IEOR 130 Methods of Manufacturing Improvement Fall, 2018, Prof. Leachman Homework Assignment 8, Due Tuesday Nov. 13
|
|
- Blake McDowell
- 5 years ago
- Views:
Transcription
1 IEOR 130 Methods of Manufacturing Improvement Fall, 2018, Prof. Leachman Homework Assignment 8, Due Tuesday Nov Consider a factory operating at a steady production rate. Suppose the target WIP level is 200 lots. The average cycle time per lot from release to factory output is 50 days. (a) On average, how many lots leave the factory each day, and how many new ones are released into the factory? (Hint: Apply Little's Law.). (b) Suppose photo is the bottleneck work center and it is visited 5 times by each lot as it moves through the process flow. The processing time at each photo step is 5 hours per lot. There are five identical machines in the photo work center averaging 90% availability. What is the utilization of total time and the utilization of available time in the bottleneck work center? Assume the factory operates 24 hours per day, seven days per week. (c) The standard deviations of the cycle times between each photo exposure operation have been computed as follows: Fab-in to Layer days Layer 1 to Layer days Layer 2 to Layer days Layer 3 to Layer days Layer 4 to Layer days The sum of standard cycle times for the process steps in each layer are as follows: Layer 1-2 days Layer 3-4 days Layer 5-4 days Layer 2-4 days Layer 4-4 days Layer 6-2 days For a target cycle time of 50 days, determine the target WIP level in each layer. (d) For a 50-day target cycle time, what is the multiplier of standard cycle time? What is the value of the multiplier in the various layers? Why is the multiplier different in different layers? (e) What target cycle time would be equal to 2 times standard cycle time? 2. Consider a factory producing high-volume products. A particular type of processing machine performs several recipes with the following data:! 1
2 Actual Target Target Avg. Process On-hand WIP Recipe Downstream Downstream Fab Outs Time per and WIP arriving WIP WIP per shift Wafer (mins) this shift A B C D (a) Assuming the line yields are 100%, calculate the ideal production quantity (IPQ) for each recipe. (The IPQ is defined as the production quantity needed to bring the actual downstream WIP up to the target WIP level by the end of the shift, considering that one more shift's worth of fab outs must be added to the downstream WIP to replace the fab outs due in the current shift.) (b) Calculate the schedule score for each recipe. (The schedule score is defined as the IPQ divided by the average fab out rate over the cycle time from recipe start to fab out.) According to the schedule score, what is the priority ordering of the recipes? (c) The fab line has 2 machines of the type used to process recipes A, B, C and D. Considering the available WIP and the IPQ's, how many lots of each recipe should be allocated to each machine to be processed this shift? Assume all lots have 25 wafers, a shift lasts 8 hours, machine number one will be available all shift, and machine number two is due to receive a PM during the shift lasting 1.5 hours and will be otherwise available. 3. A wafer fab has a single process flow with five masking layers. The standard deviation of the cycle time between photo exposure operations has been computed as follows: Fab-in to Layer 1 exposure shifts (where one shift equals 8 hours) Layer 1 exposure to Layer 2 exposure shifts Layer 2 exposure to Layer 3 exposure shifts Layer 3 exposure to Layer 4 exposure shifts Layer 4 exposure to Layer 5 exposure shifts Layer 5 exposure to fab-out shifts The sum of standard cycle times for the process steps in each layer has been computed as follows: Layer 1-2 shifts Layer 3-4 shifts Layer 2-4 shifts Layer 4-4 shifts! 2
3 Layer 5-4 shifts Layer 6-2 shifts (a) The target cycle time for the entire fab process is 40 shifts. The target production rate is 10 lots per shift. Determine the target WIP level for each layer. (b) Currently, layer 5 has a WIP level of 110 lots. The photo stepper machines each can process two lots per hour when they are up; average availability of these machines is 90%. If two steppers are qualified to perform the layer 5 exposure, estimate how long it will take to reduce the WIP in layer 5 to the target level. (c) How many steppers would need to be qualified for layer 5 if the recovery time is to be within two hours, i.e., less than 0.25 shifts? (d) Now suppose at the start of a shift the actual WIP levels (expressed in lots) are as follows: Layer Total WIP WIP On-Hand Qualified in Layer at Photo step Steppers A,B,C,D C,D A,B,C,D D B Assuming fab-outs up until the start of the shift are exactly on time, determine the ideal production quantity (IPQ) and schedule score (SS) for each photo operation. (Each photo operation is the last operation in its layer.) (e) The fab has four total steppers (A, B, C, D). Each stepper is qualified to perform only certain photo operations, as specified in the table above. Assume that all four steppers will be available all 8 hours during the shift, and that the process time per lot is 0.5 hours for all photo operations. Suggest an efficient shift schedule for the four steppers. Assume that only WIP on-hand at photo may be scheduled for processing by the steppers. 4. A wafer fab operates a single process flow that has a photo step at the end of layers one through five. Layer six includes the remaining process steps after the last photo step. A detailed simulation of the fab has been run and stable steady-state statistics were collected as follows: Layer Avg. Wait time Std. Dev. Of Wait time Avg. No. of Lots! 3
4 in the layer (days) in the layer (days) in the layer The average output rate in the steady-state statistics of the simulation is 20 lots per day. (a) What was the steady-state average total cycle time in the simulation? (b) Suppose management sets the target cycle time for the process flow to be equal to the simulated average total cycle time. For an output rate of 20 lots per day, recommend target WIP levels in each layer. (c) Suppose fab outs to date are on time, and suppose the target output rate of 20 lots per day will be maintained for many weeks. The fab operates two 12-hour shifts per day. Suppose it is the start of a shift and the current WIP levels in each layer are as follows: Layer WIP (no. of lots) Calculate IPQs and Schedule Scores for each photo step. What is the priority order for scheduling the photo steps? (d) In the etch area of the fab, the process time per lot is 1 hour for all etch steps. There are two etch machines, M1 and M2. Each machine can perform any etch step. At the start of the shift, the etch area has the following data: Step IPQ (lots) Available WIP (lots) A 6 4 B 2 4 C D 2 8 The following shift schedule has been prepared by the etch area supervisor:! 4
5 Machine M1: Run 4 lots of A, then run 2 lots of B, then run 6 lots of C Machine M2: Run 8 lots of C, then run 4 lots of D Can this schedule be improved upon? If so, suggest the best schedule you can, and briefly note the reason why your schedule should be preferred over the schedule above.! 5
IEOR 130 Methods of Manufacturing Improvement Fall, 2017, Prof. Leachman Solutions to Homework Assignment 8
IEOR 130 Methods of Manufacturing Improvement Fall, 2017, Prof. Leachman Solutions to Homework Assignment 8 1. Consider a factory operating at a steady production rate. Suppose the target WIP level is
More informationIEOR 130 Methods of Manufacturing Improvement Fall, 2016 Prof. Leachman Homework Problems #6 Due Tuesday Oct. 11, 2016
IEOR 130 Methods of Manufacturing Improvement Fall, 2016 Prof. Leachman Homework Problems #6 Due Tuesday Oct. 11, 2016 1. Data in a factory has been collected on the performance of five types of machines,
More informationIEOR 130 Methods of Manufacturing Improvement Solutions to HW #5 Fall 2018, Prof. Leachman
IEOR 130 Methods of Manufacturing Improvement Solutions to HW #5 Fall 2018, Prof. Leachman 1. Data in a factory has been collected on the performance of five types of machines, as displayed in the following
More informationIEOR 130 Methods of Manufacturing Improvement Fall, 2016, Prof. Leachman Solutions to Homework Assignment 10.
IEOR 130 Methods of Manfactring Improvement Fall, 016, Prof. Leachman Soltions to Homework Assignment 10. 1. Consider a fab prodcing a NAND flash device. Prodction volme is 50,000 wafer starts per week.
More informationA LOAD BALANCING METHOD FOR DEDICATED PHOTOLITHOGRAPHY MACHINE CONSTRAINT
36 A LOAD BALANCING METHOD FOR DEDICATED PHOTOLITHOGRAPHY MACHINE CONSTRAINT Arthur Shr 1, Alan Liu 1, Peter P. Chen 2 1 Department of Electrical Engineering, National Chung Cheng University Chia-Yi 621,
More informationEE 126 Fall 2006 Midterm #1 Thursday October 6, 7 8:30pm DO NOT TURN THIS PAGE OVER UNTIL YOU ARE TOLD TO DO SO
EE 16 Fall 006 Midterm #1 Thursday October 6, 7 8:30pm DO NOT TURN THIS PAGE OVER UNTIL YOU ARE TOLD TO DO SO You have 90 minutes to complete the quiz. Write your solutions in the exam booklet. We will
More informationA study of digital clock usage in 7-point matches in backgammon
A study of digital clock usage in 7-point matches in backgammon Chuck Bower Abstract The results of a study of 179 seven point backgammon matches is presented. It is shown that 1 ¾ hours is sufficient
More informationDaniel Plotnick. November 5 th, 2017 Mock (Practice) AMC 8 Welcome!
November 5 th, 2017 Mock (Practice) AMC 8 Welcome! 2011 = prime number 2012 = 2 2 503 2013 = 3 11 61 2014 = 2 19 53 2015 = 5 13 31 2016 = 2 5 3 2 7 1 2017 = prime number 2018 = 2 1009 2019 = 3 673 2020
More information12.1 The Fundamental Counting Principle and Permutations
12.1 The Fundamental Counting Principle and Permutations The Fundamental Counting Principle Two Events: If one event can occur in ways and another event can occur in ways then the number of ways both events
More informationME 5281 Fall Homework 8 Due: Wed. Nov. 4th; start of class.
ME 5281 Fall 215 Homework 8 Due: Wed. Nov. 4th; start of class. Reading: Chapter 1 Part A: Warm Up Problems w/ Solutions (graded 4%): A.1 Non-Minimum Phase Consider the following variations of a system:
More informationEfficiency & Yield Improvements with Factory-Wide Process Control Software
Efficiency & Yield Improvements with Factory-Wide Process Control Software David Genova, MS, MBA david.genova@rudolphtech.com PVMC c-si Metrology Workshop July, 2012 Outline Factory Automation Data-Collection
More informationTwo Factor Full Factorial Design with Replications
Two Factor Full Factorial Design with Replications Raj Jain Washington University in Saint Louis Saint Louis, MO 63130 Jain@cse.wustl.edu These slides are available on-line at: 22-1 Overview Model Computation
More informationProcess Optimization
Process Optimization Process Flow for non-critical layer optimization START Find the swing curve for the desired resist thickness. Determine the resist thickness (spin speed) from the swing curve and find
More informationName: Final Exam May 7, 2014
MATH 10120 Finite Mathematics Final Exam May 7, 2014 Name: Be sure that you have all 16 pages of the exam. The exam lasts for 2 hrs. There are 30 multiple choice questions, each worth 5 points. You may
More informationCRITICAL TOOLS IDENTIFICATION AND CHARACTERISTICS CURVES CONSTRUCTION IN A WAFER FABRICATION FACILITY
Proceedings of the 2001 Winter Simulation Conference B. A. Peters, J. S. Smith, D. J. Medeiros, and M. W. Rohrer, eds CRITICAL TOOLS IDENTIFICATION AND CHARACTERISTICS CURVES CONSTRUCTION IN A WAFER FABRICATION
More informationHOMEWORK 3 Due: next class 2/3
HOMEWORK 3 Due: next class 2/3 1. Suppose the scores on an achievement test follow an approximately symmetric mound-shaped distribution with mean 500, min = 350, and max = 650. Which of the following is
More informationCompetitive Semiconductor Manufacturing: Summary Report on Findings from Benchmarking Eight-inch, sub-350nm Wafer Fabrication Lines
Competitive Semiconductor Manufacturing: Summary Report on Findings from Benchmarking Eight-inch, sub-350nm Wafer Fabrication Lines Robert C. Leachman Competitive Semiconductor Manufacturing Program Engineering
More informationProceedings of the 2016 Winter Simulation Conference T. M. K. Roeder, P. I. Frazier, R. Szechtman, E. Zhou, T. Huschka, and S. E. Chick, eds.
Proceedings of the 2016 Winter Simulation Conference T. M. K. Roeder, P. I. Frazier, R. Szechtman, E. Zhou, T. Huschka, and S. E. Chick, eds. DEDICATION LOAD BASED DISPATCHING RULE FOR PHOTOLITHOGRAPHY
More informationPixel Response Effects on CCD Camera Gain Calibration
1 of 7 1/21/2014 3:03 PM HO M E P R O D UC T S B R IE F S T E C H NO T E S S UP P O RT P UR C HA S E NE W S W E B T O O L S INF O C O NTA C T Pixel Response Effects on CCD Camera Gain Calibration Copyright
More informationCritical Dimension Sample Planning for 300 mm Wafer Fabs
300 S mm P E C I A L Critical Dimension Sample Planning for 300 mm Wafer Fabs Sung Jin Lee, Raman K. Nurani, Ph.D., Viral Hazari, Mike Slessor, KLA-Tencor Corporation, J. George Shanthikumar, Ph.D., UC
More informationWednesday, Feb 27, :45 PM / High Speed quad SPST CMOS analog switch ADG201HS
Wednesday, Feb 27, 2008 3:45 PM / High Speed quad SPST CMOS analog switch ADG201HS 1.0 SCOPE This specification documents the detail requirements for space qualified product manufactured on Analog Devices,
More information3D SIMULATOR OF TRACK SYSTEMS IN SEMICONDUCTOR FABRICATION. Seung Bong Hong, Doo Yong Lee, and Hyun Joong Yoon
Copyright 2002 IFAC 15th Triennial World Congress, Barcelona, Spain 3D SIMULATOR OF TRACK SYSTEMS IN SEMICONDUCTOR FABRICATION Seung Bong Hong, Doo Yong Lee, and Hyun Joong Yoon Department of Mechanical
More informationA Perspective on Semiconductor Equipment. R. B. Herring March 4, 2004
A Perspective on Semiconductor Equipment R. B. Herring March 4, 2004 Outline Semiconductor Industry Overview of circuit fabrication Semiconductor Equipment Industry Some equipment business strategies Product
More informationIMAPS NE 45 A HETEROGENEOUS SIP SOLUTION FOR RF APPLICATIONS
IMAPS NE 45 A HETEROGENEOUS SIP SOLUTION FOR RF APPLICATIONS May 1st 2018 Justin C. Borski i3 Microsystems Inc. justin.borski@i3microsystems.com A HETEROGENEOUS SIP SOLUTION FOR RF APPLICATIONS Presentation
More informationProcess Control Limits in a CMOS ASIC Fabrication Process K. Jayavel, K.S.R.C.Murthy
Process Control Limits in a CMOS ASIC Fabrication Process K. Jayavel, K.S.R.C.Murthy Society for Integrated circuit Technology and Applied Research Centre (SITAR), 1640, Doorvaninagar, Bangalore, Karnataka,
More information* How many total outcomes are there if you are rolling two dice? (this is assuming that the dice are different, i.e. 1, 6 isn t the same as a 6, 1)
Compound probability and predictions Objective: Student will learn counting techniques * Go over HW -Review counting tree -All possible outcomes is called a sample space Go through Problem on P. 12, #2
More informationDay 1 p.2-3 SS 3.1/3.2: Rep-Tile Quadrilaterals & Triangles
Stretching and Shrinking Unit: Understanding Similarity Name: Per: Investigation 3: Scaling Perimeter and Area and Investigation 4: Similarity and Ratios Date Learning Target/s Classwork (Check Off Completed/
More informationStudent's height (in)
Psych 315, Winter 2018, Homework 4 Answer Key Due Wednesday, January 31 either in section or in your TA s mailbox by 4pm. Name ID Section [AA Kit] [AB Kit] [AC Kelly] [AD Kelly] The scatterplot below plots
More informationTaiwan International Mathematics Competition 2012 (TAIMC 2012)
Time:60 minutes Instructions: Do not turn to the first page until you are told to do so. Remember to write down your team name in the space indicated on every page. There are 10 problems in the Team Contest,
More informationMAT points Impact on Course Grade: approximately 10%
MAT 409 Test #3 60 points Impact on Course Grade: approximately 10% Name Score Solve each problem based on the information provided. It is not necessary to complete every calculation. That is, your responses
More informationExplain how you found your answer. NAEP released item, grade 8
Raynold had 31 baseball cards. He gave the cards to his friends. Six of his friends received 3 cards Explain how you found your answer. Scoring Guide Solution: 6 x 3 cards = 18 cards 7 x 1 card = 7 cards
More informationChapter 8 Traffic Channel Allocation
Chapter 8 Traffic Channel Allocation Prof. Chih-Cheng Tseng tsengcc@niu.edu.tw http://wcnlab.niu.edu.tw EE of NIU Chih-Cheng Tseng 1 Introduction What is channel allocation? It covers how a BS should assign
More informationCS445: Modeling Complex Systems
CS445: Modeling Complex Systems Travis Desell! Averill M. Law, Simulation Modeling & Analysis, Chapter 2!! Time-Shared Computer Model Time Shared Computer Model Terminals Computer Unfinished s 2 2... Active
More informationQuestion Score Max Cover Total 149
CS170 Final Examination 16 May 20 NAME (1 pt): TA (1 pt): Name of Neighbor to your left (1 pt): Name of Neighbor to your right (1 pt): This is a closed book, closed calculator, closed computer, closed
More information1) What is the total area under the curve? 1) 2) What is the mean of the distribution? 2)
Math 1090 Test 2 Review Worksheet Ch5 and Ch 6 Name Use the following distribution to answer the question. 1) What is the total area under the curve? 1) 2) What is the mean of the distribution? 2) 3) Estimate
More informationA Student Scheduling System for Federal Law Enforcement Training Centers (FLETC)
A Student Scheduling System for Federal Law Enforcement Training Centers (FLETC) Frederik Fiand FrederikFiand@googlemail.com Diploma Thesis at the Institute for Mathematical Optimization, TU Braunschweig
More informationUKMT UKMT. Team Maths Challenge 2015 Regional Final. Group Round UKMT. Instructions
Instructions Your team will have 45 minutes to answer 10 questions. Each team will have the same questions. Each question is worth a total of 6 marks. However, some questions are easier than others! Do
More information32 nd NEW BRUNSWICK MATHEMATICS COMPETITION
UNIVERSITY OF NEW BRUNSWICK UNIVERSITÉ DE MONCTON 32 nd NEW BRUNSWICK MATHEMATICS COMPETITION Friday, May 9, 2014 GRADE 7 INSTRUCTIONS TO THE STUDENT: 1. Do not start the examination until you are told
More informationMarch 5, What is the area (in square units) of the region in the first quadrant defined by 18 x + y 20?
March 5, 007 1. We randomly select 4 prime numbers without replacement from the first 10 prime numbers. What is the probability that the sum of the four selected numbers is odd? (A) 0.1 (B) 0.30 (C) 0.36
More information2359 (i.e. 11:59:00 pm) on 4/16/18 via Blackboard
CS 109: Introduction to Computer Science Goodney Spring 2018 Homework Assignment 4 Assigned: 4/2/18 via Blackboard Due: 2359 (i.e. 11:59:00 pm) on 4/16/18 via Blackboard Notes: a. This is the fourth homework
More informationCH 20 NUMBER WORD PROBLEMS
187 CH 20 NUMBER WORD PROBLEMS Terminology To double a number means to multiply it by 2. When n is doubled, it becomes 2n. The double of 12 is 2(12) = 24. To square a number means to multiply it by itself.
More informationCS188 Spring 2010 Section 3: Game Trees
CS188 Spring 2010 Section 3: Game Trees 1 Warm-Up: Column-Row You have a 3x3 matrix of values like the one below. In a somewhat boring game, player A first selects a row, and then player B selects a column.
More informationSome Problems Involving Number Theory
Math F07 Activities, page 7 Some Problems Involving Number Theory. Mrs. Trubblemacher hosted a party for her son s Boy Scout troop. She was quite flustered having a house full of enthusiastic boys, so
More informationJessica Fauser EDUC 352 October 21, 2011 Unit Lesson Plan #3. Lesson: Permutations and Combinations Length: 45 minutes Age/Grade Intended: Algebra II
Jessica Fauser EDUC 352 October 21, 2011 Unit Lesson Plan #3 Lesson: Permutations and Combinations Length: 45 minutes Age/Grade Intended: Algebra II Academic Standard(s): A2.8.4 Use permutations, combinations,
More informationDiminishing Returns on Knowledge in Operations Management
PICMET 2008 08 Diminishing Returns on Knowledge in Operations Management Charles Weber and Asser Fayed October 12-15, 2008 Washington, DC, USA ETM Slide # 1 Abstract A empirically grounded model of the
More informationOptolith 2D Lithography Simulator
2D Lithography Simulator Advanced 2D Optical Lithography Simulator 4/13/05 Introduction is a powerful non-planar 2D lithography simulator that models all aspects of modern deep sub-micron lithography It
More informationCompetitive Semiconductor Manufacturing: Final Report on Findings from Benchmarking Eight-inch, sub-350nm Wafer Fabrication Lines Robert C.
Competitive Semiconductor Manufacturing: Final Report on Findings from Benchmarking Eight-inch, sub-350nm Wafer Fabrication Lines Robert C. Leachman Competitive Semiconductor Manufacturing Program Engineering
More informationSeparating the Signals from the Noise
Quality Digest Daily, October 3, 2013 Manuscript 260 Donald J. Wheeler The second principle for understanding data is that while some data contain signals, all data contain noise, therefore, before you
More informationBCD Adder. Lecture 21 1
BCD Adder -BCD adder A 4-bit binary adder that is capable of adding two 4-bit words having a BCD (binary-coded decimal) format. The result of the addition is a BCD-format 4-bit output word, representing
More information4.3. Trigonometric Identities. Introduction. Prerequisites. Learning Outcomes
Trigonometric Identities 4.3 Introduction trigonometric identity is a relation between trigonometric expressions which is true for all values of the variables (usually angles. There are a very large number
More informationGrade 6 Math Circles March 8-9, Modular Arithmetic
Faculty of Mathematics Waterloo, Ontario N2L 3G Centre for Education in Mathematics and Computing Grade 6 Math Circles March 8-9, 26 Modular Arithmetic Introduction: The 2-hour Clock Question: If its 7
More informationHW4: The Game of Pig Due date: Thursday, Oct. 29 th at 9pm. Late turn-in deadline is Tuesday, Nov. 3 rd at 9pm.
HW4: The Game of Pig Due date: Thursday, Oct. 29 th at 9pm. Late turn-in deadline is Tuesday, Nov. 3 rd at 9pm. 1. Background: Pig is a folk jeopardy dice game described by John Scarne in 1945, and was
More informationModule 7. Accounting for quantization/digitalization e ects and "o -scale" values in measurement
Module 7 Accounting for quantization/digitalization e ects and "o -scale" values in measurement Prof. Stephen B. Vardeman Statistics and IMSE Iowa State University March 4, 2008 Steve Vardeman (ISU) Module
More informationThere is no class tomorrow! Have a good weekend! Scores will be posted in Compass early Friday morning J
STATISTICS 100 EXAM 3 Fall 2016 PRINT NAME (Last name) (First name) *NETID CIRCLE SECTION: L1 12:30pm L2 3:30pm Online MWF 12pm Write answers in appropriate blanks. When no blanks are provided CIRCLE your
More informationContents. Basic Concepts. Histogram of CPU-burst Times. Diagram of Process State CHAPTER 5 CPU SCHEDULING. Alternating Sequence of CPU And I/O Bursts
Contents CHAPTER 5 CPU SCHEDULING Basic Concepts Scheduling Criteria Scheduling Algorithms Multiple-Processor Scheduling Real-Time Scheduling Basic Concepts Maximum CPU utilization obtained with multiprogramming
More informationCS188 Spring 2010 Section 3: Game Trees
CS188 Spring 2010 Section 3: Game Trees 1 Warm-Up: Column-Row You have a 3x3 matrix of values like the one below. In a somewhat boring game, player A first selects a row, and then player B selects a column.
More informationISMI Industry Productivity Driver
SEMATECH Symposium Japan September 15, 2010 Accelerating Manufacturing Productivity ISMI Industry Productivity Driver Scott Kramer VP Manufacturing Technology SEMATECH Copyright 2010 SEMATECH, Inc. SEMATECH,
More informationPROCESS SAFETY FOR THE REFINING AND PETROCHEMICAL INDUSTRIES
PROCESS SAFETY FOR THE REFINING AND PETROCHEMICAL INDUSTRIES AREAS COVERED IN THE SITE ASSESSMENT PROGRAM Process Safety Leadership Management of Change Mechanical Integrity (focused on Fixed Equipment)
More informationIntroduction to Counting Homework Solutions
Introduction to Counting Homework Solutions 1. Area codes: Here are the rules that were in use until 1993: The first digit must be 2 through 9. The second digit must be 0 or 1. The third digit must be
More informationCCD Image Calibration Using AIP4WIN
CCD Image Calibration Using AIP4WIN David Haworth The purpose of image calibration is to remove unwanted errors caused by CCD camera operation. Image calibration is a very import first step in the processing
More informationLAM TCP 9400 PTX Silicon Trench Etch Process Monitoring for Fault Detection and Classification
LAM TCP 9400 PTX Silicon Trench Etch Process Monitoring for Fault Detection and Classification Teina Pardue Teina.Pardue@fairchildsemi.com Fairchild Semiconductor 3333 West 9000 South West Jordan Utah
More informationIf a fair coin is tossed 10 times, what will we see? 24.61% 20.51% 20.51% 11.72% 11.72% 4.39% 4.39% 0.98% 0.98% 0.098% 0.098%
Coin tosses If a fair coin is tossed 10 times, what will we see? 30% 25% 24.61% 20% 15% 10% Probability 20.51% 20.51% 11.72% 11.72% 5% 4.39% 4.39% 0.98% 0.98% 0.098% 0.098% 0 1 2 3 4 5 6 7 8 9 10 Number
More informationName. Is the game fair or not? Prove your answer with math. If the game is fair, play it 36 times and record the results.
Homework 5.1C You must complete table. Use math to decide if the game is fair or not. If Period the game is not fair, change the point system to make it fair. Game 1 Circle one: Fair or Not 2 six sided
More informationCH 11 ADDING AND SUBTRACTING SIGNED NUMBERS
CH 11 ADDING AND SUBTRACTING SIGNED NUMBERS 95 Let s Play Jeopardy! E ach answer in Jeopardy is worth a specific number of dollars. Your score goes up or down depending on whether you get the question
More information5. Suppose the points of a scatterplot lie close to the line 3x + 2y = 6. The slope of this line is: A) 3. B) 2/3. C) 3/2. D) 3/2.
DISCRETE MIDTERM REVIEW 1. An outlier is an individual value that: A) extends the pattern. B) deviates from the pattern. C) determines the strength of the relationship. D) outlines the general form of
More informationBasic Bidding. Review
Bridge Lesson 2 Review of Basic Bidding 2 Practice Boards Finding a Major Suit Fit after parter opens 1NT opener, part I: Stayman Convention 2 Practice Boards Fundamental Cardplay Concepts Part I: Promotion,
More informationLesson 1: Place Value of Whole Numbers. Place Value, Value, and Reading Numbers in the Billions
Place Value of Whole Numbers Lesson 1: Place Value, Value, and Reading Numbers in the Billions Jul 15 9:37 PM Jul 16 10:55 PM Numbers vs. Digits Let's begin with some basic vocabulary. First of all, what
More informationMIDTERM REVIEW INDU 421 (Fall 2013)
MIDTERM REVIEW INDU 421 (Fall 2013) Problem #1: A job shop has received on order for high-precision formed parts. The cost of producing each part is estimated to be $65,000. The customer requires that
More information4.510 Digital Design Fabrication Fall 2008
MIT OpenCourseWare http://ocw.mit.edu 4.510 Digital Fall 2008 For information about citing these materials or our Terms of Use, visit: http://ocw.mit.edu/terms. Assignment 2 Sept 15, 2008 Design and Fabrication
More informationPart 5-1: Lithography
Part 5-1: Lithography Yao-Joe Yang 1 Pattern Transfer (Patterning) Types of lithography systems: Optical X-ray electron beam writer (non-traditional, no masks) Two-dimensional pattern transfer: limited
More information6.777J/2.372J Design and Fabrication of Microelectromechanical Devices Spring Term Massachusetts Institute of Technology
6.777J/2.372J Design and Fabrication of Microelectromechanical Devices Spring Term 2007 Massachusetts Institute of Technology PROBLEM SET 2 (16 pts) Issued: Lecture 4 Due: Lecture 6 Problem 4.14 (4 pts):
More informationABSTRACT APPLICATION OF A 2-STAGE GROUP-SCREENING DESIGN TO A WHOLE-LINE SEMICONDUCTOR MANUFACTURING SIMULATION MODEL
Proceedings of the 1996 Winter Simulation Conference ed. J. M. Charnes, D. J. Morrice, D. T. Brunner, and J. J. S,vain APPLICATION OF A 2-STAGE GROUP-SCREENING DESIGN TO A WHOLE-LINE SEMICONDUCTOR MANUFACTURING
More informationNumber Theory/Cryptography (part 1 of CSC 282)
Number Theory/Cryptography (part 1 of CSC 282) http://www.cs.rochester.edu/~stefanko/teaching/11cs282 1 Schedule The homework is due Sep 8 Graded homework will be available at noon Sep 9, noon. EXAM #1
More information7.1 Chance Surprises, 7.2 Predicting the Future in an Uncertain World, 7.4 Down for the Count
7.1 Chance Surprises, 7.2 Predicting the Future in an Uncertain World, 7.4 Down for the Count Probability deals with predicting the outcome of future experiments in a quantitative way. The experiments
More informationStatistics Laboratory 7
Pass the Pigs TM Statistics 104 - Laboratory 7 On last weeks lab we looked at probabilities associated with outcomes of the game Pass the Pigs TM. This week we will look at random variables associated
More informationAREA & PERIMETER LESSON 1 OBJ ECTIVE: OBJECTIVE: INVESTIGATE AND USE THE FORMULAS FOR AREA AND PERIMETER OF RECTANGLES.
AREA & PERIMETER LESSON 1 OBJ ECTIVE: OBJECTIVE: INVESTIGATE AND USE THE FORMULAS FOR AREA AND PERIMETER OF RECTANGLES. Learning Goal By the end of the unit... students will apply the area and perimeter
More informationEUV Light Source The Path to HVM Scalability in Practice
EUV Light Source The Path to HVM Scalability in Practice Harald Verbraak et al. (all people at XTREME) 2011 International Workshop on EUV and Soft X-ray Sources Nov. 2011 Today s Talk o LDP Technology
More informationProblem 1 (15 points: Graded by Shahin) Recall the network structure of our in-class trading experiment shown in Figure 1
Solutions for Homework 2 Networked Life, Fall 204 Prof Michael Kearns Due as hardcopy at the start of class, Tuesday December 9 Problem (5 points: Graded by Shahin) Recall the network structure of our
More informationStatistical Process Control and Computer Integrated Manufacturing. The Equipment Controller
Statistical Process Control and Computer Integrated Manufacturing Run to Run Control, Real-Time SPC, Computer Integrated Manufacturing. 1 The Equipment Controller Today, the operation of individual pieces
More informationIt s Time for 300mm Prime
It s Time for 300mm Prime Iddo Hadar Managing Director, 300mm Prime Program Office SEMI Strategic Business Conference Napa Valley, California Tuesday, April 24, 2007 Safe Harbor Statement This presentation
More informationIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 22, NO. 3, AUGUST
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 22, NO. 3, AUGUST 2009 351 Photolithography Control in Wafer Fabrication Based on Process Capability Indices With Multiple Characteristics W. L. Pearn,
More informationMATH 021 TEST 2 REVIEW SHEET
TO THE STUDENT: MATH 021 TEST 2 REVIEW SHEET This Review Sheet gives an outline of the topics covered on Test 2 as well as practice problems. Answers for all problems begin on page 8. In several instances,
More informationEE141-Fall 2009 Digital Integrated Circuits
EE141-Fall 2009 Digital Integrated Circuits Lecture 2 Integrated Circuit Basics: Manufacturing and Cost 1 1 Administrative Stuff Discussions start this Friday We have a third GSI Richie Przybyla, rjp@eecs
More informationMath for Economics 1 New York University FINAL EXAM, Fall 2013 VERSION A
Math for Economics 1 New York University FINAL EXAM, Fall 2013 VERSION A Name: ID: Circle your instructor and lecture below: Jankowski-001 Jankowski-006 Ramakrishnan-013 Read all of the following information
More informationENGIN 112 Intro to Electrical and Computer Engineering
ENGIN 112 Intro to Electrical and Computer Engineering Lecture 28 Timing Analysis Overview Circuits do not respond instantaneously to input changes Predictable delay in transferring inputs to outputs Propagation
More informationACTIVITY 6.7 Selecting and Rearranging Things
ACTIVITY 6.7 SELECTING AND REARRANGING THINGS 757 OBJECTIVES ACTIVITY 6.7 Selecting and Rearranging Things 1. Determine the number of permutations. 2. Determine the number of combinations. 3. Recognize
More informationMath Exam 1 Review Fall 2009
Note: This is NOT a practice exam. It is a collection of problems to help you review some of the material for the exam and to practice some kinds of problems. This collection is not necessarily exhaustive.
More informationProceedings of the 2016 Winter Simulation Conference T. M. K. Roeder, P. I. Frazier, R. Szechtman, E. Zhou, T. Huschka, and S. E. Chick, eds.
Proceedings of the 2016 Winter Simulation Conference T. M. K. Roeder, P. I. Frazier, R. Szechtman, E. Zhou, T. Huschka, and S. E. Chick, eds. A LITERATURE REVIEW ON VARIABILITY IN SEMICONDUCTOR MANUFACTURING:
More informationChapter 20. Inference about a Population Proportion. BPS - 5th Ed. Chapter 19 1
Chapter 20 Inference about a Population Proportion BPS - 5th Ed. Chapter 19 1 Proportions The proportion of a population that has some outcome ( success ) is p. The proportion of successes in a sample
More informationTHOMSON REUTERS INDICES EQUAL WEIGHT COMMODITY TOTAL RETURN INDEX
THOMSON REUTERS INDICES EQUAL WEIGHT COMMODITY TOTAL RETURN INDEX May 2015 1 TABLE OF CONTENTS Index Description 3 Methodology 3 Contract Roll 4 Real-Time Pricing Considerations 4 Constituent Contracts
More informationMidterm 2 Practice Problems
Midterm 2 Practice Problems May 13, 2012 Note that these questions are not intended to form a practice exam. They don t necessarily cover all of the material, or weight the material as I would. They are
More informationPartial Answers to the 2005 Final Exam
Partial Answers to the 2005 Final Exam Econ 159a/MGT522a Ben Polak Fall 2007 PLEASE NOTE: THESE ARE ROUGH ANSWERS. I WROTE THEM QUICKLY SO I AM CAN'T PROMISE THEY ARE RIGHT! SOMETIMES I HAVE WRIT- TEN
More information03_57_104_final.fm Page 97 Tuesday, December 4, :17 PM. Problems Problems
03_57_104_final.fm Page 97 Tuesday, December 4, 2001 2:17 PM Problems 97 3.9 Problems 3.1 Prove that for a hexagonal geometry, the co-channel reuse ratio is given by Q = 3N, where N = i 2 + ij + j 2. Hint:
More informationMath 1070 Sample Exam 1 Spring 2015
University of Connecticut Department of Mathematics Spring 2015 Name: Discussion Section: Read This First! Read the questions and any instructions carefully. The available points for each problem are given
More informationChapter 9 Introduction to Statistical Quality Control, 6 th Edition by Douglas C. Montgomery. Copyright (c) 2009 John Wiley & Sons, Inc.
1 2 Learning Objectives Chapter 9 Introduction to Statistical Quality Control, 6 th Edition by Douglas C. Montgomery. 3 9.1 The Cumulative Sum Control Chart Chapter 9 4 5 The Cumulative Sum Control Chart
More informationANALYZE. Lean Six Sigma Black Belt. Chapter 2-3. Short Run SPC Institute of Industrial Engineers 2-3-1
Chapter 2-3 Short Run SPC 2-3-1 Consider the Following Low production quantity One process produces many different items Different operators use the same equipment These are all what we refer to as short
More informationMath is Cool Masters
Sponsored by: Algebra II January 6, 008 Individual Contest Tear this sheet off and fill out top of answer sheet on following page prior to the start of the test. GENERAL INSTRUCTIONS applying to all tests:
More informationMethods for Manufacturing Improvement IEOR 130. Prof. Robert C. Leachman University of California at Berkeley. August, 2017
Methods for Manufacturing Improvement IEOR 130 Prof. Robert C. Leachman University of California at Berkeley August, 2017 IEOR 130 Purpose of course: instill cross-disciplinary, industrial engineering
More informationControl and Optimization
Control and Optimization Example Design Goals Prevent overheating Meet deadlines Save energy Design Goals Prevent overheating Meet deadlines Save energy Question: what the safety, mission, and performance
More informationMASSACHUSETTS INSTITUTE OF TECHNOLOGY
MASSACHUSETTS INSTITUTE OF TECHNOLOGY 15.053 Optimization Methods in Management Science (Spring 2007) Problem Set 7 Due April 12 th, 2007 at :30 pm. You will need 157 points out of 185 to receive a grade
More information