BR24G16FVM-3A. Datasheet. I 2 C BUS EEPROM (2-Wire) Serial EEPROM series Standard EEPROM 1/33

Transcription

1 erial EEPOM series tandard EEPOM I 2 BU EEPOM (2-Wire) B24G6-3 General Description B24G6-3 is a serial EEPOM of I 2 BU interface method Features ompletely conforming to the world standard I 2 BU. ll controls available by 2 ports of serial clock(l) and serial data(d) Other devices than EEPOM can be connected to the same port, saving microcontroller port.6v to 5.5V single power source action most suitable for battery use MHz action is possible (.7V to 5.5V) Up to 6 bytes in page write mode elf-timed programming cycle Low current consumption Prevention of write mistake Write (write protect) function added Prevention of write mistake at low voltage More than million write cycles More than 4 years data retention Noise filter built in L / D terminal Initial delivery state FFh Packages W(yp.) x D(yp.)x H(Max.) DIP-8 9.3mm x 6.5mm x 7.mm OP8 5.mm x 6.2mm x.7mm OP-B8J 3.mm x 4.9mm x.mm MOP8 2.9mm x 4.mm x.9mm OP-J8 4.9mm x 6.mm x.65mm VON8X23 2.mm x 3.mm x.6mm OP-B8 3.mm x 6.4mm x.2mm Figure. B24G6-3 apacity Bit Format ype B24G6-3 B24G6F-3 B24G6FJ-3 Power ource Voltage Package DIP-8 OP8 OP-J8 6bit 2 8 B24G6FV-3.6V to 5.5V OP-B8 B24G6FVJ-3 OP-B8J B24G6FVM-3 MOP8 B24G6NUX-3 VON8X23 Product structure:ilicon monolithic integrated circuit his product is not designed protection against radioactive rays. m Z22-2G OHM o., Ltd. ll rights reserved. /33 Z ug.24 EV.3

2 B24G6-3 bsolute Maximum atings (a=25 ) Parameter ymbol atings Unit emarks upply Voltage V -.3 to +6.5 V 45 (OP8) When using at a=25 or higher 4.5mW to be reduced per. 45 (OP-J8) When using at a=25 or higher 4.5mW to be reduced per. 33 (OP-B8) When using at a=25 or higher 3.3mW to be reduced per. Power Dissipation Pd 3 (OP-B8J) mw When using at a=25 or higher 3.mW to be reduced per. 3 (MOP8) When using at a=25 or higher 3.mW to be reduced per. 3 (VON8X23) When using at a=25 or higher 3.mW to be reduced per. 8 (DIP-8) When using at a=25 or higher 8.mW to be reduced per. torage emperature stg -65 to +5 Operation emperature opr -4 to +85 Input Voltage/ Output Voltage -.3 to Vcc+. V he Max value of Input voltage / output voltage is not over 6.5V. When the pulse width is 5ns or less, the Min value of input voltage / output voltage is not under -.V. Junction emperature jmax 5 Junction temperature at the storage condition Electrostatic discharge voltage (human body model) VED -4 to +4 V Memory ell haracteristics (a=25, Vcc=.6V to 5.5V) Parameter Limits Min. yp. Max Unit Write cycles *,, - - imes Data retention * Years *Not % EED ecommended Operating atings Parameter ymbol atings Unit upply voltage Vcc.6 to 5.5 V Input voltage VIN to Vcc D haracteristics (Unless otherwise specified, a=-4 to +85, Vcc =.6 to 5.5V) Parameter ymbol Limits Min. yp. Max. Unit onditions Input High Voltage VIH.7Vcc - Vcc+. V.7V Vcc 5.5V Input Low Voltage VIL -.3 * -.3Vcc V.7V Vcc 5.5V Input High Voltage2 VIH2.8Vcc - Vcc+. V.6V Vcc<.7V Input Low Voltage2 VIL2 -.3 * -.2Vcc V.6V Vcc<.7V Output Low Voltage VOL V IOL=3.m, 2.5V Vcc 5.5V (D) Output Low Voltage2 VOL V IOL=.7m,.6V Vcc<2.5V (D) Input Leakage urrent ILI - - μ VIN= to Vcc Output Leakage urrent ILO - - μ VOU= to Vcc (D) upply urrent (Write) I upply urrent (ead) I tandby urrent IB μ * When the pulse width is 5ns or less, it is -.V. m Vcc=5.5V, fl=mhz, tw=5ms, Byte write, page write Vcc=5.5V, fl=mhz andom read, current read, sequential read Vcc=5.5V, D, L=Vcc,, 2=GND,WP=GND 24 OHM o., Ltd. ll rights reserved. Z22 5 2/33 Z22-2G ug.24 EV.3

3 B24G6-3 haracteristics (Unless otherwise specified, a=-4 to +85 ) Parameter ymbol Limits (.6V Vcc<.7V) Limits (.7V Vcc 5.5V) Unit Min. yp. Max. Min. yp. Max. lock Frequency fl khz Data lock HIGH Period thigh µs Data lock LOW Period tlow µs D, L (INPU) ise ime * t µs D, L (INPU) Fall ime * tf µs D (OUPU) Fall ime * tf µs tart ondition Hold ime thd: µs tart ondition etup ime tu: µs Input Data Hold ime thd:d ns Input Data etup ime tu:d ns Output Data Delay ime tpd µs Output Data Dold ime tdh µs top ondition etup ime tu:o µs Bus Free ime tbuf µs Write ycle ime tw ms Noise pike Width (D, L) ti µs WP Hold ime thd:wp µs WP etup ime tu:wp µs WP High Period thigh:wp µs * Not % tested haracteristics ondition Parameter ymbol ondition Unit Load apacitance L pf D, L (INPU) ise ime t 2 ns D, L (INPU) Fall ime tf 2 ns Input Data Level VIL/VIH.2Vcc/.8Vcc V Input/Output Data iming eference Level -.3Vcc/.7Vcc V 24 OHM o., Ltd. ll rights reserved. Z22 5 3/33 Z22-2G ug.24 EV.3

4 B24G6-3 erial Input / Output timing t tf thigh L 7% 7% 7% 7% 7% thd: 3% 3% 3% tlow tu:d 3% thd:d D (INPU) ( 入力 ) 7% tbuf 7% 7% 3% tpd 7% 3% tdh D (OUPU) ( 出力 ) 7% Input read at the rise edge of L Data output in sync with the fall of L 7% 3% 3% 3% tf2 Figure 2-(a). erial input / output timing 7% 7% 7% tu: thd: tu:o 7% 3% 3% ONDIION OP ONDIION Figure 2-(b). tart-stop bit timing D 7% 7% write data (n-th address) tw OP ONDIION ONDIION Figure 2-(c). Write cycle timing 7% D D() D D(n) 7% tw 3% 3% tu:wp thd:wp OP ONDIION Figure 2-(d). WP timing at write execution D() D(n) D D 7% thigh:wp tw 7% 7% Figure 2-(e). WP timing at write cancel 24 OHM o., Ltd. ll rights reserved. Z22 5 4/33 Z22-2G ug.24 EV.3

5 B24G6-3 Block Diagram * 6bit EEPOM array 8 V cc 8bit * 2 ddress decoder bit Word address register Data register 7 WP *2 3 ontrol circuit OP 6 L GND 4 High voltage generating circuit Power source voltage detection 5 D *,, 2=Don't use Figure 3. Block diagram Pin onfiguration 8 Vcc 2 B24G6-3 7 WP L GND 4 5 D Pin Descriptions erminal Name Input/ Output Function Input Don t use* Input Don t use* 2 Input Don t use* GND - eference voltage of all input / output, V D Input/ output erial data input serial data output L Input erial clock input WP Input Write protect terminal Vcc - onnect the power source. *Pins not used as device address may be set to any of H, L, and Hi-Z. 24 OHM o., Ltd. ll rights reserved. Z22 5 5/33 Z22-2G ug.24 EV.3

6 B24G6-3 ypical Performance urves (he following values are yp. ones) 6 6 INPU HIGH VOLGE: V IH (V) a=-4 a= 25 a= 85 INPU LOW VOLGE: V IL (V) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 4. Input High Voltage,2 VIH,2 (L, D, WP) Figure 5. Input Low Voltage,2 VIL,2 (L, D, WP) OUPU LOW VOLGE: V OL (V) a=-4 a= 25 a= 85 OUPU LOW VOLGE: V OL2 (V) a=-4 a= 25 a= L OUPU UEN: I OL (m) L OUPU UEN: I OL (m) Figure 6. Output Low Voltage VOL (Vcc=2.5V) Figure 7. Output Low Voltage2 VOL2 (Vcc=.6V) 24 OHM o., Ltd. ll rights reserved. Z22 5 6/33 Z22-2G ug.24 EV.3

7 B24G6-3 ypical Performance urves ontinued.2.2 INPU LEGE UEN: I LI (µ) a=-4 a= 25 a= 85 OUPU LEGE UEN: I LO (µ) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 8. Input Leakage urrent ILI (L, WP) Figure 9. Output Leakage urrent ILO (D) UPPLY UEN (WIE) : Icc(m) a=-4 a= 25 a= 85 UPPLY UEN (ED) : Icc2(m) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure. upply urrent (WIE) I (fscl=mhz) Figure. upply urrent (ED) I2 (fscl=mhz) 24 OHM o., Ltd. ll rights reserved. Z22 5 7/33 Z22-2G ug.24 EV.3

8 B24G6-3 ypical Performance urves ontinued 2.5 NDBY UEN: I B (µ) a=-4 a= 25 a= 85 L FEQUENY: fscl(khz) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 2. tandby urrent IB Figure 3. lock Frequency fl.4.6 D L H IME : t HIGH (µs).3.2. a=-4 a= 25 a= 85 D L L IME : t LOW (µs) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 4. Data lock High Period thigh Figure 5. Data lock Low Period tlow 24 OHM o., Ltd. ll rights reserved. Z22 5 8/33 Z22-2G ug.24 EV.3

9 B24G6-3 ypical Performance urves ontinued.4.3 D (OUPU) FLL IME: t F2 (µs) a=-4 a= 25 a= 85 ONDIION HOLD IME: t HD: (µs) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 6. D (OUPU) Fall ime tf2 Figure 7. tart ondition Hold ime thd:.3 5 ONDIION EUP IME: t U: (µs) a=-4 a= 25 a= INPU D HOLD IME: t HD:D (ns) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 8. tart ondition etup ime tu: Figure 9. Input Data Hold ime thd:d (HIGH) 24 OHM o., Ltd. ll rights reserved. Z22 5 9/33 Z22-2G ug.24 EV.3

10 B24G6-3 ypical Performance urves ontinued 5 6 INPU D HOLD IME: t HD:D (ns) -5 - a=-4 a= 25 a= 85 INPU D E UP IME: t U:D (ns) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 2. Input Data Hold ime thd:d (LOW) Figure 2. Input Data etup ime tu:d (HIGH) INPU D E UP IME: t U:D (ns) a=-4 a= 25 a= OUPU D DELY IME: t PD (µs) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 22. Input Data etup ime tu:d(low) Figure 23. L Output Data Delay ime tpd 24 OHM o., Ltd. ll rights reserved. Z22 5 /33 Z22-2G ug.24 EV.3

11 B24G6-3 ypical Performance urves ontinued OUPU D DELY IME: t PD (µs) a=-4 a= 25 a= OP ONDIION E UP IME: t U:O (µs) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 24. H Output Data Delay ime tpd Figure 25. top ondition etup ime tu:o.6 6 BU OPEN IME BEFOE NMIION: t BUF (µs) a=-4 a= 25 a= 85 INENL WIING YLE IME: t W (ms) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 26. Bus Free ime tbuf Figure 27. Write ycle ime tw 24 OHM o., Ltd. ll rights reserved. Z22 5 /33 Z22-2G ug.24 EV.3

12 B24G6-3 ypical Performance urves ontinued NOIE EDUION EFEIVE IME: t I (L H)(µs) a=-4 a= 25 a= 85 NOIE EDUION EFEIVE IME: t I (L L)(µs) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 28. Noise pike Width ti (L H) Figure 29. Noise pike Width ti (L L) NOIE EDUION EFEIVE IME: t I (D H)(µs) a=-4 a= 25 a= 85 NOIE EDUION EFEIVE IME: t I (D L)(µs) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 3. Noise pike Width ti (D H) Figure 3. Noise pike Width ti (D L) 24 OHM o., Ltd. ll rights reserved. Z22 5 2/33 Z22-2G ug.24 EV.3

13 B24G6-3 ypical Performance urves ontinued.2.2 WP D HOLD IME: t HD:WP (µs) a=-4 a= 25 a= 85 WP D E UP IME: t U:WP (µs) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) UPPLY VOLGE: Vcc(v) Figure 32. WP Hold ime thd:wp Figure 33. WP etup ime tu:wp.2 WP EFEIVE IME: t HIGH:WP ( µs) a=-4 a= 25 a= UPPLY VOLGE: Vcc(v) Figure 34. WP High Period thigh:wp 24 OHM o., Ltd. ll rights reserved. Z22 5 3/33 Z22-2G ug.24 EV.3

14 B24G6-3 iming hart I 2 BU data communication I 2 BU data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long, and acknowledge is always required after each byte. I 2 BU carries out data transmission with plural devices connected by 2 communication lines of serial data (D) and serial clock (L). mong devices, there are master that generates clock and control communication start and end, and slave that is controlled by address peculiar to devices. EEPOM becomes slave. nd the device that outputs data to bus during data communication is called transmitter, and the device that receives data is called receiver. D L DDE /W D D condition Figure 35. Data transfer timing P OP condition tart condition (tart bit recognition) Before executing each command, start condition (start bit) where D goes from 'HIGH' down to 'LOW' when L is 'HIGH' is necessary. his I always detects whether D and L are in start condition (start bit) or not, therefore, unless this confdition is satisfied, any command is executed. top condition (stop bit recongnition) Each command can be ended by D rising from 'LOW' to 'HIGH' when stop condition (stop bit), namely, L is 'HIGH' cknowledge () signal his acknowledge () signal is a software rule to show whether data transfer has been made normally or not. In master and slave, the device (μ-om at slave address input of write command, read command, and this I at data output of read command) at the transmitter (sending) side releases the bus after output of 8bit data. he device (this I at slave address input of write command, read command, and μ-om at data output of read command) at the receiver (receiving) side sets D 'LOW' during 9 clock cycles, and outputs acknowledge signal ( signal) showing that it has received the 8bit data. his I, after recognizing start condition and slave address (8bit), outputs acknowledge signal ( signal) 'LOW'. Each write action outputs acknowledge signal ( signal) 'LOW', at receiving 8bit data (word address and write data). Each read action outputs 8bit data (read data), and detects acknowledge signal ( signal) 'LOW'. When acknowledge signal ( signal) is detected, and stop condition is not sent from the master (μ-om) side, this I continues data output. When acknowledge signal ( signal) is not detected, this I stops data transfer, and recognizes stop cindition (stop bit), and ends read action. nd this I gets in status. Device addressing Output slave address after start condition from master. he significant 4 bits of slave address are used for recognizing a device type. he device code of this I is fixed to ''. he most insignificant bit (/W --- ED / WIE) of slave address is used for designating write or read action, and is as shown below. etting / W to write (setting to word address setting of random read) etting / W to read ype lave address Maximum number of onnected buses B24G6-3 P2 P P /W P~P2 are page select bits. 24 OHM o., Ltd. ll rights reserved. Z22 5 4/33 Z22-2G ug.24 EV.3

15 B24G6-3 Write ommand Write cycle rbitrary data is written to EEPOM. When to write only byte, byte write is normally used, and when to write continuous data of 2 bytes or more, simultaneous write is possible by page write cycle. Up to 6 arbitrary bytes can be written. LVE DDE W I E WOD DDE D O P D LINE P2 P P W 7 W D7 D / W Figure 36. Byte write cycle LVE DDE W I E WOD DDE(n) D(n) D(n+5) O P D LINE P2 P P W 7 W D7 D D / W Figure 37. Page write cycle During internal write execution, all input commands are ignored, therefore is not sent back. Data is written to the address designated by word address (n-th address) By issuing stop bit after 8bit data input, write to memory cell inside starts. When internal write is started, command is not accepted for tw (5ms at maximum). By page write cycle, data up to 6 bytes can be written in bulk. nd when data of the maximum bytes or higher is sent, data from the first byte is overwritten. (efer to "Internal address increment") s for page write command of B24G6-3, after page select bit P,P,P2 of slave address are designated arbitrarily, by continuing data input of 2 bytes or more, the address of insignificant 4 bits is incremented internally, and data up to 6 bytes can be written. 24 OHM o., Ltd. ll rights reserved. Z22 5 5/33 Z22-2G ug.24 EV.3

16 B24G6-3 Notes on write cycle continuous input he maximum page numbers of B24G6-3 are 6 bytes. ny bytes below these can be written. page=6bytes, but the page write cycle time is 5ms at maximum for 6byte bulk write. It does not stand 5ms at maximum 6byte=8ms(Max.) Internal address increment Page write mode W7 W4 W3 W2 W W Increment Eh ignificant bit is fixed. No digit up For example, when it is started from address Eh, therefore, increment is made as below, Eh Fh h h which please note. Eh E in hexadecimal, therefore, becomes a binary number. Write protect (WP) terminal Write protect (WP) function When WP terminal is set Vcc (H level), data rewrite of all addresses is prohibited. When it is set GND (L level), data rewrite of all address is enabled. Be sure to connect this terminal to Vcc or GND, or control it to H level or L level. Do not use it open. In the case of use it as an OM, it is recommended to connect it to pull up or Vcc. t extremely low voltage at power ON / OFF, by setting the WP terminal 'H', mistake write can be prevented. 24 OHM o., Ltd. ll rights reserved. Z22 5 6/33 Z22-2G ug.24 EV.3

17 B24G6-3 ead ommand ead cycle Data of EEPOM is read. In read cycle, there are random read cycle and current read cycle. andom read cycle is a command to read data by designating address, and is used generally. urrent read cycle is a command to read data of internal address register without designating address, and is used when to verify just after write cycle. In both the read cycles, sequential read cycle is available, and the next address data can be read in succession. LVE DDE W I E WOD DD E(n) LVE DDE E D D(n) O P D LINE P2 P P W 7 W P2P P D7 D / W / W Figure 38. andom read cycle LVE DDE E D D(n) O P D LINE P2PP D7 D / W Figure 39. urrent read cycle LVE DDE E D D(n) D(n+x) O P D LINE P2 PP D7 D D7 D / W Figure 4. equential read cycle (in the case of current read l ) In random read cycle, data of designated word address can be read. When the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle), data of incremented last read address (n)-th address, i.e., data of the (n+)-th address is output. When signal 'LOW' after D is detected, and stop condition is not sent from master (μ-om) side, the next address data can be read in succession. ead cycle is ended by stop condition where 'H' is input to signal after D and D signal is started at L signal 'H'. When 'H' is not input to signal after D, sequential read gets in, and the next data is output. herefore, read command cycle cannot be ended. When to end read command cycle, be sure input stop condition to input 'H' to signal after D, and to start D at L signal 'H'. equential read is ended by stop condition where 'H' is input to signal after arbitrary D and D is started at L signal 'H'. 24 OHM o., Ltd. ll rights reserved. Z22 5 7/33 Z22-2G ug.24 EV.3

18 B24G6-3 oftware eset oftware reset is executed when to avoid malfunction after power on, and to reset during command input. oftware reset has several kinds, and 3 kinds of them are shown in the figure below. (efer to Figure 4-(a), Figure 4-(b), Figure 4-(c)) In dummy clock input area, release the D bus ('H' by pull up). In dummy clock area, output and read data '' (both 'L' level) may be output from EEPOM, therefore, if 'H' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices. Dummy clock x 4 tart x 2 L D Normal command Normal command Figure 4-(a). Dummy clock x command input tart Dummy clock x 9 tart L D Normal command Normal command Figure 4-(b). + dummy clock x command input tart x 9 L D Normal command Normal command Figure 4-(c). x 9 + command input tart command from input. cknowledge Polling During internal write execution, all input commands are ignored, therefore is not sent back. During internal automatic write execution after write cycle input, next command (slave address) is sent, and if the first signal sends back 'L', then it means end of write action, while if it sends back 'H', it means now in writing. By use of acknowledge polling, next command can be executed without waiting for tw = 5ms. When to write continuously, /W =, when to carry out current read cycle after write, slave address /W = is sent, and if signal sends back 'L', then execute word address input and data output and so forth. First write command During internal write, = HIGH is sent back. Write command O P lave address H tw lave address H econd write command lave address tw H lave address L Word address L Data L O P fter completion of internal write, =LOW is sent back, so input next word address and data in succession. Figure 42. ase to continuously write by acknowledge polling 24 OHM o., Ltd. ll rights reserved. Z22 5 8/33 Z22-2G ug.24 EV.3

19 B24G6-3 WP Valid iming (Write ancel) WP is usually fixed to 'H' or 'L', but when WP is used to cancel write cycle and so forth, pay attention to the following WP valid timing. During write cycle execution, in cancel valid area, by setting WP='H', write cycle can be cancelled. In both byte write cycle and page write cycle, the area from the first start condition of command to the rise of clock to taken in D of data(in page write cycle, the first byte data) is cancel invalid area. WP input in this area becomes don't care. he area from the rise of L to take in D to input the stop condition is cancel valid area. nd, after execution of forced end by WP, standby status gets in. ise of D taken clock ise of D L L D D D D D Enlarged view Enlarged view D WP lave address L Word address L D7 D6 D5 D4 D3 D2 D D WP cancel invalid area L Data WP cancel valid area Data is not written. L O P tw WP cancel invalid area Figure 43. WP valid timing ommand ancel by tart ondition and top ondition During command input, by continuously inputting start condition and stop condition, command can be cancelled. (Figure 44) However, in output area and during data read, D bus may output 'L', and in this case, start condition and stop condition cannot be input, so reset is not available. herefore, execute software reset. nd when command is cancelled by start, stop condition, during random read cycle, sequential read cycle, or current read cycle, internal setting address is not determined, therefore, it is not possible to carry out current read cycle in succession. When to carry out read cycle in succession, carry out random read cycle. L D tart condition top condition Figure 44. ase of cancel by start, stop condition during slave address input 24 OHM o., Ltd. ll rights reserved. Z22 5 9/33 Z22-2G ug.24 EV.3

20 B24G6-3 I/O Peripheral ircuit Pull up resistance of D terminal D is NMO open drain, so requires pull up resistance. s for this resistance value (PU), select an appropriate value to this resistance value from microcontroller VIL, IL, and VOL-IOL characteristics of this I. If PU is large, action frequency is limited. he smaller the PU, the larger the supply current. Maximum value of PU he maximum value of PU is determined by the following factors. D rise time to be determined by the capacitance (BU) of bus line of PU and D should be t or below. nd timing should be satisfied even when D rise time is late. 2he bus electric potential to be determined by input leak total (IL) of device connected to bus at output of 'H' to D bus and PU should sufficiently secure the input 'H' level (VIH) of microcontroller and EEPOM including recommended noise margin.2vcc. V-ILPU-.2 V VIH PU.8V-VIH IL Ex.) V =3V IL=μ VIH=.7 V from2 PU Microcontroller IL PU IL EEPOM D terminal 3 [kω] Bus line capacity BU Figure 45. I/O circuit diagram Minimum value of PU he minimum value of PU is determined by the following factors. When I outputs LOW, it should be satisfied that VOLMX=.4V and IOLMX=3m. V-VOL PU IOL PU V-VOL IOL 2VOLMX=.4V should secure the input 'L' level (VIL) of microcontroller and EEPOM including recommended noise margin.vcc. VOLMX VIL-. V Ex.) V =3V, VOL=.4V, IOL=3m, microcontroller, EEPOM VIL=.3Vcc from PU [Ω] nd VOL=.4[V] VIL=.3 3 =.9[V] herefore, the condition 2 is satisfied. Pull up resistance of L terminal When L control is made at MO output port, there is no need, but in the case there is timing where L becomes 'Hi-Z', add a pull up resistance. s for the pull up resistance, one of several kω to several ten kω is recommended in consideration of drive performance of output port of microcontroller. 24 OHM o., Ltd. ll rights reserved. Z22 5 2/33 Z22-2G ug.24 EV.3

21 B24G6-3 autions on Microcontroller onnection In I 2 BU, it is recommended that D port is of open drain input/output. However, when to use MO input / output of tri state to D port, insert a series resistance s between the pull up resistance pu and the D terminal of EEPOM. his is controls over current that occurs when PMO of the microcontroller and NMO of EEPOM are turned ON simultaneously. s also plays the role of protection of D terminal against surge. herefore, even when D port is open drain input/output, s can be used. L PU D 'H' output of microcontroller 'L' output of EEPOM Microcontroller EEPOM Figure 46. I/O circuit diagram Over current flows to D line by 'H' output of microcontroller and 'L' output of EEPOM. Figure 47. Input / output collision timing Maximum value of s he maximum value of s is determined by the following relations. D rise time to be determined by the capacity (BU) of bus line of pu and D should be t or below. nd timing should be satisfied even when D rise time is late. 2he bus electric potential to be determined by pu and s the moment when EEPOM outputs 'L' to D bus sufficiently secure the input 'L' level (VIL) of microcontroller including recommended noise margin.vcc. V PU (V-VOL) PU+ + VOL+.V VIL IOL VOL VIL-VOL-.V.V-VIL PU VIL Bus line capacity BU Micro controller EEPOM Ex.)V=3V VIL=.3V VOL=.4V PU=2kΩ Figure 48. I/O ircuit Diagram.67[kΩ] Minimum value of s he minimum value of s is determined by over current at bus collision. When over current flows, noises in power source line, and instantaneous power failure of power source may occur. When allowable over current is defined as I, the following relation must be satisfied. Determine the allowable current in consideration of impedance of power source line in set and so forth. et the over current to EEPOM m or below. V I PU 'L'output V I Over current I 'H' output Microcontroller EEPOM Figure 49. I/O circuit diagram Ex.) V=3V, I=m 3-3 3[Ω] 24 OHM o., Ltd. ll rights reserved. Z22 5 2/33 Z22-2G ug.24 EV.3

22 B24G6-3 I/O Equivalence ircuit Input (L, WP) Input / output (D) Figure 5. Input pin circuit diagram Figure 5. Input / output pin circuit diagram Power-up / Down onditions t power on, in I internal circuit and set, Vcc rises through unstable low voltage area, and I inside is not completely reset, and malfunction may occur. o prevent this, functions of PO circuit and LV circuit are equipped. o assure the action, observe the following conditions at power on.. et D = 'H' and L ='L' or 'H 2. tart power source so as to satisfy the recommended conditions of t, toff, and Vbot for operating PO circuit. t V ecommended conditions of t, toff,vbot t toff Vbot ms or below ms or larger.3v or below toff Vbot or below ms or larger.2v or below Figure 52. ise waveform diagram 3. et D and L so as not to become 'Hi-Z'. When the above conditions and 2 cannot be observed, take the following countermeasures. a) In the case when the above condition cannot be observed. When D becomes 'L' at power on. ontrol L and D as shown below, to make L and D, 'H' and 'H'. V tlow L D fter Vcc becomes stable fter Vcc becomes stable tdh tu:d tu:d Figure 53. When L= 'H' and D= 'L' Figure 54. When L='L' and D='L' b) In the case when the above condition 2 cannot be observed. fter power source becomes stable, execute software reset(p8). c) In the case when the above conditions and 2 cannot be observed. arry out a), and then carry out b). Low Voltage Malfunction Prevention Function LV circuit prevents data rewrite action at low power, and prevents wrong write. t LV voltage (yp. =.2V) or below, it prevent data rewrite. Noise ountermeasures Bypass capacitor When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended to attach a by pass capacitor (.μf) between I Vcc and GND. t that moment, attach it as close to I as possible. nd, it is also recommended to attach a bypass capacitor between board Vcc and GND. 24 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G ug.24 EV.3

23 B24G6-3 Operational Notes () Described numeric values and data are design representative values, and the values are not guaranteed. (2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static characteristics and transition characteristics and fluctuations of external parts and our LI. (3) bsolute maximum ratings If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, LI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum ratings should not be impressed to LI. (4) GND electric potential et the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of GND terminal. (5) erminal design In consideration of permissible loss in actual use condition, carry out heat design with sufficient margin. (6) erminal to terminal shortcircuit and wrong packaging When to package LI onto a board, pay sufficient attention to LI direction and displacement. Wrong packaging may destruct LI. nd in the case of shortcircuit between LI terminals and terminals and power source, terminal and GND owing to foreign matter, LI may be destructed. (7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently. 24 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G ug.24 EV.3

24 B24G6-3 Part Numbering B 2 4 G 6 x x x - 3 x x x x BU type 24 : I 2 Operating temperature/ Operating Voltage -4 to +85 /.6V to 5.5V apacity 6=6 Package Blank : DIP-8 FJ : OP-J8 FVJ : OP-B8J NUX : VON8X23 F FV FVM : OP8 : OP-B8 : MOP8 Process code evision G : Halogen free Blank : Not Halogen free s an exception, VON8X23 package will be Halogen free with Blank Blank : % n : % n Packaging and forming specification E2 : Embossed tape and reel (OP8, OP-J8, OP-B8, OP-B8J) : Embossed tape and reel (MOP8, VON8X23) None : ube (DIP-8) Lineup apacity 6 Package ype Quantity Orderable Part Number emark DIP-8 ube of 2 B24G6-3 Not Halogen free % n OP8 B24G6F -3GE2 Halogen free % n eel of 25 OP-J8 B24G6FJ -3GE2 Halogen free % n OP-B8 eel of 3 B24G6FV -3GE2 Halogen free % n OP-B8J eel of 25 B24G6FVJ -3GE2 Halogen free % n MOP8 eel of 3 B24G6FVM -3G Halogen free % n VON8X23 eel of 4 B24G6NUX -3 Halogen free % n 24 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G ug.24 EV.3

25 B24G6-3 Physical Dimensions ape and eel Information DIP-8 9.3± ± ±.3.5Min ± ±. 5.3±. (Unit : mm) <ape and eel information> ontainer ube Quantity 2pcs Direction of feed Direction of products is fixed in a container tube Order quantity needs to be multiple of the minimum quantity. 24 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G ug.24 EV.3

26 B24G6-3 OP8 5.±.2 (MX 5.35 include BU) ±.3 4.4±.2.3MIN.9± ± ±. (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 25pcs E2 he direction is the pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand ( ) eel Direction of feed pin Order quantity needs to be multiple of the minimum quantity. 24 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G ug.24 EV.3

27 B24G6-3 OP-J8 4.9±.2 (MX 5.25 include BU) ±.3 3.9±.2.45MIN ±..375± ±.. (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 25pcs E2 he direction is the pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand ( ) eel Direction of feed pin Order quantity needs to be multiple of the minimum quantity. 24 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G ug.24 EV.3

28 B24G6-3 OP-B8 3.±. (MX 3.35 include BU) ± 4.2MX.±.5 6.4±.2 4.4±..± PIN M ±.5.8 M.± (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 3pcs E2 he direction is the pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand ( ) eel pin Direction of feed Order quantity needs to be multiple of the minimum quantity. 24 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G ug.24 EV.3

29 B24G6-3 OP-B8J 3.±. (MX 3.35 include BU) ± 4 4.9±.2 3.±..MX.85±.5.± PIN M ±.5.95± M (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 25pcs E2 he direction is the pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand ( ) eel pin Direction of feed Order quantity needs to be multiple of the minimum quantity. 24 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G ug.24 EV.3

30 B24G6-3 MOP8 4.±.2 2.9±. (MX 3.25 include BU) 2.8± ±.5.6± MX.75±.5.8± PIN M (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 3pcs he direction is the pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand ( ) pin eel Direction of feed Order quantity needs to be multiple of the minimum quantity. 24 OHM o., Ltd. ll rights reserved. Z22 5 3/33 Z22-2G ug.24 EV.3

31 B24G6-3 VON8X23 2.±..6MX.8.5± ±. PIN M (.2) ± ± (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 4pcs he direction is the pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand ( ) eel pin Direction of feed Order quantity needs to be multiple of the minimum quantity. 24 OHM o., Ltd. ll rights reserved. Z22 5 3/33 Z22-2G ug.24 EV.3

32 B24G6-3 Marking Diagrams (OP VIEW) DIP-8 (OP VIEW) OP8(OP VIEW) Part Number Marking Part Number Marking B24G6 LO Number 4 G 6 LO Number PIN M OP-J8(OP VIEW) Part Number Marking OP-B8(OP VIEW) Part Number Marking 4 G 6 LO Number 4G6 LO Number PIN M PIN M OP-B8J(OP VIEW) Part Number Marking 4 G LO Number 6 3 MOP8(OP VIEW) 4 G E Part Number Marking LO Number PIN M PIN M VON8X23 (OP VIEW) 4 G 6 3 Part Number Marking LO Number PIN M 24 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G ug.24 EV.3

33 B24G6-3 evision History Date evision hanges 26.Dec.22 New elease 3.May.23 2 P hange format of package line-up table and change title. P.2 dd VED in bsolute Maximum atings 27.ug.24 3 P.3 Modified tu: (.25->.2) P.24 Update Part Numbering. dd Lineup able 24 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G ug.24 EV.3

34 Notice Precaution on using OHM Products. Our Products are designed and manufactured for application in ordinary electronic equipments (such as V equipment, O equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note ), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( pecific pplications ), please consult with the OHM sales representative in advance. Unless otherwise agreed in writing by OHM in advance, OHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any OHM s Products for pecific pplications. (Note) Medical Equipment lassification of the pecific pplications JPN U EU HIN LⅢ LⅡb LⅢ LⅢ LⅣ LⅢ 2. OHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. he following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. ccordingly, OHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any OHM s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including l2, H2, NH3, O2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] ealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. he Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. void applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on mbient temperature (a). When used in sealed area, confirm the actual ambient temperature. 8. onfirm that operation temperature is within the specified range described in the product specification. 9. OHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / ircuit board design. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the OHM representative in advance. For details, please refer to OHM Mounting specification Notice GE 23 OHM o., Ltd. ll rights reserved. ev.2

35 Precautions egarding pplication Examples and External ircuits. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. herefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. OHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic his Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for torage / ransportation. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including l2, H2, NH3, O2, and NO2 [b] the temperature or humidity exceeds those recommended by OHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under OHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. tore / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label Q code printed on OHM Products label is for OHM s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign rade act ince our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with OHM representative in case of export. Precaution egarding Intellectual Property ights. ll information and data including but not limited to application example contained in this document is for reference only. OHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. OHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of OHM or any third parties with respect to the information contained in this document. Other Precaution. his document may not be reprinted or reproduced, in whole or in part, without prior written consent of OHM. 2. he Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of OHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. he proper names of companies or products described in this document are trademarks or registered trademarks of OHM, its affiliated companies or third parties. Notice GE 23 OHM o., Ltd. ll rights reserved. ev.2

36 General Precaution. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. OHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny OHM s Products against warning, caution or note contained in this document. 2. ll information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using OHM s Products, please confirm the la test information with a OHM sale s representative. 3. he information contained in this doc ument is provi ded on an as is basis and OHM does not warrant that all information contained in this document is accurate an d/or error-free. OHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice WE 24 OHM o., Ltd. ll rights reserved. ev.