ISOCOM 6N135, 6N136, ICPL4502, ICPL4503 COMPONENTS DESCRIPTION FEATURES

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1 DESCRIPTION The 6N135, 6N136, ICPL4502 and ICPL4503 devices each consists of an infrared emitting diode, optically coupled to a high speed photo detector transistor. A separate connection for the photodiode bias and output-transistor collector increases the speed by several orders of magnitude over conventional phototransistor couplers by reducing the base-collector capacitance of the input transistor. FEATURES High speed 1Mbit/s High AC Isolation Voltage 5000V rms Guaranteed performance from 0 C to 70 C Wide Operating temperature range -55 C to 100 C Pb Free and RoHS Compliant UL File E91231 VDE Approval Certificate No for 6N135 and 6N136, with suffix V APPLICATIONS Line Receivers Telecommunication Equipments Power Transistor Isolation in Motor Drives Replacement of Low Speed Phototransistor Optocouplers Feedback Loop in Switch Mode Power Supplies High Speed Logic Ground Isolation Home Appliances ORDER INFORMATION Add G after PN for 10mm lead spacing Add SM after PN for Surface Mount Add SMT&R after PN for Surface Mount Tape & Reel. ISOCOM 2004 LTD Unit 25B, Park View Road West, Park View Industrial Estate Hartlepool, Cleveland, TS25 1PE, United Kingdom Tel : +44 (0) Fax : +44 (0) sales@isocom.co.uk N135 / 6N ICPL4502 / ICPL4503 Input Forward Current Forward Peak Current (50% duty cycle, 1ms pulse width) Peak Transient Current ( 1μs pulse width, 300pps) Reverse Voltage Power dissipation Output Output Current Peak Output Current Emitter-Base Reverse Voltage (6N135 and 6N136) Base Current (6N135 and 6N136) Supply Voltage Output Voltage Power Dissipation ISOCOM ASIA LTD Hong Kong Office, Block A, 8/F, Wah Hing Industrial mansion, 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong. Tel : Fax : sales@isocom.com.hk NC 2 Anode 3 Cathode 4 NC 5 GND 6 V O 7 V B (6N135, 6N136) NC (ICPL4502, ICPL4503) 8 V CC A 0.1μF bypass Capacitor shall be connected between V CC and GND. ABSOLUTE MAXIMUM RATINGS (T A = 25 C) Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. 25mA 50mA 1A 5V 45mW 8mA 16mA 5V 5mA -0.5V to 30V -0.5V to 20V 100mW Total Package Isolation Voltage 5000V RMS Operating Temperature -55 to 100 C Storage Temperature -55 to 125 C Lead Soldering Temperature (10s) 260 C 1 24/07/17 DD93217

2 ELECTRICAL CHARACTERISTICS (T A = 0 C to 70 C unless otherwise specified) INPUT Parameter Symbol Test Condition Min Typ.* Max Unit Forward Voltage V F I F = 16mA V Reverse Voltage V R I R = 10μA 5.0 V Forward Voltage Temperature Coefficient ΔV F /ΔT A I F = 16mA -1.9 mv/ C OUTPUT Parameter Symbol Test Condition Min Typ.* Max Unit Logic High Output Current Logic Low Output Voltage I OH V OL I F = 0mA, V O = V CC = 5.5V, μa T A = 25 C I F = 0mA, V O = V CC = 15V, T A = 25 C I F = 0mA, V O = V CC = 15V 50 6N135 I F = 16mA, I O = 1.1mA, V CC = 4.5V, T A = 25 C V I F = 16mA, I O = 0.8mA, V CC = 4.5V, 0.5 6N136 / ICPL4502 / ICPL4503 I F = 16mA, I O = 3mA, V CC = 4.5V, T A = 25 C I F = 16mA, I O = 2.4mA, V CC = 4.5V 0.5 Logic Low Supply Current I CCL I F = 16mA, V O = Open, V CC = 15V μa Logic High Supply Current I CCH I F = 0mA, V O = Open, V CC = 15V, T A = 25 C μa I F = 0mA, V O = Open, V CC = 15V 2 * Typical values at T A = 25 C 2 24/07/17 DD93217

3 ELECTRICAL CHARACTERISTICS (T A = 0 C to 70 C unless otherwise specified) COUPLED Parameter Symbol Test Condition Min Typ.* Max Unit Current Transfer Ratio CTR 6N % 6N136 / ICPL4502 / ICPL I F = 16mA, V O = 0.4V V CC = 4.5V, T A = 25 C 6N N136 / ICPL4502 / ICPL I F = 16mA, V O = 0.5V V CC = 4.5V ISOLATION Parameter Symbol Test Condition Min Typ.* Max Unit Insulation Voltage V ISO T A = 25 C, RH = 40 % to 60%, t = 1 min, 5000 V RMS * Typical values at T A = 25 C 3 24/07/17 DD93217

4 ELECTRICAL CHARACTERISTICS (T A = 0 C to 70 C unless otherwise specified) Switching Characteristics (T A = 0 C to 70 C, I F = 16mA, V CC = 5V unless otherwise specified) Parameter Symbol Test Condition Min Typ.* Max Unit Propagation Delay Time to Logic Low T PHL 6N135 R L = 4.1kΩ, T A = 25 C R L = 4.1kΩ μs 6N136 / ICPL4502 / ICPL4503 R L = 1.9kΩ, T A = 25 C R L = 1.9kΩ Propagation Delay Time to Logic High T PLH 6N135 R L = 4.1kΩ, T A = 25 C R L = 4.1kΩ μs 6N136 / ICPL4502 / ICPL4503 R L = 1.9kΩ, T A = 25 C R L = 1.9kΩ Common Mode Transient Immunity at Logic High CM H 6N135 I F = 0mA, V CM = 10Vp-p, R L = 4.1kΩ, T A = 25 C 1000 V/μs 6N136 / ICPL I F = 0mA, V CM = 10Vp-p, R L = 1.9kΩ, T A = 25 C ICPL I F = 0mA, V CM = 1500Vp-p, R L = 1.9kΩ, T A = 25 C Common Mode Transient Immunity at Logic Low CM L 6N135 I F = 16mA, V CM = 10Vp-p, R L = 4.1kΩ, T A = 25 C 1000 V/μs 6N136 / ICPL I F = 16mA, V CM = 10Vp-p, R L = 1.9kΩ, T A = 25 C ICPL I F = 16mA, V CM = 1500Vp-p, R L = 1.9kΩ, T A = 25 C * Typical values at T A = 25 C 4 24/07/17 DD93217

5 Fig 1 Forward Current vs Forward Voltage Fig 2 Output Current vs Output Voltage Fig 3 Normalized CTR vs Forward Current Fig 4 Normalized CTR vs T A Fig 5 Propagation Delay vs Load Resistance Fig 6 Propagation Delay vs T A 5 24/07/17 DD93217

6 Fig 7 Logic High Output Current vs T A Switching Time Test Circuit 6 24/07/17 DD93217

7 Common Mode Transient Immunity Test Circuit Note: Common mode transient immunity in logic high level is the maximum tolerable (positive) dv CM /dt on the leading edge of the common mode pulse signal V CM, to assure that the output will remain in a logic high state (i.e., V O > 2.0V). Common mode transient immunity in logic low level is the maximum tolerable (negative) dv CM /dt on the trailing edge of the common mode pulse signal, V CM, to assure that the output will remain in a logic low state (i.e., V O < 0.8V). 7 24/07/17 DD93217

8 ORDER INFORMATION (UL Approval) After PN PN Description Packing quantity None 6N135, 6N136, ICPL4502, ICPL4503 G SM SMT&R 6N135G, 6N136G, ICPL4502G, ICPL4503G 6N135SM, 6N136SM, ICPL4502SM, ICPL4503SM 6N135SMT&R, 6N136SMT&R, ICPL4502SMT&R, ICPL4503SMT&R Standard Dip8 10mm Lead Spacing Surface Mount Surface Mount Tape & Reel 45 pcs per tube 45 pcs per tube 45 pcs per reel 1000 pcs per reel 6N135V, 6N136V (UL and VDE Approvals) After PN PN Description Packing quantity None 6N135V, 6N136V Standard Dip8 45 pcs per tube G 6N135VG, 6N136VG 10mm Lead Spacing 45 pcs per tube SM 6N135VSM, 6N136VSM Surface Mount 45 pcs per reel SMT&R 6N135VSMT&R, Surface Mount Tape & Reel 1000 pcs per reel 6N136VSMT&R DEVICE MARKING (Example : 6N136) 6N136 IYWW 6N136 Y WW I denotes Device Part Number denotes 1 digit Year code denotes 2 digit Week code denoted Isocom 8 24/07/17 DD93217

9 PACKAGE DIMENSIONS (mm) DIP G-Form 9 24/07/17 DD93217

10 PACKAGE DIMENSIONS (mm) SMD RECOMMENDED PAD LAYOUT FOR SMD (mm) 10 24/07/17 DD93217

11 TAPE AND REEL PACKAGING Direction of feed from reel Dimension No. A B D 0 D 1 E F Dimension( mm) 10.4± ± ± ± ± ±0.1 Dimension No. P 0 P 1 P 2 t W K Dimension (mm) 4.0± ± ± ± ±0.3 / ± /07/17 DD93217

12 REFLOW SOLDERING TEMPERATURE PROFILE (One Time Reflow Soldering is Recommended) T P 260 C T P - 5 C Max Ramp Up Rate 3 C/s t P Max Ramp Down Rate 6 C/s T L 217 C T smax 200 C t L T smin TEMP ( C) 25 C 150 C t s Preheat 60s 120s Time 25 C to Peak Temperature TIME (s) Preheat - Min Temperature (T SMIN ) - Max Temperature (T SMAX ) - Time T SMIN to T SMAX (t s ) Profile Details Soldering Zone - Peak Temperature (T P ) - Liquidous Temperature (T L ) - Time within 5 C of Actual Peak Temperature (T P 5 C) - Time maintained above T L (t L ) - Ramp Up Rate (T L to T P ) - Ramp Down Rate (T P to T L ) Average Ramp Up Rate (T smax to T P ) Time 25 C to Peak Temperature 150 C 200 C 60s - 120s 260 C 217 C 30s 60s - 100s 3 C/s max 6 C/s max 3 C/s max 8 minutes max Conditions 12 24/07/17 DD93217

13 NOTES : - Isocom is continually improving the quality, reliability, function or design and Isocom reserves the right to make changes without further notices. - The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical application and instrumentation. - For equipment/application where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc., please contact our sales representatives. - When requiring a device for any specific application, please contact our sales for advice. - The contents described herein are subject to change without prior notice. - Do not immerse device body in solder paste /07/17 DD93217

14 DISCLAIMER ISOCOM is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing ISOCOM products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such ISOCOM products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that ISOCOM products are used within specified operating ranges as set forth in the most recent ISOCOM products specifications. The ISOCOM products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ( Unintended Usage ). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation Instruments, traffic signal instruments, combustion control instruments, medical Instruments, all types of safety devices, etc.. Unintended Usage of ISOCOM products listed in this document shall be made at the customer s own risk. Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. The products described in this document are subject to the foreign exchange and foreign trade laws. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by ISOCOM Components for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of ISOCOM Components or others. The information contained herein is subject to change without notice /07/17 DD93217