SD Diff Channels ADC SOC with RTC and 24*4 LCD

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1 2 Diff Channels ADC SOC with RTC and 24*4 LCD Features High precision ADC, 2 differential or 4 single-ended inputs Low noise, high input impedance preamplifier with selectable gain: 1, 12.5, 50, 100, or bits RISC ultra-low power MCU. The MCU current consumption is 300uA typically at 3V and 2MHz operating clock rate. Standby current is 1.5uA at 32kHz clock, and less than 1uA at sleep 16K Bytes OTP, 512 Bytes SRAM Low OTP programming voltage, can replace external EEPROM Multiple clock sources, flexible clock selection, external oscillator malfunction detection ADC output rate: 8SPS 2kSPS 24SEG X 4COM LCD drive, ultra-low power consumption and high driving capability, programmable boost module to maintain luminance at low supply voltage Built-in temperature sensor, supports single point calibration 1.2V low temperature drift voltage reference output Selectable voltage source for external transducer excitation: 2.4V/2.6V/2.9V/3.3V Flexible battery voltage detection range 2.0V~ 3.3V External or internal voltage reference for ADC, multiple internal voltage references RTC module provides second output Abundant peripheral resources: UART, I 2 C, SPI, PWM/PDM, PFD, TIMER, CAPTURE Low voltage detection and power on reset circuit Operating voltage range: 2.4V~ 3.6V Operating temperature range: -40 C~85 C Description The SD8709 is a CMOS SOC with built-in 24 bit ADC and abundant peripheral resources: RTC, selectable voltage sources, flexible PGIA, voltage step-up module, UART, I 2 C, SPI, TIMER, PWM/PDM, PFD, CAPTURE, and LCD driver. The OTP can be programmed in situ and the 2.4V~3.6V programming voltage is generated internally. The OTP can be used in place of external EEPROM. The IC was designed with ultra-low power technology. Typical total operating current is only 1mA (IAD=0) or 1.5mA (IAD=1). Three working modes are provided so users can select the optimum choice between speed and power. They are normal mode, standby mode, and sleep mode. Applications Infrared temperature measurement, instrument and meter, weak transducer signal processing applications Ordering Information QFN48 package SDIC Microelectronics Rev. 0.1 Dec of 10

2 Pin Diagram and Descriptions P30/COM0 P31/COM1 P32/COM2 P33/COM3 P40/SEG4 P41/SEG5 P42/SEG6 P43/SEG7 P44/SEG8 P45/SEG9 P46/SEG10 P47/SEG11 CN CP VLCD ACM AI0 AI1 AI2 AI3 AR VSS P00/KEY SDIC NNNNNNN SD P50/SEG12/SCK P51/SEG13/MOSI P52/SEG14/MISO P53/SEG15/CCP/CS P54/SEG16/CLKout P55/SEG17/PWM/PDM P56/SEG18/RXD P57/SEG19/TXD P20/SEG20/INT0 P21/SEG21/INT1 P22/SEG22/SDA P23/SEG23/SCL P01/KEY1 P02/KEY2 P03/KEY3 P04/KEY4 P05/LBTIN P06/XOUT P07/XIN VPP P27/SEG27/BUZ P26/SEG26 P25/SEG25/T0CK P24/SEG24/PFD Figure 1. Pad diagram Table 1. Pad Descriptions Pad No. Pin Name Attribute Description 1-2 CN, CP Analog 3 VLCD Analog 4 ACM Analog 5-8 AI0 -- AI3 Analog input 9 AR Analog External capacitor connection pins for the voltage booster circuit. Capacitor not needed if high frequency RC clock is used for the booster LCD driver power supply, internally connect to or booster output through register setting, connect 1uF filter capacitor to 1.2V reference output, floating when ACM is shutdown, connect cap to VSS Analog signal inputs, each port has an independent register controlled pull-down resistor (default OFF), should set to ON for unused port; AI0-1, AI2-3 can be used as 2 differential or 4 single-ended inputs Internal LDO output for IC s analog module, can provide excitation to external transducer, connect to 10uF filter capacitor to VSS 10 Power Power supply voltage, connect capacitor to VSS 11 VSS Ground Power ground SDIC Microelectronics Rev. 0.1 Dec of 10

3 12-16 P00/KEY0 -- P04/KEY4 Digital port P00-04 or external key inputs KEY P05/LBTIN P06/XOUT -- P07/XIN Analog, Analog, Digital port P05 or low battery detect LBTIN input Digital ports P06-07, or kHz or 1MHz-4MHz crystal oscillator pins XIN can be used as external clock input 20 VPP I OTP high voltage programming pin, connect 1uF capacitor to VSS 21 P27/SEG27/ BUZ Digital port P27, LCD segment SEG27, or buzzer BUZ output 22 P26/SEG26 Digital port P26 or LCD segment SEG26 23 P25/SEG25/ T0CK Digital port P25, LCD segment SEG25, or TIMER0 external clock T0CK input 24 P24/SEG24/ PFD Digital port P24, LCD segment SEG24, or Programmable frequency divider PFD 25 P23/SEG23/SCL Digital port P23, LCD segment SEG23, or I 2 C clock line 26 P22/SEG22/SDA Digital port P22, LCD segment SEG22, or I 2 C data line 27 P21/SEG21/INT1 Digital port P21, LCD segment SEG21, or external interrupt INT1 28 P20/SEG20/INT0 Digital port P20, LCD segment SEG20, or external interrupt INT P57/SEG19/TXD-- P56/SEG18/RXD P55/SEG17/ PWM/PDM Digital port P57-56, LCD segment SEG19-18, or UART data transmit TXD and data receive RXD Digital port P55, LCD segment SEG17, or PWM/PDM output 32 P54/SEG16/CLKout Digital port P54, LCD segment SEG16, or CLKout output 33 P53/SEG15/CCP/C S Digital port P53, LCD segment SEG15, compare/capture output CCP, or SPI s CS port 34 P52/SEG14/MISO Digital port P52, LCD segment SEG14, or SPI s MISO port 35 P51/SEG13/MOSI Digital port P52, LCD segment SEG13, or SPI s MOSI port 36 P50/SEG12/SCK Digital port P50, LCD segment SEG12, or SPI s SCK port P47/SEG11-- P40/SEG4 P33/COM3-- P30/COM0 Digital port P47-40 or LCD segment SEG11-4 Digital port P33-30 or LCD COM3-0 During serial programming, COM3-0 serve as Data Output, 2MHz clock Input, Data Input, and Data Clock Remark: 1. All ports Pnn have internal pull-up option (default OFF) and input hysteresis at 0.3/0.7. SDIC Microelectronics Rev. 0.1 Dec of 10

4 Functional Block XOUT XIN AR RC OSC (32 khz) RC OSC ( ) 4MHz Crystal OSC POR/LVD Power Management VSS CLKout VPP OTP 16 k Bytes Timing Control Generator RTC External Interrupt INT 1 INT0 8 Bits RISC MCU SRAM 512 Bytes WDT PGIA AI0-3 VLCD SEG27-4 COM3-0 LCD Driver Special Registers ADC Voltage Reference ACM CP CN Battery Detect LBTIN PWM/PDM/ PFD Capture Buzzer I2C SPI UART Keys T/C (T0/T1/T2) PWM /PDM PFD CPP P07-00 P27-20 P33-30 P47-40 P57-50 BUZ SCL SDA CS SCK MISO MOSI RXD TXD KEY4-0 T0CK Figure 2. Functional block diagram SDIC Microelectronics Rev. 0.1 Dec of 10

5 Typical Applications LCD Panel C1 1 2 CN CP P30/COM0 P31/COM1 P32/COM2 P33/COM3 P40/SEG4 P41/SEG5 P42/SEG6 P43/SEG7 P44/SEG8 P45/SEG9 P46/SEG10 P47/SEG11 C2 1uF VIN1+ VIN1- VIN2+ VIN2- C3 AR C5 C6 4 5 C7 ACM 6 7 C4 ACM VLCD ACM AI0 AI1 AI2 AI3 AR VSS P00/KEY0 12 P01/KEY1 P02/KEY2 SD8709 P03/KEY3 P04/KEY P05/LBTIN P06/XOUT P07/XIN VPP P53/SEG15/CCP/CS P54/SEG16 P55/SEG17/PWM/PDM P27/SEG27/BUZ C7 P50/SEG12/SCK 36 P51/SEG13/MOSI 35 P52/SEG14/MISO 34 P56/SEG18/RXD P57/SEG19/TXD P20/SEG20/INT0 P21/SEG21/INT1 P22/SEG22/SDA P23/SEG23/SCL P26/SEG26 P25/SEG25/T0CK P24/SEG24/PFD KEY0 1uF KEY1 KEY2 KEY3 22pF kHz or 1-4MHz 22pF Figure 3. Weak transducer signal measurement typical application diagram SDIC Microelectronics Rev. 0.1 Dec of 10

6 ADC Characteristics Table 2. ENOB and voltage noise Vn rms (AR=2.4V, VREF=0.6V, SINC3, Buffer on, IAD=1) ADC sampling rate = 128kHz OSR Gain ENOB Vn rms (nv) ENOB Vn rms (nv) ENOB Vn rms (nv) Gain ADC sampling rate = 512kHz OSR ENOB Vn rms (nv) ENOB Vn rms (nv) ENOB Vn rms (nv) Remark: The above data are averages based on multiple ICs measured results. Each IC contributes 1024 data points. ENOB = 2 FRS log ( ) Vrms, FRS is the Full Scale Voltage Range (2 * Vref / Gain), Vrms is the rms Noise. SDIC Microelectronics Rev. 0.1 Dec of 10

7 Electrical Specifications Table 3. Absolute Maximum Ratings Symbol Parameter Minimum Maximum Unit T A Operating temperature C T S Storage temperature C V DD Supply voltage V Vpp Programming voltage V V IN, V OUT Digital input/output voltage -0.2 V DD +0.3 V T L Reflow temperature profile Per IPC/JEDECJ-STD-020C C Remarks: 1. CMOS device can easily be damaged by electrostatics. It must be stored in conductive foam, and careful not to exceed the operating voltage range. 2. Turn off power before insert or remove the device. SDIC Microelectronics Rev. 0.1 Dec of 10 Table 4. Electrical Specifications(=3V, T A =25 ) Symbol Parameter Minimum Typical Maximum Unit Conditions/Remarks Supply voltage V Analog modules operating voltage V FOSC Operating frequency 16k 2M 4M Hz IHRC ILRC HXT LXT Internal high frequency RC oscillator Internal low frequency RC oscillator External high frequency crystal oscillator External low frequency crystal oscillator Digital modules and MCU operating voltage FOSC must be 2MHz when read/write tables in OTP MHz Frequency after calibration khz Frequency after calibration MHz khz IDD1 Operating current ma IDD2 Operating current ma IDD3 Operating current ua IDD4 Operating current ua Fsam ADC sampling rate khz OSR Over sampling rate Internal RC oscillator freq halved for MCU Analog modules active, IAD=1 Internal RC oscillator freq halved for MCU Analog modules active, IAD=0 32kHz internal RC oscillator for MCU MCU at standby mode Analog modules inactive MCU at sleep mode Analog modules inactive NFbit Noise free bits bits Gain=200, input FSR=±4mV NMbit No missing code bits INL INL %FSR VINdif PGIA differential input range -Vref -- Vref 1X gain -Vref/ Vref/ X gain mv -Vref/50 -- Vref/50 50X gain -Vref/ Vref/ X gain

8 VIN -Vref/ Vref/ X gain PGIA input voltage AR 1X gain and buffer is off range AR-0.7 1X gain and buffer is on, or gain 1 Vnrms RMS noise nvrms 200X gain Vacm ACM voltage output V IacmSour ACM current source ma IacmSink ACM current sink ma PSRacm ACM PSR uv/v Tgain Gain tempco -- ±4 -- ppm/ -10 to +40 Vavddr AR voltage output ARX [1:0]= ARX [1:0]=01 V ARX [1:0]= ARX [1:0]=11 Iavddr AR current ma POR POR voltage V LVD LVD voltage V THlbt LVD hysteresis mv LBTX[3:0]= LBTX[3:0]= LBTX[3:0]= LBTX[3:0]=0101 Vlbt Vlcd Ilcd Low alarm threshold LCD charge pump output voltage LBTX[3:0]= LBTX[3:0]= V LBTX[3:0]= LBTX[3:0]= LBTX[3:0]= LBTX[3:0]= LBTX[3:0]= LBTX[3:0]= LBTX[3:0]= LBTX[3:0]= VLCDX[2:0]= VLCDX[2:0]= VLCDX[2:0]= VLCDX[2:0]=011 V VLCDX[2:0]= VLCDX[2:0]= VLCDX[2:0]= VLCDX[2:0]=111 LCD charge pump current ua SDIC Microelectronics Rev. 0.1 Dec of 10

9 Digital parameter IOH IOL High output current source Output low current sink VOH=-0.3V, PTxSR=0 ma VOH=-0.3V, PTxSR= VOL=0.3V, PTxSR=0 ma VOL=0.3V, PTxSR=1 VIH Input high voltage V VIL Input low voltage V VOH Output high voltage V VOL Output low voltage VSS+0.3 V Rpu Pin pull up resistance kω = 3.0 Note: 1. Noise free bits and effective resolution are both related to the signal s full scale range. Its peak to peak or rms noise plays the decisive role. 2. The signal input range is limited by the differential signal input range and the absolute voltage at the input terminals. The first one is the real signal input range. It is affected by the PGIA gain and the ADC voltage reference choice. The second one includes both differential and common mode components and is mainly limited by the circuit. 3. The charge pump driving capability is related to the choice of capacitor and the operating frequency. SDIC Microelectronics Rev. 0.1 Dec of 10

10 Packaging Information Dimensions: mm Symbol Min. Nom. Max. A A b c D D e 0.40BSC Ne 4.40BSC Nd 4.40BSC E E L h Figure 4. QFN48 mechanical specification SDIC Microelectronics Rev. 0.1 Dec of 10

SDIC XXXXXXX SD

SDIC XXXXXXX SD Meterage SOC Features High precision ADC, 18 bits effective resolution, 1 differential or 2 single-ended inputs Low noise, high input impedance preamplifier with selectable gain: 1, 12.5, 50, 100, or 200