3.4 A 2.1 A. Symbol Parameter Value Unit
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1 BUZ80 BUZ80FI N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR BUZ80 BUZ80FI TYPE VDSS R DS(on) ID 800 V 800 V < 4 Ω < 4 Ω 3.4 A 2.1 A TYPICAL R DS(on) = 3.3 Ω AVALANCHE RUGGEDNESS TECHNOLOGY 100% AVALANCHE TESTED REPETITIVE AVALANCHE DATA AT 100 o C LOW INPUT CAPACITANCE LOW GATE CHARGE APPLICATION ORIENTED CHARACTERIZATION APPLICATIONS HIGH CURRENT, HIGH SPEED SWITCHING SWITCH MODE POWER SUPPLIES (SMPS) CONSUMER AND INDUSTRIAL LIGHTING DC-AC INVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLY (UPS) TO-220 ISOWATT220 INTERNAL SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit BUZ80 BUZ80FI V D S Drain-source Voltage (V GS = 0) 800 V V DG R Drain- gate Voltage (R GS = 20 kω) 800 V VGS Gate-source Voltage ± 20 V I D Drain Current (continuous) at T c = 25 o C A I D Drain Current (continuous) at T c = 100 o C A ID M( ) Drain Current (pulsed) A Ptot Total Dissipation at Tc = 25 o C W Derating Factor W/ o C VISO Iulation Withstand Voltage (DC) 2000 V Tstg Storage Temperature -65 to 150 T j Max. Operating Junction Temperature 150 ( ) Pulse width limited by safe operating area o C o C April /10
2 THERMAL DATA TO-220 ISOWATT220 Rthj-cas e Thermal Resistance Junction-case Max Rthj-amb Rthc- sin k T l Thermal Resistance Junction-ambient Max Thermal Resistance Case-sink Typ Maximum Lead Temperature For Soldering Purpose o C/W o C/W o C/W o C AVALANCHE CHARACTERISTICS Symbol Parameter Max Value Unit I A R E AS EAR I A R Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T j max, δ < 1%) Single Pulse Avalanche Energy (starting Tj = 25 o C, ID = IAR, VD D = 50 V) Repetitive Avalanche Energy (pulse width limited by T j max, δ < 1%) Avalanche Current, Repetitive or Not-Repetitive (T c = 100 o C, pulse width limited by T j max, δ < 1%) 3.4 A 180 mj 4.8 mj 2.1 A ELECTRICAL CHARACTERISTICS (Tcase = 25 o C unless otherwise specified) OFF V (BR)DSS IDS S I G SS Drain-source Breakdown Voltage Zero Gate Voltage Drain Current (VGS = 0) Gate-body Leakage Current (VD S = 0) I D = 250 µa V G S = V VDS = Max Rating VDS = Max Rating x 0.8 Tc = 125 o C V GS = ± 20 V ± 100 na µa µa ON ( ) V G S(th) Gate Threshold Voltage V DS = V GS I D = 1 ma V RDS(on) Static Drain-source On Resistance VGS = 10 V I D = 1.7 A V GS = 10 V I D = 1.7 A T c = 100 o C ID(on) On State Drain Current VDS > ID(on) x RDS(on)max VGS = 10 V Ω Ω 3.4 A DYNAMIC gfs ( ) C iss C oss C rss Forward Traconductance Input Capacitance Output Capacitance Reverse Trafer Capacitance VDS > ID(on) x RD S(on)max ID = 1.7 A S V DS = 25 V f = 1 MHz V G S = pf pf pf 2/10
3 ELECTRICAL CHARACTERISTICS (continued) SWITCHING ON t d(on) t r Turn-on Time Rise Time V DD = 30 V I D = 2.1 A R G = 50 Ω V GS = 10 V (see test circuit, figure 3) (di/dt) on Turn-on Current Slope VDD = 640 V ID = 3 A RG = 50 Ω VGS = 10 V (see test circuit, figure 5) Q g Q gs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge V DD = 400 V I D = 3 A V GS = 10 V A/µs 55 nc nc nc SWITCHING OFF tr(voff) tf t c Off-voltage Rise Time Fall Time Cross-over Time VDD = 640 V ID = 3 A RG = 50 Ω VGS = 10 V (see test circuit, figure 5) SOURCE DRAIN DIODE I S D I SDM ( ) Source-drain Current Source-drain Current (pulsed) VSD ( ) Forward On Voltage ISD = 6 A VGS = V t rr Reverse Recovery I SD = 3 A di/dt = 100 A/µs Time V DD = 80 V T j = 150 o C Qrr IRRM Reverse Recovery Charge Reverse Recovery Current (see test circuit, figure 5) ( ) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % ( ) Pulse width limited by safe operating area A A µc A Safe Operating Areas For TO-220 Safe Operating Areas For ISOWATT220 3/10
4 Thermal Impedeance For TO-220 Thermal Impedance For ISOWATT220 Derating Curve For TO-220 Derating Curve For ISOWATT220 Output Characteristics Trafer Characteristics 4/10
5 Traconductance Static Drain-source On Resistance Gate Charge vs Gate-source Voltage Capacitance Variatio Normalized Gate Threshold Voltage vs Temperature Normalized On Resistance vs Temperature 5/10
6 Turn-on Current Slope Turn-off Drain-source Voltage Slope Cross-over Time Switching Safe Operating Area Accidental Overload Area Source-drain Diode Forward Characteristics 6/10
7 Fig. 1: Unclamped Inductive Load Test Circuits Fig. 2: Unclamped Inductive Waveforms Fig. 3: Switching Times Test Circuits For Resistive Load Fig. 4: Gate Charge Test Circuit Fig. 5: Test Circuit For Inductive Load Switching And Diode Reverse Recovery Time 7/10
8 TO-220 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A C D D E F F F G G H L L L L L L DIA F G D1 C D A E L2 G1 H2 F1 Dia. L5 L7 L9 F2 L6 L4 P011C 8/10
9 ISOWATT220 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A B D E F F F G G H L L L L L Ø H G B D A E L6 L7 L3 Ø F1 F F2 G L2 L4 P011G 9/10
10 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no respoability for the coequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No licee is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificatiomentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproducts are not authorizedfor use as critical components in life supportdevices or systems without express written approval of SGS-THOMSON Microelectonics SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 10/10
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