EF Solder Cream (V) (EFC-3C05)

Transcription

1 EF Solder Cream (V) (EFC3C05) EF Solder Cream Series

2 Technical Data Sheet EFC3C05 (Sn3.0Ag0.5Cu) Ecojoin.co.,Ltd 7233, KorimDong, YongInSi, KyungKiDo,(449010), KOREA Tel : , Fax :

3 Features of EF Solder Cream Pb Free Solder of high temperature Excellent Continuous Workability in Fine pitch Excellent Soldering property in 180 of Preheat Temperature Flux have Excellent insulation property and no cleaning Excellent Joint Strength and Thermal properties Minimal generation of void and crack at soldering joint. of Product 1. Product Name E F C 3 C 0 5 Alloy Composition 2. of Powder 3. of Flux Symbol Granularity Use Symbol Active rate ~20μm 20~38μm 20~45μm μbga, CSP, Micro Bumping 0.3~0.4mmPitch QFP, CSP 0.4~0.5mmPitch QFP Printing Type A M R RA Type RMA Type R Type 40 20~53 μm 0.65mmPitch QFP Dispenser D RA, RMA Type 4. Content of Flux 5. Viscosity of Solder Cream 11.6wt% ± ± 50Pa S 6. Packing Unit of Product 7. Valid 500g Three months after manufacturing in 5~10 0ne month after manufacturing in normal temperature Composition of Solder Alloy Sn Ag Cu Pb Sb Bi Zn Fe Ge Al Ni As Cd

4 Size Distribution Feature of Solder Powder Homogenized component Extremely low oxygen content Homogenous Powder shape & Granularity 1. Granularity and Shape 2. Oxygen Concentration 10 μm 10 μm 20 μm EF Solder Micro Solder Ultra Micro Solder Size( μm ) Oxygen Concentration (PPM) 20~ ~45 20~38 20~45 5~ μm 100 μm 250 μm (a) EF Solder (b) Micro Solder (c) Ultra Micro Solder Size( μm ) Feature of Flux Pb Free Solder Flux of Ecojoin don t generated Erosion of Copper plate, and hardened alteration. 12 Also, Insulation Resistance is over 10 Ω, and Spread rate is over 80%. 1. Erosion Features of Copper plates 2. Spreadability 3. Features of Insulation Resistance Insulation Resistance (Ω) Time (hrs) Flux of Pb Base System Flux of Pb Free System 96

5 EFC3C05 Features Remark Ref. Alloy composition Sn3.0Ag0.5Cu Sn3.0Ag0.5Cu Solder Powder Powder size Shape of powder Melting point( ) S5, 20~38μm Sphere,Within ~219 20~38μm Sphere, ~219 Laser SEM DSC Contents of oxide(ppm) Under 100ppm 77 Erosion of Copper plate Discoloration Discoloration JIS Z 3197 Spreadability(%) Over 80% 82 JIS Z 3197 Flux Solidity content(%) Halide content(%) Under 60% Under 0.14% 58 0 JIS Z 3197 JIS Z 3197 Resistance of water(ω Cm) Over 1 Ⅹ Ⅹ 10 6 JIS Z 3197 Resistance of Insulation(Ω) 40, 90%R.H Over 1 Ⅹ Ⅹ JIS Z 3197 Flux content (%) 11.6% ±0.5% Basic Feature of Solder Cream Rheol ogy Slump Viscosity(Pa S) Thixotropic Restoration(%) Tackiness (gf) After printing After heating (150 ) 200 ± ±0.05 Under 5% Over 120gf No crumbliness of 0.3mm Pitch No crumbliness of 0.3mm Pitch No crumbliness of 0.2mm Pitch No crumbliness of 0.2mm Pitch Sheet 1 Sheet 1 Sheet 1 Sheet 1 Sheet 2 Sheet 2 Solder Ball Initial After 72 hours Class2 (Under 3 point) Class2 (Under 3 point) Class2 (Under 3 point) Class2 (Under 3 point) Sheet 3 Sheet 3 Workab ility of Solder Cream Workability Viscosity Of Continuous Printing Tackiness Of Continuous Printing Viscosity Of Continuous Printing ± 30(8 hours) Tackiness: over 120gf (After Continuous Printing for 8 hours) Printing of 50 times In no cleaning Viscosity Of Continuous Printing 11Pa.s(194) Tackiness : 137gf Sheet 4 Sheet 5 Sheet 6 Stability of Charge No Change of Viscosity For 3 months No Change of Viscosity For 3 months Sheet 7 Tack Time Over 4 hours 12 hours (134gf after 48 hours) Sheet 7 Reliabil ity Of Solder Cream Resista nce of Insulati on Migration 40, 90%R.H 85, 85%R.H 40, 90%R.H,50V 85, 85%R.H,50V Over 1.0 Ⅹ Over 1.0 Ⅹ Ⅹ 10 9 No occurring migration Ⅹ Ⅹ Ⅹ Ⅹ Sheet 8 Sheet 8 Sheet 9 Sheet 9 Residue Tar test Pass Tar Test Pass Sheet 10 of Flux Shape of application Application of 10φ Shape of application Sheet 10

6 Features of Basic Rheology of Solder Cream is evaluated as follows using EFC3C05 Solder Cream. 1. Rheology Temp. Type 10RPM 3RPM 4RPM Visc 5RPM ocity 10RPM 20RPM 30RPM 10RPM Thixo Restoration EFC3C05 Malcom, VS3 25 Spiral Type Viscosity Temp.( ) (PaS) % ±20PaS ± % under Time(min.) Thixo (TI) Viscosity(PaS) 2. Dependence in Temperature of Viscosity Viscosity of Solder Cream depend on temperature as result, Solder Cream must raise temperature to normal temperature using negligence or stirrer. Temp. Type Viscosity(PaS ) EFC3C05 Malcom, VS3 25 Spiral Type Tackiness Test Temperature( ) Viscosity(PaS) Temperature( ) EFC3C05 Solder Cream of Ecojoin co.,ltd produce good result from tackiness test. EFC3C05 Malcom, TK1 condition Mask Squeeze 0.20mmt Urethane Over 120gf Time 4 5 Average Tackiness(gf) Attached Sheet 1

7 4. Slump Test EFC3C05 Solder Cream is produced good result to slump test. As maintaining 150, 5min, EFC3C05 Solder Cream don t crumble to 0.2mm pitch. EFC3C05 Mask Heat Method of Measurement 0.15mmt 180, 5min. Observation of Crumble in Printing Observation of Crumble in heat to180, 5min No Crumbliness of 0.3mm Pitch 41. After Printing No crumble in 0.3mm pitch No crumble in 0.3mm pitch 42. After heating (150, 5min.) No crumble in 0.3mm pitch No crumble in 0.3mm pitch Attached Sheet 2

8 5. Solder Ball Test EFC3C05 Solder Cream is produced good result to Solder Ball test as follows. EFC3C05 Solder Cream have class 1 after printing and negligence of 72 hours to 25,80%R.H. Test Temp.of Bath Board Mask Method of Measurement EFC3C Alumina 0.2mmt Observation of one hour Observation after printing and negligence in 60%R.H. 25 for 24 hours Observation after printing and negligence in 90%R.H. 30, for 8 hours Class After printing immediately No detect solder ball 52. After 72 hours No detect solder ball Attached Sheet 3

9 Workability of Solder Cream 1. of Printing Of Test of Test Squeeze Angle of Squeeze Speed Of Printing Printer Mask Environment of test Method of Measurement EFC3C05 Urethane 30 30mm/sec. MK2805A SUS304, 0.18mmt 23~25, 50~60%R.H. Observation of 50 sheets after continuous printing Observation of Workability 2. Continuous Workability ( QFP 0.4mm Pitch ) EFC3C05 Solder Cream have excellent Workability as continuous printing test of 50 times. 5 Sheets 10 Sheets 20 Sheets 30 Sheets Attached Sheet 4

10 40 Sheets 50 Sheets

11 Thixo. 3. Viscosity of Continuous Printing EF Solder Cream don t become different viscosity or thixotropic agent by times and condition of printing in continuous printing. of Test EFC3C05 Of Test Squeeze Angle Speed Of Printing Pressure Of Printing Printer Mask Of Test Viscosity Meter Method of Measurement Metal(Ti Coating) 30 30mm/sec. 150KPa MK2805A SUS304, 0.15mmt Malcom, VS3 Measurement per 150 sheets(one hour) Viscosity Thixo Early Times Viscosity (PaS) (150) 2(300) 4(600) 6(900) 8(1200 ) Printing Time (hrs) Attached Sheet 5

12 Tackiness(gf) 4. Tackiness of Continuous Printing EF Solder Cream don t become different tackiness by increasing sheet of printing, and maintain enough tackiness for sticking of part. Test of EFC3C05 Squeeze Metal (Ti Coating) Of Test Of Test Angle Speed of Printing Pressure of Printing Printer Mask Tackiness 30 30mm/sec. 150KPa MK2805A SUS304, 0.15mmt Malcom, TK1 Method of Measurement Measurement per 150 sheets (one hour) Early Times Tackiness (150) 2(300) 4(600) 6(900) 8(1200) Printing Time (hrs) Attached Sheet 6

13 Reliability of Solder Cream 1. Stability of Charge in Viscosity EF Solder Cream don t become different viscosity after three months in refrigerator. Cond ition Temp. Type EFC3C05 Malcom, VS3 25 Spiral Type Period of Storage( month) Viscosity(PaS) Viscosity(PaS) Time (Month) 2. Aging Time of Tackiness Tack time of Solder Cream of EFC3C0530M is 8 hours, and Tackiness is 138 gf after 48 hours. Mask Squeeze Tackiness (gf) EFC3C0530M Malcom, TK mmt Urethane Time after printing(hrs) Tack Time Over 4 hours Tackiness(gf) Time (hrs) Attached Sheet 7

14 3. Test of Insulation resistance Of Measurement Time (hrs) Voltage Pole Gap of Measurement 100V Pole of comb 24hrs, 96hrs, 168hrs Over 1 Ⅹ Ω EFC3C05 Resistance of Insulation : Agilent 4339B Enex, ENGLMP52 85 ±2, 85%R.H, 168hrs 85 ±2, 85%R.H, 168hrs Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ SIR (Ω) ±2, 85%R.H Attached Sheet 9

15 4. Test of Migration Voltage Of Measurement Pole Gap of Measurement Time (hrs) Resistance of Insulation : Agilent 4339B Enex, ENGLMP52 100V 85 ±2, 85%R.H, 168hrs Pole of comb 24hrs, 96hrs, 168hrs EFC3C0530M Over 1 Ⅹ 10 9 Ω, No occurring migration 85 ±2, 85%R.H, 1000hrs Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ Ⅹ SIR (Ω) ±2, 85%R.H Time (hrs)

16 Features of Solderability Initial heat(rt~150 ) : 55~100 sec Slope 1 ( RT ~150 ) : 1.5~2.5 /sec Peak Temp. : 235±3 Preheat (150~180 ) : 50~85sec Slope 2 (180~230 ) : 1.5~2.5 /sec Above 220 : 30~50sec Peak Temp. 235± Slope2 (180 ~230 ) 1.5 ~ 2.5 /sec Above 220 (30~50sec) 150 Preheat (150~180 ) 50~85sec Slope 1 ( ~150 ) 1.5 ~ 2.5 /sec 55~100sec Caution 1. Speed of preheating zone set up 1.5~2.5 /sec. Very Rapid Heating bring about obstruction of Spreadability. 2. Temperature of preheating zone set up 50~85 sec to 150~180. Very long or short zone bring about solder ball. 3. Slope of preheating zone set up 1.5~2.5 /sec to 180~ Temperature of Reflow Zone set up 235±3. Very Rapid heating of reflow zone bring about obstruction of Spreadability. 4. Very slow speed of cooling bring about fallingoff of strength and movement of parts. Attached Sheet 10