M52769FP DESCRIPTION FEATURES RECOMMENDED OPERATING CONDITIONS APPLICATION

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1 ICs (TV) DESCRIPTION FEATURES PLL-SPLIT /SIF is a semiconductor integrated circuit consisting of /SIF signal processing for CTVs and VCRs. corresponds to FM radio and provide low cost and high performance system with the coil-less AFT. FM radio receiving is available without FM radio IC and external filter Built-in FM radio carrier indicator Coil-less AFT. The PLL-SPLIT system provides good sound sensitivity and reduces buzz. Video output is.0vp-p through EQ AMP. Built-in QIF AGC. Improve over modulation characteristics and Vcc ripple rejection. RECOMMENDED OPERATG CONDITIONS Supply Voltage Range (Vcc) 4.75 to 5.5 V Rated Supply Voltage (Vcc) 5.0 V APPLICATION TV,VTR P CONFIGURATION (TOP VIEW) RF AGC DELAY AFT OUT RF AGC OUT NC GND GND SIF IF AGC FILTER / FM RADIO FM DET COIL AUDIO OUT pin SSOP SIF CARRIER DET LEVEL APC FILTER VIDEO OUT NTSC / OTHER SW Vcc Vcc VCO COIL VCO COIL SIF CARRIER DET OUT QIF OUT AF FILTER ITER

2 ICs (TV) PLL-SPLIT /SIF BLOCK DIAGRAM and PERIPHERAL CIRCUIT Vcc VCO COIL 5549 K BPF Radio VCO AMP AFT AMP Radio IF AGC TV VIDEO DET APC QIF DET QIF AGC FM DET 50K 50K TV RF AGC AMP SIF AMP AF AMP N.C TP TP3 SW SIF FM det coil 593 TP

3 ICs (TV) PLL-SPLIT /SIF ABSOLUTE MAXIMUM RATGS ( Ta = 5ºC, unless otherwise noted ) Parameter Symbol Ratings Unit Note Supply Voltage Vcc 6.0 V Power Consumption Pd 90 mw Operating Temperature Topr -0 to +75 ºC Storage Temperature Tstg -40 to +50 ºC Temperature Characteristics ( maximum ratings ) 750 Mounting in standard circuit board Ambient temperature Ta(ºC) 50 3

4 ICs (TV) AL CHARACTERISTICS TV Mode NO Parameter Symbol Test Circuit Test Point Point SG PLL-SPLIT /SIF (Vcc=,Ta=5ºC unless otherwise noted) Measurement condition External power V0 V4 switches set to position unless otherwise noted Limits M TYP MAX Circuit Current VCC= Vcc= ICC A SG ma SW9= Video Output DC Voltage Video Output Voltage Video S/N Video Band Width Sensitivity Maximum Allowable AGC Control Range V TPA 0 SW0= V Vo det TPA SG. Vp-p.8.4 Video S/N TPB BW V M V MAX TPA TPA TPA SG SG3 SG4 SG5 Variable SW= SW0= GR db Unit Note db MHz dbµ dbµ IF AGC Voltage V0 TP0 SG V 0 Maximum IF AGC Voltage V0H TP V Minimum IF AGC Voltage Maximum RF AGC Voltage V0L V3H TP0 TP3 SG7 SG V V 3 Minimum RF AGC Voltage V3L TP3 SG V 4 RF AGC Delay Point V3 TP3 SG8 SW= dbµ 6 5 Capture Range U CL-U TPA SG9.0.7 MHz Capture Range L Capture Range T CL-L CL-T TPA SG MHz MHz AFT Sensitivity µ TP AFT Maximum Voltage VH AFT Minimum Voltage VL TP TP SG0 mv SG V 0 khz 0 SG V 0 4

5 ICs (TV) PLL-SPLIT /SIF NO Parameter Symbol Test Circuit Test Point Point SG Measurement condition External power V0 V4 switches set to position unless otherwise noted Limits M TYP MAX Unit Note Inter Modulation IM TPA Variable SG SW0= 40 db 35 Differential Gain DG TPA SG 5 % 3 Differential Phase DP TPA SG 5 deg 4 Sync. tip level V SYNC TPA SG V 5 Resistor RV TP5. kω 6 capacitance CV TP5 5 pf 5

6 ICs (TV) PLL-SPLIT /SIF NO Parameter Symbol Test Circuit Test Point Point SG Measurement condition External power V0 V4 switches set to position unless otherwise noted Limits M TYP MAX Unit Note QIF Output 7 QIF Voltage TP5 SIF SG SG dbµ 8 QIF Output Voltage QIF TP5 SIF SG SG dbµ 9 AF Output (4.5MHz) VoAF TP SG mvrms 30 AFOutput Distortion (4.5MHz) THD AF TP SG % 3 Limiting Sensitivity (4.5MHz) TP SG dbµ 3 AM Rejection (4.5MHz) AMR TP SG db 3 33 AF S/N (4.5MHz) AF S/N TP SG db 4 34 SIF Resistor RS TP9.5 kω 35 SIF capacitance CS TP9 4 pf FM Radio Mode NO Parameter Symbol Test Circuit Test Point Point SG Measurement condition External power V0 V4 switches set to position unless otherwise noted Limits M TYP MAX Unit Note 3 SIF detection out High Voltage V6H TP6 0 SW0= V 33 SIF detection out Low Voltage SIF V6L TP6 SG0 0 SW0= 0..0 V 34 SIF detection Threshold Point TSIF TP6 SIF SG 0 SW0= dbµ 5 35 RF AGC Delay Point V3F SIF TP3 SG 0 SW= SW0= dbµ 6 36 AF Output VoF TP SG 0 SW0= mvrms 37 AF Output Distortion THD F TP SG 0 SW0= 0..0 % 38 AF S/N S/N F TP SG9 0 SW0= 55 6 db 7 6

7 ICs (TV) PLL-SPLIT /SIF Measuring Circuit Diagram BPF TPB SW9 A Vcc= K TP4 SW SW VCO COIL 5549 TP6 SW5 TP5 SW Radio VCO AMP AFT AMP Radio IF AGC TV VIDEO DET APC QIF DET QIF AGC 50K FM DET 50K TV RF AGC AMP SIF AMP AF AMP N.C : TP TP3 TP9 TP0 SW TP 5 5 SIF SW0 FM det coil 593 Vcc TP V8 * All capacitor is 0.0µF, unless otherwise noted. * The Measuring Circuit is Mitsubishi standard evaluation fixture. 7

8 ICs (TV) PLL-SPLIT /SIF Measuring Circuit Diagram Radio VCO AMP AFT AMP Radio IF AGC TV VIDEO DET APC QIF DET QIF AGC 50K FM DET 50K TV RF AGC AMP SIF AMP AF AMP TP4 TP7 HI LO RX meter HI LO RX meter * All capacitor is 0.0µF, unless otherwise noted. 8

9 ICs (TV) PLL-SPLIT /SIF PUT SIGNAL SG ohm Termination fo=58.75mhz AM 0 KHz 77.8 % 90 dbµ fo=58.75mhz 90 dbµ Cw f=58.75mhz 90 dbµ Cw f=frequency Variable 70 dbµ Cw Mixed Signal fo=58.75mhz AM 0 KHz 77.8% Level Variable fo=58.75mhz AM 0 KHz 4.0% Level Variable fo=58.75 MHz 80 dbµ Cw fo=58.75 MHz 0 dbµ Cw fo=58.75 MHz Level Variable Cw fo=frequency Variable AM 0 KHz 77.8 % 90 dbµ fo=frequency Variable 90 dbµ Cw f=58.75mhz 90 dbµ Cw f=55.7mhz 80 dbµ Cw Mixed Signal f3=54.5mhz 80 dbµ Cw fo=58.75mhz 87.5 % TV modulation Ten-step waveform Sync Tip Level 90 dbµ fo=54.5mhz 95 dbµ Cw fo=54.5mhz 75 dbµ Cw fo=4.5 MHz 90 dbµ FM 400 Hz ±5 KHz dev fo=4.5 MHz Level Variable FM 400Hz ±5KHz dev fo=4.5 MHz 00 dbµ AM 400 Hz 30 % fo=4.5 MHz Level Variable Cw fo=4.5 MHz 90 dbµ Cw fo=54.5 MHz 90 dbµ Cw fo=54.5 MHz Level Variable Cw fo=4.5 MHz 90 dbµ FM 400 Hz ±75 KHz dev 9

10 ICs (TV) Notes. Video S/N PLL-SPLIT /SIF SG into and measure the video out(pin ) noise in r.m.s at TP-B through a 5MHz (-3dB) L.P.F. S/N=0 log 0.7 X V 0 det NOISE (db). Video Band width: BW. Measure the MHz component level of Video output TPA with a spectrum analyzer when SG3(f=57.75MHz) is input into. At that time, measure the voltage at TP0 with SW0, set to position, and then fix V0 at that voltage.. Reduce f and measure the value of (f-f) when the (f-f) component level reaches -3dB from the MHz component level as shown below. TP -3dB MHz BW ( f - f ) 3. Sensitivity: V M SG4 (Vi=90dBµ) into, and then gradually reduce Vi and measure the input level when the 0KHz component of Video output TPA reaches -3dB from Vo det level. 4. Maximum Allowable : V MAX. SG5 (Vi=90dBµ) into, and measure the level of the 0KHz component of Video output.. Gradually increase the Vi of SG and measure the input level when the output reaches -3dB. 0

11 ICs (TV) PLL-SPLIT /SIF 5. AGC Control Range: GR GR = V MAX - V M (db) 6. RF AGC Operating Voltage: V3 SG8 into and gradually reduce Vi and then measure the input level when RF AGC output TP3 reaches / VCC, as shown below. TP3 Voltage V3H /VCC V3L Vi Vi(dBµ) 7. Capture range: CL - U. Increase the frequency of SG9 until the VCO is out of locked-oscillation.. Decrease the frequency of SG9 and measure the frequency fu when the VCO locks. CL - U = fu (MHz) 8. Capture range: CL - L. Decrease the frequency of SG9 until the VCO is out of locked-oscillation.. Increase the frequency of SG9 and measure the frequency fl when the VCO locks. CL - L = fl (MHz) 9. Capture range: CL - T CL - T = CL - U + CL - L (MHz)

12 ICs (TV) 0. AFT sensitivity u, Maximum AFT voltage VH, Minimum AFT voltage VL. SG0 into, and set the frequency of SG0 so that the voltage of AFT output TP is 3V. This frequency is named f(3).. Set the frequency of SG0 so that the AFT output voltage is V. This frequency is named f() 3. the graph, maximum and minimum DC voltage is VH and VL, respectively. PLL-SPLIT /SIF TP Voltage u = 000 (mv) f() - f(3) (khz) (mv / khz) 4V VH f(3) f() VL f(mhz). Inter modulation: IM. SG into, and measure EQ output TPA with an oscilloscope.. Adjust AGC filter voltage V0 so that the minimum DC level of the output waveform is.0v. 3. At this time, measure TPA with a spectrum analyzer. The inter modulation is defined as a difference between 0.9MHz and 3.58 MHz frequency components.

13 ICs (TV) PLL-SPLIT /SIF. Limiting Sensitivity:. SG6 (Vi=90dBµ) into SIF, and measure the 400Hz component level of AF output TP.. Lower the input level of SG6, and measure the level of SG6 when the VoAF level reaches -3dB. Audio output [mvrms] -3dB 90 level [dbµ] 3. AM Rejection: AMR. SG7 into SIF, and measure the output level of AF OUT (TP). This level is named VAM.. AMR is; AMR = 0log VoAF (mvr.m.s) VAM (mvr.m.s) (db) 4. AF S/N: AF S/N. SG9 into SIF, and measure the output noise level of AF OUT (TP). This level is named VN.. S/N is; S/N = 0log VoAF (mvr.m.s) VN (mvr.m.s) (db) 3

14 ICs (TV) PLL-SPLIT /SIF 5. SIF detection threshold level TSIF SG is applied to SIF and the input amplitude is swept. Then, the level of SG, TSIF, is measured at the time when the DC voltage of SIF CARRIER DET OUT (TP6) has just begun to vary. 6. RF AGC voltage V3F SG is applied to SIF and the input amplitude is swept. Then, the level of SG, V3F, is measured at the time when the DC voltage of RF AGC OUT (TP3) has just reached /Vcc. 7. AF S/ N (S/N F). SG9 is applied to SIF and the output noise of AUDIO OUT (TP) is measured. The measured noise is named VNF.. S/N F is, S/N F = 0log VoF [mvr.m.s] VNF [mvr.m.s] [db] 4

15 ICs (TV) PLL-SPLIT /SIF VCO coil adjustment methods. SG (fo=58.75mhz, 90dBµ CW) into.. And adjust the coil until the voltage of AFT output reaches about Vcc/=.. FM DET coil adjustment methods. The first thing, adjust the VCO coil.. SG3 (fo=54.5mhz, 95dBµ CW) into SIF. 3. Change the switch of SW3 and SW5 to position. 4. Change to FM RADIO mode (V0=0V). 5. Adjust the DC voltage of AFT OUT to Vcc/ and SIF det OUT to Low (under V). 5

16 ICs (TV) DETAILED DIAGRAM OF PACKAGE OUTLE PLL-SPLIT /SIF 4PQ-A Plastic 4pin 300mil SSOP EIAJ Package Code JEDEC Code Weight(g) Lead Material SSOP4-P Cu Alloy e b 4 3 HE E D e y b A A A F Symbol A A A b c D E e HE L L y I Dimension in Millimeters Min Nom Max cl L e I Detail F Recommended Mount Pad 0 8 b 0.5 e 6

17 ICs (TV) PLL-SPLIT /SIF Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page ( When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein. 7

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