Tc=25 C 150 Tc=80 C 100 Collector current

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1 2MBI1HB-12-5 HIGH SPEED IGBT MODULE 12V / 1A / 2 in one package Features High speed switching Voltage drive Low Inductance module structure Applications Soft-switching Application Industrial machines, such as Welding machines Maximum Ratings and Characteristics Absolute Maximum Ratings (at Tc=25 C unless otherwise specified) Items Symbols Conditions Maximum ratings Units Collector-Emitter voltage VCES 12 V Gate-Emitter voltage VGES ±2 V Ic Continuous Tc=25 C 15 Tc=8 C 1 Collector current Ic pulse 1ms Tc=25 C 3 Tc=8 C 2 A -Ic 5 -Ic pulse 1ms 1 Collector Power Dissipation Pc 1 device 14 W Junction temperature Tj +15 Storage temperature Tstg -4 ~ +125 C Isolation voltage Between terminal and copper base (*1) Viso AC : 1min. 25 VAC Screw torque Mounting (*2) Terminals (*3) 3.5 N m Note *1: All terminals should be connected together when isolation test will be done. Note *2: Recommendable Value : Mounting 2.5 to 3.5 Nm (M5) Note *3: Recommendable Value : Terminals 2.5 to 3.5 Nm (M5) Electrical characteristics (at Tj= 25 C unless otherwise specified) Items Symbols Conditions Characteristics min. typ. max. Units Zero gate voltage collector current ICES VGE = V, VCE = 12V ma Gate-Emitter leakage current IGES VCE = V, VGE = ±2V na Gate-Emitter threshold voltage VGE (th) VCE = 2V, IC = 1mA V VCE (sat) Tj=25 C Collector-Emitter saturation voltage (terminal) VGE = 15V Tj=125 C VCE (sat) IC = 1A Tj=25 C V (chip) Tj=125 C Input capacitance Cies VCE = 1V, VGE = V, f = 1MHz nf Turn-off time toff VCC = 6V, IC = 1A VGE = ±15V, RG = 3.1Ω tf Ls = 2nH.5.2 µs VF Tj=25 C Forward on voltage (terminal) VGE = V Tj=125 C VF IF = 5A Tj=25 C V (chip) Tj=125 C Lead resistance, terminal-chip (*4) R lead mω Note *4: Biggest internal terminal resistance among arm. Thermal resistance characteristics Items Symbols Conditions Characteristics min. typ. max. Thermal resistance (1device) Rth(j-c) IGBT FWD Contact Thermal resistance (1 device) (*5) Rth(c-f) with Thermal Compound Note *5: This is the value which is defined mounting on the additional cooling fin with thermal compound. Units C/W 1

2 2MBI1HB-12-5 Characteristics (Representative) 25 Collector current vs. Collector-Emitter voltage (typ.) Tj=25 o C / chip 25 Collector current vs. Collector-Emitter voltage (typ.) Tj=125 o C / chip V 12V VGE=2V 1V 8V Collector current : Ic [A ] V 12V VGE=2V 1V 8V Collector current vs. Collector-Emitter voltage (typ.) VGE=15V / chip 1 Collector-Emitter voltage vs. Gate-Emitter voltage (typ.) Tj=25 o C / chip Tj=25 o C Tj=125 o C Ic=2A Ic=1A Ic=5A Gate-Emitter voltage : VGE [ V ] Capacitance vs. Collector-Emitter voltage (typ.) VGE=V, f=1mhz, Tj=25 o C Dynamic Gate charge (typ.) Vcc=6V, Ic=1A, Tj=25 o C Capacitance : Cies, Coes, Cres [ nf ] Cies Coes Cres Collector- Emitter voltage : VCE[ 2V/div ] Gate-Emitter voltage : VGE [ 5V/div ] VCE VGE Gate charge : Qg [ nc ] 2

3 2MBI1HB Switching time vs. Collector current (typ.) Vcc=6V, VGE=±15V, RG=3.1Ω,Tj=25ºC 1 Switching time vs. Collector current (typ.) Vcc=6V, VGE=±15V, RG=3.1Ω,Tj=125ºC Switching time : toff, tf [ nsec ] 1 toff tf Switching time : toff, tf [ nsec ] 1 toff tf Switching time vs. Gate resistance (typ.) Vcc=6V, Ic=1A, VGE=±15V,Tj=25ºC Switching loss vs. Collector current (typ.) Vcc=6V, VGE=±15V, RG=3.1Ω 1 1 Switching time : toff, tf [ nsec ] 1 toff tf Switching loss : Eoff [ mj/pulse ] 5 Eoff(125 o C) Eoff(25 o C) Gate resistance : RG [ Ω ] Switching loss vs. Gate resistance (typ.) Reverse bias safe operating area (max.) Vcc=6V, Ic=1A, VGE=±15V,Tj=125ºC +VGE=15V, -VGE <= 15V, RG >= 3.1Ω,Tj <= 125ºC 2 3 Switching loss : Eoff [ mj/pulse ] 1 Eoff Gate resistance : RG [ Ω ]

4 2MBI1HB Forward current vs. Forward on voltage (typ.) chip 1. Transient thermal resistance (max.) Forward current : IF [ A ] Tj=25ºC Tj=125ºC Thermal resistance : Rth(j-c) [ ºC/W ].1.1 FWD IGBT Forward on voltage : VF [ V ] Pulse width : PW [ sec ] 4

5 2MBI1HB-12-5 Outline Drawings, mm Equivalent Circuit Schematic C1 G1 E1 C2E1 G2 E2 E2 5

6 2MBI1HB-12-5 WARNING 1. This Catalog contains the product specifications, characteristics, data, materials, and structures as of May 211. The contents are subject to change without notice for specification changes or other reasons. When using a product listed in this Catalog, be sur to obtain the latest specifications. 2. All applications described in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Co., Ltd. is (or shall be deemed) granted. Fuji Electric Co., Ltd. makes no representation or warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property rights which may arise from the use of the applications described herein. 3. Although Fuji Electric Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the products become faulty. It is recommended to make your design failsafe, flame retardant, and free of malfunction. 4. The products introduced in this Catalog are intended for use in the following electronic and electrical equipment which has normal reliability requirements. Computers OA equipment Communications equipment (terminal devices) Measurement equipment Machine tools Audiovisual equipment Electrical home appliances Personal equipment Industrial robots etc. 5. If you need to use a product in this Catalog for equipment requiring higher reliability than normal, such as for the equipment listed below, it is imperative to contact Fuji Electric Co., Ltd. to obtain prior approval. When using these products for such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's product incorporated in the equipment becomes faulty. Transportation equipment (mounted on cars and ships) Trunk communications equipment Traffic-signal control equipment Gas leakage detectors with an auto-shut-off feature Emergency equipment for responding to disasters and anti-burglary devices Safety devices Medical equipment 6. Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic equipment (without limitation). Space equipment Aeronautic equipment Nuclear control equipment Submarine repeater equipment 7. Copyright by Fuji Electric Co., Ltd. All rights reserved. No part of this Catalog may be reproduced in any form or by any means without the express permission of Fuji Electric Co., Ltd. 8. If you have any question about any portion in this Catalog, ask Fuji Electric Co., Ltd. or its sales agents before using the product. Neither Fuji Electric Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in accordance with instructions set forth herein. 6

7 Technical Information Please refer to URLs below for futher information about products, application manuals and technical documents. 关于本规格书中没有记载的产品信息, 应用手册, 技术资料等, 请参考以下链接 本データシートに記載されていない製品情報, アプリケーションマニュアル, 技術資料は以下の URL をご参照下さい FUJI ELECTRIC Power Semiconductor WEB site 日本 Global 中国 Europe North America Information 日本 1 半導体総合カタログ 2 製品情報 3 アプリケーションマニュアル 4 技術資料 5 マウンティングインストラクション 6 IGBT 損失シミュレーションソフト 7 AT-NPC 3-Level 損失シュミレーションソフト 8 富士電機技報 9 製品のお問い合わせ 1 改廃のお知らせ Global 1 Semiconductors General Catalog 2 Product Information 3 Application Manuals 4 Technical Documents 5 Mounting Instructions 6 IGBT Loss Simulation Software 7 AT-NPC 3-Level Loss Simulation Software 8 Fuji Electric Journal 9 Contact 1 Revised and discontinued product information 中国 1 半导体综合目录 2 产品信息 3 应用手册 4 技术资料 5 安装说明书 6 IGBT 损耗模拟软件 7 AT-NPC 3-Level 损耗模拟软件 8 富士电机技报 9 产品咨询 1 产品更改和停产信息

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