Engineering Manual LOCTITE GC 10 T3 Solder Paste

Transcription

1 Engineering Manual LOCTITE GC T Solder Paste Suitable for use with: Standard SAC Alloys GC The Game Changer

2 Contents. Performance Summary. Introduction: Properties, Features & Benefits. Operating Parameters Printing: Process Window Printing: Continuous and Abandon Time Testing Slump Testing Tack-Life Force Reflow Process Window Reflow Performance Testing Voiding Data 4. Reliability and Specification Testing. Operating Parameters: Storage Printing & Reflow Performance 6. Product Summary January 6, 6 Engineering Manual GC Solder Paste

3 Contents. Performance Summary. Introduction: Properties, Features & Benefits. Operating Parameters Printing: Process Window Printing: Continuous and Abandon Time Testing Slump Testing Tack-Life Force Reflow Process Window Reflow Performance Testing Voiding Data 4. Reliability and Specification Testing. Operating Parameters: Storage Printing & Reflow Performance 6. Product Summary January 6, 6 Engineering Manual GC Solder Paste

4 GC : Performance Summary Flux Halogen-free flux: passes IC with pretreatment IPC-TM-6..4/EN48 Halogen-free flux classification: ANSI/J-STD-4 Rev. B for a type ROL classification Paste Suitable for printing up to mm/s ( /s) Optimized for long hot soak reflow profiles Excellent coalescence in air & nitrogen atmosphere Excellent humidity resistance Excellent solderability on challenging surface finishes, including CuNiZn Colourless residues for easy post-reflow inspection Long month shelf-life when stored below C 4 January 6, 6 Engineering Manual GC Solder Paste

5 Contents. Performance Summary. Introduction: Properties, Features & Benefits. Operating Parameters Printing: Process Window Printing: Continuous and Abandon Time Testing Slump Testing Tack-Life Force Reflow Process Window Reflow Performance Testing Voiding Data 4. Reliability and Specification Testing. Operating Parameters: Storage Printing & Reflow Performance 6. Product Summary January 6, 6 Engineering Manual GC Solder Paste

6 Introduction Basic Solder Paste Properties Flux Description GC Alloy SAC Henkel Powder Size Type Powder Size range, m 4- Metal Content, % 88. Malcom Viscosity, rpm Pa.s 7 TI. IPC C (.mm x.mm) first space no bridge IPC Solder Balling. preferred 6 January 6, 6 Engineering Manual GC Solder Paste

7 Introduction GC Features & Benefits Product Attribute Process Benefit Halogen Free No added halogen Measured <9ppm chlorine and bromine and <,ppm total by oxygen (O ) bomb test Halide Free Flux classification ROL in accordance to J-STD-4B Application Designed for printing and pin-in-paste Excellent wetting to a broad range of metallisations, even through long hot soak profiles in an air atmosphere Compatible with existing halogen free solutions Suitable for medium to large board assemblies Designed for long month shelf-life stability without impact to printing or reflow 7 January 6, 6 Engineering Manual GC Solder Paste

8 Introduction GC Features & Benefits Product Attribute Technology Printing Advantages Technology Reflow Advantages Process Benefit Wide process window for printing and minimal slump Abandon time of up to hours; work life > 6 hours Excellent print capability and reduction in print related defects Suited for high throughput production, where yield consistency on print deposits is key Improved paste transfer efficiency Allows on line paste utilisation protocols to be re-written Optimised for long hot soak reflow processes Very shiny Pb-free solder joints over wide range of reflow Excellent coalescence Excellent humidity resistance Excellent solderability on challenging surface finishes (ENIG, Copper OSP, CuNiZn and Imm Ag) Low Voiding Low void levels increases solder joint reliability New chemistries allow pursuit of class void levels in accordance to IPC79B on industry surface finishes: ENIG, Copper OSP, CuNiZn and Imm Ag Low voiding in CSP/BGA Residues Clear, transparent and colourless Pin testable after 4x reflows 8 January 6, 6 Engineering Manual GC Solder Paste

9 Contents. Performance Summary. Introduction: Properties, Features & Benefits. Operating Parameters Printing: Process Window Printing: Continuous and Abandon Time Testing Slump Testing Tack-Life Force Reflow Process Window Reflow Performance Testing Voiding Data 4. Reliability and Specification Testing. Operating Parameters: Storage Printing & Reflow Performance 6. Product Summary 9 January 6, 6 Engineering Manual GC Solder Paste

10 Pressure kg/mm Pressure kg/mm Pressure kg/mm Pressure kg/mm Operating Parameters Print Process Window (LOCTITE GC SAC T 88V) Excellent printing in the range mm/s,.4mm to.7mm round apertures.4 Contour Plot of.8mm BGA (.4mm aperture) Cpk.8BGA Cpk < >..4 Contour Plot of.mm CSP (.mm aperture) Cpk.CSPCpk < > Speed mm/s Speed mm/s Contour Plot of.mm diam circles Cpk Contour Plot of.mm BGA (.7mm aperture) Cpk.4.mm diam Cpk < >..4.BGA Cpk < > Speed mm/s Speed mm/s.8mm,.mm &.4mm pitch round apertures, (µm stencil) January 6, 6 Engineering Manual GC Solder Paste

11 Pressure kg/mm Pressure kg/mm Pressure kg/mm Pressure kg/mm Operating Parameters Print Process Window (LOCTITE GC SAC T 88V) Contour Plot of.8mm diam circles Cpk Contour Plot of.mm diam circles Cpk Excellent printing in the range mm/s,.8-.mm round apertures.4..8mm diam Cpk < >..4..mm diam Cpk < >. Limited process window with.mm apertures. GC T4 may be required Speed mm/s Contour Plot of.mm diam circles Cpk Speed mm/s Contour Plot of.mm diam circles Cpk.4.mm diam Cpk < >..4.mm diam Cpk < > Speed mm/s Speed mm/s.8mm.mm round apertures, (µm stencil) January 6, 6 Engineering Manual GC Solder Paste

12 Cpk Operating Parameters Separation Speed Print Process Window (LOCTITE GC SAC T 88V) Excellent printing in the range down to.mm round apertures. Fast separation speed is preferable. 4 Separation speed. Cpk Loctite GC SAC T 88V Variable Fast Medium Slow.67 ref. ref.8mm BGA (.4mm ap).mm ubga (.mm ap).mm CSP (.mm ap).mm BGA (.7mm ap).8mm dia circles.mm dia circles.mm dia circles.mm dia circles.8mm dia circles.8mm BGA.8mm round apertures, m stencil thickness, 6mm/s,kg January 6, 6 Engineering Manual GC Solder Paste

13 Operating Parameters Continuous Print and Abandon Stability Assessment Henkel Board.8mm BGA to.8mm diameter circles Process flow for Henkel print test as shown below Paste added to stencil Paste kneaded Dry under stencil wipe Print PCBs, dry wipe every Print PCBs hr pause Print PCBs hr pause Volumes Measured Blank stencil or cycles Print PCBs, dry wipe every Volumes Measured Printing DEK Europa Stainless steel, laser cut m thickness Vacuum tooling mm, 6 squeegee 6mm/s squeegee speed Fast separation speed Conditions typical, C, 4% RH Koh Young KY-8T volume measurement January 6, 6 Engineering Manual GC Solder Paste

14 Cpk Operating Parameters Abandon Stability C/4%RH Print Process Window (LOCTITE GC SAC T 88V) Print Capabilities Excellent printing in the range down to.mm round apertures Single knead cycle required after hr abandon at.mm round apertures 4 Abandon time hr, hr, hr + knead Loctite GC SAC T 88V Variable Initial hr hr hr + knead.67 ref. ref.8mm BGA (.4mm ap).mm µbga (.mm ap).mm CSP (.mm ap).mm BGA (.7mm ap).8mm dia circles.mm dia circles.mm dia circles.mm dia circles.8mm dia circles.8mm BGA.mm round apertures m stencil thickness, 6mm/s, fast separation, mm squeegee, kg 4 January 6, 6 Engineering Manual GC Solder Paste

15 Transfer Efficiency % Transfer Efficiency % Transfer Efficiency % Transfer Efficiency % Operating Parameters Abandon Stability C/4%RH Print Process Window (LOCTITE GC SAC T 88V) Transfer Efficiencies Excellent printing in the range.4mm down to.7mm round apertures 6 8.8mm BGA (.4mm ap).mm BGA (.4mm ap) Initial hr ab hr ab X=98. X=97.7 X=94.4. Vnom 6 8 Initial hr ab hr ab X=88.8 X=86.9 X=8.6. Vnom 4. Vnom 4.Vnom Print No. Print No..mm CSP (.mm ap).mm BGA (.7mm dia ap) 6 Initial hr ab hr ab. Vnom 6 Initial hr ab hr ab. Vnom 8 X=84.7 X=84.9 X=8. 8 X=84.7 X=8. X=8.4 4.V nom 4. Vnom 7 9 Print No Print no mm BGA.mm BGA round apertures m stencil thickness, 6mm/s, fast separation, mm squeegee, kg January 6, 6 Engineering Manual GC Solder Paste

16 Transfer Efficiency % Transfer Efficiency % Transfer Efficiency % Transfer Efficiency % Operating Parameters Abandon Stability C/4%RH Print Process Window (LOCTITE GC SAC T 88V) Transfer Efficiencies.mm dia round apertures.mm dia round apertures Excellent printing in the range down to.mm round apertures Single knead cycle for best results after hr abandon at.mm round apertures and below Initial hr ab hr ab 7 9 X=9. Print No. X= X=9.6. Vnom. Vnom Initial hr ab hr ab 7 9 X=96. Print No. X= X=9.. Vnom. Vnom.mm dia round apertures.8mm dia round apertures 6 Initial hr ab hr ab. Vnom 6 Initial hr ab hr ab. Vnom 8 X=99.6 X=99.4 X=9.7 8 X=9. X=94.6 X= Vnom 4. Vnom 7 9 Print No Print No mm.mm round apertures m stencil thickness, 6mm/s, fast separation, mm squeegee, kg 6 January 6, 6 Engineering Manual GC Solder Paste

17 Cpk Operating Parameters Continuous Print Stability Print Process Window (LOCTITE GC SAC T 88V) Print Capabilities No impact on print performance after 8 hours ( cycles) and 6 hours ( cycles) printing 4 Continuous Print Stability cycles, cycles Loctite GC SAC T 88V Variable Initial, cycles, cycles.67 ref. ref.8mm BGA (.4mm ap).mm µbga (.mm ap).mm CSP (.mm ap).mm BGA (.7mm ap).8mm dia circles.mm dia circles.mm dia circles.mm dia circles.8mm dia circles.8mm BGA.8mm round apertures, m stencil thickness, 6mm/s, Fast separation, mm squeegee, kg 7 January 6, 6 Engineering Manual GC Solder Paste

18 Transfer Efficiency % Transfer Efficiency % Transfer Effiency % Transfer Efficieny % Operating Parameters Continuous Print Stability Print Process Window (LOCTITE GC SAC T 88V) Transfer Efficiencies.8mm BGA (.4mm ap).mm BGA (.4mm ap) No impact on print performance after 8 hours ( cycles) and 6 hours ( cycles) printing 6 8 Initial prints prints X=98. X=96. X=94.. V nom 6 8 Initial prints prints X=88.8 X=87. X=8.8. Vnom 4. Vnom 4. Vnom 9 7 Print No Print No mm CSP (.mm ap).mm BGA (.7mm ap) 6 Initial prints prints. Vnom 6 Initial prints prints. Vnom X=84.7 X=84. X=8.8 X=84.7 X=8. X= Vnom 4. Vnom 9 7 Print No Print no mm BGA.mm BGA round apertures, m stencil thickness, 6mm/s, Fast separation, mm squeegee, kg 8 January 6, 6 Engineering Manual GC Solder Paste

19 Transfer Efficiency % Transfer Efficiency % Transfer Efficiency % Transfer Efficiency % Operating Parameters Continuous Print Stability Print Process Window (LOCTITE GC SAC T 88V) Transfer Efficiencies.mm dia round apertures.mm dia round apertures 6 Initial prints prints. Vnom 6 Initial prints prints. Vnom No impact on print performance after 8 hours ( cycles) and 6 hours ( cycles) printing 8 4 X=9. X=89. X=8.. Vnom 8 4 X=96. X=9.9 X=89.6. Vnom 9 7 Print No Print No mm dia round apertures.8mm dia round apertures 6 Initial prints prints. Vnom 6 Initial prints prints. Vnom X=99.6 X=96.9 X=9.9 X=9. X=9.7 X= Vnom 4. Vnom 9 7 Print No Print no mm.mm round apertures, m stencil thickness, 6mm/s, Fast separation, mm squeegee, kg 9 January 6, 6 Engineering Manual GC Solder Paste

20 6.mm Overprint.mm CSP Temperature ( C) Operating Parameters (Reflow) Paste Properties After Continuous Printing Initial, cycles (8 hours) C, 4%RH, cycles (6 hours) C, 4%RH Profile 7 C Time (min) 4 6 No change to reflow performance after 6hours printing ( print cycles) January 6, 6 Engineering Manual GC Solder Paste

21 Operating Parameters Slump Slump evaluation was performed in accordance with J-STD-A, IPC-TM-6.4. First spacing with no bridge recorded after minutes at 8 C ( C below melting point 7 C) Stencil Design/ thickness A m A m Aperture.6 x.mm. x.mm. x.mm. x.mm Pass mark.6mm.mm.mm.mm GC C.mm.mm.8mm.7mm GC 8 C.mm.mm.mm.mm A m A m January 6, 6 Engineering Manual GC Solder Paste

22 Tack Force gf Operating Parameters Tack Force Tackiness evaluation was performed in accordance with J-STD-A, IPC-TM GC tack-life >48hours IPC Tack force gf Time hours Tack force gf 8% Peak Tack Force Malcom TK Tackiness Tester Preload g Preload time secs Retraction Speed.mm/sec Deposit diameter.mm Deposit height.mm January 6, 6 Engineering Manual GC Solder Paste

23 Operating Parameters Solder Balling Solder balling performance as been assessed in accordance with an extended version of IPC-TM Clear and colourless residues observed post-reflow Initial 4hrs C % RH Preferred Pass Preferred Pass January 6, 6 Engineering Manual GC Solder Paste

24 T e m p e r a t u r e ( C ) Operating Parameters Reflow Process Window (Air) LOCTITE GC solder paste offers halogen containing reflow performance in a truly halogen free formulation GC shows excellent coalescence onto a range of PCB and component finishes especially during long-hot profiles There is no single profile that works for all applications and each process should be assessed individually, under laboratory conditions the following profiles have been found to give good results These process window guidelines are suitable for Type SAC powder Reflow Profiles 7 C Profile Profile Profile Profile 4 Profile 4 Peak Temp ( C) Time to Peak (min) Soak Time (- C) (min) (No Soak) Time above Liquidus (min) Time (minutes) 6 7 Time above Liquidus (sec) January 6, 6 Engineering Manual GC Solder Paste

25 4 chips 6 chips 6 chips Operating Parameters (Reflow) Reflow Profile Reflow Profiles Profile Profile Profile Profile 4 7 C 4 T e m p e r a t u r e ( C ) Time (minutes) January 6, 6 Engineering Manual GC Solder Paste

26 .4mm TQFP.mm CSP6 Overprinted Solder ball Operating Parameters (Reflow) Reflow Profile Reflow Profiles Profile Profile Profile Profile 4 7 C 4 T e m p e r a t u r e ( C ) Time (minutes) 6 January 6, 6 Engineering Manual GC Solder Paste

27 6 chips 4 chips chips Temperature ( C) Operating Parameters (Reflow GC) Reflow Profile Reflow Profiles Profile Profile 7 C Time (minutes) 7 January 6, 6 Engineering Manual GC Solder Paste

28 .mm CSP6.4mm TQFP Temperature ( C) Operating Parameters (Reflow GC) Reflow Profile Reflow Profiles Profile Profile 7 C 4 6 Time (minutes) 8 January 6, 6 Engineering Manual GC Solder Paste

29 IPC voiding % % Voiding Operating Parameters Voiding Void performance assessed using 4 different reflow profiles..mm CSP, µm stencil With component,.mm CSP, SAC balls GC shows low levels of voiding over a range of profiles Void Percentage analysed in accordance with IPC79B T e m p e r a t u r e ( C ) Reflow Profiles 7 C Profile Profile Profile Profile Time (minutes) Boxplot of IPC Voiding Percentage Line Plot of No. of Voids Class Class 8 6 Class 4 Profile Profile Profile Profile 4 Profile Profile Profile Profile 4 GC meets IPC79B class 9 January 6, 6 Engineering Manual GC Solder Paste

30 4.mm CSP 6 Operating Parameters nd side reflow nd second side reflow profile Reflow Profiles Profile Profile Profile Profile 4 7 C 4 T e m p e r a t u r e ( C ) Time (minutes) January 6, 6 Engineering Manual GC Solder Paste

31 Percentage No. of Voids Operating Parameters Voiding after nd side reflow Void performance assessed using 4 different reflow profiles..mm CSP, µm stencil With component,.mm CSP, SAC balls GC shows no deterioration in voiding with pre reflowed boards T e m p e r a t u r e ( C ) Reflow Profiles 7 C Profile Profile Profile Profile Time (minutes) Boxplot of % voiding GC T Class Line Plot of No. of voids Pre reflow No pre-reflow pre-reflowed 8 Class 6 Class 4 Profile Pre reflow Profile Profile Profile Profile 4 No pre-reflow Profile Profile Profile Profile 4 pre-reflowed Profile Profile Profile Profile 4 GC meets IPC79B class January 6, 6 Engineering Manual GC Solder Paste

32 Operating Parameters Pin Testing Before Test After Test T e m p e r a t u r e ( C ) Reflow Profiles 7 C Profile Profile Profile Profile Time (minutes) Board Stencil Pads Probe Profiles No. of reflow m pads per board, boards tested.9mm 4 point plain crown light spring probe g spring force 4 reflow profiles,, & 4 passes through oven Atmosphere Air & ppm O Time after reflow day, week January 6, 6 Engineering Manual GC Solder Paste

33 4 reflows reflows reflows reflow Operating Parameters Pin Testing Reflow Profile (% after tests) Reflow Profiles Profile Profile Profile Profile 4 7 C 4 T e m p e r a t u r e ( C ) % % % 99.% 4 Time (minutes) 6 7 % % 99.6% 99.9% 99.9% % % 98.9% 99.9% % % 98.% January 6, 6 Engineering Manual GC Solder Paste

34 week after reflow day after reflow Reflowed in N Operating Parameters Pin Testing Reflow Profile (% after tests) Reflow Profiles Profile Profile Profile Profile 4 7 C 4 T e m p e r a t u r e ( C ) % % % % 4 Time (minutes) 6 7 % 99.9% 99.8% 99.6% % 99.8% 99.% 99.6% 4 January 6, 6 Engineering Manual GC Solder Paste

35 Tin Finish Silver Finish OSP Finish Operating Parameters Surface Finish Reflow Profile (.mm CSP6) Reflow Profiles Profile Profile Profile Profile 4 7 C 4 T e m p e r a t u r e ( C ) Time (minutes) January 6, 6 Engineering Manual GC Solder Paste

36 Tin Finish Silver Finish OSP Finish Operating Parameters Surface Finish Reflow Profile () Reflow Profiles Profile Profile Profile Profile 4 7 C 4 T e m p e r a t u r e ( C ) Time (minutes) 6 January 6, 6 Engineering Manual GC Solder Paste

37 Tin Finish Silver Finish OSP Finish Operating Parameters Surface Finish Reflow Profile (4) Reflow Profiles Profile Profile Profile Profile 4 7 C 4 T e m p e r a t u r e ( C ) Time (minutes) 7 January 6, 6 Engineering Manual GC Solder Paste

38 Tin Finish Silver Finish OSP Finish Operating Parameters Surface Finish Reflow Profile (6.mm overprinted solder ball) Reflow Profiles Profile Profile Profile Profile 4 7 C 4 T e m p e r a t u r e ( C ) Time (minutes) 8 January 6, 6 Engineering Manual GC Solder Paste

39 Average Time (s) Reliability and Specification Testing Head in Pillow Test Head in Pillow Time to first defect 4 Print solder paste on a Cu plate, 4 pad, stencil thickness µm. When the solder paste starts to melt, place a solder sphere (SAC,.76mm diameter) on the printed solder paste Place another sphere after sec, 6 sec, 9sec until the solder sphere no-longer coalesces Flux activity at elevated temperatures up to % longer than industry standard helping to reduce HiP GC Competitor A Competitor B Competitor C Competitor D Paste Competitor E Competitor F Competitor G Place a solder sphere onto printed paste +/- C Copper plate Solder paste Solder sphere.. +/- C.. Initial sec 6 sec First st sphere nd sphere rd sphere Defect 9 January 6, 6 Engineering Manual GC Solder Paste

40 Reliability and Specification Testing J-STD- 4B Standard Test Result Cu Corrosion Pass ANSI/ J-STD-4B Cu Mirror Pass GC Control Halogen Pass (no added halogen) Surface Insulation Resistance Pass 6.x Ohms after 7days Electromigration Pass.x Ohms after days GC J-STD-4B classification ROL 4 January 6, 6 Engineering Manual GC Solder Paste

41 Reliability and Specification Testing rd Party Testing SGS report for GC Sample reflowed flux residue Reference EN48/IC Analysis To meet halogen free requirements Br<9ppm, Cl <9ppm, and combined <ppm Halogen Fluorine - ND Halogen Chorine - ND Halogen Bromine ND Halogen Iodine ND GC has no detectable halogen and is designated as halogen free 4 January 6, 6 Engineering Manual GC Solder Paste

42 Temperature T e m p e r a t u r e ( C) ( C ) Reliability and Specification Testing IPC J-STD 4B Reflow Profiles Profile Profile 7 C 4 Time (minutes) 6 4 January 6, 6 Engineering Manual GC Solder Paste

43 Contents. Performance Summary. Introduction: Properties, Features & Benefits. Operating Parameters Printing: Process Window Printing: Continuous and Abandon Time Testing Slump Testing Tack-Life Force Reflow Process Window Reflow Performance Testing Voiding Data 4. Reliability and Specification Testing. Operating Parameters: Storage Printing & Reflow Performance 6. Product Summary 4 January 6, 6 Engineering Manual GC Solder Paste

44 Cpk Operating Parameters: Storage Printing After Storage months C Print Capabilities Abandon time after storage hr, hr, hr + knead Excellent print capability after storage for C No knead cycle required after hrs abandon down to.mm round apertures 6 4 Loctite GC SAC T 88V months C Variable Initial hr hr hr + knead.67 ref. ref.8mm BGA (.4mm ap).mm µbga (.mm ap).mm CSP (.mm ap).mm BGA (.7mm ap).8 mm dia circles. mm dia circles. mm dia circles. mm dia circles.8mm dia circles.8mm BGA.8mm round apertures, m stencil thickness, 6mm/s, Fast separation, mm squeegee, kg 44 January 6, 6 Engineering Manual GC Solder Paste

45 Cpk Operating Parameters: Storage Printing After Storage months C Print Capabilities Continuous Print Stability after storage, cycles Excellent print capability after storage for C Excellent print performance after cycles down to.mm round apertures 6 4 Loctite GC SAC T 88V months C Variable Initial, cycles.67 ref. ref.8mm BGA (.4mm ap).mm µbga (.mm ap).mm CSP (.mm ap).mm BGA (.7mm ap).8 mm dia circles. mm dia circles. mm dia circles. mm dia circles.8mm dia circles.8mm BGA.8mm round apertures, m stencil thickness, 6mm/s, Fast separation, mm squeegee, kg 4 January 6, 6 Engineering Manual GC Solder Paste

46 Transfer Efficiency % Transfer Efficiency % Transfer Efficiency % Transfer Efficiency % Operating Parameters: Storage Printing After Storage months C Transfer Efficiencies.8mm BGA (.4mm apertures).mm BGA (.4mm apertures) Excellent print capability after storage for C No knead cycle required after hrs abandon Initial hr ab hr ab prints X=98.9 X=97. X=98.6 X=9.. Vnom. Vnom Initial hr ab hr ab prints X=9.9 X=88. X=88.7 X=86.. Vnom. Vnom Excellent print performance after cycles Print No..mm CSP (.mm apertures) Initial hr ab hr ab prints 9 7. Vnom Print No..mm BGA (.7mm apertures) Initial hr ab hr ab prints 9 7. Vnom 8 X=88. X=87. X=8.8 X= X=88. X=84. X=8.6 X= Vnom 4. Vnom 9 7 Print No Print No mm BGA.mm BGA, m stencil thickness, 6mm/s, Fast separation, mm squeegee, kg 46 January 6, 6 Engineering Manual GC Solder Paste

47 Transfer Efficiency % Transfer Efficiency % Transfer Efficiency % Transfer Efficiency % Operating Parameters: Storage Printing After Storage months C Transfer Efficiencies.mm dia round apertures.mm dia round apertures Excellent print capability after storage for C No knead cycle required after hrs abandon Initial hr ab hr ab prints X=96. X=96. X=94. X=9.8. Vnom. Vnom Initial hr ab hr ab prints X=.8 X=.6 X=.6 X=97.. Vnom. Vnom Excellent print performance after cycles Print no..mm dia round apertures Initial hr ab hr ab prints X=8.4 X= V nom Print No..8mm dia round apertures Initial hr ab hr ab prints X=99. X=98. X= Vnom 8 X=. X=. 8 X= Vnom 4. Vnom 9 7 Print no Print No. 9 7.mm.8mm round apertures, m stencil thickness, 6mm/s, Fast separation, mm squeegee, kg 47 January 6, 6 Engineering Manual GC Solder Paste

48 4.mm CSP Temperature ( C) Operating Parameters: Storage Reflow After Storage to months C After Paste storage Profile 7 C Initial m 4 C 6m C m C 4 6 Time (min) 48 January 6, 6 Engineering Manual GC Solder Paste

49 Contents. Performance Summary. Introduction: Properties, Features & Benefits. Operating Parameters Printing: Process Window Printing: Continuous and Abandon Time Testing Slump Testing Tack-Life Force Reflow Process Window Reflow Performance Testing Voiding Data 4. Reliability and Specification Testing. Operating Parameters: Storage Printing & Reflow Performance 6. Product Summary 49 January 6, 6 Engineering Manual GC Solder Paste

50 GC : Performance Summary Flux Halogen-free flux: passes IC with pretreatment IPC-TM-6..4/EN48 Halogen-free flux classification: ANSI/J-STD-4 Rev. B for a type ROL classification Paste Suitable for printing up to mm/s ( /s) Optimized for long hot soak reflow profiles Excellent coalescence in air & nitrogen atmosphere Excellent humidity resistance Excellent solderability on challenging surface finishes, including CuNiZn Colourless residues for easy post-reflow inspection Long month shelf-life when stored below C January 6, 6 Engineering Manual GC Solder Paste

51 Thank you!