Dr. James McFadden, UC Berkeley
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1 Plasma Instrument Design: Outline Dr. James McFadden, UC Berkeley Outline: Particle detectors Analog Signal Processing Analyzers How to Design an instrument Calibration Issues Example Instruments James P. McFadden 1 UCLA, April 21, 2008
2 Plasma Instrument Design: Examples Measure charged particles from ~1 ev to ~30 kev James P. McFadden 2 UCLA, April 21, 2008
3 Plasma Instrument Design: Outline Some Types of Instrument Design: Developing a new technology (rare) Recognizing a use for new technology (paying attention at the right place, right time) Miniaturize a known technology (expensive) New optics for known technology (clever) Combining known technologies (innovative) Improve features of a technology (perfectionist) Simplifying the packaging (practical) James P. McFadden 3 UCLA, April 21, 2008
4 Plasma Instruments Components of a Plasma Sensor Analyzer selects a subset of particles to be measured. Detector to amplify an event. Analog signal processing to register an event. Digital electronics to store/compress event data. Analyzer James P. McFadden 4 UCLA, April 21, 2008
5 Detectors Faraday Cups Faraday cups are used to measure current. Cannot detect individual particles. Require large charged particle flux. Very stable sensitivity over time. James P. McFadden 5 UCLA, April 21, 2008
6 To detect a single particle requires a detector with gain. Detectors Dynode Multipliers James P. McFadden 6 UCLA, April 21, 2008
7 Detectors Channel Electron Multiplier (CEM) The channels are curved to prevent ion feedback. Tube diameter ~1-2 mm. CEM diameter ~3 cm. James P. McFadden 7 UCLA, April 21, 2008
8 Detectors Microchannel Plates (MCPs) Channel diameter ~5-25 um, Plate diameter up to ~10 cm. ~1 kv per plate James P. McFadden 8 UCLA, April 21, 2008
9 Detectors Microchannel Plates James P. McFadden 9 UCLA, April 21, 2008
10 Detectors Bias Voltage The change in count rate near threshold reflects the shape of the MCP pulse height distribution. James P. McFadden 10 UCLA, April 21, 2008
11 Detectors Pulse Height Distributions Chevron 2 MCPs Z-Stack 3 MCPs James P. McFadden 11 UCLA, April 21, 2008
12 Detectors Electron Detection Efficiency James P. McFadden 12 UCLA, April 21, 2008
13 Detectors Electron Detection Efficiency James P. McFadden 13 UCLA, April 21, 2008
14 Detectors Ion Detection Efficiency James P. McFadden 14 UCLA, April 21, 2008
15 Detectors Detection Efficiency w/ Angle James P. McFadden 15 UCLA, April 21, 2008
16 Detectors MCP gain degradation This initial gain degradation of MCP detectors is known as scrubbing. Surface contaminates, primarily water, are removed over time, reducing the secondary electron yield. James P. McFadden 16 UCLA, April 21, 2008
17 Detectors MCP gain degradation James P. McFadden 17 UCLA, April 21, 2008
18 Analog Signal Processing Discrete Anodes Ion ESA Electron ESA 16 Anodes 8 Anodes Discrete anodes provide highest counting rates with modest angle resolution. James P. McFadden 18 UCLA, April 21, 2008
19 Analog Signal Processing MCP WITH DELAY-LINE OR Discrete anodes provide imaging in angle. James P. McFadden 19 UCLA, April 21, 2008
20 Analog Signal Processing Delay Line Serpentine signal line must be impedance matched. Constant Fraction Discriminator Delay Continuous delay-line can provide finer angle imaging without requiring a large number of preamplifiers and their associated power. James P. McFadden 20 UCLA, April 21, 2008
21 Analog Signal Processing Discrete Delay Line Time to Digital Converter Start Stop Discrete delay line can reduce the number of preamplifiers while providing fixed angle sector. James P. McFadden 21 UCLA, April 21, 2008
22 Analog Signal Processing Resistive 2-D Imaging Resistive anodes can split charge, and the ratio of charge determines position in 2-D. James P. McFadden 22 UCLA, April 21, 2008
23 Analog Signal Processing Wedge & Strip Wedge and Strip anodes can split charge, and the ratio of charge determines position in 2-D. James P. McFadden 23 UCLA, April 21, 2008
24 Analyzers Retarding Potential Fixed voltage retarding grid provides integral measurement with sharp low energy cutoff. Modulated retarding grid and filtering can provide a differential measurement of flux. James P. McFadden 24 UCLA, April 21, 2008
25 Analyzers Cylindrical Electrostatic For trajectories without out-of-plane velocity. Energy Constant = E/qΔV = R/2ΔR James P. McFadden 25 UCLA, April 21, 2008
26 Analyzers Electrostatic Spherical Trajectories within spherical analyzers can be solved analytically, however fringing fields are not treated properly. James P. McFadden 26 UCLA, April 21, 2008
27 Analyzers Spherical Spherical analyzers provide angle focusing. James P. McFadden 27 UCLA, April 21, 2008
28 Analyzers Spherical Top-Hat Focal point at ~80 o deflection. Most compact for largest sensitivity. James P. McFadden 28 UCLA, April 21, 2008
29 Analyzers Top Hat Response Top-hat analyzers have been characterized to allow optimization without resorting to simulations. James P. McFadden 29 UCLA, April 21, 2008
30 Analyzers Toroidal For spherical analyzers the deflection and symmetry radius are the same and parallel velocity particles focus after 90 degrees of deflection. For cylindrical analyzers the symmetry radius is infinite and parallel velocity particles never focus. Toroidal analyzers have the symmetry radius different from the deflection radius. By choosing the symmetry radius larger than the deflection radius, parallel velocity particles will focus after >90 degrees deflection. By carefully choosing the ratio of these radii, one can select the focal point of the analyzer. James P. McFadden 30 UCLA, April 21, 2008
31 Analyzers - Toroidal Toroidal design with flat-top transition. However, flat surfaces are more susceptible to sunlight UV scattering. James P. McFadden 31 UCLA, April 21, 2008
32 Analyzers Toroidal Continuous Toroidal designs with spherical-hat avoid sunlight problems. Toroidal designs allow the imaging focal point to be located beyond 80 o of deflection. James P. McFadden 32 UCLA, April 21, 2008
33 Analyzers Magnetic Ion Deflection determines ion momentum. Broom magnet is used to remove electrons Energy determined by SSDs. Momentum and energy allow determination of composition. James P. McFadden 33 UCLA, April 21, 2008
34 Analyzers Magnetic Electron Electron spectrographs have limited energy range. Internal scattering limits spectral resolution. James P. McFadden 34 UCLA, April 21, 2008
35 Analyzers Double Focusing Double focusing provides the highest mass resolution for composition instruments. ESA and magnetic aberations can be made to cancel. James P. McFadden 35 UCLA, April 21, 2008
36 Analyzers Time-of-Flight Time of flight techniques allow ion velocity measurement without magnetic, thereby reducing mass. James P. McFadden 36 UCLA, April 21, 2008
37 Analyzers Carbon Foils James P. McFadden 37 UCLA, April 21, 2008
38 Analyzers ESA + Time-of-Flight TOF techniques have been combined with ESAs to measure composition. Ions are post-accelerated to >15 kev in order to penetrate the thin carbon foils. James P. McFadden 38 UCLA, April 21, 2008
39 Analyzers Energetic Neutral TOF techniques can be combined with electrostatic rejection and solid state detectors to determine energy and composition of energetic neutrals. James P. McFadden 39 UCLA, April 21, 2008
40 Design - Requirements Start with a science question or motivation: What causes the aurora? Science requirements needed to answer the question: Measure precipitating electrons and ions Measurement cadence and mission duration Measurement location (~6000 km, >60 o Latitude) Measurement requirements (depends on satellite/orbit): Instrument field-of-view. Anglular resolution. Energy range and energy resolution. Sensitivity or geometic factor. James P. McFadden 40 UCLA, April 21, 2008
41 Design - Requirements Instrument requirements: Analyzer geometry determines energy/angle resolution. Size of analyzer determines sensitivity. Detector/Electronics counting rates Mass and Power Telemetry rate to get data to the ground. Housekeeping diagnostics Mission requirements: Spacecraft transmitter power Ground receiver diameter Solar array size Fuel/Stationkeeping requirements Attitude/Orbit/Spin-rate Control/Knowledge Cleanliness. James P. McFadden 41 UCLA, April 21, 2008
42 Design Example Parameters Requirement Energy-Angle resolution Sensitivity or Geometric Factor Field of View Sunlight Rejection Scattered Particle Rejection Penetrating Background Uniform response No HV arcing No Out-gassing Minimum Radiation Shielding Survive Vibration Ease of assembly/disassembly Contamination Control Long Life Radiation Tolerance Mass Constraints Power Constraints Thermal Constraints Design Parameter ΔR/R, Anode size R and ΔR/R Collimation, deflectors Blacking ESA Serrate ESA Anti-coincidence Machine Tolerance Insulator Length Material Selection Material Thickness Structural Ribs # of screws Aperture Mechanism Ground N 2 Purge Parts selection Size, material selection Electronics Speed Flexible, Fit tolerance James P. McFadden 42 UCLA, April 21, 2008
43 Design Example Procedure 1. Start with a concept (combination of analyzers/detectors/electronics) 2. Work out a rough mechanical design based on general knowledge. 3. Perform a sanity check with ME/EE (mechanical, optics, electronics) 4. Perform simulations to refine the optics (2-D and 3-D) 5. Develop preliminary mechanical design determine limits to optics, subassemblies. 6. Perform mechanical sanity check (any exposed insulators, alignment tolerance, vibration issues, ease of assembly) 7. Work out a preliminary electrical design EE sanity check. 8. Compare with other techniques (is it simpler?, less resources?, time to start over?) 9. Re-run simulations with mechanical design limitations. 10. Perform electrical-mechanical interface design (ease of assembly) 11. Finish mechanical design (simplify, look for off-the-shelf parts). 12. Electronics board layout and parts select, parts qualification (radiation testing) 13. Fabricate mechanical prototype and electronics boards. 14. Test subassemblies. 15. Construct prototype and test for unanticipated problems. 16. Re-design and modify to solve unanticipated problems and simplify construction. 17. Vibration and thermal vacuum testing James P. McFadden 43 UCLA, April 21, 2008
44 Design Common Problems 1. Allowing the engineers to control the design 2. Galling 3. Solder bridge or unsoldered part 4. Ground loops electronic noise 5. Improper part loading impossible to read component values. 6. Insulators exposed and charging 7. Tantalum Capacitors loaded backward 8. Improper mechanical fit tolerance for thermal expansion 9. Wrong heat treatment of parts. 10. Incorrect material thickness or clamping for vibration tests 11. Improper load on power supplies when testing 12. Electronic noise inadequate capacitance on power lines 13. Digital timing problemslatch up 14. Initialization and power on reset 15. High voltage disable 16. Leakage electric fields through grids 17. Poor baffling for pump out 18. Electronic part latch up James P. McFadden 44 UCLA, April 21, 2008
45 Design Simulation Tools 1. Program for calculating electric/magnetic fields with specified boundary conditions 2. Ray tracing program with plot routines 3. Analyzer characterization routine (finds the space of throughput trajectories) 4. Plotting routines for analyzing response. 5. Routines for calculating particle transmission through materials (Casino, SRIM/TRIM) 6. CAD program for mechanical drawings There are commercial programs available Or you can write your own program in day or two. Optimized programs could take a couple of weeks to write. James P. McFadden 45 UCLA, April 21, 2008
46 Design Simulations James P. McFadden 46 UCLA, April 21, 2008
47 Design Simulations - Focusing James P. McFadden 47 UCLA, April 21, 2008
48 Design Simulations Optimize Throughput James P. McFadden 48 UCLA, April 21, 2008
49 Design Energy/Angle Response James P. McFadden 49 UCLA, April 21, 2008
50 Design Simplify, Modularize James P. McFadden 50 UCLA, April 21, 2008
51 Design Modular Electronics Preamplifier Front Preamplifier-Back Low Voltage Power Supply Interface/HVCtrl Front Interface/HVCtrl-Back Dual HV Power Supply James P. McFadden 51 UCLA, April 21, 2008
52 Calibration Procedures In the old days, instruments were designed by estimating sensor performance based on analytic models. Ground calibrations were required in order to quantify the instrument s energy and angle response. Modern instruments can be simulated, and ground calibrations are primarily a check of proper instrument construction. Calibration curves are generally compared with simulations, providing a functional test of proper operation. The primary parameter calibrations determine is the energy constant. James P. McFadden 52 UCLA, April 21, 2008
53 Calibration Tests Detector characterization matching MCP pairs Background tests looking for hot spots, arcing Energy constant test vary beam energy & elevation Concentricity test vary energy and rotation angle Sensitivity Uniformity slow rotation at peak energy/angle Energy sweep test confirm flight operation modes Thermal vacuum test operates properly over temp range Data packet tests check onboard data compression James P. McFadden 53 UCLA, April 21, 2008
54 Calibration ESA Top-Hat Comparison of ground calibration data and simulations James P. McFadden 54 UCLA, April 21, 2008
55 Calibration Poorly designed Plots show the energy response at different look direction of two nearly identical instruments. Non-concentricity of the analyzer hemispheres in the Venus Express sensor (lower plot) produced non-uniform energy response with look direction. The Mars Express sensor (upper plot) was adjusted by hand to improve its response. James P. McFadden 55 UCLA, April 21, 2008
56 Calibration Good Symmetry THEMIS in-flight calibration was facilitated by having sensors with excellent concentricity typically less than 1% variation in energy with look direction. This near perfect concentricity was obtained under normal assembly -- without heroic efforts to align hemispheres. The mechanical design resulted in alignment determined by a single interface. James P. McFadden 56 UCLA, April 21, 2008
57 Calibration Uniform Response THEMIS ion ESA uniformity test. Anodes come in 3 sizes 22.5 o, o and 5.6 o. THEMIS electron ESA uniformity test. Double counting occurs at borders between anodes. James P. McFadden 57 UCLA, April 21, 2008
58 Calibration Leakage Fields Enhanced ion ESA efficiency at low energies is probably due to leakage fields from the MCP through the analyzer exit grid. -2 kv on front of MCP James P. McFadden 58 UCLA, April 21, 2008
59 Calibration - Out of Band Response Solar UV scattering to the detector can be eliminated with proper blacking (ebanol-c). Photo-electrons at the aperture are more difficult to eliminate. James P. McFadden 59 UCLA, April 21, 2008
60 Instruments Wind 3DP Design included scintillator to reduce background from penetrating radiation James P. McFadden 60 UCLA, April 21, 2008
61 Instruments THEMIS/FAST FAST analyzers were designed to be modular. Subsystems could be easily tested. Common mechanisms. Common shielding. Designed for ease of assembly. Few screws. Contamination control includes aperture closer and purge. James P. McFadden 61 UCLA, April 21, 2008
62 Instruments Cluster-CODIF First combined top-hat & TOF Use of grids & anodes to separate charge for TOF and position imaging Includes separate aperture for retarding potential analyzer James P. McFadden 62 UCLA, April 21, 2008
63 Instruments - TIMAS Complicated double focusing mass spectrometer No magnet yoke needed Relatively low sensitivity compared to TOF analyzers. James P. McFadden 63 UCLA, April 21, 2008
64 Instruments STEREO-PLASTIC Top-at w/ deflectors Separate solar wind analyzer entrance MCPs and SSDs. James P. McFadden 64 UCLA, April 21, 2008
65 Instruments Low Energy Neutral James P. McFadden 65 UCLA, April 21, 2008
66 Instruments Sounding Rocket Top-hat ESAs Compact HVPS Burst Memory Stacer Booms Fast Electron Spectrograph And Wave-particle Correlator Processor controlled Star Sensor James P. McFadden 66 UCLA, April 21, 2008
67 Instruments Sounding Rocket Payload layout James P. McFadden 67 UCLA, April 21, 2008
68 Instruments Can be part of structure Instruments can provide mech. structure to reduce mass. James P. McFadden 68 UCLA, April 21, 2008
69 Can current plasma sensors be improved? Of course what hasn t been done? High time resolution composition. High time resolution 3-D plasma measurements. Multi-point high resolution 3-D plasma. Cold plasma measurements. High energy overlap with energetic SSDs. Elimination of background sources of noise. James P. McFadden 69 UCLA, April 21, 2008
70 THE END James P. McFadden 70 UCLA, April 21, 2008
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