SINGLE-SUPPLY, micropower CMOS OPERATIONAL AMPLIFIERS
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1 OPA336 OPA336 OPA336 OPA336 OPA336 OPA336 SBOS68C JANUARY 997 REVISED JANUARY SINGLE-SUPPLY, micropower CMOS OPERATIONAL AMPLIFIERS microamplifier Series FEATURES SINGLE-SUPPLY OPERATION RAIL-TO-RAIL OUTPUT (within 3mV) micropower: I Q = µa/amplifier microsize PACKAGES LOW OFFSET VOLTAGE: µv max SPECIFIED FROM V S =.3V to.v SINGLE, DUAL, AND QUAD VERSIONS APPLICATIONS BATTERY-POWERED INSTRUMENTS PORTABLE DEVICES HIGH-IMPEDANCE APPLICATIONS PHOTODIODE PRE-AMPS PRECISION INTEGRATORS MEDICAL INSTRUMENTS TEST EQUIPMENT OPA336 DESCRIPTION OPA336 series micropower CMOS operational amplifiers are designed for battery-powered applications. They operate on a single supply with operation as low as.v. The output is rail-to-rail and swings to within 3mV of the supplies with a kω load. The common-mode range extends to the negative supply ideal for single-supply applications. Single, dual, and quad versions have identical specifications for maximum design flexibility. In addition to small size and low quiescent current (µa/amplifier), they feature low offset voltage (µv max), low input bias current (pa), and high openloop gain (db). Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom from interaction. OPA336 packages are the tiny SOT3- surface mount and SO-8 surface-mount. OPA336 come in the miniature MSOP-8 surface-mount, SO-8 surface-mount, and DIP-8 packages. The OPA336 package is the space-saving SSOP-6 surface-mount. All are specified from C to +8 C and operate from C to + C. A macromodel is available for download (at ) for design analysis. Out V+ OPA336 OPA336 V +In 3 SOT3- In OPA336 Out A In A +In A V+ 3 A D 6 3 Out D In D +In D V NC In +In NC V+ Output Out A In A +In A 3 A B V+ Out B In B +In B In B Out B 6 7 B C +In C In C Out C V NC V +In B NC 8 9 NC SO-8 NC = No Connection DIP-8, SO-8, MSOP-8 SSOP-6 NC = No Connection Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 997-, Texas Instruments Incorporated
2 PACKAGE/ORDERING INFORMATION () PACKAGE DRAWING PACKAGE PRODUCT PACKAGE-LEAD DESIGNATOR MARKING Single OPA336N SOT3- DBV A36 () OPA336NA SOT3- DBV A36 () OPA336NJ SOT3- DBV J36 OPA336U SO-8 Surface-Mount D OPA336U OPA336UA SO-8 Surface-Mount D OPA336UA OPA336UJ SO-8 Surface-Mount D OPA336UJ Dual OPA336E MSOP-8 Surface-Mount DGK B36 () OPA336EA MSOP-8 Surface-Mount DGK B36 () OPA336P DIP-8 P OPA336P OPA336PA DIP-8 P OPA336PA OPA336U SO-8 Surface-Mount D OPA336U OPA336UA SO-8 Surface-Mount D OPA336UA Quad OPA336EA SSOP-6 Surface-Mount DBQ OPA336EA NOTES: () For the most current package and ordering information, see the package option addendum at the end of this data sheet. () Grade will be marked on the Reel. ABSOLUTE MAXIMUM RATINGS () Supply Voltage... 7.V Signal Input Terminals, Voltage ()... (V ).3V to (V+) +.3V Current ()... ma Output Short-Circuit (3)... Continuous Operating Temperature... C to + C Storage Temperature... C to + C Junction Temperature... C Lead Temperature (soldering, s)... 3 C ESD Rating: Charged Device Model, OPA336 NJ and UJ only (CDM) ()... V Human Body Model (HBM) ()... V Machine Model (MM) ()... V NOTES: () Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only. Functional operation of the device at these conditions, or beyond the specified operating conditions, is not implied. () Input terminals are diode-clamped to the power supply rails. Input signals that can swing more than.3v beyond the supply rails should be current-limited to ma or less. (3) Short-circuit to ground, one amplifier per package. () OPA336 NJ and UJ have been tested to CDM of V. All other previous package versions have been tested using HBM and MM. Results are shown. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. OPA336, 336, 336 SBOS68C
3 ELECTRICAL CHARACTERISTICS: V S =.3V to.v Boldface limits apply over the specified temperature range, T A = C to +8 C. At T A = + C, V S = +V, and R L = kω connected to V S /, unless otherwise noted. OPA336NA, UA OPA336N, U OPA336EA, PA, UA OPA336E, P, U OPA336EA OPA336NJ, UJ PARAMETER CONDITION MIN TYP () MAX MIN TYP MAX MIN TYP MAX UNITS OFFSET VOLTAGE Input Offset Voltage V OS ±6 ± ± ± ± µv vs Temperature dv OS /dt ±. µv/ C vs Power Supply PSRR V S =.3V to.v µv/v Over Temperature V S =.3V to.v 3 µv/v Channel Separation, dc. µv/v INPUT BIAS CURRENT Input Bias Current I B ± ± pa Over Temperature ±6 pa Input Offset Current I OS ± ± pa NOISE Input Voltage Noise, f =. to Hz 3 µvp-p Input Voltage Noise Density, f = khz e n nv/ Hz Current Noise Density, f = khz i n 3 fa/ Hz INPUT VOLTAGE RANGE Common-Mode Voltage Range V CM. (V+) V Common-Mode Rejection Ratio CMRR.V < V CM < (V+) V db Over Temperature.V < V CM < (V+) V db INPUT IMPEDANCE Differential 3 Ω pf Common-Mode 3 Ω pf OPEN-LOOP GAIN Open-Loop Voltage Gain A OL R L = kω, mv < V O < (V+) mv 9 9 db Over Temperature R L = kω, mv < V O < (V+) mv 9 9 db R L = kω, mv < V O < (V+) mv 9 6 db Over Temperature R L = kω, mv < V O < (V+) mv 9 db FREQUENCY RESPONSE Gain-Bandwidth Product GBW V S = V, G = khz Slew Rate SR V S = V, G =.3 V/µs Overload Recovery Time V IN G = V S µs OUTPUT Voltage Output Swing from Rail () R L = kω, A OL 7dB 3 mv R L = kω, A OL 9dB mv Over Temperature R L = kω, A OL 9dB mv R L = kω, A OL 9dB 7 mv Over Temperature R L = kω, A OL 9dB mv Short-Circuit Current I SC ± ma Capacitive Load Drive C LOAD See Text pf POWER SUPPLY Specified Voltage Range V S.3. V Minimum Operating Voltage. V Quiescent Current (per amplifier) I Q I O = µa Over Temperature I O = 36 µa TEMPERATURE RANGE Specified Range +8 C Operating Range + C Storage Range + C Thermal Resistance θ JA SOT-3- Surface-Mount C/W MSOP-8 Surface-Mount C/W SO-8 Surface-Mount C/W DIP-8 C/W SSOP-6 Surface-Mount C/W DIP- 8 C/W Specifications same as OPA336E, P, U. NOTES: () V S = +V. () Output voltage swings are measured between the output and positive and negative power-supply rails. OPA336, 336, SBOS68C
4 TYPICAL CHARACTERISTICS At T A = + C, V S = +V, and R L = kω connected to V S /, unless otherwise noted. OPEN-LOOP GAIN/PHASE vs FREQUENCY POWER-SUPPLY and COMMON-MODE REJECTION RATIO vs FREQUENCY CMRR 8 G 8 Voltage Gain (db) 6 Φ 9 3 Phase ( ) PSRR, CMRR (db) 6 PSRR 8 k k k M k k k Frequency (Hz) Frequency (Hz) QUIESCENT CURRENT vs SUPPLY VOLTAGE QUIESCENT CURRENT vs TEMPERATURE 3 Per Amplifier 3 Per Amplifier V S = +V Quiescent Current (µa) Quiescent Current (µa) V S = +.3V Supply Voltage (V) 7 7 Temperature ( C) SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE SHORT-CIRCUIT CURRENT vs TEMPERATURE ±6 8 Short-Circuit Current (ma) ± ± ±3 ± ± I SC +I SC Short-Circuit Current (ma) I SC V S = +V +I SC +I SC V S = +.3V I SC Supply Voltage (V) 7 7 Temperature ( C) OPA336, 336, 336 SBOS68C
5 TYPICAL CHARACTERISTICS (Cont.) At T A = + C, V S = +V, and R L = kω connected to V S /, unless otherwise noted. k INPUT VOLTAGE AND CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY k CHANNEL SEPARATION vs FREQUENCY Voltage Noise Voltage Noise (nv/ Hz) Current Noise Current Noise (fa/ Hz) Channel Separation (db) 3 k k k Frequency (Hz) 6 MAXIMUM OUTPUT VOLTAGE vs FREQUENCY A OL, CMRR, PSRR vs TEMPERATURE A OL Output Voltage (Vp-p) 3 V S = +.3V V S = +.V k k Frequency (Hz) k Temperature ( C) Percent of Amplifiers (%) Typical production distribution of packaged units..% OFFSET VOLTAGE PRODUCTION DISTRIBUTION.3%.%.% 3 3 A OL, CMRR, PSRR (db) 9 8 PSRR CMRR Percent of Amplifiers (%) OFFSET VOLTAGE DRIFT MAGNITUDE PRODUCTION DISTRIBUTION Typical production distribution of packaged units Dual and Quad devices, G =, all channels. Quad measured channel A to D or B to C other combinations yield improved rejection. k k k Frequency (Hz) Offset Voltage (µv) Offset Voltage Drift (µv/ C) OPA336, 336, 336 SBOS68C
6 TYPICAL CHARACTERISTICS (Cont.) At T A = + C, V S = +V, and R L = kω connected to V S /, unless otherwise noted. k INPUT BIAS CURRENT vs TEMPERATURE INPUT BIAS CURRENT vs INPUT COMMON-MODE VOLTAGE Input Bias Current (pa) Input Bias Current (pa) 3 V S = +V. 7 7 Temperature ( C) 3 Common-Mode Voltage (V) OUTPUT VOLTAGE SWING vs OUTPUT CURRENT. OUTPUT VOLTAGE SWING vs OUTPUT CURRENT V S = +V V S = ±.V Output Voltage (V) SMALL-SIGNAL STEP RESPONSE G =, C L = pf, V S = +V LARGE-SIGNAL STEP RESPONSE G =, C L = 6pF, V S = +V mv/div mv/div 3 Sourcing Current V S = +.3V C C + C + C + C Output Voltage (V).... Sinking Current C + C + C + C Output Current (ma) Output Current (ma) µs/div µs/div 6 OPA336, 336, 336 SBOS68C
7 APPLICATIONS INFORMATION OPA336 series op amps are fabricated on a state-of-the-art.6 micron CMOS process. They are unity-gain stable and suitable for a wide range of general-purpose applications. Power-supply pins should be bypassed with.µf ceramic capacitors. OPA336 series op amps are protected against reverse battery voltages. OPERATING VOLTAGE OPA336 series op amps can operate from a +.V to +.V single supply with excellent performance. Most behavior remains unchanged throughout the full operating voltage range. Parameters which vary significantly with operating voltage are shown in the typical characteristics. OPA336 series op amps are fully specified for operation from +.3V to +.V; a single limit applies over the supply range. In addition, many parameters are ensured over the specified temperature range, C to +8 C. INPUT VOLTAGE The input common-mode range of OPA336 series op amps extends from (V ).V to (V+) V. For normal operation, inputs should be limited to this range. The absolute maximum input voltage is 3mV beyond the supplies. Thus, inputs greater than the input common-mode range but less than maximum input voltage, while not valid, will not cause any damage to the op amp. Furthermore, the inputs may go beyond the power supplies without phase inversion, as shown in Figure, unlike some other op amps. 6V V OUT Normally, input bias current is approximately pa. However, input voltages exceeding the power supplies can cause excessive current to flow in or out of the input pins. Momentary voltages greater than the power supply can be tolerated as long as the current on the input pins is limited to ma. This is easily accomplished with an input resistor, as shown in Figure. V IN I OVERLOAD ma max kω +V OPAx336 V OUT FIGURE. Input Current Protection for Voltages Exceeding the Supply Voltage. CAPACITIVE LOAD AND STABILITY OPA336 series op amps can drive a wide range of capacitive loads. However, all op amps under certain conditions may become unstable. Op-amp configuration, gain, and load value are just a few of the factors to consider when determining stability. When properly configured, OPA336 series op amps can drive approximately,pf. An op amp in unity-gain configuration is the most vulnerable to capacitive load. The capacitive load reacts with the op amp s output resistance, along with any additional load resistance, to create a pole in the response which degrades the phase margin. In unity gain, OPA336 series op amps perform well with a pure capacitive load up to about 3pF. Increasing gain enhances the amplifier s ability to drive loads beyond this level. One method of improving capacitive load drive in the unity-gain configuration is to insert a Ω to Ω resistor inside the feedback loop, as shown in Figure 3. This reduces ringing with large capacitive loads while maintaining DC V V IN OPAx336 R S Ω V OUT C L R L FIGURE. No Phase Inversion with Inputs Greater than the Power-Supply Voltage. FIGURE 3. Series Resistor in Unity-Gain Configuration Improves Capacitive Load Drive. OPA336, 336, SBOS68C
8 accuracy. For example, with R L = kω, OPA336 series op amps perform well with capacitive loads in excess of pf, as shown in Figure. Without R S, capacitive load drive is typically 3pF for these conditions, as shown in Figure. R S = Ω, Load = kω pf, V S = +V Direct Current (DC) error at the output; however, this error may be insignificant. For instance, with R L = kω and R S = Ω, there is only about a.% error at the output. Figure shows the recommended operating regions for the OPA336. Decreasing the load resistance generally improves capacitive load drive. Figure also illustrates how stability differs depending on where the resistive load is connected. With G = + and R L = kω connected to V S /, the OPA336 can typically drive pf. Connecting the same load to ground improves capacitive load drive to pf. mv/div k Operation Above Selected Gain Curve Not Recommended µs/div FIGURE. Small-Signal Step Response Using Series Resistor to Improve Capacitive Load Drive. Alternatively, the resistor may be connected in series with the output outside of the feedback loop. However, if there is a resistive load parallel to the capacitive load, it and the series resistor create a voltage divider. This introduces a Capacitive Load (pf) k G = + R L to Ground G = + R L to Ground G = + R L to V S / V S = +V, V O = V S / Resistive Load (kω) FIGURE. Stability Capacitive Load vs Resistive Load. 8 OPA336, 336, 336 SBOS68C
9 PACKAGE OPTION ADDENDUM 6-Dec-6 PACKAGING INFORMATION Orderable Device Status () Package Type Package Drawing Pins Package Qty OPA336E/ ACTIVE MSOP DGK 8 Green (RoHS & OPA336E/G ACTIVE MSOP DGK 8 Green (RoHS & OPA336E/K ACTIVE MSOP DGK 8 Green (RoHS & OPA336E/KG ACTIVE MSOP DGK 8 Green (RoHS & OPA336EA/ ACTIVE MSOP DGK 8 Green (RoHS & OPA336EA/G ACTIVE MSOP DGK 8 Green (RoHS & OPA336EA/K ACTIVE MSOP DGK 8 Green (RoHS & OPA336EA/KG ACTIVE MSOP DGK 8 Green (RoHS & OPA336P ACTIVE PDIP P 8 Green (RoHS & OPA336PA ACTIVE PDIP P 8 Green (RoHS & OPA336PG ACTIVE PDIP P 8 Green (RoHS & OPA336U ACTIVE SOIC D 8 Green (RoHS & OPA336U/K ACTIVE SOIC D 8 Green (RoHS & OPA336U/KG ACTIVE SOIC D 8 Green (RoHS & OPA336UA ACTIVE SOIC D 8 Green (RoHS & OPA336UA/K ACTIVE SOIC D 8 Green (RoHS & OPA336UA/KG ACTIVE SOIC D 8 Green (RoHS & OPA336UAG ACTIVE SOIC D 8 Green (RoHS & OPA336UG ACTIVE SOIC D 8 Green (RoHS & OPA336N/ ACTIVE SOT-3 DBV Green (RoHS & OPA336N/G ACTIVE SOT-3 DBV Green (RoHS & OPA336N/3K ACTIVE SOT-3 DBV 3 Green (RoHS & OPA336N/3KG ACTIVE SOT-3 DBV 3 Green (RoHS & OPA336NA/ ACTIVE SOT-3 DBV Green (RoHS & OPA336NA/G ACTIVE SOT-3 DBV Green (RoHS & Eco Plan () Lead/Ball Finish MSL Peak Temp (3) Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C-UNLIM Level--6C-UNLIM Level--6C-UNLIM Level--6C-UNLIM Level--6C-UNLIM Level--6C-UNLIM Addendum-Page
10 PACKAGE OPTION ADDENDUM 6-Dec-6 Orderable Device Status () Package Type Package Drawing Pins Package Qty OPA336NA/3K ACTIVE SOT-3 DBV 3 Green (RoHS & OPA336NA/3KG ACTIVE SOT-3 DBV 3 Green (RoHS & OPA336NJ/ ACTIVE SOT-3 DBV Green (RoHS & OPA336NJ/G ACTIVE SOT-3 DBV Green (RoHS & OPA336NJ/3K ACTIVE SOT-3 DBV 3 Green (RoHS & OPA336NJ/3KG ACTIVE SOT-3 DBV 3 Green (RoHS & Eco Plan () Lead/Ball Finish MSL Peak Temp (3) OPA336P OBSOLETE PDIP P 8 TBD Call TI Call TI OPA336PA OBSOLETE PDIP P 8 TBD Call TI Call TI OPA336U ACTIVE SOIC D 8 Green (RoHS & OPA336U/K ACTIVE SOIC D 8 Green (RoHS & OPA336U/KG ACTIVE SOIC D 8 Green (RoHS & OPA336UA ACTIVE SOIC D 8 Green (RoHS & OPA336UA/K ACTIVE SOIC D 8 Green (RoHS & OPA336UA/KG ACTIVE SOIC D 8 Green (RoHS & OPA336UAG ACTIVE SOIC D 8 Green (RoHS & OPA336UG ACTIVE SOIC D 8 Green (RoHS & OPA336UJ PREVIEW SOIC D 8 Green (RoHS & OPA336UJ/K PREVIEW SOIC D 8 Green (RoHS & OPA336EA/ ACTIVE SSOP/ QSOP OPA336EA/G ACTIVE SSOP/ QSOP OPA336EA/K ACTIVE SSOP/ QSOP OPA336EA/KG ACTIVE SSOP/ QSOP DBQ 6 Green (RoHS & DBQ 6 Green (RoHS & DBQ 6 Green (RoHS & DBQ 6 Green (RoHS & OPA336PA OBSOLETE PDIP N TBD Call TI Call TI Level--6C-UNLIM Level--6C-UNLIM Level--6C-UNLIM Level--6C-UNLIM Level--6C-UNLIM Level--6C-UNLIM Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR Level--6C- YEAR () The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page
11 PACKAGE OPTION ADDENDUM 6-Dec-6 () Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & - please check for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed.% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either ) lead-based flip-chip solder bumps used between the die and package, or ) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & : TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed.% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3
12 MECHANICAL DATA MPDIA JANUARY 99 REVISED JUNE 999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 8. (,6).3 (9,).6 (6,6). (6,).7 (,78) MAX. (,) MIN.3 (8,6).3 (7,6). (,38). (,8) MAX Gage Plane Seating Plane. (3,8) MIN. (,) NOM. (,3). (,38). (,). (,) M.3 (,9) MAX 8/D /98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS- For the latest package information, go to POST OFFICE BOX 633 DALLAS, TEXAS 76
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18 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio /audio Data Converters dataconverter.ti.com Automotive /automotive DSP dsp.ti.com Broadband /broadband Interface interface.ti.com Digital Control /digitalcontrol Logic logic.ti.com Military /military Power Mgmt power.ti.com Optical Networking /opticalnetwork Microcontrollers microcontroller.ti.com Security /security Low Power Wireless /lpw Telephony /telephony Video & Imaging /video Wireless /wireless Mailing Address: Texas Instruments Post Office Box 633 Dallas, Texas 76 Copyright 6, Texas Instruments Incorporated
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