TSZ R2R0G

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1 erial EEPROM eries tandard EEPROM I 2 BU EEPROM (2-Wire) BR2428-W General Description BR2428-W series is a serial EEPROM of I 2 BU Interface Method Features Packages W(yp) x D(yp) x H(Max) ompletely conforming to the world standard I 2 BU. ll controls available by 2 ports of serial clock (L) and serial data (D) Other devices than EEPROM can be connected to the same port, saving microcontroller port.6v to 5.5V ingle Power ource Operation most suitable for battery use.6v to 5.5V wide limit of operating voltage, possible F MODE 4Hz operation Page Write Mode useful for initial value write at factory shipment elf-timed Programming ycle Low urrent onsumption Prevention of Write Mistake Write (Write Protect) Function dded Prevention of Write Mistake at Low Voltage More than million write cycles More than 4 years data retention Noise filter built in L / D terminal Initial delivery state FFh DIP-8 9.3mm x 6.5mm x 7.mm DIP8 9.27mm x 6.35mm x 8.63mm OP8 5.mm x 6.2mm x.7mm OP-B8 3.mm x 6.4mm x.2mm OP-B8J 3.mm x 4.9mm x.mm MOP8 2.9mm x 4.mm x.9mm OP- J8 4.9mm x 6.mm x.65mm VON8X23 2.mm x 3.mm x.6mm BR2428-W apacity Bit Format ype BR2428-W BR2428-WZ BR2428F-W BR2428FJ-W Power ource Voltage OP-B8 3.mm x 6.4mm x.35mm Figure. Package DIP-8 () DIP8 OP8 OP-J8 28bit 6 8 BR2428FV-W.6V to 5.5V OP-B8 BR2428FV-W OP-B8 BR2428FVJ-W OP-B8J BR2428FVM-W MOP8 BR2428NUX-W () Not Recommended for New Designs. Recommend BR2428-WZ. VON8X23 Product structure:ilicon monolithic integrated circuit his product has no designed protection against radioactive rays 23 ROHM o., Ltd. ll rights reserved. Z22 4 /34 Z22-R2RG3--2

2 BR2428-W bsolute Maximum Ratings (a=25 ) Parameter ymbol Rating Unit Remark upply Voltage Vcc -.3 to +6.5 V Power Dissipation Pd 45 (OP8) Derate by 4.5mW/ when operating above a=25 45 (OP-J8) Derate by 4.5mW/ when operating above a=25 3 (OP-B8) Derate by 3.mW/ when operating above a=25 33 (OP-B8) Derate by 3.3mW/ when operating above a=25 3 (OP-B8J) mw Derate by 3.mW/ when operating above a=25 3 (MOP8) Derate by 3.mW/ when operating above a=25 3 (VON8X23) Derate by 3.mW/ when operating above a=25 8 (DIP-8 () ) Derate by 8.mW/ when operating above a= (DIP8) torage emperature stg -65 to +5 Operating emperature opr -4 to +85 Input Voltage / Output Voltage Junction emperature Electrostatic discharge voltage (human body model) -.3 to Vcc+. V Derate by 8.52mW/ when operating above a=25 When mounted (on 4.5 mm.5 mm.6 mm thick, glass epoxy on single-layer substrate). he Max value of input voltage / output voltage is not over 6.5V. When the pulse width is 5ns or less, the Min value of input voltage / output voltage is not lower than -.V. jmax 5 Junction temperature at the storage condition V ED -4 to +4 V () Not Recommended for New Designs. Recommend BR2428-WZ. Memory ell haracteristics (a=25, Vcc=.6V to 5.5V) Parameter Limit Min yp Max Unit Write ycles (),, - - imes Data Retention () Years () Not % EED Recommended Operating Ratings Parameter ymbol Rating Unit Power ource Voltage Vcc.6 to 5.5 V Input Voltage V IN to Vcc D haracteristics (Unless otherwise specified, a=-4 to +85, Vcc=.6V to 5.5V) Limit Parameter ymbol Unit Min yp Max Input HIgh Voltage V IH.7Vcc - Vcc+. V.7V Vcc 5.5V Input Low Voltage V IL -.3 (2) - +.3Vcc V.7V Vcc 5.5V Input HIgh Voltage2 V IH2.8Vcc - Vcc+. V.6V Vcc<.7V Input Low Voltage2 V IL2 -.3 (2) - +.2Vcc V.6V Vcc<.7V onditions Output Low Voltage V OL V I OL=3.m, 2.5V Vcc 5.5V (D) Output Low Voltage2 V OL V I OL=.7m,.6V Vcc<2.5V (D) Input Leakage urrent I LI µ V IN= to Vcc Output Leakage urrent I LO µ V OU= to Vcc (D) upply urrent (Write) I m Vcc=5.5V, f L=4kHz, t WR=5ms, Byte write, Page write upply urrent (Read) I m Vcc=5.5V, f L=4kHz Random read, current read, sequential read tandby urrent I B µ Vcc=5.5V, D L=Vcc,,2=GND,WP=GND (2) When the pulse width is 5ns or less, it is -.V. 23 ROHM o., Ltd. ll rights reserved. Z22 5 2/34 Z22-R2RG3--2

3 BR2428-W haracteristics (Unless otherwise specified, a=-4 to +85, Vcc=.6V to 5.5V) Limit Parameter ymbol Min yp Max lock Frequency f L khz Data lock High Period t HIGH µs Data lock Low Period t LOW µs D,L(INPU) Rise ime () t R - -. µs D,L (INPU)Fall ime () t F - -. µs D(OUPU)Fall ime () t F µs tart ondition Hold ime t HD: µs tart ondition etup ime t U: µs Input Data Hold ime t HD:D - - ns Input Data etup ime t U:D - - ns Output Data Delay ime t PD. -.9 µs Output Data Hold ime t DH. - - µs top ondition etup ime t U:O µs Bus Free ime t BUF µs Write ycle ime t WR ms Noise pike Width (D and L) t I - -. µs WP Hold ime t HD:WP. - - µs WP etup ime t U:WP. - - µs WP High Period t HIGH:WP. - - µs () Not % EED. ondition Input Data Level: VIL=.2 Vcc VIH=.8 Vcc Input Data iming Reference Level:.3 Vcc/.7 Vcc Output Data iming Reference Level:.3 Vcc/.7 Vcc Rise/Fall ime: 2ns Unit erial Input / Output iming tr tf thigh 7% L 7% 7% 7% 7% 7% 7% D (INPU) ( 入力 ) 3% 3% 3% thd: tlow tu:d 7% 7% 3% tbuf tpd 3% thd:d 7% 3% tdh D D() D 3% D(n) 7% 3% twr D (OUPU) ( 出力 ) D (output) Input read at the rise edge of L 3% Data output in sync with the fall of L 7% 7% 3% 3% 3% 7% 7% Figure 2-(a). erial Input / Output iming 3% tf2 tu:wp thd:wp OP ONDIION Figure 2-(d). WP iming at Write Execution 7% 7% 7% tu: thd: tu:o 7% 3% 3% R ONDIION OP ONDIION 3% Figure 2-(b). tart-top Bit iming R ONDIION 3% OP ONDIION D() D(n) 7% D D 7% thigh:wp twr 7% 7% Fig-(4) Write 7% cycle timing 7% Fig-(5) WP timing at write execution Fig-(6) WP timing at write cancel Figure 2-(e). WP iming at Write ancel D 7% 7% write data (n-th address) twr OP ONDIION R ONDIION Figure 2-(c). Write ycle iming Fig-(5) WP timing at write execution Fig-(6) WP timing at write cancel 23 ROHM o., Ltd. ll rights reserved. Z22 5 3/34 Z22-R2RG3--2

4 BR2428-W Block Diagram 28bit EEPROM rray 8 V 8bit 2 ddress Decoder 4bit Word ddress Register Data Register 7 WP 2 3 R ontrol ircuit OP 6 L GND 4 High Voltage Generating ircuit Power ource Voltage Detection 5 D Figure 3. Block Diagram Pin onfiguration (OP VIEW) 8 V 2 BR2428-W 7 WP L GND 4 5 D Pin Descriptions erminal Name Input/ Output Input lave address setting* Input lave address setting* 2 Input lave address setting* Descriptions GND - Reference voltage of all input / output, V D Input/ Output erial data input serial data output L Input erial clock input WP Input Write protect terminal V - onnect the power source. *, and 2 are not allowed to use as open. 23 ROHM o., Ltd. ll rights reserved. Z22 5 4/34 Z22-R2RG3--2

5 Output Low Voltage: VOL(V) Output Low Voltage2: VOL2(V) Input High Voltage: VIH(V) Input Low Voltage: VIL(V) BR2428-W ypical Performance urves 6 5 a=-4 a= 25 a= a=-4 a= 25 a= upply Voltage: V(V) Figure 4. Input High Voltage,2 vs upply Voltage (,, 2, L, D, WP) Figure 5. Input Low Voltage,2 vs upply Voltage (,, 2, L, D, WP).8 a=-4 a= 25 a= 85.8 a=-4 a= 25 a= Output Low urrent: IOL(m) Output Low urent: IOL(m) Figure 6. Output Low Voltage vs Output Low urrent (Vcc=2.5V) Figure 7. Output Low Voltage2 vs Output Low urrent (Vcc=.6V) 23 ROHM o., Ltd. ll rights reserved. Z22 5 5/34 Z22-R2RG3--2

6 upply urrent (Write): Icc(m) upply urrent (Read): Icc2(m) Input Leakage urrent: I LI (µ) Output Leakage urrent: I LO(µ) BR2428-W ypical Performance urves continued a=-4 a= 25 a= 85.8 a=-4 a= 25 a= Figure 8. Input Leakage urrent vs upply Voltage (,, 2, L, WP) Figure 9. Output Leakage urrent vs upply Voltage (D) a=-4 a= 25 a= a=-4 a= 25 a= Figure. upply urrent (Write) vs upply Voltage (f L=4kHz) Figure. upply urrent (Read) vs upply Voltage (f L=4kHz) 23 ROHM o., Ltd. ll rights reserved. Z22 5 6/34 Z22-R2RG3--2

7 Data lock High Period : t HIGH(µs) Data lock Low Period : t LOW(µs) tandby urrent: I B (µ) lock Frequency: fscl(khz) BR2428-W ypical Performance urves continued a=-4 a= 25 a= 85 a=-4 a= 25 a= Figure 2. tandby urrent vs upply Voltage Figure 3. lock Frequency vs upply Voltage a=-4 a= 25 a= a=-4 a= 25 a= Figure 4. Data lock High Period vs upply Voltage Figure 5. Data lock Low Period vs upply Voltage 23 ROHM o., Ltd. ll rights reserved. Z22 5 7/34 Z22-R2RG3--2

8 Input Data Hold ime: t HD:D (ns) Input Data Hold ime: t HD:D(ns) tart ondition Hold ime: thd:(µs) tart ondition etup ime: tu: (µs) BR2428-W ypical Performance urves continued a=-4 a= 25 a= a=-4 a= 25 a= Figure 6. tart ondition Hold ime vs upply Voltage Figure 7. tart ondition etup ime vs upply Voltage a=-4 a= 25 a= a=-4 a= 25 a= Figure 8. Input Data Hold ime vs upply Voltage (HIGH) Figure 9. Input Data Hold ime vs upply Voltage (LOW) 23 ROHM o., Ltd. ll rights reserved. Z22 5 8/34 Z22-R2RG3--2

9 L Output Data Delay ime: t PD(µs) H Output Data Delay ime: t PD (µs) Input Data etup ime: t U:D(ns) Input Data etup ime: t U:D(ns) BR2428-W ypical Performance urves continued a=-4 a= 25 a= 85 - a=-4 a= 25 a= Figure 2. Input Data etup ime vs upply Voltage (HIGH) Figure 2. Input Data etup ime vs upply Voltage (LOW) a=-4 a= 25 a= 85.5 a=-4 a= 25 a= Figure 22. L Output Data Delay ime vs upply Voltage Figure 23. H Output Data Delay ime vs upply Voltage 23 ROHM o., Ltd. ll rights reserved. Z22 5 9/34 Z22-R2RG3--2

10 Write ycle ime: t WR(ms) Noise pike Width(L H):tI(µs) top ondition etup ime: t U:O(µs) Bus Free ime : t BUF(µs) BR2428-W ypical Performance urves continued a=-4 a= 25 a= a=-4 a= 25 a= Figure 24. top ondition etup ime vs upply Voltage Figure 25. Bus Free ime vs upply Voltage a=-4 a= 25 a= a=-4 a= 25 a= Figure 26. Write ycle ime vs upply Voltage Figure 27. Noise pike Width vs upply Voltage (L H) 23 ROHM o., Ltd. ll rights reserved. Z22 5 /34 Z22-R2RG3--2

11 Noise pike Width(D L): ti(µs) WP Hold ime: t HD:WP(µs) Noise pike Width(L L): ti(µs) Noise pike Width(D H): ti(µs) BR2428-W ypical Performance urves continued a=-4 a= 25 a= a=-4 a= 25 a= Figure 28. Noise pike Width vs upply Voltage (L L) Figure 29. Noise pike Width vs upply Voltage (D H) a=-4 a= 25 a= a=-4 a= 25 a= Figure 3. Noise pike Width vs upply Voltage (D L) Figure 3. WP Hold ime vs upply Voltage 23 ROHM o., Ltd. ll rights reserved. Z22 5 /34 Z22-R2RG3--2

12 WP etup ime: t U:WP(µs) WP High Period: t HIGH:WP ( µs) BR2428-W ypical Performance urves continued a=-4 a= 25 a= a=-4 a= 25 a= Figure 32. WP etup ime vs upply Voltage Figure 33. WP High Period vs upply Voltage 23 ROHM o., Ltd. ll rights reserved. Z22 5 2/34 Z22-R2RG3--2

13 BR2428-W iming hart. I 2 BU Data ommunication I 2 BU data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long, and acknowledge is always required after each byte. I 2 BU data communication with several devices is possible by connecting with 2 communication lines: serial data (D) and serial clock (L). mong the devices, there should be a master that generates clock and control communication start and end. he rest become slave which are controlled by an address peculiar to each device, like this EEPROM. he device that outputs data to the bus during data communication is called transmitter, and the device that receives data is called receiver.. D L R DDRE R/W D D condition Figure 34. Data ransfer iming P OP condition 2. tart ondition (tart Bit Recognition) () Before executing each command, start condition (start bit) where D goes from 'HIGH' down to 'LOW' when L is 'HIGH' is necessary. (2) his I always detects whether D and L are in start condition (start bit) or not, therefore, unless this condition is satisfied, any command cannot be executed. 3. top ondition (top Bit Recognition) () Each command can be ended by a stop condition (stop bit) where D goes from 'LOW' to 'HIGH' while L is 'HIGH'. 4. cknowledge () signal () he acknowledge () signal is a software rule to show whether data transfer has been made normally or not. In a master-slave communication, the device (Ex. µ-om sends slave address input for write or read command, to this I ) at the transmitter (sending) side releases the bus after output of 8bit data. (2) he device (Ex. his I receives the slave address input for write or read command from the µ-om) at the receiver (receiving) side sets D 'LOW' during the 9th clock cycle, and outputs acknowledge signal ( signal) showing that it has received the 8bit data. (3) his I, after recognizing start condition and slave address (8bit), outputs acknowledge signal ( signal) 'LOW'. (4) fter receiving 8bit data (word address and write data) during each write operation, this I outputs acknowledge signal ( signal) 'LOW'. (5) During read operation, this I outputs 8bit data (read data) and detects acknowledge signal ( signal) 'LOW'. When acknowledge signal ( signal) is detected, and stop condition is not sent from the master (µ-om) side, this I continues to output data. When acknowledge signal ( signal) is not detected, this I stops data transfer, recognizes stop condition (stop bit), and ends read operation. hen this I becomes ready for another transmission. 5. Device addressing () lave address comes after start condition from master. (2) he significant 4 bits of slave address are used for recognizing a device type. he device code of this I is fixed to ''. (3) Next slave addresses (2 --- device address) are for selecting devices, and plural ones can be used on a same bus according to the number of device addresses. (4) he most insignificant bit ( --- RED / WRIE ) of slave address is used for designating write or read operation, and is as shown below. etting etting R / W R / W to write (setting to word address setting of random read) R / W to read lave ddress Maximum Number of onnected Buses 2 R/W 8 23 ROHM o., Ltd. ll rights reserved. Z22 5 3/34 Z22-R2RG3--2

14 BR2428-W Write ommand. Write ycle () rbitrary data can be written to this EEPROM. When writing only byte, Byte Write is normally used, and when writing continuous data of 2 bytes or more, simultaneous write is possible by Page Write cycle. he maximum number of bytes is specified per device of each capacity. Up to 8 arbitrary bytes can be written. R LVE DDRE W R I E st WORD DDRE 2nd WORD DDRE D O P D LINE W W W 2 * * 3 2 W D7 D * Don't are bit R / W Figure 35. Byte Write ycle R LVE DDRE W R I E st WORD DDRE(n) 2nd WORD DDRE(n) D(n) D(n+63) O P D LINE 2 * * W W W 3 2 W D7 D D * Don't are bit R / W Figure 36. Page Write ycle (2) During internal write execution, all input commands are ignored, therefore is not returned. (3) Data is written to the address designated by word address (n-th address) (4) By issuing stop bit after 8bit data input, internal write to memory cell starts. (5) When internal write is started, command is not accepted for t WR (5ms at maximum). (6) Using page write cycle, writing in bulk is done as follows: When data of more than 64 bytes is sent, the bytes in excess overwrite the data already sent first.. (Refer to "Internal address increment") (7) s for page write cycle of BR2428-W, where 2 or more bytes of data is intended to be written, after the 8 significant bits of word address are designated arbitrarily, only the value of 6 least significant bits in the address is incremented internally, so that data up to 64 bytes of memory only can be written. In the case BR2428-W, page=64bytes, but the page write cycle time is 5ms at maximum for 64byte bulk write. It does not stand 5ms at maximum 64byte=32ms(Max). 2. Internal ddress Increment Page write mode (in the case of BR2428-W) W7 W6 W5 W4 W3 W2 W W Increment 3Eh ignificant bit is fixed. No digit up For example, when it is started from address 3Eh, then, increment is made as below, 3Eh 3Fh h h please take note. 3Eh 3E in hexadecimal, therefore, becomes a binary number. 3. Write Protect (WP) erminal Write Protect (WP) Function When WP terminal is set at Vcc (H level), data rewrite of all addresses is prohibited. When it is set at GND (L level), data rewrite of all address is enabled. Be sure to connect this terminal to Vcc or GND, or control it to H level or L level. Do not leave it open. In case of using it as ROM, it is recommended to connect it to pull up or Vcc. t extremely low voltage at power ON / OFF, by setting the WP terminal 'H', write error can be prevented. 23 ROHM o., Ltd. ll rights reserved. Z22 5 4/34 Z22-R2RG3--2

15 BR2428-W Read ommand. Read ycle Read cycle is when data of EEPROM is read. Read cycle could be random read cycle or current read cycle. Random read cycle is a command to read data by designating a specific address, and is used generally. urrent read cycle is a command to read data of internal address register without designating an address, and is used when to verify just after write cycle. In both the read cycles, sequential read cycle is available where the next address data can be read in succession. D LINE R LVE DDRE W R I E st WORD DDRE (n) 2nd WORD DDRE(n) D(n) W W W W 2 * * 3 2 D7 D 2 R LVE DDRE R E D O P * Don't are bit R / W Figure 37. Random Read ycle R / W R LVE DDRE R E D D(n) O P D LINE 2 D7 D R / W Figure 38. urrent Read ycle R LVE DDRE R E D D(n) D(n+x) O P D LINE 2 D7 D D7 D R / W Figure 39. equential Read ycle (in the case of current read cycle) () In random read cycle, data of designated word address can be read. (2) When the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle), data of incremented last read address (n)-th, i.e., data of the (n+)-th address is output. (3) When signal 'LOW' after D is detected, and stop condition is not sent from master (µ-om) side, the next address data can be read in succession. (4) Read cycle is ended by stop condition where 'H' is input to signal after D and D signal goes from L to H while L signal is 'H'. (5) When 'H' is not input to signal after D, sequential read gets in, and the next data is output. herefore, read command cycle cannot be ended. o end read command cycle, be sure to input 'H' to signal after D, and the stop condition where D goes from L to H while L signal is 'H'. (6) equential read is ended by stop condition where 'H' is input to signal after arbitrary D and D is asserted from L to H while L signal is 'H'. 23 ROHM o., Ltd. ll rights reserved. Z22 5 5/34 Z22-R2RG3--2

16 BR2428-W oftware Reset oftware reset is executed to avoid malfunction after power on and during command input. oftware reset has several kinds and 3 kinds of them are shown in the figure below. (Refer to Figure 4-(a), Figure 4-(b), and Figure 4-(c)) Within the dummy clock input area, the D bus is released ('H' by pull up) and output and read data '' (both 'L' level) may be output from EEPROM. herefore, if 'H' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices. Dummy clock 4 tart 2 L D Normal command Normal command Figure 4-(a). he ase of Dummy lock 4 + R+R+ ommand Input tart Dummy clock 9 tart L D Normal command Normal command Figure 4-(b). he ase of R + Dummy lock 9 + R + ommand Input tart 9 L D Normal command Normal command Figure 4-(c). R 9 + ommand Input tart command from R input. cknowledge Polling During internal write execution, all input commands are ignored, therefore is not returned. During internal automatic write execution after write cycle input, next command (slave address) is sent. If the first signal sends back 'L', then it means end of write operation, else 'H' is returned, which means writing is still in progress. By the use of acknowledge polling, next command can be executed without waiting for t WR = 5ms. R / W o write continuously, =, then to carry out current read cycle after write, slave address with signal sends back 'L', and then execute word address input and data output and so forth.. R / W = is sent. If First write command During internal write, = HIGH is returned. R Write ommand O P R lave ddress H R lave ddress H twr econd write command R lave ddress H R lave ddress L Word ddress L Data L O P twr fter completion of internal write, =LOW is returned, so input next word address and data in succession. Figure 4. ase of ontinuous Write by cknowledge Polling 23 ROHM o., Ltd. ll rights reserved. Z22 5 6/34 Z22-R2RG3--2

17 BR2428-W WP Valid iming (Write ancel) WP is usually fixed to 'H' or 'L', but when WP is used to cancel write cycle and so on, observe the following WP valid timing. During write cycle execution, inside cancel valid area, by setting WP='H', write cycle can be cancelled. In both byte write cycle and page write cycle, the area from the first start condition of command to the rise of clock to take in D of data(in page write cycle, the first byte data) is the cancel invalid area. WP input in this area becomes Don't care. he area from the rise of L to take in D to the stop condition input is the cancel valid area. Furthermore, after the execution of forced end by WP, the I enters standby status. Rise of D taken clock Rise of D L L D D D D D Enlarged view Enlarged view D WP R lave ddress L Word ddress L D7 D6 D5 D4 D3 D2 D D WP cancel invalid area L Data WP cancel valid area Data is not written. L O P twr WP cancel invalid area Figure 42. WP Valid iming ommand ancel by tart ondition and top ondition During command input, by continuously inputting start condition and stop condition, command can be cancelled. (Figure 43.) However, within output area and during data read, D bus may output 'L'. In this case, start condition and stop condition cannot be input, so reset is not available. herefore, execute software reset. When command is cancelled by start-stop condition during random read cycle, sequential read cycle, or current read cycle, internal setting address is not determined. herefore, it is not possible to carry out current read cycle in succession. o carry out read cycle in succession, carry out random read cycle. L D tart condition top condition Figure 43. ase of ancel by tart, top ondition during lave ddress Input 23 ROHM o., Ltd. ll rights reserved. Z22 5 7/34 Z22-R2RG3--2

18 BR2428-W I/O Peripheral ircuit. Pull-up Resistance of D terminal D is NMO open drain, so it requires a pull up resistor. s for this resistance value (R PU), select an appropriate value from microcontroller V IL, I L, and V OL-I OL characteristics of this I. If R PU is large, operating frequency is limited. he smaller the R PU, the larger is the supply current (Read). 2. Maximum Value of RPU he maximum value of R PU is determined by the following factors. () D rise time to be determined by the capacitance ( BU) of bus line and R PU of D should be t R or lower. Furthermore, timing should be satisfied even when D rise time is slow. (2) he bus. electric potential to be determined by the input current leak total (I L) of device connected to bus at output of 'H' to the D line and R PU should sufficiently secure the input 'H' level (V IH) of microcontroller and EEPROM including recommended noise margin of.2vcc. Vcc-I LR PU-.2 Vcc V IH R PU.8Vcc-VI H I L Microcontroller BR24XX Ex.) V =3V I L=µ VIH=.7 Vcc From (2) R PU -6 IL R PU IL D erminal 3 [kω] Bus Line apacity BU Figure 44. I/O ircuit Diagram 3. Minimum Value of RPU he minimum value of R PU is determined by the following factors. () When I outputs LOW, it should be satisfied that V OLMX=.4V and I OLMX=3m. Vcc-V OL R PU R PU I OL Vcc-V OL I OL (2) V OLMX=.4V should secure the input 'L' level (V IL) of microcontroller and EEPROM including recommended noise margin.vcc. VOLMX V IL-. Vcc Ex.) Vcc =3V, VOL=.4V, IOL=3m, microcontroller, EEPROM V IL=.3Vcc from () 3-.4 R PU [Ω] nd V OL=.4 [V] V IL=.3 3 =.9 [V] herefore, the condition (2) is satisfied. 4. Pull-up Resistance of L erminal When L control is made at the MO output port, there is no need for a pull up resistor. But when there is a time where L becomes 'Hi-Z', add a pull up resistor. s for the pull up resistor value, one of several kω to several ten kω is recommended in consideration of drive performance of output port of microcontroller. 23 ROHM o., Ltd. ll rights reserved. Z22 5 8/34 Z22-R2RG3--2

19 BR2428-W autions on Microcontroller onnection. R In I 2 BU, it is recommended that D port is of open drain input/output. However, when using MO input / output of tri state to D port, insert a series resistance R between the pull up resistor R PU and the D terminal of EEPROM. his is to control over current that may occur when PMO of the microcontroller and NMO of EEPROM are turned ON simultaneously. R also plays the role of protecting the D terminal against surge. herefore, even when D port is open drain input/output, R can be used. R PU R L D 'H' output of microcontroller 'L' output of EEPROM Microcontroller EEPROM Figure 45. I/O ircuit Diagram Over current flows to D line by 'H' output of microcontroller and 'L' output of EEPROM. Figure 46. Input / Output ollision iming 2. Maximum Value of R he maximum value of R is determined by the following relations. () D rise time to be determined by the capacitance ( BU) of bus line and R PU of D should be t R or lower. Furthermore, timing should be satisfied even when D rise time is slow. (2) he bus electric potential to be determined by R PU and R the moment when EEPROM outputs 'L' to D bus should sufficiently secure the input 'L' level (V IL) of microcontroller including recommended noise margin of.vcc. V RPU R VOL (Vcc-V OL) R RPU+R R +V OL+.Vcc VIL V IL-V OL-.Vcc.Vcc-VIL R PU VIL Micro controller IOL Bus line capacity BU EEPROM Figure 47. I/O ircuit Diagram Ex.) V=3V V IL=.3V V OL=.4V R PU=2kΩ R [kω] 3. Minimum Value of R he minimum value of R is determined by over current at bus collision. When over current flows, noises in power source line and instantaneous power failure of power source may occur. When allowable over current is defined as I, the following relation must be satisfied. Determine the allowable current in consideration of the impedance of power source line in set and so forth. et the over current to EEPROM at m or lower. 'H' output R PU R Over current I 'L'output Vcc R I R Vcc I Ex.) V =3V I=m R 3-3 Microcontroller EEPROM 3 [Ω] Figure 48. I/O ircuit Diagram 23 ROHM o., Ltd. ll rights reserved. Z22 5 9/34 Z22-R2RG3--2

20 BR2428-W I/O Equivalence ircuit. Input (,, 2, L, WP) Figure 49. Input Pin ircuit Diagram 2. Input / Output (D) Figure 5. Input / Output Pin ircuit Diagram 23 ROHM o., Ltd. ll rights reserved. Z22 5 2/34 Z22-R2RG3--2

21 BR2428-W Power-Up / Down onditions t power ON, the I s internal circuits may go through unstable low voltage area as the Vcc rises, making the I s internal logic circuit not completely reset, hence, malfunction may occur. o prevent this, the I is equipped with POR circuit and LV circuit. o assure the operation, observe the following conditions at power ON.. et D = 'H' and L ='L' or 'H 2. tart power source so as to satisfy the recommended conditions of t R, t OFF, and V bot for operating POR circuit. V tr toff Vbot Figure 5. Rise Waveform Diagram Recommended conditions of t R, t OFF,V bot t R t OFF V bot ms or below ms or larger.3v or below ms or below ms or larger.2v or below 3. et D and L so as not to become 'Hi-Z'. When the above conditions and 2 cannot be observed, take the following countermeasures. () In the case when the above condition cannot be observed such that D becomes 'L' at power ON. ontrol L and D as shown below, to make L and D, 'H' and 'H'. V tlow L D fter Vcc becomes stable fter Vcc becomes stable tdh tu:d tu:d Figure 52. When L= 'H' and D= 'L' Figure 53. When L='L' and D='L' (2) In the case when the above condition 2 cannot be observed. fter power source becomes stable, execute software reset (PGE 6). (3) In the case when the above conditions and 2 cannot be observed. arry out (), and then carry out (2). Low Voltage Malfunction Prevention Function LV circuit prevents data rewrite operation at low power, and prevents write error. t LV voltage (yp =.2V) or below, data rewrite is prevented. Noise ountermeasures. Bypass apacitor When noise or surge gets in the power source line, malfunction may occur, therefore, it is recommended to connect a bypass capacitor (.µf) between I Vcc and GND pins. onnect the capacitor as close to I as possible. In addition, it is also recommended to connect a bypass capacitor between board s Vcc and GND. 23 ROHM o., Ltd. ll rights reserved. Z22 5 2/34 Z22-R2RG3--2

22 BR2428-W Operational Notes. Described numeric values and data are design representative values only, and the values are not guaranteed. 2. We believe that the application circuit examples in this document are recommendable. However, in actual use, confirm characteristics further sufficiently. If changing the fixed number of external parts is desired, make your decision with sufficient margin in consideration of static characteristics, transient characteristics, and fluctuations of external parts and our LI. 3. bsolute maximum ratings If the absolute maximum ratings such as supply voltage, operating temperature range, and so on are exceeded, LI may be destroyed. Do not supply voltage or subject the I to temperatures exceeding the absolute maximum ratings. In the case of fear of exceeding the absolute maximum ratings, take physical safety countermeasures such as adding fuses, and see to it that conditions exceeding the absolute maximum ratings should not be supplied to the LI. 4. GND electric potential et the voltage of GND terminal lowest at any operating condition. Make sure that each terminal voltage is not lower than that of GND terminal. 5. hermal design Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions 6. hort between pins and mounting errors Be careful when mounting the I on printed circuit boards. he I may be damaged if it is mounted in a wrong orientation or if pins are shorted together. hort circuit may be caused by conductive particles caught between the pins. 7. Operating the I in the presence of strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently. 23 ROHM o., Ltd. ll rights reserved. Z /34 Z22-R2RG3--2

23 BR2428-W Part Numbering B R x x x - W x x x BU ype 24:I 2 Operating emperature/ Power ource Voltage -4 to +85 /.6V to 5.5V apacity 28=28 Package Blank F FJ FV FV FVJ FVM NUX :DIP-8 (), DIP8 :OP8 Double ell :OP-J8 : OP-B8 : OP-B8 : OP-B8J : MOP8 : VON8X23 Blank Z :DIP-8 (), OP8, OP-J8, OP-B8, OP-B8, OP-B8J, MOP8, VON8X23 :DIP8 Packaging and Forming pecification E2 : Embossed tape and reel (OP8,OP-J8, OP-B8,OP-B8, OP-B8J) R : Embossed tape and reel (MOP8, VON8X23) None : ube (DIP-8 (), DIP8) () Not Recommended for New Designs. Recommend BR2428-WZ. 23 ROHM o., Ltd. ll rights reserved. Z /34 Z22-R2RG3--2

24 BR2428-W Physical Dimension and Packing Information Package Name DIP-8 <ontainer Information> 23 ROHM o., Ltd. ll rights reserved. Z /34 Z22-R2RG3--2

25 BR2428-W Physical Dimension and Packing Information - continued Package Name DIP8 23 ROHM o., Ltd. ll rights reserved. Z /34 Z22-R2RG3--2

26 BR2428-W Physical Dimension and Packing Information - continued Package Name OP8 (Max 5.35 (include.burr)) (UNI: mm) PG: OP8 Drawing No.: EX ROHM o., Ltd. ll rights reserved. Z /34 Z22-R2RG3--2

27 BR2428-W Physical Dimension and Packing Information - continued Package Name OP-J8 23 ROHM o., Ltd. ll rights reserved. Z /34 Z22-R2RG3--2

28 BR2428-W Physical Dimension and Packing Information - continued Package Name OP-B8 23 ROHM o., Ltd. ll rights reserved. Z /34 Z22-R2RG3--2

29 BR2428-W Physical Dimension and Packing Information - continued Package Name OP-B8 23 ROHM o., Ltd. ll rights reserved. Z /34 Z22-R2RG3--2

30 BR2428-W Physical Dimension and Packing Information - continued Package Name OP-B8J 23 ROHM o., Ltd. ll rights reserved. Z22 5 3/34 Z22-R2RG3--2

31 BR2428-W Physical Dimension and Packing Information - continued Package Name MOP8 23 ROHM o., Ltd. ll rights reserved. Z22 5 3/34 Z22-R2RG3--2

32 BR2428-W Physical Dimension and Packing Information continued Package Name VON8X23 23 ROHM o., Ltd. ll rights reserved. Z /34 Z22-R2RG3--2

33 4 2 8 BR2428-W Marking Diagrams (OP VIEW) DIP-8 (OP VIEW) Part Number Marking OP8 (OP VIEW) Part Number Marking BR2428 LO Number LO Number PIN MR DIP8 (OP VIEW) B R Part Number Marking LO Number OP-B8 (OP VIEW) Part Number Marking LO Number OP-J8 (OP VIEW) Part Number Marking LO Number OP-B8J (OP VIEW) Part Number Marking PIN MR LO Number PIN MR PIN MR OP-B8 (OP VIEW) Part Number Marking (,, 2, L, WP) LO Number VON8X23 (OP VIEW) Part Number Marking LO Number PIN MR PIN MR MOP8 (OP VIEW) Part Number Marking LO Number PIN MR 23 ROHM o., Ltd. ll rights reserved. Z /34 Z22-R2RG3--2

34 BR2428-W Revision History Date Revision hanges 8.May.22 New Release 25.Feb.23 2 Update some English words, sentences descriptions, grammar and formatting. dd tf2 in erial Input / Output iming 3.May.23 3 P hange format of package line-up table. P.2 dd VED in bsolute Maximum Ratings P.4 dd directions in Pin Descriptions 3.ep.28 4 dd DIP8 hange DIP-8 to Not Recommended for New Designs hange Physical Dimension ape and Reel Information 23 ROHM o., Ltd. ll rights reserved. Z /34 Z22-R2RG3--2

35 Notice Precaution on using ROHM Products. Our Products are designed and manufactured for application in ordinary electronic equipment (such as V equipment, O equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note ), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( pecific pplications ), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM s Products for pecific pplications. (Note) Medical Equipment lassification of the pecific pplications JPN U EU HIN LⅢ LⅡb LⅢ LⅢ LⅣ LⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. he following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. ccordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including l2, H2, NH3, O2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] ealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. he Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. void applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. onfirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / ircuit board design. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PG-E 25 ROHM o., Ltd. ll rights reserved. Rev.3

36 Precautions Regarding pplication Examples and External ircuits. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. herefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic his Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for torage / ransportation. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including l2, H2, NH3, O2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. tore / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label two-dimensional barcode printed on ROHM Products label is for ROHM s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign rade act ince concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights. ll information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution. his document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. he Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. he proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PG-E 25 ROHM o., Ltd. ll rights reserved. Rev.3

37 General Precaution. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM s Products against warning, caution or note contained in this document. 2. ll information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM s Products, please confirm the latest information with a ROHM sales representative. 3. he information contained in this document is provided on an as is basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice WE 25 ROHM o., Ltd. ll rights reserved. Rev.