FEATURES SYMBOL QUICK REFERENCE DATA

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1 FEATURES SYMBOL QUICK REFERENCE DATA Low forward volt drop Fast switching Soft recovery characteristic High thermal cycling performance Isolated mounting tab k a 1 2 V R = 1500 V V F 1.2 V / 1.25 V I F(peak) = 12 A (f = 48 khz) I F(peak) = A (f = 82 khz) I FSM 0 A t rr 350 ns / 220 ns GENERAL DESCRIPTION PINNING SOD113 Glass-passivated double diffused PIN DESCRIPTION rectifier diode featuring fast forward recovery and low forward recovery 1 cathode voltage. The device is intended for use in HDTV receivers and multi-sync monitor horizontal 2 anode deflection circuits. tab isolated case The BY459X series is supplied in the conventional leaded SOD113 package. 1 2 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V RSM Peak non repetitive reverse voltage V V RRM Peak repetitive reverse V voltage V RWM Crest working reverse voltage V S I F(peak) Peak working forward current f = 48 khz; A f = 82 khz; - - A I FRM Peak repetitive forward current t = 0 µs - 0 A I F(RMS) RMS forward current - 30 A I FSM Peak non-repetitive forward current t = ms t = 8.3 ms A A sinusoidal; T j = 150 C prior to surge; with reapplied V RWM(max) T stg Storage temperature C T j Operating junction C temperature November Rev 2.000

2 ISOLATION LIMITING VALUE & CHARACTERISTIC T hs = 25 C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V isol R.M.S. isolation voltage from both terminals to external f = Hz; sinusoidal waveform; V heatsink R.H. 65% ; clean and dustfree C isol Capacitance from both terminals f = 1 MHz to external heatsink - - pf THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT R th j-hs Thermal resistance junction to with heatsink compound K/W heatsink without heatsink compound K/W R th j-a Thermal resistance junction to in free air K/W ambient STATIC CHARACTERISTICS T j = 25 C unless otherwise stated SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT BY459X S S V F Forward voltage I F = 6.5 A V I F = 6.5 A; T j = 125 C V I R Reverse current V R = 1300 V µa V R = 1300 V; T j = 125 C ma DYNAMIC CHARACTERISTICS T j = 25 C unless otherwise stated SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT BY459X S S t rr Reverse recovery I F = 1 A, V R 30 V; µs Q s Reverse recovery charge I F = 2 A, -di F /dt = 20 A/µs µc V fr t fr Peak forward recovery voltage Forward recovery I F = 6.5A, di F /dt = 50A/µs I F = 6.5A, di F /dt = 50A/µs V ns November Rev 2.000

3 I F Maximum pulse width / us 0 V BY459X-1500 VRRM % tfr pulse width tp period T V F V fr 5V / 2V V F Fig.1. Definition of Vfr and tfr 1 0 line frequency / khz Fig.4. Maximum allowable pulse width t p versus line frequency; Basic horizontal deflection circuit. I F di F dt 30 IF / A Tj = 125 C Tj = 25 C BY459 trr 20 typ max Qs 25% 0% I R Fig.2. Definition of t rr and Q s VF / V Fig.5. BY459X-1500 Typical and maximum forward characteristic I F = f(v F ); parameter T j VCC IF / A 30 Tj = 125 C Tj = 25 C BY459S Line output transformer LY 20 typ max deflection transistor D1 Cf Cs Fig.3. Basic horizontal deflection circuit VF / V 2 Fig.6. BY459X-1500S Typical and maximum forward characteristic I F = f(v F ); parameter T j November Rev 2.000

4 Transient thermal impedance, Zth j-hs (K/W) P D tp D = T tp T t us us 0us 1ms ms 0ms 1s s pulse width, tp (s) BY459F Fig.7. Transient thermal impedance Z th = f(t p ) November Rev 2.000

5 MECHANICAL DATA Dimensions in mm Net Mass: 2 g Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-leads TO-220 'full pack' SOD113 A E P z A 1 q T m D H E j L 1 (1) k Q L 1 2 b 1 b w M c e 0 20 mm scale DIMENSIONS (mm are the original dimensions) H (1) UNIT A A 1 b b D E e j k L m P Q q T w z (2) 1 c E L max. 1 mm Notes 1. Terminals are uncontrolled within zone L z is depth of T. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE SOD113 2-lead TO Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". Fig.8. SOD113; The seating plane is electrically isolated from all terminals. November Rev 2.000

6 DEFINITIONS DATA SHEET STATUS DATA SHEET PRODUCT DEFINITIONS STATUS 1 STATUS 2 Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1 Please consult the most recently issued datasheet before initiating or completing a design. 2 The product status of the device(s) described in this datasheet may have changed since this datasheet was published. The latest information is available on the Internet at URL November Rev 2.000