BR24T04FVM-W. Datasheet. I 2 C BUS EEPROM (2-Wire) Serial EEPROM Series Standard EEPROM. General Description. Packages W(Typ) x D(Typ) x H(Max)

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1 erial EEPOM eries tandard EEPOM I 2 BU EEPOM (2-Wire) B244-W General Description B244-W is a serial EEPOM of I 2 BU Interface Method Features Packages W(yp) x D(yp) x H(Max) ompletely conforming to the world standard I 2 BU. ll controls available by 2 ports of serial clock (L) and serial data (D) Other devices than EEPOM can be connected to the same port, saving microcontroller port.6v to 5.5V ingle Power ource ction most suitable for battery use.6v to 5.5V wide limit of action voltage, possible F MODE 4kHz action Page Write Mode useful for initial value write at factory shipment elf-timed Programming ycle Low urrent onsumption Prevention of Write Mistake Write (Write Protect) Function added Prevention of Write Mistake at Low Voltage More than million write cycles More than 4 years data retention Noise filter built In L / D terminal Initial delivery state FFh DIP-8 9.3mm x 6.5mm x 7.mm OP8 5.mm x 6.2mm x.7mm OP- J8 4.9mm x 6.mm x.65mm OP-B8 3.mm x 6.4mm x.2mm OP-B8J 3.mm x 4.9mm x.mm MOP8 2.9mm x 4.mm x.9mm OP-B8 3.mm x 6.4mm x.35mm VON8X23 2.mm x 3.mm x.6mm Figure. B244-W apacity Bit Format ype B244-W B244F-W B244FJ-W Power ource Voltage Package DIP-8 OP8 OP-J8 4bit 52 8 B244FV-W B244FV-W.6V to 5.5V OP-B8 OP-B8 B244FVJ-W OP-B8J B244FVM-W MOP8 B244NUX-W VON8X23 Product structure:ilicon monolithic integrated circuit his product has no designed protection against radioactive rays 23 OHM o., Ltd. ll rights reserved. Z22 4 /33 Z22-2G8--2

2 B244-W bsolute Maximum atings (a=25 ) Parameter ymbol ating Unit emark upply Voltage V -.3 to +6.5 V Power Dissipation Pd 45 (OP8) torage emperature stg -65 to +5 Operating emperature opr -4 to +85 Input Voltage/ Output Voltage Junction emperature Electrostatic discharge voltage (human body model) Derate by 4.5mW/ when operating above a=25 45 (OP-J8) Derate by 4.5mW/ when operating above a=25 3 (OP-B8) Derate by 3.mW/ when operating above a=25 33 (OP-B8) Derate by 3.3mW/ when operating above a=25 mw 3 (OP-B8J) Derate by 3.mW/ when operating above a=25 3 (MOP8) Derate by 3.mW/ when operating above a=25 3 (VON8X23) Derate by 3.mW/ when operating above a=25 8 (DIP-8) Derate by 8.mW/ when operating above a= to Vcc+. V he Max value of input voltage / output voltage is not over 6.5V. When the pulse width is 5ns or less, the Min value of input voltage / output voltage is not lower than -.8V. jmax 5 Junction temperature at the storage condition V ED -4 to +4 Memory ell haracteristics (a=25, Vcc=.6V to 5.5V) Parameter Limit Min yp Max Unit Write ycles (),, - - imes Data etention () Years () Not % EED ecommended Operating atings Parameter ymbol ating Unit Power ource Voltage Vcc.6 to 5.5 V Input Voltage V IN to Vcc D haracteristics (Unless otherwise specified, a=-4 to +85, Vcc=.6V to 5.5V) Parameter ymbol Limit Min yp Max Unit onditions Input High Voltage V IH.7Vcc - Vcc+. V.7V Vcc 5.5V Input Low Voltage V IL -.3 (2) - +.3Vcc V.7V Vcc 5.5V Input High Voltage2 V IH2.8Vcc - Vcc+. V.6V Vcc<.7V Input Low Voltage2 V IL2 -.3 (2) - +.2Vcc V.6V Vcc<.7V Output Low Voltage V OL V I OL =3.m, 2.5V Vcc 5.5V (D) Output Low Voltage2 V OL V I OL =.7m,.6V Vcc<2.5V (D) Input Leakage urrent I LI µ V IN = to Vcc Output Leakage urrent I LO µ V OU = to Vcc (D) upply urrent (Write) I m Vcc=5.5V, f L =4kHz, t W =5ms, Byte write, Page write upply urrent (ead) I m Vcc=5.5V, f L =4kHz andom read, current read, sequential read tandby urrent I B µ Vcc=5.5V, D L=Vcc,,2=GND,WP=GND (2) When the pulse width is 5ns or less, it is -.8V. 23 OHM o., Ltd. ll rights reserved. Z22 5 2/33 Z22-2G8--2

3 B244-W haracteristics (Unless otherwise specified, a=-4 to +85, Vcc=.6V to 5.5V) Limit Parameter ymbol Min yp Max lock Frequency f L khz Data lock High Period t HIGH µs Data lock Low Period t LOW µs D,L(INPU) ise ime () t - -. µs D,L (INPU)Fall ime () t F - -. µs D(OUPU)Fall ime () t F µs tart ondition Hold ime t HD: µs tart ondition etup ime t U: µs Input Data Hold ime t HD:D - - ns Input Data etup ime t U:D - - ns Output Data Delay ime t PD. -.9 µs Output Data Hold ime t DH. - - µs top ondition etup ime t U:O µs Bus Free ime t BUF µs Write ycle ime t W ms Noise pike Width (D and L) t I - -. µs WP Hold ime t HD:WP. - - µs WP etup ime t U:WP. - - µs WP High Period t HIGH:WP. - - µs () Not % EED. ondition Input Data Level:V IL =.2 Vcc V IH =.8 Vcc Input Data iming eference Level:.3 Vcc/.7 Vcc Output Data iming eference Level:.3 Vcc/.7 Vcc ise/fall ime : 2ns erial Input / Output iming Unit t tf thigh L 7% D (INPU) ( 入力 ) 7% 7% 7% 7% 7% 3% 3% 3% 3% thd: tlow tu:d thd:d 7% 7% 7% 3% 3% tbuf tpd tdh D 7% D() D D(n) 7% tw D (OUPU) ( 出力 ) Input read at the rise edge of L Data output in sync with the fall of L Figure 2-(a). erial Input / Output iming 7% 7% 3% 3% 3% tf2 3% tu:wp Figure 2-(d). WP iming at Write Execution 3% thd:wp OP ONDIION 7% 7% 7% D() D(n) tu: thd: tu:o D D thigh:wp 7% tw 7% 3% 3% 7% 7% ONDIION OP ONDIION Figure 2-(b). tart-top Bit iming Figure 2-(e). WP iming at Write ancel D 7% 7% write data (n-th address) tw OP ONDIION ONDIION Figure 2-(c). Write ycle iming 23 OHM o., Ltd. ll rights reserved. Z22 5 3/33 Z22-2G8--2

4 B244-W Block Diagram bit~256bit 4bit EEPOM EEPOM rray array 8 V 8bit 2 ddress Decoder 9bit Word ddress egister Data egister 7 WP 2 3 ontrol ircuit OP 6 L GND 4 High Voltage Generating ircuit Power ource Voltage Detection 5 D Figure 3. Block Diagram Pin onfiguration (OP VIEW) 8 V B244-W 7 6 WP L GND 4 5 D Pin Descriptions erminal Name Input/ Output Descriptions - Don t use () Input lave address setting (2) 2 Input lave address setting (2) GND - eference voltage of all input / output, V D Input/ Output erial data input serial data output L Input erial clock input WP Input Write protect terminal V - onnect the power source. () Pins not used as device address may be set to any of H, 'L', and 'Hi-Z'. (2) and 2 are not allowed to use as open. 23 OHM o., Ltd. ll rights reserved. Z22 5 4/33 Z22-2G8--2

5 B244-W ypical Performance urves 6 6 Input High Voltage: V IH (V) a=-4 a= 25 a= 85 Input Low Voltage: V IL (V) a=-4 a= 25 a= upply Voltage: Vcc(V) Figure 4. Input High Voltage,2 vs upply Voltage (, 2, L, D, WP) upply Voltage: Vcc(v) Figure 5. Input Low Voltage,2 vs upply Voltage (, 2, L, D, WP) Output Low Voltage: V OL (V) a=-4 a= 25 a= 85 Output Low Voltage2: V OL2 (V) a=-4 a= 25 a= Output Low urrent: I OL (m) Output Low urrent: I OL (m) Figure 6. Output Low Voltage vs Output Low urrent (Vcc=2.5V) Figure 7. Output Low Voltage2 vs Output Low urrent (Vcc=.6V) 23 OHM o., Ltd. ll rights reserved. Z22 5 5/33 Z22-2G8--2

6 B244-W ypical Performance urves continued.2.2 Input Leakage urrent: I LI (µ) a=-4 a= 25 a= 85 Output Leakage urrent: I LO (µ) a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure 8. Input Leakage urrent vs upply Voltage (, 2, L, WP) Figure 9. Output Leakage urrent vs upply Voltage (D) 3.6 upply urrent (Write): Icc(m) a=-4 a= 25 a= 85 upply urrent (ead): Icc2(m) a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure. upply urrent (Write) vs upply Voltage (f L =4kHz) Figure. upply urrent (ead) vs upply Voltage (f L =4kHz) 23 OHM o., Ltd. ll rights reserved. Z22 5 6/33 Z22-2G8--2

7 B244-W ypical Performance urves continued 2.5 tandby urrent: I B (µ) a=-4 a= 25 a= 85 lock Frequency: fscl(khz) a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure 2. tandby urrent vs upply Voltage Figure 3. lock Frequency vs upply Voltage.5 Data lock High Period : t HIGH (µs) a=-4 a= 25 a= 85 Data lock Low Period : t LOW (µs) a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure 4. Data lock High Period vs upply Voltage Figure 5. Data lock Low Period vs upply Voltage 23 OHM o., Ltd. ll rights reserved. Z22 5 7/33 Z22-2G8--2

8 B244-W ypical Performance urves continued tart ondition Hold ime: t HD: (µs) a=-4 a= 25 a= 85 tart ondition etup ime: t U: (µs) a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure 6. tart ondition Hold ime vs upply Voltage Figure 7. tart ondition etup ime vs upply Voltage 5 5 Input Data Hold ime: t HD:D (ns) a=-4 a= 25 a= 85 Input Data Hold ime: t HD:D(ns) a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure 8. Input Data Hold ime vs upply Voltage (HIGH) Figure 9. Input Data Hold ime vs upply Voltage (LOW) 23 OHM o., Ltd. ll rights reserved. Z22 5 8/33 Z22-2G8--2

9 B244-W ypical Performance urves continued 3 3 Input Data etup ime: t U:D (ns) 2 - a=-4 a= 25 a= 85 Input Data etup ime: t U:D (ns) 2 - a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure 2. Input Data etup ime vs upply Voltage (HIGH) Figure 2. Input Data etup ime vs upply Voltage (LOW) 2 2 L Output Data Delay ime: t PD (µs).5.5 a=-4 a= 25 a= H Output Data Delay ime: t PD (µs).5.5 a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure 22. L Output Data Delay ime vs upply Voltage Figure 23. H Output Data Delay ime vs upply Voltage 23 OHM o., Ltd. ll rights reserved. Z22 5 9/33 Z22-2G8--2

10 B244-W ypical Performance urves continued 2 2 top ondition etup ime: t U:O (µs).5.5 a=-4 a= 25 a= 85 Bus Free ime : t BUF (µs).5.5 a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure 24. top ondition etup ime vs upply Voltage Figure 25. Bus Free ime vs upply Voltage 6.6 Write ycle ime: t W (ms) a=-4 a= 25 a= 85 Noise pike Width(L H):tI(µs) a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure 26. Write ycle ime vs upply Voltage Figure 27. Noise pike Width vs upply Voltage (L H) 23 OHM o., Ltd. ll rights reserved. Z22 5 /33 Z22-2G8--2

11 B244-W ypical Performance urves continued.6.6 Noise pike Width(L L): ti(µs) a=-4 a= 25 a= 85 Noise pike Width(D H): ti(µs) a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure 28. Noise pike Width vs upply Voltage (L L) Figure 29. Noise pike Width vs upply Voltage (D H).6.2 Noise pike Width(D L): ti(µs) a=-4 a= 25 a= 85 WP Hold ime: t HD:WP (µs) a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure 3. Noise pike Width vs upply Voltage (D L) Figure 3. WP Hold ime vs upply Voltage 23 OHM o., Ltd. ll rights reserved. Z22 5 /33 Z22-2G8--2

12 B244-W ypical Performance urves continued.2.2 WP etup ime: t U:WP (µs) a=-4 a= 25 a= 85 WP High Period: t HIGH:WP ( µs) a=-4 a= 25 a= upply Voltage: Vcc(V) upply Voltage: Vcc(V) Figure 32. WP etup ime vs upply Voltage Figure 33. WP High Period vs upply Voltage 23 OHM o., Ltd. ll rights reserved. Z22 5 2/33 Z22-2G8--2

13 B244-W iming hart. I 2 BU Data ommunication I 2 BU data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long, and acknowledge is always required after each byte. I 2 BU data communication with several devices is possible by connecting with 2 communication lines: serial data (D) and serial clock (L). mong the devices, there should be a master that generates clock and control communication start and end. he rest become slave which are controlled by an address peculiar to each device, like this EEPOM. he device that outputs data to the bus during data communication is called transmitter, and the device that receives data is called receiver. D L DDE /W D D condition Figure 34. Data ransfer iming P OP condition 2. tart ondition (tart Bit ecognition) () Before executing each command, start condition (start bit) where D goes from 'HIGH' down to 'LOW' when L is 'HIGH' is necessary. (2) his I always detects whether D and L are in start condition (start bit) or not, therefore, unless this condition is satisfied, any command cannot be executed. 3. top ondition (top Bit ecognition) () Each command can be ended by a stop condition (stop bit) where D goes from 'LOW' to 'HIGH' while L is 'HIGH'. 4. cknowledge () ignal () he acknowledge () signal is a software rule to show whether data transfer has been made normally or not. In a master-slave communication, the device (Ex. µ-om sends slave address input for write or read command, to this I ) at the transmitter (sending) side releases the bus after output of 8bit data. (2) he device (Ex. his I receives the slave address input for write or read command from the µ-om) at the receiver (receiving) side sets D 'LOW' during the 9th clock cycle, and outputs acknowledge signal ( signal) showing that it has received the 8bit data. (3) his I, after recognizing start condition and slave address (8bit), outputs acknowledge signal ( signal) 'LOW'. (4) fter receiving 8bit data (word address and write data) during each write operation, this I outputs acknowledge signal ( signal) 'LOW'. (5) During read operation, this I outputs 8bit data (read data) and detects acknowledge signal ( signal) 'LOW'. When acknowledge signal ( signal) is detected, and stop condition is not sent from the master (µ-om) side, this I continues to output data. When acknowledge signal ( signal) is not detected, this I stops data transfer, recognizes stop condition (stop bit), and ends read operation. hen this I becomes ready for another transmission. 5. Device ddressing () lave address comes after start condition from master. (2) he significant 4 bits of slave address are used for recognizing a device type. he device code of this I is fixed to ''. (3) Next slave addresses (2 --- device address) are for selecting devices, and plural ones can be used on a same bus according to the number of device addresses. (4) he most insignificant bit ( / W --- ED / WIE ) of slave address is used for designating write or read operation, and is as shown below. etting etting / W to write (setting to word address setting of random read) / W to read lave ddress Maximum Number of onnected Buses 2 P /W 4 P is page select bit. 23 OHM o., Ltd. ll rights reserved. Z22 5 3/33 Z22-2G8--2

14 B244-W Write ommand. Write ycle () rbitrary data can be written to this EEPOM. When writing only byte, Byte Write is normally used, and when writing continuous data of 2 bytes or more, simultaneous write is possible by Page Write cycle. he maximum number of bytes is specified per device of each capacity. Up to 8 arbitrary bytes can be written. D LINE LVE DDE 2 P W I E W 7 WOD DDE W D7 D D O P / W Figure 35. Byte Write ycle LVE DDE W I E WOD DDE(n) D(n) D(n+5) O P D LINE 2 P W 7 W D7 D D / W Figure 36. Page Write ycle (2) During internal write execution, all input commands are ignored, therefore is not returned. (3) Data is written to the address designated by word address (n-th address) (4) By issuing stop bit after 8bit data input, internal write to memory cell starts. (5) When internal write is started, command is not accepted for t W (5ms at maximum). (6) Using page write cycle, writing in bulk is done as follows: When data of more than 6 bytes is sent, the bytes in excess overwrite the data already sent first. (efer to "Internal ddress Increment") (7) s for page write cycle of B244-W, where 2 or more bytes of data is intended to be written, after the page select bit P of slave address is designated arbitrarily, only the value of 4 least significant bits in the address is incremented internally, so that data up to 6 bytes of memory only can be written. In the case B244-W, page=6bytes, but the page write cycle time is 5ms at maximum for 6byte bulk write. It does not stand 5ms at maximum 6byte=8ms (Max) 2. Internal ddress Increment Page write mode (in the case of B244-W) W7 W4 W3 W2 W W Increment Eh ignificant bit is fixed. No digit up For example, when it is started from address Eh, then, increment is made as below, Eh Fh h h please take note. Eh E in hexadecimal, therefore, becomes a binary number. 3. Write Protect (WP) erminal Write Protect (WP) Function When WP terminal is set at Vcc (H level), data rewrite of all addresses is prohibited. When it is set at GND (L level), data rewrite of all address is enabled. Be sure to connect this terminal to Vcc or GND, or control it to H level or L level. Do not use it open. In case of using it as OM, it is recommended to connect it to pull up or Vcc. t extremely low voltage at power ON / OFF, by setting the WP terminal 'H', write error can be prevented. 23 OHM o., Ltd. ll rights reserved. Z22 5 4/33 Z22-2G8--2

15 B244-W ead ommand. ead ycle ead cycle is when data of EEPOM is read. ead cycle could be random read cycle or current read cycle. andom read cycle is a command to read data by designating a specific address, and is used generally. urrent read cycle is a command to read data of internal address register without designating an address, and is used when to verify just after write cycle. In both the read cycles, sequential read cycle is available where the next address data can be read in succession. LVE DDE W I E WOD DDE(n) LVE DDE E D D(n) O P D LINE 2 P W 7 W 2 D7 D / W Figure 37. andom ead ycle / W LVE DDE E D D(n) O P D LINE 2 P D7 D / W Figure 38. urrent ead ycle LVE DDE E D D(n) D(n+x) O P D LINE 2 P D7 D D7 D / W Figure 39. equential ead ycle (in the case of current read cycle) () In random read cycle, data of designated word address can be read. (2) When the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle), data of incremented last read address (n)-th, i.e., data of the (n+)-th address is output. (3) When signal 'LOW' after D is detected, and stop condition is not sent from master (µ-om) side, the next address data can be read in succession. (4) ead cycle is ended by stop condition where 'H' is input to signal after D and D signal goes from L to H while L signal is 'H'. (5) When 'H' is not input to signal after D, sequential read gets in, and the next data is output. herefore, read command cycle cannot be ended. o end read command cycle, be sure to input 'H' to signal after D, and the stop condition where D goes from L to H while L signal is 'H'. (6) equential read is ended by stop condition where 'H' is input to signal after arbitrary D and D is asserted from L to H while L signal is 'H'. 23 OHM o., Ltd. ll rights reserved. Z22 5 5/33 Z22-2G8--2

16 B244-W oftware eset oftware reset is executed to avoid malfunction after power on and during command input. oftware reset has several kinds and 3 kinds of them are shown in the figure below. (efer to Figure 4.-(a), Figure 4.-(b), and Figure 4.-(c).) Within the dummy clock input area, the D bus is released ('H' by pull up) and output and read data '' (both 'L' level) may be output from EEPOM. herefore, if 'H' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices. Dummy clock 4 tart 2 L D Normal command Normal command Figure 4-(a). he ase Of Dummy lock ommand Input tart Dummy clock 9 tart L D Normal command Normal command Figure 4-(b). he ase of + Dummy lock ommand Input tart 9 L D D Figure 4-(c). 9 + ommand Input Normal command Normal command tart command from input. cknowledge Polling During internal write execution, all input commands are ignored, therefore is not returned. During internal automatic write execution after write cycle input, next command (slave address) is sent. If the first signal sends back 'L', then it means end of write operation, else 'H' is returned, which means writing is still in progress. By the use of acknowledge polling, next command can be executed without waiting for t W = 5ms. o write continuously, / W =, then to carry out current read cycle after write, slave address with / W = is sent. If signal sends back 'L', and then execute word address input and data output and so forth. First write command During internal write, = HIGH is returned. Write ommand O P lave ddress H lave ddress H t W econd write command lave ddress H lave ddress L Word ddress L Data L O P t W fter completion of internal write, =LOW is returned, so input next word address and data in succession. Figure 4. ase of ontinuous Write by cknowledge Polling 23 OHM o., Ltd. ll rights reserved. Z22 5 6/33 Z22-2G8--2

17 B244-W WP Valid iming (Write ancel) WP is usually fixed to 'H' or 'L', but when WP is used to cancel write cycle and so on, observe the following WP valid timing. During write cycle execution, inside cancel valid area, by setting WP='H', write cycle can be cancelled. In both byte write cycle and page write cycle, the area from the first start condition of command to the rise of clock to take in D of data(in page write cycle, the first byte data) is the cancel invalid area. WP input in this area becomes Don't care. he area from the rise of L to take in D to the stop condition input is the cancel valid area. Furthermore, after the execution of forced end by WP, the I enters standby status. ise of D taken clock ise of D L L D D D D D Enlarged view Enlarged view D WP lave ddress L Word ddress L D7 D6 D5 D4 D3 D2 D D WP cancel invalid area L Data WP cancel valid area Data is not written. L O P t W WP cancel invalid area Figure 42. WP Valid iming ommand ancel by tart ondition and top ondition During command input, by continuously inputting start condition and stop condition, command can be cancelled. (Figure 43.) However, within output area and during data read, D bus may output 'L'. In this case, start condition and stop condition cannot be input, so reset is not available. herefore, execute software reset. When command is cancelled by start-stop condition during random read cycle, sequential read cycle, or current read cycle, internal setting address is not determined. herefore, it is not possible to carry out current read cycle in succession. o carry out read cycle in succession, carry out random read cycle. L D tart condition top condition Figure 43. ase of ancel by tart, top ondition during lave ddress Input 23 OHM o., Ltd. ll rights reserved. Z22 5 7/33 Z22-2G8--2

18 B244-W I/O Peripheral ircuit. Pull-up esistance of D erminal D is NMO open drain, so it requires a pull up resistor. s for this resistance value ( PU ), select an appropriate value from microcontroller V IL, I L, and V OL -I OL characteristics of this I. If PU is large, operating frequency is limited. he smaller the PU, the larger is the supply current (ead). 2. Maximum Value of PU he maximum value of PU is determined by the following factors. () D rise time to be determined by the capacitance ( BU ) of bus line and PU of D should be t or lower. Furthermore, timing should be satisfied even when D rise time is slow. (2) he bus electric potential to be determined by the input current leak total (I L ) of device connected to bus at output of 'H' to the D line and PU should sufficiently secure the input 'H' level (V IH ) of microcontroller and EEPOM including recommended noise margin of.2vcc. Vcc-I L PU -.2 Vcc V IH Microcontroller B24XX.8Vcc-V IH PU I L Ex.) Vcc =3V I L =µ V IH =.7 Vcc From (2) PU -6 IL PU IL D erminal 3 [kω] Bus Line apacity BU Figure 44. I/O ircuit Diagram 3. Minimum Value of PU he minimum value of PU is determined by the following factors. () When I outputs LOW, it should be satisfied that V OLMX =.4V and I OLMX =3m. Vcc-V OL PU PU I OL Vcc-V OL I OL (2) VOLMX=.4V should secure the input 'L' level (V IL ) of microcontroller and EEPOM including recommended noise margin.vcc. V OLMX V IL -. Vcc Ex.) Vcc =3V, V OL =.4V, I OL =3m, microcontroller, EEPOM V IL =.3Vcc from () 3-.4 PU [Ω] nd V OL =.4 [V] V IL =.3 3 =.9 [V] herefore, the condition (2) is satisfied. 4. Pull-up esistance of L erminal When L control is made at the MO output port, there is no need for a pull up resistor. But when there is a time where L becomes 'Hi-Z', add a pull up resistor. s for the pull up resistor value, one of several kω to several ten kω is recommended in consideration of drive performance of output port of microcontroller. 23 OHM o., Ltd. ll rights reserved. Z22 5 8/33 Z22-2G8--2

19 B244-W autions on Microcontroller onnection. In I 2 BU, it is recommended that D port is of open drain input/output. However, when using MO input / output of tri state to D port, insert a series resistance between the pull up resistor PU and the D terminal of EEPOM. his is to control over current that may occur when PMO of the microcontroller and NMO of EEPOM are turned ON simultaneously. also plays the role of protecting the D terminal against surge. herefore, even when D port is open drain input/output, can be used. PU L D 'H' output of microcontroller 'L' output of EEPOM Microcontroller EEPOM Over current flows to D line by 'H' output of microcontroller and 'L' output of EEPOM. Figure 45. I/O ircuit Diagram Figure 46. Input / Output ollision iming 2. Maximum value of he maximum value of is determined by the following relations. () D rise time to be determined by the capacitance ( BU ) of bus line and PU of D should be t or lower. Furthermore, timing should be satisfied even when D rise time is slow. (2) he bus electric potential to be determined by PU and the moment when EEPOM outputs 'L' to D bus should sufficiently secure the input 'L' level (V IL ) of microcontroller including recommended noise margin of.vcc. V (Vcc-V OL ) PU + +V OL +.Vcc V IL PU VOL V IL -V OL -.Vcc.Vcc-V IL PU VIL Micro controller IOL Bus line capacity BU EEPOM Figure 47. I/O ircuit Diagram Ex.) Vcc=3V V IL =.3Vcc V OL =.4V PU =2kΩ [kω] Minimum Value of he minimum value of is determined by over current at bus collision. When over current flows, noises in power source line and instantaneous power failure of power source may occur. When allowable over current is defined as I, the following relation must be satisfied. Determine the allowable current in consideration of the impedance of power source line in set and so forth. et the over current to EEPOM at m or lower. PU 'L'output Vcc I Vcc I 'H' output Over current I Ex.) Vcc=3V I=m 3-3 Microcontroller EEPOM 3 [Ω] Figure 48. I/O ircuit Diagram 23 OHM o., Ltd. ll rights reserved. Z22 5 9/33 Z22-2G8--2

20 B244-W I/O Equivalence ircuit. Input (, 2, L, WP) Figure 49. Input Pin ircuit Diagram 2. Input / Output (D) Figure 5. Input / Output Pin ircuit Diagram 23 OHM o., Ltd. ll rights reserved. Z22 5 2/33 Z22-2G8--2

21 B244-W Power-Up / Down onditions t power ON, the I s internal circuits may go through unstable low voltage area as the Vcc rises, making the I s internal logic circuit not completely reset, hence, malfunction may occur. o prevent this, the I is equipped with PO circuit and LV circuit. o assure the operation, observe the following conditions at power ON.. et D = 'H' and L ='L' or 'H 2. tart power source so as to satisfy the recommended conditions of t, t OFF, and V bot for operating PO circuit. V t toff Vbot Figure 5. ise Waveform Diagram ecommended conditions of t, t OFF,V bot t t OFF V bot ms or below ms or larger.3v or below ms or below ms or larger.2v or below 3. et D and L so as not to become 'Hi-Z'. When the above conditions and 2 cannot be observed, take the following countermeasures. () In the case when the above condition cannot be observed such that D becomes 'L' at power ON. ontrol L and D as shown below, to make L and D, 'H' and 'H'. V t LOW L D fter Vcc becomes stable fter Vcc becomes stable t DH t U:D t U:D Figure 52. When L= 'H' and D= 'L' Figure 53. When L='L' and D='L' (2) In the case when the above condition 2 cannot be observed. fter power source becomes stable, execute software reset (Page 6). (3) In the case when the above conditions and 2 cannot be observed. arry out (), and then carry out (2). Low Voltage Malfunction Prevention Function LV circuit prevents data rewrite operation at low power, and prevents write error. t LV voltage (yp =.2V) or below, data rewrite is prevented. Noise ountermeasures. Bypass apacitor When noise or surge gets in the power source line, malfunction may occur, therefore, it is recommended to connect a bypass capacitor (.µf) between I Vcc and GND pins. onnect the capacitor as close to I as possible. In addition, it is also recommended to connect a bypass capacitor between board s Vcc and GND. 23 OHM o., Ltd. ll rights reserved. Z22 5 2/33 Z22-2G8--2

22 B244-W Operational Notes. Described numeric values and data are design representative values only, and the values are not guaranteed. 2. We believe that the application circuit examples in this document are recommendable. However, in actual use, confirm characteristics further sufficiently. If changing the fixed number of external parts is desired, make your decision with sufficient margin in consideration of static characteristics, transient characteristics, and fluctuations of external parts and our LI. 3. bsolute maximum ratings If the absolute maximum ratings such as supply voltage, operating temperature range, and so on are exceeded, LI may be destroyed. Do not supply voltage or subject the I to temperatures exceeding the absolute maximum ratings. In the case of fear of exceeding the absolute maximum ratings, take physical safety countermeasures such as adding fuses, and see to it that conditions exceeding the absolute maximum ratings should not be supplied to the LI. 4. GND electric potential et the voltage of GND terminal lowest at any operating condition. Make sure that each terminal voltage is not lower than that of GND terminal. 5. hermal design Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions. 6. hort between pins and mounting errors Be careful when mounting the I on printed circuit boards. he I may be damaged if it is mounted in a wrong orientation or if pins are shorted together. hort circuit may be caused by conductive particles caught between the pins. 7. Operating the I in the presence of strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently. 23 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G8--2

23 B244-W Part Numbering B x x x - W x x BU ype 24:I 2 Operating emperature/ Power ource Voltage -4 to+85 /.6V to 5.5V apacity 4=4 Package Blank F FJ FV FV FVJ FVM NUX Double ell :DIP-8 :OP8 :OP-J8 : OP-B8 : OP-B8 : OP-B8J : MOP8 : VON8X23 Packaging and Forming pecification E2 : EMBOED tape and reel (OP8,OP-J8, OP-B8,OP-B8, OP-B8J) : Embossed tape and reel (MOP8, VON8X23) None : ube (DIP-8) 23 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G8--2

24 B244-W Physical Dimensions ape and eel Information DIP-8 9.3± ± ±.3.5Min ± ±. 5.3±. (Unit : mm) <ape and eel information> ontainer ube Quantity 2pcs Direction of feed Direction of products is fixed in a container tube Order quantity needs to be multiple of the minimum quantity. 23 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G8--2

25 B244-W OP8 5.±.2 (MX 5.35 include BU) ±.3 4.4±.2.3MIN.9± ± ±. (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 25pcs E2 he direction is the pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand ( ) eel Direction of feed pin Order quantity needs to be multiple of the minimum quantity. 23 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G8--2

26 B244-W OP-J8 4.9±.2 (MX 5.25 include BU) ±.3 3.9±.2.45MIN ±..375± ±.. (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 25pcs E2 he direction is the pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand ( ) eel Direction of feed pin Order quantity needs to be multiple of the minimum quantity. 23 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G8--2

27 B244-W OP-B8 3.±.2 (MX 3.35 include BU) MIN..5±. 6.4±.3 4.4±.2 (.52) M.5±. (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 25pcs E2 he direction is the pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand ( ) eel Direction of feed pin Order quantity needs to be multiple of the minimum quantity. 23 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G8--2

28 B244-W OP-B8 3.±. (MX 3.35 include BU) ± 4.2MX.±.5 6.4±.2 4.4±..± PIN M ±.5.8 M.± (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 3pcs E2 he direction is the pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand ( ) eel pin Direction of feed Order quantity needs to be multiple of the minimum quantity. 23 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G8--2

29 B244-W OP-B8J 3.±. (MX 3.35 include BU) ± 4 4.9±.2 3.±..MX.85±.5.± PIN M ±.5.95± M (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 25pcs E2 he direction is the pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand ( ) eel pin Direction of feed Order quantity needs to be multiple of the minimum quantity. 23 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G8--2

30 B244-W MOP8 4.±.2 2.9±. (MX 3.25 include BU) 2.8± ±.5.6± MX.75±.5.8± PIN M (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 3pcs he direction is the pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand ( ) pin eel Direction of feed Order quantity needs to be multiple of the minimum quantity. 23 OHM o., Ltd. ll rights reserved. Z22 5 3/33 Z22-2G8--2

31 B244-W VON8X23 2.±..6MX.8.5± ±. PIN M (.2) ± ± (Unit : mm) <ape and eel information> ape Quantity Direction of feed Embossed carrier tape 4pcs he direction is the pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand ( ) eel pin Direction of feed Order quantity needs to be multiple of the minimum quantity. 23 OHM o., Ltd. ll rights reserved. Z22 5 3/33 Z22-2G8--2

32 B244-W Marking Diagrams (OP VIEW) DIP-8 (OP VIEW) Part Number Marking OP8 (OP VIEW) Part Number Marking B244-W LO Number 4 LO Number PIN M OP-J8 (OP VIEW) 4 Part Number Marking LO Number OP-B8 (OP VIEW) Part Number Marking 4 LO Number PIN M PIN M OP-B8 (OP VIEW) Part Number Marking 4 LO Number OP-B8J (OP VIEW) Part Number Marking 4 LO Number PIN M PIN M MOP8 (OP VIEW) 4 Part Number Marking LO Number VON8X23 (OP VIEW) 4 Part Number Marking LO Number PIN M PIN M 23 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G8--2

33 B244-W evision History Date evision hanges 8.May.22 New elease 25.Feb.23 2 Update some English words, sentences descriptions, grammar and formatting. dd tf2 in erial Input / Output iming 3.May.23 3 P hange format of package line-up table. P.2 dd VED in bsolute Maximum atings P.4 dd directions in Pin Descriptions 23 OHM o., Ltd. ll rights reserved. Z /33 Z22-2G8--2

34 Notice Precaution on using OHM Products. Our Products are designed and manufactured for application in ordinary electronic equipments (such as V equipment, O equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note ), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( pecific pplications ), please consult with the OHM sales representative in advance. Unless otherwise agreed in writing by OHM in advance, OHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any OHM s Products for pecific pplications. (Note) Medical Equipment lassification of the pecific pplications JPN U EU HIN LⅢ LⅡb LⅢ LⅢ LⅣ LⅢ 2. OHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. he following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. ccordingly, OHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any OHM s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including l2, H2, NH3, O2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] ealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. he Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. void applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on mbient temperature (a). When used in sealed area, confirm the actual ambient temperature. 8. onfirm that operation temperature is within the specified range described in the product specification. 9. OHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / ircuit board design. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the OHM representative in advance. For details, please refer to OHM Mounting specification Notice - GE 24 OHM o., Ltd. ll rights reserved. ev.2

35 Precautions egarding pplication Examples and External ircuits. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. herefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. OHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic his Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for torage / ransportation. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including l2, H2, NH3, O2, and NO2 [b] the temperature or humidity exceeds those recommended by OHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under OHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. tore / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label Q code printed on OHM Products label is for OHM s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign rade act ince our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with OHM representative in case of export. Precaution egarding Intellectual Property ights. ll information and data including but not limited to application example contained in this document is for reference only. OHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. OHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of OHM or any third parties with respect to the information contained in this document. Other Precaution. his document may not be reprinted or reproduced, in whole or in part, without prior written consent of OHM. 2. he Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of OHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. he proper names of companies or products described in this document are trademarks or registered trademarks of OHM, its affiliated companies or third parties. Notice - GE 24 OHM o., Ltd. ll rights reserved. ev.2

36 General Precaution. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. OHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny OHM s Products against warning, caution or note contained in this document. 2. ll information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using OHM s Products, please confirm the la test information with a OHM sale s representative. 3. he information contained in this doc ument is provi ded on an as is basis and OHM does not warrant that all information contained in this document is accurate an d/or error-free. OHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice WE 24 OHM o., Ltd. ll rights reserved. ev.