Polymer Multimode Waveguide Optical and Electronic PCB Manufacturing
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1 Polymer Multimode Waveguide Optical and Electronic PCB Manufacturing David R. Selviah Department of Electronic and Electrical Engineering, University College London, UCL, UK, Invited Paper Number , Optical Interconnects II, Integrated Circuits XI, Vol. 7219, SPIE Photonics West, San Jose, USA, Wednesday 28 th January 2009 UCL
2 Outline Optical Connector Optical and Electronic Interconnects Backplane Electronic versus Optical interconnects The OPCB project OPCB University Research Overview Heriot Watt Loughborough UCL System Demonstrator Mezzanine Board (Daughter Board, Line Card) 2
3 Copper Tracks versus Optical Waveguides for High Bit Rate Interconnects Copper Track EMI Crosstalk Loss Impedance control to minimize back reflections, additional equalisation, costly board material Optical Waveguides Low loss Low cost Low power consumption Low crosstalk Low clock skew WDM gives higher aggregate bit rate Cannot transmit electrical power 3
4 On-board Platform Applications 4
5 On-board Platform Applications core processor Aircraft utilities Reconfigurable Network Interconnections Signal concentrator RF/EO Sensors & comms data High Bandwidth Signals 5
6 The Integrated Optical and Electronic Interconnect PCB Manufacturing (OPCB) project Hybrid Optical and Electronic PCB Manufacturing Techniques 8 Industrial and 3 University Partners led by industry end user Multimode waveguides at 10 Gb/s on a 19 inch PCB Project funded by UK Engineering and Physical Sciences Research Council (EPSRC) via the Innovative Electronics Manufacturing Research Centre (IeMRC) as a Flagship Project 2.5 years into the 3 year, 1.3 million project 6
7 Daughter card VCSEL Detector Daughter card Integration of Optics and Electronics Core Cladding Multilayer organic substrate Backplanes Butt connection of plug-in daughter cards In-plane interconnection Focus of OPCB project VCSEL Detector Core Cladding Multilayer organic substrate Out-of-plane connection 45 mirrors Chip to chip connection possible 7
8 Exxelis Polymer supply and photolithography Cadence PCB design tools and rules Dow Corning Polymer supply and photolithography Heriot -Watt University Polymer formulation Supply of laser written waveguides UCL Optical modelling Waveguide design rules Optical measurements NPL NPL Physical Measurements Physical measurements Stevenage Circuits Ltd Sample PCBs, dry film CAD conversion, laser work Loughborough University Laser ablation and ink-jet printing of waveguides End Users Xyratex Network storage interconnect BAE Systems In-flight interconnect Renishaw Precision measurement 8
9 Direct Laser-writing Setup: Schematic Slotted baseplate mounted vertically over translation, rotation & vertical stages; components held in place with magnets By using two opposing 45º beams we minimise the amount of substrate rotation needed 9
10 Writing sharply defined features flat-top, rectangular laser spot TEM00 Gaussian Beam Imaged aperture Images of the resulting waveguide core cross-sections 10
11 Laser written polymer structures SEM images of polymer structures written using imaged 50 µm square aperture (chrome on glass) Writing speed: ~75 µm / s Optical power: ~100 µw Flat-top intensity profile Oil immersion Single pass Optical microscope image showing end on view of the 45º surfaces 11
12 Waveguide terminated with 45-deg mirror Out-of-plane coupling, using 45-deg mirror (silver) Microscope image looking down on mirror coupling light towards camera OPTICAL INPUT 12
13 Current Results Laser-writing Parameters: - Intensity profile: Gaussian - Optical power: ~8 mw - Cores written in oil Polymer: - Custom multifunctional acrylate photo-polymer - Fastest effective writing speed to date: 50 mm/s (Substrate: FR4 with polymer undercladding) 13
14 Large Board Processing: Writing Stationary writing head with board moved using Aerotech sub-µm precision stages Waveguide trajectories produced using CAD program 600 x 300 mm travel Requires a minimum of 700 x 1000 mm space on optical bench Height: ~250 mm Mass: 300 mm: 21 kg 600 mm: 33 kg Vacuum tabletop 14
15 Large Board Processing: Writing The spiral was fabricated using a Gaussian intensity profile at a writing speed of 2.5 mm/s on a 10 x 10 cm lower clad FR4 substrate. Total length of spiral waveguide is ~1.4 m. The spiral was upper cladded at both ends for cutting. 15
16 Laser Ablation of Optical Waveguides Research Straight waveguides 2D & 3D integrated mirrors Approach Excimer laser Loughborough CO 2 laser - Loughborough UV Nd:YAG Stevenage Circuits Ltd Optical polymer Truemode Exxelis Core Lower clad FR-4 substrate Stage1 : Spin coating of clad and core layers which are UV-cured individually. Lower clad FR-4 substrate Stage2 : Laser ablation of optical layer from the core through to clad layer Schematic diagram (side view) showing stages in the fabrication of optical waveguides by laser ablation Pitch Core FR-4 substrate Clad material 16 Stage3 : Deposition of upper cladding
17 Machining of Optical Polymer with CO 2 Laser System 10 Watt(max.) power CW beam Wavelength = 10.6 µm (infrared) Process Thermally-dominated ablation process Machining quality Curved profile Investigation of waveguide fabrication underway FR4 layer Side view Ablated profile Plan view (Optical microscope) Plan view (SEM) 17
18 Optical Waveguide Fabrication with UV Nd:YAG Waveguide of 71 µm x 79 µm fabricated using UV Nd:YAG Waveguide detected using back lighting Side view Plan view System 355 nm (UV) Pulsed laser with 60 ns pulse width and Gaussian beam (TEM 00 ) or Tophat profile at Stevenage Circuits Ltd. Process Photochemically-dominated ablation process. Waveguide quality Minimum Heat Affected Zone Propagation loss measurement underway
19 Machining of Optical Polymer with Excimer Laser core 260μm 70μm Lower clad FR-4 layer Cross-section Straight structures machined in an optical polymer. Future work to investigate preparation of curved mirrors for out-of-plane interconnection. Plan View 19
20 Inkjetting as a Route to Waveguide Deposition Print polymer then UV cure Advantages: controlled, selective deposition of core and clad less wastage: picolitre volumes large area printing low cost Deposit Lower Cladding Deposit Core Deposit Upper Cladding 20
21 Viscosity (cst) Challenges of Inkjet Deposition Viscosity tailored to inkjet head via addition of solvent Coffee stain effects Solvent A Solvent B Temperature (deg C) A 2 x 2 array of inkjet printed drops Cross-section of dried droplet coffee-stain effect 21
22 Changing Surface Wettability Contact Angles Core material on cladding Core material on modified glass surface (hydrophobic) Large wetting - broad inkjetted lines Reduced wetting discrete droplets Identical inkjetting conditions - spreading inhibited on modified surface 22
23 Towards Stable Structures Stable line structures with periodic features Cross section of inkjetted core material surrounded by cladding (width 80 microns) A balance between wettability, line stability and adhesion 23
24 Waveguide components and measurements Straight waveguides 480 mm x 70 µm x 70 µm Bends with a range of radii Crossings Spiral waveguides Tapered waveguides Bent tapered waveguides Loss Crosstalk Misalignment tolerance Surface Roughness Bit Error Rate, Eye Diagram Copyright 2009 UCL 24
25 Optical Power Loss in 90 Waveguide Bends I Input A w R f = R s + NΔR R s +ΔR l in R s B l out Output O Schematic diagram of one set of curved waveguides. Light through a bent waveguide of R = 5.5 mm 34.5 mm Radius R, varied between 5.5 mm < R < 35 mm, ΔR = 1 mm Light lost due to scattering, transition loss, bend loss, reflection and backscattering Illuminated by a MM fiber with a red-laser. Copyright 2009 UCL 25
26 BPM, beam propagation method modeling of optical field in bend segments w = 50 μm, R = 13 mm (left picture) in the first segment (first 10 ). (right picture) in the 30 to 40 degree segment. Copyright 2009 UCL 26
27 Differences in misalignment tolerance and loss as a function of taper ratio Graph plots the differences between a tapered bend and a bend There is a trade off between insertion loss and misalignment tolerance Copyright 2009 UCL 27
28 Crosstalk in Chirped Width Waveguide Array 100 µm 110 µm 120 µm 130 µm 140 µm 150 µm Light launched from VCSEL imaged via a GRIN lens into 50 µm x 150 µm waveguide Photolithographically fabricated chirped with waveguide array Photomosaic with increased camera gain towards left Copyright 2009 UCL 28
29 Surface roughness RMS side wall roughness: 9 nm to 74 nm RMS polished end surface roughness: 26 nm to 192 nm. Copyright 2009 UCL 29
30 Design rules for waveguide width depending on insertion loss and cross-talk 6~7dB for a 70 μm width waveguide Copyright 2009 UCL 30
31 BER Bit error rate for laterally misaligned 1550 nm 2.5 Gb/s DFB laser R = 9.5 mm (+) Direction 10-2 R = 13.5 mm R = 20.5 mm Straight No wvg (-) Direction Power at the receiver (dbm) Power at the receiver (dbm) Copyright 2009 UCL 31
32 Contour map of VCSEL and PD misalignment (a) Contour map of relative insertion loss compared to the maximum coupling position for VCSEL misalignment at z = 0. (b) Same for PD misalignment at z = 0. Resolution step was Δx = Δy = 1 µm. Dashed rectangle is the expected relative insertion loss according to the calculated misalignments along x and y. The minimum insertion loss was 4.4 db, corresponded to x = 0, y = 0, z = 0 Copyright 2009 UCL 32
33 Insertion Loss (db) Coupling Loss for VCSEL and PD for misalignments along optic axis VCSEL 3 Photo Detector axial distance z (μm) Copyright 2009 UCL 33
34 Fabrication Techniques and Waveguides Samples Straight waveguides Optical InterLinks 90 Crossings Dow Corning 90 Crossings Heriot Watt University 50 Crossings Exxelis Copyright 2009 UCL 34
35 Photolithographic Fabrication of Waveguides Copyright 2009 UCL 35
36 Optical Loss Measurement 850 nm VCSE L 0 dbm mode scrambler 50/125 μm step index fibre Index matching fluid 70 μm pinhole nw Power Meter Copyright 2009 UCL R dbm Integrating sphere photodetector dbm 36
37 VCSEL Array for Crosstalk Measurement PIN Array Source: Microsemi Corporation VCSEL Array Source: ULM Photonics GmbH GRIN Lens Array MT compatible interface Source: GRINTech GmbH Copyright 2009 UCL 37
38 Design Rules for Inter-waveguide Cross Talk PD with pinhole Normalized Transmitted Power (db) -1 st 0 th 1 st 2 nd 3 rd 4 th 5 th 6 th Recommended y 1 mm Used z x VCSEL x (µm) 70 μm 70 μm waveguide cross sections and 10 cm long In the cladding power drops linearly at a rate of db/µm Crosstalk reduced to -30 db for waveguides 1 mm apart Copyright 2009 UCL 38
39 Schematic Diagram Of Waveguide Crossings at 90 and at an Arbitrary Angle, θ Copyright 2009 UCL 39
40 Design Rules for Arbitrary Angle Crossings Loss per crossing (db) Power drops 0.08 db at Recommended Used Crossing angle (degree) Loss of db per 90 crossing consistent with other reports The output power dropped by 0.5% at each 90 crossing The loss per crossing (L c ) depends on crossing angle (θ), L c = θ Copyright 2009 UCL 40
41 Loss of Waveguide Bends Bend radius (mm) Transmitted power (db) 50 µm 50 µm 75 µm 50 µm 100 µm 50 µm Recommended Used Width (μm) Optimum Radius (mm) Maximum Power (db) Copyright 2009 UCL 41
42 System Demonstrator Fully connected waveguide layout using design rules Copyright 2009 UCL 42
43 Power Budget Input power (dbm/mw) / 0.62 Bend 90 Radii (mm) Loss per bend (db) Crossings Crossing angles ( ) Loss per crossing (db) Min. detectable power (dbm) Min. power no bit error rate -15 / / 0.06 Copyright 2009 UCL 43
44 Demonstrator Dummy Board Copyright 2009 UCL 44
45 The Shortest Waveguide Illuminated by Red Laser Copyright 2009 UCL 45
46 Waveguide with 2 Crossings Connected 1 st to 3 rd Linecard Interconnect Copyright 2009 UCL 46
47 Output Facet of the Waveguide Interconnection Copyright 2009 UCL 47
48 OPTICAL BACKPLANE CONNECTION ARCHITECTURE Backplane and Line Cards Orthogonal Connector housing Parallel optical transceiver Copper layers FR4 layers Lens Interface Backplane Optical layer Research and Development Overview Richard Pitwon 48
49 OPTICAL BACKPLANE CONNECTION ARCHITECTURE Butt-coupled connection approach without 90º deflection optics VCSEL array PIN array Waveguide illuminated through buttcoupled fibre connection Research and Development Overview Richard Pitwon 49
50 ELECTRO-OPTICAL BACKPLANE Hybrid Electro-Optical Printed Circuit Board Standard Compact PCI backplane architecture 12 electrical layers for power and C-PCI signal bus and peripheral connections Optical connector site Electrical C-PCI connector slots for SBC and line cards 1 polymeric optical layer for high speed 10 GbE traffic 4 optical connector sites Dedicated point-to-point optical waveguide architecture Compact PCI slot for single board computer Compact PCI slots for line cards 50
51 ELECTRO-OPTICAL BACKPLANE Hybrid Electro-Optical Printed Circuit Board Standard Compact PCI backplane architecture 12 electrical layers for power and C-PCI signal bus and peripheral connections Optical connector site Electrical C-PCI connector slots for SBC and line cards 1 polymeric optical layer for high speed 10 GbE traffic 4 optical connector sites Dedicated point-to-point optical waveguide architecture Compact PCI slot for single board computer Compact PCI slots for line cards Polymer optical waveguides on optical layer 51
52 PARALLEL OPTICAL PCB CONNECTOR MODULE Parallel optical transceiver circuit Small form factor quad parallel optical transceiver Microcontroller supporting I 2 C interface Samtec SEARAY open pin field array connector Spring loaded platform for optical engagement mechanism Custom heatsink for photonic drivers Backplane connector module Samtec / Xyratex collaborate to develop optical PCB connector 1 stage insertion engagement mechanism developed Xyratex transceiver integrated into connector module Spring loaded platform Samtec field array connector Microcontroller 52
53 ACTIVE PLUGGABLE OPTICAL CONNECTOR Engagement process Optical transceiver interface floats Cam followers Backplane receptacle funnels connector Cam followers force optical interface up Optical transceiver lens butt-couples to backplane lens Undocked Docked Cam track Research and Development Overview Richard Pitwon 53
54 HIGH SPEED SWITCHING LINE CARD Array connector for pluggable active optical connector Compact PCI bus connector PCI Bridge FPGA SMP connector sites 8 x 8 Crosspoint switch XFP ports Transceiver programming port XFP ports Research and Development Overview Richard Pitwon 54
55 Demonstrator with Optical Interconnects Copyright 2009 UCL 55
56 DEMONSTRATION ASSEMBLY Electro-optical backplane Pluggable optical backplane connectors Compact PCI chassis High speed switch line cards XFP front end Single board computer Research and Development Overview Richard Pitwon 56
57 DEMONSTRATOR MANAGEMENT SOFTWARE GUI control interface Remote admin Remote log-in XFP control Crosspoint switch configuration Full transceiver control (VCSEL/PIN settings) Selectable between any line card in system XFP controls Crosspoint Switch control Research and Development Overview Richard Pitwon 57
58 Acknowledgments University College London, UK Kai Wang, Hadi Baghsiahi, F. Aníbal Fernández, Ioannis Papakonstantinou (now at CERN, Geneva, Switzerland) Loughborough University, UK David A. Hutt, Paul P. Conway, John Chappell, Shefiu S. Zakariyah Heriot Watt University Andy C. Walker, Aongus McCarthy, Himanshu Suyal BAE Systems, UK Henry White Stevenage Circuits Ltd. (SCL), UK Dougal Stewart, Jonathan Calver, Jeremy Rygate, Steve Payne Xyratex Technology Ltd., UK Dave Milward, Richard Pitwon, Ken Hopkins Exxelis Ltd Navin Suyal and Habib Rehman Cadence Gary Hinde EPSRC and all partner companies for funding + IBM Zurich for fab. Invited Paper Number , Optical Interconnects II, Integrated Circuits XI, Vol. 7219, SPIE Photonics West, San Jose, USA, Wednesday 28 th January 2009 UCL
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