Solder Dross & Metal Recovery. High Performance Solder Products. High Precision Laser Cut Parts. Advanced Stencil & Laser Technology

Size: px
Start display at page:

Download "Solder Dross & Metal Recovery. High Performance Solder Products. High Precision Laser Cut Parts. Advanced Stencil & Laser Technology"

Transcription

1 High Performance Solder Products Advanced Stencil & Laser Technology High Precision Laser Cut Parts Solder Dross & Metal Recovery Leaders in lead free technology SN100C North America Licensee of Nihon Superior s SN100C Bar Solder SN100C 63/37 No Clean an Water Soluble: Solder Pastes Fluxes Wire Solder Technology Leaders in Stencil Technology Leaders in Laser Technology Advanced Material Technology SLIC Ultra SLIC FG Delivery Memphis, Tennessee: FedEx Plant Ship until midnight San Jose, California: West Coast Plant Colorado and Canada plants Technology Diode pumped frequency tripled NdYag lasers +/ tolerances Ultra thin metals and plastics Experience 50+ years experience Support Engineering Support Same day quotes and quick turns A Fresh Perspective One source electronic recycling A Unique Approach Our transparent process means you always know what your dross is worth Customer Service Customer service is our number one priority. No customer is too small and payment will be issued in 30 days

2 FCT Solder has positioned itself as a leader in lead-free solder products We are the original licensee of Nihon Superior s technology, and know SN100C and its applications better than anyone in the industry. Combining our latest flux technology with SN100c gives us an advantage over all other solder suppliers in: Paste Wire Flux

3 NC670 Halogen-free, leaded solder paste that has excellent wetting characteristics, excellent fine print characteristics with a pin probable crystal clear residue RMA 250 Leaded solder paste that is more active than the NC670 offering fine print characteristics. Pin probable clear residue that can be cleaned NL930PT Halogen-free, lead-free solder paste (SAC or SN100C) that leaves a crystal clear residue, is pin probable and has excellent fine print characteristics NL932 Halogen-free, lead-free solder paste (SAC or SN100C) that leaves a minimal clear residue that can be cleaned. NL932 has excellent fine print characteristics with good wetting on all surface finishes

4 WS159 Leaded solder paste that is water washable with minimal hydroscopic characteristics leading to a long stencil life in harsh environments( 25-65% RH). WS888 Long Term Stability Lowest voiding paste on the market to date Excellent wetting on all surface finishes Lead free solder paste (SAC or SN100C) that has very similar characteristics to our WS159 Flux medium.

5 Sn100c Bar Solder: Leading lead free solder for wave and selective solder applications. Low Drossing Low Copper Erosion Shiny finish Easiest maintenance of all lead free alloys Joint reliability at least equal to that of Sn63/Pb37 Over 1.5 billion products assembled using SN100C with no known defects SN100c Wire Solder: Flux: Sn100c Alloy in No Clean and Water Soluble core wire Fluxes that are designed to be used with both SN100c and SAC305 alloys. Check out SN100C or

6

7 Who Are We? Fine Line Stencil is a technology leading manufacture, committed to delivering the highest quality laser stencils in the industry. We use the most advanced laser and material technologies available in the world to meet current and future industry demands as components get smaller and smaller; µbga, CSP, QFN, and components. The combination of the laser and material technology advancements coupled with our over 15 years technical expertise has resulted in our new SLIC and UltraSLIC stencils. We serve our customers as a trusted ally, providing the loyalty of a business partner, an extension of engineering departments through our Root Cause Analysis Service and the economics of an outside vendor. We ensure that our customers have the highest quality products delivered on-time and pride ourselves as your value add supplier.

8 R&D Group with degrees in Physics, Electrical Engineering and Chemistry that study all aspects of stencil technology and printing parameters Investment in the latest, most highly developed Laser Technology on the market. Utilization of the finest grain foil technology the market offers today. Most Advanced Testing/QC equipment on the market today with the LPKF s Scan Check System

9 SLIC Stencil: Excellent print performance down to a surface area ratio of 0.55 Ultra-SLIC Stencil: Excellent print performance down to a surface area ratio of 0.45 Performance Consistent solder paste deposition / Volume Reduction in stencil cleaning frequency Minimized Rework

10 Root Cause Analysis Service: Investigate yield problems anywhere in your assembly process Identify the root cause Provide a solution based on accurate analysis Increase yields Same Day Service with 3 manufacture locations Memphis, TN. San Jose, CA. Montreal, Canada ITAR Registered and ISO 9001:2008 Certified Quality System - Measures every replacement and missed shipment One Goal - 99% or better quality shipments, delivered on time.

11 A-Laser is the precision parts manufacturing division of FCT Assembly. Combining state of the art technology, years of engineering experience and a culture of curiosity we ve built a reputation for quick turn delivery of high quality components.

12 Frequency Tripled ND-Yag laser cutting systems operating at 355nm wavelength Materials are ablated rather than melted, yielding virtually carbon free cuts Able to process materials from down to.9 microns Programs designed to handle multiple thicknesses in a single step Experienced in fixturing for ultra thin material handling

13 Beam diameter less than 20 microns enabling micro-drilling, intricate design and fine features. Precise table movement and stability to maintain +/- 12 micron tolerances Optical fiducial recognition systems and LPKF Scan Check for processing flex panels 3 shifts running to allow for same day turns on local flex jobs.

14 Nd Yag Diode pumped and fiber laser cutting systems operating at 1065 nm wavelength Used for working with metals between 1 and 25 mil thick materials Process ideal for thin metal parts manufacturing due to ease of design change, especially for multiple revisions seen in prototyping stages Less than 25 micron beam diameter yields clean edged and intricate designs The stability of the table and motion systems allows us to reach precision levels +/- 12 microns

15 We offer recovery services for lead free and tin/lead solder dross and scrap including: solder paste solder wire populated circuit boards bare boards FCT Recovery is committed to providing a high quality, reliable and transparent service to its customers

16 Visit for additional information

Stencil Technology. Agenda: Laser Technology Stencil Materials Processes Post Process

Stencil Technology. Agenda: Laser Technology Stencil Materials Processes Post Process Stencil Technology Agenda: Laser Technology Stencil Materials Processes Post Process Laser s YAG LASER Conventional Laser Pulses Laser beam diameter is 2.3mil Ridges in the inside walls of the apertures

More information

ESCC2006 European Supply Chain Convention

ESCC2006 European Supply Chain Convention ESCC2006 European Supply Chain Convention PCB Paper 20 Laser Technology for cutting FPC s and PCB s Mark Hüske, Innovation Manager, LPKF Laser & Electronics AG, Germany Laser Technology for cutting FPCs

More information

FILL THE VOID III. Tony Lentz FCT Assembly Greeley, CO, USA

FILL THE VOID III. Tony Lentz FCT Assembly Greeley, CO, USA FILL THE VOID III Tony Lentz FCT Assembly Greeley, CO, USA tlentz@fctassembly.com ABSTRACT This study is part three in a series of papers on voiding in solder joints and methods for mitigation of voids.

More information

Commitment and Innovation

Commitment and Innovation Commitment and Innovation ETAG has been introducing innovations in electronics manufacturing for more than 10 years. The ETAG StencilLaser established a new form of electronics manufacturing in Even today

More information

Practical Solutions for Successful Pb-Free Soldering. Brian Allder Qualitek-Europe

Practical Solutions for Successful Pb-Free Soldering. Brian Allder Qualitek-Europe Practical Solutions for Successful Pb-Free Soldering Brian Allder Qualitek-Europe Challenges/Barriers to Lead Free Cost Material Availability Process Modifications Material Compatibility Standards Inspection

More information

Micron Laser Technology

Micron Laser Technology Micron Laser Technology AS9100C / ISO9001:2008 Certified 18,000 sq. ft. facility with 20 laser drilling systems solely dedicated to microvia drilling, laser material processing, micromachining, prototyping,

More information

Quantitative Evaluation of New SMT Stencil Materials

Quantitative Evaluation of New SMT Stencil Materials Quantitative Evaluation of New SMT Stencil Materials Chrys Shea Shea Engineering Services Burlington, NJ USA Quyen Chu Sundar Sethuraman Jabil San Jose, CA USA Rajoo Venkat Jeff Ando Paul Hashimoto Beam

More information

General Bearing Corporation

General Bearing Corporation General Bearing Corporation General Bearing Corporation GBC: We are Customer Driven. In 1943, General Bearing Corporation (GBC) began production as a manufacturer of highly-specialized bearings, bushings,

More information

Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses

Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses Mark Woolley, Wesley Brown, and Dr. Jae Choi Avaya Inc. 1300 W 120 th Avenue Westminster, CO 80234 Abstract:

More information

Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design

Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith FCT Assembly, Inc. gsmith@fctassembly.com This paper and presentation was first presented at the 2017 IPC Apex Expo Technical

More information

Excellence. it s our passion. is more than a word

Excellence. it s our passion. is more than a word Excellence is more than a word it s our passion With roots in the world of metal stretching back over 75 years, AIM has evolved from humble beginnings into an international leader in the development, manufacture

More information

Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling

Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling Ahne Oosterhof Eastwood Consulting Hillsboro, OR ABSTRACT Using modern laser systems for the depanelization of

More information

What s Coming Down the Tracks for Printing and Stencils?

What s Coming Down the Tracks for Printing and Stencils? What s Coming Down the Tracks for Printing and Stencils? Presented by: Chrys Shea, Shea Engineering Services Expert Panelists: Tony Lentz, FCT Companies Mark Brawley, Speedprint Jeff Schake, DEK-ASMPT

More information

Bob Willis Process Guides

Bob Willis Process Guides What is a Printed Circuit Board Pad? What is a printed circuit board pad, it may sound like a dumb question but do you stop to think what it really does and how its size is defined and why? A printed circuit

More information

Practical Applications of Laser Technology for Semiconductor Electronics

Practical Applications of Laser Technology for Semiconductor Electronics Practical Applications of Laser Technology for Semiconductor Electronics MOPA Single Pass Nanosecond Laser Applications for Semiconductor / Solar / MEMS & General Manufacturing Mark Brodsky US Application

More information

BGA/CSP Re-balling Bob Doetzer Circuit Technology Inc.

BGA/CSP Re-balling Bob Doetzer Circuit Technology Inc. BGA/CSP Re-balling Bob Doetzer Circuit Technology Inc. www.circuittechnology.com The trend in the electronics interconnect industry towards Area Array Packages type packages (BGA s, CSP s, CGA s etc.)

More information

Solder Paste Deposits and the Precision of Aperture Sizes

Solder Paste Deposits and the Precision of Aperture Sizes Solder Paste Deposits and the Precision of Aperture Sizes Ahne Oosterhof Eastwood Consulting Hillsboro, OR, USA ahne@oosterhof.com Stephan Schmidt LPKF Laser & Electronics Tualatin, OR, USA sschmidt@lpkfusa.com

More information

A Technique for Improving the Yields of Fine Feature Prints

A Technique for Improving the Yields of Fine Feature Prints A Technique for Improving the Yields of Fine Feature Prints Dr. Gerald Pham-Van-Diep and Frank Andres Cookson Electronics Equipment 16 Forge Park Franklin, MA 02038 Abstract A technique that enhances the

More information

Engineering Manual LOCTITE GC 10 T3 Solder Paste

Engineering Manual LOCTITE GC 10 T3 Solder Paste Engineering Manual LOCTITE GC T Solder Paste Suitable for use with: Standard SAC Alloys GC The Game Changer Contents. Performance Summary. Introduction: Properties, Features & Benefits. Operating Parameters

More information

SUB-CONTRACT MACHINING. Collaborating with the World s Finest

SUB-CONTRACT MACHINING. Collaborating with the World s Finest SUB-CONTRACT MACHINING Collaborating with the World s Finest 55 Years Expertise Superior Quality Craftsman Tools is one of Europe s Our services range from one-off prototypes Craftsman Tools is fully accredited

More information

Strip Tinning China & Asia. Strip Tinning Ltd UK. Listen, Research, Innovate, Design...

Strip Tinning China & Asia. Strip Tinning Ltd UK. Listen, Research, Innovate, Design... Listen, Research, Innovate, Design... Strip Tinning Ltd UK Arden Business Park Arden Road Birmingham B45 0JA United Kingdom Tel.: +44 (0)121 457 7675 Fax.: +44 (0)121 453 6532 sales@striptinning.com Strip

More information

J O I N T I N D U S T R Y S T A N D A R D. Requirements for Soldering Pastes J Standard 005A. December 2011

J O I N T I N D U S T R Y S T A N D A R D. Requirements for Soldering Pastes J Standard 005A. December 2011 J O I N T I N D U S T R Y S T A N D A R D Requirements for Soldering Pastes J Standard 005A December 2011 Requirements for Soldering Pastes 1.0 SCOPE 1.1 Scope This standard prescribes general requirements

More information

Marking Cutting Welding Micro Machining Additive Manufacturing

Marking Cutting Welding Micro Machining Additive Manufacturing Marking Cutting Welding Micro Machining Additive Manufacturing Slide: 1 CM-F00003 Rev 4 G4 Pulsed Fiber Laser Slide: 2 CM-F00003 Rev 4 Versatility for Industry Automotive 2D/3D Cutting Night & Day Marking

More information

Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design

Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith FCT Assembly, Inc. gsmith@fctassembly.com This paper and presentation was first presented at the 2017 IPC Apex Expo Technical

More information

STENCIL CONSIDERATIONS FOR MINIATURE COMPONENTS

STENCIL CONSIDERATIONS FOR MINIATURE COMPONENTS STENCIL CONSIDERATIONS FOR MINIATURE COMPONENTS William E. Coleman, Ph.D. Photo Stencil Colorado Springs, CO, USA ABSTRACT SMT Assembly is going through a challenging phase with the introduction of miniature

More information

What the Designer needs to know

What the Designer needs to know White Paper on soldering QFN packages to electronic assemblies. Brian J. Leach VP of Sales and Marketing AccuSpec Electronics, LLC Defect free QFN Assembly What the Designer needs to know QFN Description:

More information

Application Note 5026

Application Note 5026 Surface Laminar Circuit (SLC) Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction This document outlines the design and assembly guidelines for surface laminar circuitry

More information

Specifications subject to change Packaging

Specifications subject to change Packaging VCSEL Standard Product Packaging Options All standard products are represented in the table below. The Part Number for a standard product is determined by replacing the x in the column Generic Part Number

More information

QUALITY SEMICONDUCTOR, INC.

QUALITY SEMICONDUCTOR, INC. Q QUALITY SEMICONDUCTOR, INC. AN-20 Board Assembly Techniques for 0.4mm Pin Pitch Surface Mount Packages Application Note AN-20 The need for higher performance systems continues to push both silicon and

More information

Process Control & Inspection, Assembly Programming, Reverse Engineering & Design. Products for the Electronics Industry

Process Control & Inspection, Assembly Programming, Reverse Engineering & Design. Products for the Electronics Industry Process Control & Inspection, Assembly Programming, Reverse Engineering & Design Products for the Electronics Industry COMPANY OVERVIEW Introduction Product Philosophy Agenda TECHNOLOGY AND HARDWARE PLATFORMS

More information

Highly Versatile Laser System for the Production of Printed Circuit Boards

Highly Versatile Laser System for the Production of Printed Circuit Boards When batch sizes go down and delivery schedules are tight, flexibility becomes more important than throughput Highly Versatile Laser System for the Production of Printed Circuit Boards By Bernd Lange and

More information

Application Specification Ultraminiature Bare Poke-in Contact 26FEB2019 REV:A2

Application Specification Ultraminiature Bare Poke-in Contact 26FEB2019 REV:A2 Application Specification 114-137190 Ultraminiature Bare Poke-in Contact 26FEB2019 REV:A2 1. INTRODUCTION This specification covers the requirements for application of ultraminiature bare poke-in contacts

More information

Lead-free solder pot contamination

Lead-free solder pot contamination Lead-free solder pot contamination Nigel Burtt Production Engineering Manager Dolby Laboratories, Inc. European HQ Lead-Free Wave and Selective Soldering Workshop SMART Group Lead-Free Wave & Selective

More information

Lasers for Materials Processing

Lasers for Materials Processing Lasers for Materials Processing Superior Reliability & Performance Any Material Any Pro cess At the forefront of materials processing applications Since its inception in 1966, Coherent has been at the

More information

Print Performance Studies Comparing Electroform and Laser-Cut Stencils

Print Performance Studies Comparing Electroform and Laser-Cut Stencils Print Performance Studies Comparing Electroform and Laser-Cut Stencils Rachel Miller Short William E. Coleman Ph.D. Photo Stencil Colorado Springs, CO Joseph Perault Parmi Marlborough, MA ABSTRACT There

More information

HOW DOES PRINTED SOLDER PASTE VOLUME AFFECT SOLDER JOINT RELIABILITY?

HOW DOES PRINTED SOLDER PASTE VOLUME AFFECT SOLDER JOINT RELIABILITY? HOW DOES PRINTED SOLDER PASTE VOLUME AFFECT SOLDER JOINT RELIABILITY? ABSTRACT Printing of solder paste and stencil technology has been well studied and many papers have been presented on the topic. Very

More information

Getting the FLI Lead Out. Thomas J. De Bonis Assembly & Test Technology Development Technology and Manufacturing Group

Getting the FLI Lead Out. Thomas J. De Bonis Assembly & Test Technology Development Technology and Manufacturing Group Getting the FLI Lead Out Thomas J. De Bonis Assembly & Test Technology Development Technology and Manufacturing Group Lead has been used in flip chip FLI for decades. RoHS Exemption 15 was enacted in recognition

More information

PCB Supplier of the Best Quality, Lowest Price and Reliable Lead Time. Low Cost Prototype Standard Prototype & Production Stencil PCB Design

PCB Supplier of the Best Quality, Lowest Price and Reliable Lead Time. Low Cost Prototype Standard Prototype & Production Stencil PCB Design The Best Quality PCB Supplier PCB Supplier of the Best Quality, Lowest Price Low Cost Prototype Standard Prototype & Production Stencil PCB Design Visit us: www. qualiecocircuits.co.nz OVERVIEW A thin

More information

Performance of Kapton Stencils vs Stainless Steel Stencils for Prototype Printing Volumes Processes

Performance of Kapton Stencils vs Stainless Steel Stencils for Prototype Printing Volumes Processes Performance of Kapton Stencils vs Stainless Steel Stencils for Prototype Printing Volumes Processes Hung Hoang BEST Inc Rolling Meadows IL hhoang@solder.net Bob Wettermann BEST Inc Rolling Meadows IL bwet@solder.net

More information

Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design. Tony Lentz

Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design. Tony Lentz Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design Tony Lentz tlentz@fctassembly.com Outline/Agenda Introduction Experimental Design Results of Experiment Conclusions Acknowledgements

More information

PIPE & TUBE FABRICATION SERVICES CUSTOM BENDING LASER CUTTING END FORMING UNRIVALED EXPERTISE.

PIPE & TUBE FABRICATION SERVICES CUSTOM BENDING LASER CUTTING END FORMING UNRIVALED EXPERTISE. PIPE & TUBE FABRICATION SERVICES CUSTOM BENDING LASER CUTTING END FORMING UNRIVALED EXPERTISE www.sharpeproducts.com INDUSTRIES SERVED AUTOMOTIVE MEDICAL FURNITURE & FIXTURES FOOD & BEVERAGE AEROSPACE

More information

Ultra Fine Pitch Printing of 0201m Components. Jens Katschke, Solutions Marketing Manager

Ultra Fine Pitch Printing of 0201m Components. Jens Katschke, Solutions Marketing Manager Ultra Fine Pitch Printing of 0201m Components Jens Katschke, Solutions Marketing Manager Agenda Challenges in miniaturization 0201m SMT Assembly Component size and appearance Component trends & cooperation

More information

Assembly Guidelines Sterling Silver & MacStan Immersion Tin Coated PCB s

Assembly Guidelines Sterling Silver & MacStan Immersion Tin Coated PCB s Assembly Guidelines Sterling Silver & MacStan Immersion Tin Coated PCB s By: MacDermind Final Finish Team MacDermid Inc. Flat solderable surface finishes are required for the increasingly dense PCB designs.

More information

On Demand Manufacturing. Your One Stop Shop from Prototyping to Production

On Demand Manufacturing. Your One Stop Shop from Prototyping to Production On Demand Manufacturing Your One Stop Shop from Prototyping to Production On Demand Manufacturing Services 3D Systems On Demand Manufacturing Services offers a broad range of processes and technologies

More information

Features. Applications. Optional Features

Features. Applications. Optional Features Features Compact, Rugged Design TEM Beam with M 2 < 1.2 Pulse Rates from Single Shot to 15 khz IR, Green, UV, and Deep UV Wavelengths Available RS232 Computer Control Patented Harmonic Generation Technology

More information

Application Specification Slim WtoB Poke-in Connector

Application Specification Slim WtoB Poke-in Connector Application Specification 114-137049 Slim WtoB Poke-in Connector 18APR 2016 REV:B 1. INTRODUCTION This specification covers the requirements for application of Slim WtoB Poke in connector for use on lighting

More information

HOW DOES SURFACE FINISH AFFECT SOLDER PASTE PERFORMANCE?

HOW DOES SURFACE FINISH AFFECT SOLDER PASTE PERFORMANCE? HOW DOES SURFACE FINISH AFFECT SOLDER PASTE PERFORMANCE? Tony Lentz FCT Assembly Greeley, CO, USA tlentz@fctassembly.com ABSTRACT The surface finishes commonly used on printed circuit boards (PCBs) have

More information

Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads

Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads Li Ma, Fen Chen, and Dr. Ning-Cheng Lee Indium Corporation Clinton, NY mma@indium.com; fchen@indium.com; nclee@indium.com Abstract

More information

CAN NANO-COATINGS REALLY IMPROVE STENCIL PERFORMANCE?

CAN NANO-COATINGS REALLY IMPROVE STENCIL PERFORMANCE? CAN NANO-COATINGS REALLY IMPROVE STENCIL PERFORMANCE? Tony Lentz FCT Assembly Greeley, CO, USA tlentz@fctassembly.com ABSTRACT The trajectory of electronic design and its associated miniaturization shows

More information

Chrys Shea Shea Engineering Services. Originally presented at the IPC Conference on Soldering and Reliability, November 2013, Costa Mesa, CA

Chrys Shea Shea Engineering Services. Originally presented at the IPC Conference on Soldering and Reliability, November 2013, Costa Mesa, CA Chrys Shea Shea Engineering Services Originally presented at the IPC Conference on Soldering and Reliability, November 2013, Costa Mesa, CA Introduction to Broadband (BB) Printing Traditional and New Approaches

More information

Unit 12 Soldering. INTC 1307 Instrumentation Test Equipment Teaching Unit 12 Soldering

Unit 12 Soldering. INTC 1307 Instrumentation Test Equipment Teaching Unit 12 Soldering RICHLAND COLLEGE School of Engineering Business & Technology Rev. 0 W. Slonecker Rev. 1 (8/26/2012) J. Bradbury INTC 1307 Instrumentation Test Equipment Teaching Unit 12 Soldering Unit 12 Soldering 2002

More information

Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design

Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design Greg Smith FCT Assembly, Inc. Greeley, CO Abstract Reduction of first pass defects in the SMT assembly process minimizes cost, assembly

More information

COHERENT BEAM COMBINING OF HIGH POWER LASERS FOR MATERIALS PROCESSING

COHERENT BEAM COMBINING OF HIGH POWER LASERS FOR MATERIALS PROCESSING COHERENT BEAM COMBINING OF HIGH POWER LASERS FOR MATERIALS PROCESSING www.civan.co.il EXECUTIVE SUMMARY Civan Advanced Technologies develops and manufactures single-mode, highpower laser systems with a

More information

Brazing Solutions for the Tooling Industry. voestalpine Böhler Welding

Brazing Solutions for the Tooling Industry. voestalpine Böhler Welding Brazing Solutions for the Tooling Industry www.voestalpine.com/welding Join Expertise Alloys ad brazing technologies for special joint requirements The ever-growing demand for raw materials in conjunction

More information

THE ARCOR WAY: A PASSION FOR PRECISION

THE ARCOR WAY: A PASSION FOR PRECISION THE ARCOR WAY: A PASSION FOR PRECISION 1 THE A-TEAM Our entire team is ready to take on your toughest challenges. When you work with our A-Team leaders, you can feel confident that From engineers to project

More information

APPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS

APPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS Keywords: OLGA, SMT, PCB design APPLICATION NOTE 6381 ORGANIC LAND GRID ARRAY (OLGA) AND ITS APPLICATIONS Abstract: This application note discusses Maxim Integrated s OLGA and provides the PCB design and

More information

JOINT INDUSTRY STANDARD. Requirements for Soldering Pastes J Standard 005A. June 2011 Final Draft for Industry Comment

JOINT INDUSTRY STANDARD. Requirements for Soldering Pastes J Standard 005A. June 2011 Final Draft for Industry Comment JOINT INDUSTRY STANDARD Requirements for Soldering Pastes J Standard 005A Requirements for Soldering Pastes Amendment 1 1.0 SCOPE 1.1 Scope This standard prescribes general requirements for the characterization

More information

Swastik Technocast Limited

Swastik Technocast Limited An ISO-9001:2015 & ISO-14001:2015 Certified Co. PRECISION INVESTMENT & SAND CASTING UNIT About Us :- Founded in August-2007 and started production in January -2008. Swastik Technocast Limited is the premier

More information

& Anti-pillow. Product information. Koki no-clean LEAD FREE solder paste. Contents. Lead free SOLUTIONS you can TRUST.

& Anti-pillow. Product information. Koki no-clean LEAD FREE solder paste.   Contents. Lead free SOLUTIONS you can TRUST. www.ko-ki.co.jp #46019E Revised on JUN 15, 2009 Koki no-clean LEAD FREE solder paste Super Low-Void & Anti-pillow Product information Pillow defect This Product Information contains product performance

More information

Application Note AN-1011

Application Note AN-1011 AN-1011 Board Mounting Application Note for 0.800mm Pitch Devices For part numbers IRF6100, IRF6100PBF, IR130CSP, IR130CSPPBF, IR140CSP, IR140CSPPBF, IR1H40CSP, IR1H40CSPPBF By Hazel Schofield and Philip

More information

Brazing Solutions for the Tooling Industry. voestalpine Böhler Welding

Brazing Solutions for the Tooling Industry. voestalpine Böhler Welding Brazing Solutions for the Tooling Industry www.voestalpine.com/welding Metallurgical Expertise for Best Welding Results (formerly Böhler Welding Group) is a leading manufacturer and worldwide supplier

More information

ICALEO 2007, October 29 November 1, Hilton in the WALT DISNEY WORLD Resort, Orlando, FL, USA

ICALEO 2007, October 29 November 1, Hilton in the WALT DISNEY WORLD Resort, Orlando, FL, USA WHAT IS THE BEST CHOICE FOR LASER MATERIAL PROCESSING ROD, DISK, SLAB OR FIBER? Paper 201 Erwin Steiger Erwin Steiger LaserService, Graf-Toerring-Strasse 68, Maisach, Bavaria, 82216, Germany Abstract Laser

More information

BOARD DESIGN, SURFACE MOUNT ASSEMBLY AND BOARD LEVEL RELIABILITY ASPECTS OF FUSIONQUAD TM PACKAGES

BOARD DESIGN, SURFACE MOUNT ASSEMBLY AND BOARD LEVEL RELIABILITY ASPECTS OF FUSIONQUAD TM PACKAGES BOARD DESIGN, SURFACE MOUNT ASSEMBLY AND BOARD LEVEL RELIABILITY ASPECTS OF FUSIONQUAD TM PACKAGES Ahmer Syed 1, Sundar Sethuraman 2, WonJoon Kang 1, Gary Hamming 1, YeonHo Choi 1 1 Amkor Technology, Inc.

More information

ETF2017. Handsoldering and IPC Standards ETF CM

ETF2017. Handsoldering and IPC Standards ETF CM ETF2017 Handsoldering and IPC Standards Handsoldering using suitable materials, methods and defined acceptance criteria What do You use Solder Alloy Flux Melting temperature Methods Soldertip temperature

More information

Who we are. was born in 2006 as Spin-Off of Politecnico of Torino. Full time people employed 8. Laboratories and facilities 300 m 2

Who we are. was born in 2006 as Spin-Off of Politecnico of Torino. Full time people employed 8. Laboratories and facilities 300 m 2 Who we are was born in 2006 as Spin-Off of Politecnico of Torino Full time people employed 8 Laboratories and facilities 300 m 2 Administration and offices 250 m 2 Consolidated Turnover more then 600k

More information

CW Fiber Laser Products

CW Fiber Laser Products CW Fiber Laser Products 2000 2-micron CW Fiber Lasers 1060 1-micron CW Fiber Lasers 1550 1.5-micron CW Fiber Lasers 2000 Series CW 2-micron Fiber Laser Optisiv 2000 Series is maintenance-free, single-mode

More information

Brazing Solutions for the Tooling Industry

Brazing Solutions for the Tooling Industry Brazing Solutions for the Tooling Industry www.voestalpine.com/welding Metallurgical Expertise for Best Welding Results (formerly Böhler Welding Group) is a leading manufacturer and worldwide supplier

More information

FLASHSOLDERING UPDATE EXTENDING FINE MAGNET WIRE JOINING APPLICATIONS

FLASHSOLDERING UPDATE EXTENDING FINE MAGNET WIRE JOINING APPLICATIONS FLASHSOLDERING UPDATE EXTENDING FINE MAGNET WIRE JOINING APPLICATIONS David W. Steinmeier microjoining Solutions & Mike Becker Teka Interconnection Systems Abstract: FlashSoldering was first developed

More information

Applications of Solder Fortification with Preforms

Applications of Solder Fortification with Preforms Applications of Solder Fortification with Preforms Carol Gowans Indium Corporation Paul Socha Indium Corporation Ronald C. Lasky, PhD, PE Indium Corporation Dartmouth College ABSTRACT Although many have

More information

Atlantic. series. Industrial High Power Picosecond DPSS Lasers

Atlantic. series. Industrial High Power Picosecond DPSS Lasers Atlantic series Industrial High Power Picosecond DPSS Lasers Laser description Laser micromachining is rapidly becoming the material processing technology of choice for numerous small scale, real world

More information

Bumping of Silicon Wafers using Enclosed Printhead

Bumping of Silicon Wafers using Enclosed Printhead Bumping of Silicon Wafers using Enclosed Printhead By James H. Adriance Universal Instruments Corp. SMT Laboratory By Mark A. Whitmore DEK Screen Printers Advanced Technologies Introduction The technology

More information

Today s Flexible Multi-purpose Inspection Systems: Process Set-up, Process Control and Product Traceability All in One Platform

Today s Flexible Multi-purpose Inspection Systems: Process Set-up, Process Control and Product Traceability All in One Platform Today s Flexible Multi-purpose Inspection Systems: Process Set-up, Process Control and Product Traceability All in One Platform By Jeffrey Rupert, Director of Advanced Technology & Business Development,

More information

This series of lasers are available with a choice of Nd:YAG, Nd:YLF, and Nd:YVO 4. System Reliability

This series of lasers are available with a choice of Nd:YAG, Nd:YLF, and Nd:YVO 4. System Reliability Photonics Industries DS Series of UV (351/355 nm) diode pumped solid-state Q-switched lasers offer a compact, hands-free system with the long-term reliability that the manufacturing industry demands. Utilizing

More information

The Swiss Army Knife for the Lab Micro Material Processing with the LPKF ProtoLaser U4

The Swiss Army Knife for the Lab Micro Material Processing with the LPKF ProtoLaser U4 The Swiss Army Knife for the Lab Micro Material Processing with the LPKF ProtoLaser U4 Micro Machining in the Lab LPKF ProtoLasers have been in use in leading electronics laboratories around the world

More information

S3X58-M High Reliability Lead Free Solder Paste. Technical Information. Koki no-clean LEAD FREE solder paste.

S3X58-M High Reliability Lead Free Solder Paste. Technical Information. Koki no-clean LEAD FREE solder paste. www.ko-ki.co.jp #52007 Revised on Nov.27, 2014 Koki no-clean LEAD FREE solder paste High Reliability Lead Free Solder Paste S3X58-M500-4 Technical Information O₂ Reflowed 0.5mmP QFP 0603R This product

More information

Optical Information. The LDM145 laser diode modules are available with the following lens types.

Optical Information. The LDM145 laser diode modules are available with the following lens types. LDM145 Datasheet LDM145 The LDM145 is a 16mm diameter CW laser diode module available in wavelengths of 520, 635, 650, 670, 780 & 850nm with power of up to 5mW as standard. It reuires an operating voltage

More information

Custom & OEM Filter Design

Custom & OEM Filter Design Custom & OEM Filter Design Custom & OEM Benefits Latest coating technologies Competitive pricing Fast, on-time deliveries All filters manufactured in Vermont View of Coating Hall Custom & OEM Filter Design

More information

Mechatronics. Bring the challenge. We ll build the solution.

Mechatronics. Bring the challenge. We ll build the solution. Mechatronics Bring the challenge. We ll build the solution. VALUE-ADDED ENCODER ASSEMBLIES CUSTOMIZED ROTARY STAGES LINEAR AND CURVED STAGES VOICE COIL STAGES ROBOTIC JOINTS CUSTOMIZED ELECTRONICS, CABLING

More information

HOTBAR REFLOW SOLDERING

HOTBAR REFLOW SOLDERING HOTBAR REFLOW SOLDERING Content 1. Hotbar Reflow Soldering Introduction 2. Application Types 3. Process Descriptions > Flex to PCB > Wire to PCB 4. Design Guidelines 5. Equipment 6. Troubleshooting Guide

More information

no-clean and halide free INTERFLUX Electronics N.V.

no-clean and halide free INTERFLUX Electronics N.V. Delphine series no-clean and halide free s o l d e r p a s t e INTERFLUX Electronics N.V. Product manual Key properties - Anti hidden pillow defect - Low voiding chemistry - High stability - High moisture

More information

AND8211/D. Board Level Application Notes for DFN and QFN Packages APPLICATION NOTE

AND8211/D. Board Level Application Notes for DFN and QFN Packages APPLICATION NOTE Board Level Application Notes for DFN and QFN Packages Prepared by: Steve St. Germain ON Semiconductor APPLICATION NOTE INTRODUCTION Various ON Semiconductor components are packaged in an advanced Dual

More information

Can Nano-Coatings Really Improve Stencil Performance? Tony Lentz FCT Assembly

Can Nano-Coatings Really Improve Stencil Performance? Tony Lentz FCT Assembly Can Nano-Coatings Really Improve Stencil Performance? Tony Lentz FCT Assembly tlentz@fctassembly.com Outline/Agenda Introduction Claims & questions about coatings Experiment design Results of coating performance

More information

Copper Dissolution: Just Say No!

Copper Dissolution: Just Say No! Korea s New Electronics Waste Law, p. 18 AUGUST 2007 circuitsassembly.com Copper Dissolution: Just Say No! Connector after conventional SAC 305 rework showing copper dissolution (left), and minimal copper

More information

Can Nano-Coatings Really Improve Stencil Performance? Tony Lentz FCT Assembly

Can Nano-Coatings Really Improve Stencil Performance? Tony Lentz FCT Assembly Can Nano-Coatings Really Improve Stencil Performance? Tony Lentz FCT Assembly tlentz@fctassembly.com Outline/Agenda Introduction Claims & questions about coatings Experiment design Results of coating performance

More information

Crystal AC Power Supplies: 60, 100, 120, 150, and 180 kw. Mid-frequency sinusoidal power for dualmagnetron

Crystal AC Power Supplies: 60, 100, 120, 150, and 180 kw. Mid-frequency sinusoidal power for dualmagnetron Crystal AC Power Supplies: 60, 100, 120, 150, and 180 kw Mid-frequency sinusoidal power for dualmagnetron reactive sputtering and PECVD Crystal AC Power SuPPlies Precise power control is essential for

More information

Application Specification Releasable Poke-in Connector 08JUL 2015 REV:A

Application Specification Releasable Poke-in Connector 08JUL 2015 REV:A Application Specification 114-137055 Releasable Poke-in Connector 08JUL 2015 REV:A 1. INTRODUCTION This specification covers the requirements for application of Releasable Poke-in connector for use on

More information

CUSTOM JOB SHOP. The Maudlin Advantage: Custom Shims. Spring. Laser Cutting. Wire-EDM. Stamping. Water-Jet

CUSTOM JOB SHOP. The Maudlin Advantage: Custom Shims. Spring. Laser Cutting. Wire-EDM. Stamping. Water-Jet The Maudlin Advantage: Custom Shims Spring Laser Cutting Wire-EDM Stamping Water-Jet CUSTOM JOB SHOP ISO 9001:2008 Certified Maudlin Products, Inc. 1929 Hwy 146, Kemah, TX 77565 (P) 281-334-7566 Toll Free

More information

AKS has partnered with many high-quality machinery sales dealers and has an extensive service and support network.

AKS has partnered with many high-quality machinery sales dealers and has an extensive service and support network. Advanced Kiffer Systems, Inc. (AKS), a subsidiary of Kiffer Industries, is headquartered in Cleveland, OH, and has been at the forefront of manufacturing high-quality machinery for over 100 years since

More information

Pulsed Fiber Laser on Flatbed Technology FP 100 / FP 300. High Performance Marking Solutions

Pulsed Fiber Laser on Flatbed Technology FP 100 / FP 300. High Performance Marking Solutions Pulsed Fiber Laser on Flatbed Technology High Performance Marking Solutions your needs decide Your advantages at a glance Your Investment Your Return Entry-level model for marking metals and plastics Almost

More information

Assembly Instructions for SCC1XX0 series

Assembly Instructions for SCC1XX0 series Technical Note 82 Assembly Instructions for SCC1XX0 series TABLE OF CONTENTS Table of Contents...1 1 Objective...2 2 VTI's 32-lead Dual In-line Package (DIL-32)...2 3 DIL-32 Package Outline and Dimensions...2

More information

M series. Product information. Koki no-clean LEAD FREE solder paste. Contents. Lead free SOLUTIONS you can TRUST.

M series. Product information. Koki no-clean LEAD FREE solder paste.   Contents. Lead free SOLUTIONS you can TRUST. www.ko-ki.co.jp Ver. 42017e.2 Prepared on Oct. 26, 2007 Koki no-clean LEAD FREE solder paste Anti-Pillow Defect Product information This Product Information contains product performance assessed strictly

More information

FINE TUNING THE STENCIL MANUFACTURING PROCESS AND OTHER STENCIL PRINTING EXPERIMENTS

FINE TUNING THE STENCIL MANUFACTURING PROCESS AND OTHER STENCIL PRINTING EXPERIMENTS FINE TUNING THE STENCIL MANUFACTURING PROCESS AND OTHER STENCIL PRINTING EXPERIMENTS Chrys Shea Shea Engineering Services chrys@sheaengineering.com Ray Whittier Vicor Corporation VI Chip Division rwhittier@vicr.com

More information

Assembly Instructions for SCA6x0 and SCA10x0 series

Assembly Instructions for SCA6x0 and SCA10x0 series Technical Note 71 Assembly Instructions for SCA6x0 and SCA10x0 series TABLE OF CONTENTS Table of Contents...1 1 Objective...2 2 VTI'S DIL-8 and DIL-12 packages...2 3 Package Outline and Dimensions...2

More information

Solder Pastes. for electronics manufacturing. Solder Wires Solder Pastes Fluxes Solder Bars

Solder Pastes. for electronics manufacturing. Solder Wires Solder Pastes Fluxes Solder Bars Solder Wires Solder Pastes Fluxes Solder Bars Soldering equipment Measurement and testing systems Conformal Coatings Accessories Solder Pastes for electronics manufacturing WE HAVE THE RIGHT SOLDER PASTE

More information

QUANTIFYING QUALITATIVE ATTRIBUTES OF CORED SOLDER WIRE IN LED LUMINAIRE SOLDERING - PART I

QUANTIFYING QUALITATIVE ATTRIBUTES OF CORED SOLDER WIRE IN LED LUMINAIRE SOLDERING - PART I QUANTIFYING QUALITATIVE ATTRIBUTES OF CORED SOLDER WIRE IN LED LUMINAIRE SOLDERING - PART I Amit Patel, Steve Prokopiak, Nicholas Herrick, Bin Mo, Rahul Raut, Ranjit Pandher, Ph.D Alpha, an Alent plc Company

More information

LASER TECHNOLOGY. Key parameters. Groundbreaking in the laser processing of cutting tools. A member of the UNITED GRINDING Group

LASER TECHNOLOGY. Key parameters. Groundbreaking in the laser processing of cutting tools. A member of the UNITED GRINDING Group Creating Tool Performance A member of the UNITED GRINDING Group Groundbreaking in the laser processing of cutting tools Key parameters The machining of modern materials using laser technology knows no

More information

AREA ARRAY TECHNOLOGY SYMPOSIUM

AREA ARRAY TECHNOLOGY SYMPOSIUM AREA ARRAY TECHNOLOGY SYMPOSIUM Using SPI to Improve Print Yields Chrys Shea Shea Engineering Services/ CGI Americas Ray Whittier Vicor Corporation VI Chip Division SHEA ENGINEERING SERVICES Agenda How

More information

Step Stencil Technology

Step Stencil Technology Step Stencil Technology Greg Smith gsmith@fctassembly.com Tony Lentz tlentz@fctassembly.com Outline/Agenda Introduction Step Stencils Technologies Step Stencil Design Printing Experiment Experimental Results

More information

Transition to Lead Free Electronics Assembly Case Study Part II Product Reliability and Forced Rework

Transition to Lead Free Electronics Assembly Case Study Part II Product Reliability and Forced Rework Transition to Lead Free Electronics Assembly Case Study Part II Product Reliability and Forced Rework Robert Farrell, Scott Mazur, and Paul Bodmer Benchmark Electronics, Hudson NH Richard Russo, Mercury

More information

Capabilities of Flip Chip Defects Inspection Method by Using Laser Techniques

Capabilities of Flip Chip Defects Inspection Method by Using Laser Techniques Capabilities of Flip Chip Defects Inspection Method by Using Laser Techniques Sheng Liu and I. Charles Ume* School of Mechanical Engineering Georgia Institute of Technology Atlanta, Georgia 3332 (44) 894-7411(P)

More information