC connector L : APC polished SC connector 10 Warning Under Development While the laser diode is on, its gives a laser beam. Even if we can't see a laser beam by its wavelength, penetration into the eye by a laser beam or its reflected light may cause eye injury. Prevent the irradiating part or its reflected light from entering the eyes. Fiber fragments may cause injury. In cases of fiber bending or breakage, never touch the fragment. Gallium arsenide (GaAs) is used in these products. To avoid danger, strictly observe the following cautions. Never place the products in your mouth. Never burn or break the products, or use any type of chemical treatment to reduce them to gas or powder. When disposing of the products, always follow the laws which apply, as well as your own company's internal waste treatment regulations. Flame-retarded resin corresponds to industrial waste and waste plastic as defined in the Wastes Disposal and Public Cleaning Law. In compliance with the Wastes Disposal and Public Cleaning Law, consign disposal to an operator licensed in the treatment and disposal of industrial waste materials. When the local municipality is responsible for the disposal, consign the work to the said municipality. This product is a bromine type flame-retarded resin, containing bromine compounds and antimony trioxide. All disposal operations should be conducted with full consideration of this content.