EP15E7 D 2 H M TR. Pin 1 Connection Tri-State

Transcription

1 eries Quartz Crystal Clock Oscillators XO (PXO) LVCMO (CMO) 2.5Vdc 4 Pad 2.5mm x 3.2mm Ceramic urface Mount (MD) Frequency Tolerance/tability ±50ppm Maximum over -20 C to +70 C ELECTRICAL PECIFICATION Nominal Frequency Frequency Tolerance/tability Aging at 25 C MHz EP15E7 D 2 H M TR Duty Cycle 50 ±5(%) Pin 1 Connection Tri-tate Nominal Frequency MHz Packaging Options Tape & Reel ±50ppm Maximum over -20 C to +70 C (Inclusive of all conditions: Calibration Tolerance at 25 C, Frequency tability over the Operating Temperature Range, upply Voltage Change, Output Load Change, First Year Aging at 25, 260 C Reflow, hock, and Vibration) ±5ppm/Year Maximum upply Voltage 2.5Vdc ±5% Input Current Output Voltage Logic High (Voh) Output Voltage Logic Low (Vol) Rise/Fall Time Duty Cycle Load Drive Capability Output Logic Type Pin 1 Connection Pin 1 Input Voltage (Vih and Vil) Disable Current Absolute Clock Jitter tart Up Time 12mA Maximum 90% of Vdd Minimum (IOH = -8mA) 10% of Vdd Maximum (IOL = +8mA) 6nec Maximum (Measured at 20% to 80% of waveform) 50 ±5(%) (Measured at 50% of waveform) 30pF Maximum CMO Tri-tate 90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output 6mA Maximum (Pin 1 = Ground) 200pec Maximum 10mec Maximum torage Temperature Range -55 C to 125 C ENVIRONMENTAL & MECHANICAL PECIFICATION ED usceptibility Fine Leak Test Gross Leak Test Mechanical hock MIL-TD-883, Method 3015, Class 1, HBM: 1500Vdc MIL-TD-883, Method 1014, Condition A MIL-TD-883, Method 1014, Condition C MIL-TD-883, Method 2002, Condition B Moisture Resistance MIL-TD-883, Method 1004 Moisture ensitivity J-TD-020, ML 1 Resistance to oldering Heat MIL-TD-202, Method 210, Condition K Resistance to olvents MIL-TD-202, Method 215 olderability MIL-TD-883, Method 2003 Temperature Cycling Thermal hock Vibration MIL-TD-883, Method 1010, Condition B MIL-TD-883, Method 1011, Condition B MIL-TD-883, Method 2007, Condition A pecification ubject to Change Without Notice Revision G 12/11/2012 Page 1 of 7

2 MECHANICAL DIMENION (all dimensions in millimeters) 3.20 ± ±0.15 MARKING ORIENTATION 1.05 ± ±0.10 (X4) 1.20 ± ±0.10 PIN CONNECTION 1 Tri-tate 2 Ground 3 Output 4 upply Voltage LINE MARKING 1 E E=Ecliptek Designator 2 XXXXX XXXXX=Ecliptek Manufacturing Identifier 1.00 ±0.10 uggested older Pad Layout All Dimensions in Millimeters 0.95 (X4) 1.20 (X4) 1.00 older Land (X4) 0.80 All Tolerances are ±0.1 pecification ubject to Change Without Notice Revision G 12/11/2012 Page 2 of 7

3 OUTPUT WAVEFORM & TIMING DIAGRAM CLOCK OUTPUT TRI-TATE INPUT VIH VIL VOH 80% of Waveform 50% of Waveform 20% of Waveform VOL OUTPUT DIABLE (HIGH IMPEDANCE TATE) Fall Time Rise Time TW T Duty Cycle (%) = TW/T x 100 tplz tpzl pecification ubject to Change Without Notice Revision G 12/11/2012 Page 3 of 7

4 Test Circuit for CMO Output Oscilloscope Frequency Counter Current _ Meter upply Voltage (V DD ) Output Probe (Note 2) Power upply _ Voltage Meter _ 0.01µF (Note 1) 0.1µF (Note 1) Ground C L (Note 3) Tri-tate or Power Down Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. ee applicable specification sheet for Load Drive Capability. pecification ubject to Change Without Notice Revision G 12/11/2012 Page 4 of 7

5 Tape & Reel Dimensions All Dimensions in Millimeters Quantity Per Reel: 1,000 units 4.00 ± ±0.05 DIA / MAX 0.10 MAX 3.50 ± ± ±0.30 B0 DIA 1.00 MIN 4.00 ±0.10 A0 K0 Note: Compliant to EIA MIN MAX DIA 40 MIN Access Hole at lot Location 180 MAX DIA 50 MIN DIA MIN DIA ± MIN Width 10 MIN Depth Tape slot in Core for Tape tart / pecification ubject to Change Without Notice Revision G 12/11/2012 Page 5 of 7

6 Recommended older Reflow Methods T P Ramp-up Critical Zone T L to T P Ramp-down Temperature (T) T L T Max T Min t Preheat t 25 C to Peak Time (t) t P t L High Temperature Infrared/Convection T MAX to TL (Ramp-up Rate) 3 C/second Maximum Preheat - Temperature Minimum (T MIN) 150 C - Temperature Typical (T TYP) 175 C - Temperature Maximum (T MAX) 200 C - Time (t MIN) econds Ramp-up Rate (TL to TP) 3 C/second Maximum Time Maintained Above: - Temperature (TL) 217 C - Time (tl) econds Peak Temperature (TP) 260 C Maximum for 10 econds Maximum Target Peak Temperature (TP Target) 250 C +0/-5 C Time within 5 C of actual peak (tp) seconds Ramp-down Rate 6 C/second Maximum Time 25 C to Peak Temperature (t) 8 minutes Maximum Moisture ensitivity Level Level 1 pecification ubject to Change Without Notice Revision G 12/11/2012 Page 6 of 7

7 Recommended older Reflow Methods T P Ramp-up Critical Zone T L to T P Ramp-down Temperature (T) T L T Max T Min t Preheat t 25 C to Peak Time (t) t P t L Low Temperature Infrared/Convection 240 C T MAX to TL (Ramp-up Rate) 5 C/second Maximum Preheat - Temperature Minimum (T MIN) N/A - Temperature Typical (T TYP) 150 C - Temperature Maximum (T MAX) N/A - Time (t MIN) econds Ramp-up Rate (TL to TP) 5 C/second Maximum Time Maintained Above: - Temperature (TL) 150 C - Time (tl) 200 econds Maximum Peak Temperature (TP) 240 C Maximum Target Peak Temperature (TP Target) 240 C Maximum 2 Times / 230 C Maximum 1 Time Time within 5 C of actual peak (tp) 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time Ramp-down Rate 5 C/second Maximum Time 25 C to Peak Temperature (t) N/A Moisture ensitivity Level Level 1 Low Temperature Manual oldering 185 C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual oldering 260 C Maximum for 5 seconds Maximum, 2 times Maximum. pecification ubject to Change Without Notice Revision G 12/11/2012 Page 7 of 7