HPC in the Loop and Cyber-Physical Systems

Size: px
Start display at page:

Download "HPC in the Loop and Cyber-Physical Systems"

Transcription

1 High-Performance and Embedded Architecture and Compilation HPC in the Loop and Cyber-Physical Systems Marc Duranton HiPEAC vision coordinator CEA Fellow Commissariat à l énergie atomique et aux énergies alternatives Post-H202 vision for HPC workshop Sunday, 24 June 2018, Frankfurt

2 HiPEAC = High-Performance and Embedded Architecture and Compilation HiPEAC's mission is to steer and increase the European research in the area of high-performance and embedded computing systems, And stimulate cooperation between: a) academia and industry b) computer architects and tool builders. 3

3 HIPEAC HISTORY HiPEAC5 HiPEAC4 HiPEAC3 HiPEAC2 HiPEAC

4 MEMBERSHIP 13 partners, 522 members, 99 associated members, 423 affiliated members and 855 affiliated PhD students from 363 institutions in 40 countries. Membership is free of charge. Associated hipeac.net/members/stats/map members: 76 Total:

5 Conference ACACES summer school Computing systems weeks Stimulating collaboration HiPEAC Jobs WP2 Connecting the communities HIPEAC STRUCTURE Consultation meetings HiPEAC Vision 2019 Disseminating the HiPEAC Vision WP4 Roadmapping WP1 Growing the communities Membership management Growing the industrial community Growing the innovator community Growing the stakeholder community Growing the new member states membership WP3 Dissemination Communications Road show Awards Website Management Project management Financial management Industrial Advisory board 6

6 Conference ACACES summer school Computing systems weeks Stimulating collaboration HiPEAC Jobs WP2 Connecting the communities HIPEAC STRUCTURE Consultation meetings HiPEAC Vision 2019 Disseminating the HiPEAC Vision WP4 Roadmapping WP1 Growing the communities Membership management Growing the industrial community Growing the innovator community Growing the stakeholder community Growing the new member states membership WP3 Dissemination Communications Road show Awards Website Management Project management Financial management Industrial Advisory board 7

7 THE HIPEAC VISION The last HiPEAC Vision Document was published in January The next version is on-going (expect printed version for beginning 2019) One of its aim is to drive the community and to help defining the next European calls in ICT The 2017 version is available at: 8

8 HiPEAC Vision 9

9 The best way to predict the future is to invent it. Alan Kay 11

10 OUTLINE Algorithm Applications Data Hardware Language 12

11 OUTLINE Algorithm Applications Data Hardware Language 13

12 Entering in Human and Machine collaboration era 14

13 ENABLED BY ARTIFICIAL INTELLIGENCE (AND DEEP LEARNING) Artificial Intelligence is changing the man-machine interaction natural interfaces, intelligent behavior Image and situation understanding Voice recognition and synthesis Direct interfacing with the world Creating the bridge between cyber and real world decision taking 15

14 ENABLING EDGE INTELLIGENCE C 2 PS: COGNITIVE ( CYBERNETIC* AND PHYSICAL ) SYSTEMS Smart sensors Enabling Intelligent data processing at the edge: Fog computing Edge computing Stream analytics Fast data New services Cyber Physical Entanglement Systems Cloud / HPC Processing, Abstracting Understanding as soon as possible Data Analytics / Cognitive computing Internet of Things Big Data Transforming data into information as early as possible True collaboration between edge devices and the HPC/cloud ensuring: - Data security / Privacy - Lower bandwidth - Better use of HPC/cloud * As defined by Norbert Wiener: how humans, animals and machines control and communicate with each other. 16

15 LOOKING FORWARD EXAMPLE OF A CPS SYSTEM Direct Brain Computer Interface (BCI) Here allowing a paraplegic to walk again One current limitation: Required processing power need supercomputer in a box From CEA-Clinatec 17

16 Embedded intelligence needs local high-end computing System should be autonomous to make good decisions in all conditions Safety will impose that basic autonomous functions should not rely on always connected or always available Cyber-physical applications will require high performance level of computing HPC in a Box. 18

17 Embedded intelligence needs local high-end computing System should be autonomous to make good decisions in all conditions Safety will impose that basic autonomous functions should not rely on always connected or always available 25 years Current embedded systems are HPC systems of few decades ago 19

18 CYBER-PHYSICAL SYSTEMS Imposes the timing Observations Environment Actions 20

19 1948: NORBERT WIENER 21

20 BUT COMPUTING SYSTEMS WERE NOT DESIGNED FOR CPS SYSTEMS In nearly all hardware and software of computing systems: Time is abstracted or even not present at all Very few programming languages can express time or timing constraints All is done to have the best average performance, not predictable performances Caches, out of order execution, branch prediction, speculative execution, (Hidden) compiler optimization, call to (time) unspecified libraries Energy is also left out of scope This can have impact on data movement, optimizations With predictability: On-Time processing Interaction with external world are second priorities vs. computation Done with interrupts (introduced as an optimization, eliminating unproductive waiting time in polling loops) which were design to be exceptional events Etc. 22

21 3 PILLARDS OF FUTURE HPC Simulation Data Machine Learning Intertwined with CPS requirements 23

22 SIMULATION Specialist Environment Algorithm Parameters Simulation Human knowledge defines the processing Large algorithmic complexity Error? High precision floating point Large set of output data Von Neumann architecture Data SIMULATION = MODEL FOR PREDICTION 24

23 FROM CPS TO DIGITAL TWIN Observations Error? Simulation Observations Environment Actions SIMULATION SHOULD BE FASTER THAN REALITY FOR PREDICTION 25

24 BIG DATA Specialist Human knowledge refines the processing Large set of input data Mappable on Von Neumann Architecture Data Analytics Big Data Observations Environment Model Specialist 26

25 MACHINE LEARNING (DEEP LEARNING) LEARNING PHASE Specialist Human defines the learning data set, not the algorithm Large set of input data for learning phase Low precision floating point Large number of operations (Stochastic) gradient descent Labelled data set Learning phase 27

26 MACHINE LEARNING (DEEP LEARNING) INFERENCE PHASE Low precision arithmetic Medium number of operations Co-location computing and storage ( computing in memory ) Should satisfy the application non-functional requirements Environment Inference phase 28

27 DEEP LEARNING AND VOICE RECOGNITION 29

28 2017: GOOGLE S CUSTOMIZED TPU HARDWARE required to increase energy efficiency with accuracy adapted to the use (e.g. float 16) Google s TPU2 : 11.5 petaflops 16 of machine learning number crunching (and guessing about 400+ KW, 100+ GFlops 16 /W) From Google Peta = = million of milliard 31

29 Goal REINFORCEMENT LEARNING: DYNAMIC PROGRAMMING + DEEP LEARNING Rewards Observations Environment Agent Actions Learns to maximize rewards Respond to action 33

30 ALPHAGO ZERO: SELF-PLAYING TO LEARN From doi: /nature24270 (Received 07 April 2017) 34

31 ALPHAZERO: SELF-PLAYING TO LEARN REINFORCEMENT LEARNING: DYNAMIC PROGRAMMING + DEEP LEARNING 35

32 ALPHAZERO: COMPUTING RESOURCES From Google Deepmind Peta = = million of milliard 36

33 REINFORCEMENT LEARNING: DYNAMIC PROGRAMMING + DEEP LEARNING Goal Mixed precision arithmetic Very high number of operations Large internal data manipulation Rewards Mainly co-location computing and storage ( computing in memory ) High level of parallelism Minimization of energy functions Observations Environment Agent Actions Learns to maximize rewards Respond to action 37

34 REINFORCEMENT LEARNING: DYNAMIC PROGRAMMING + DEEP LEARNING Goal Rewards Observations Agent Actions Learns to maximize rewards Respond to action 38

35 OUTLINE Algorithm Applications Data Hardware Language 39

36 WHAT WILL BE THE NEXT TECHNOLOGY? And after CMOS? 40

37 Technology evolution Silicon Quantum bits 22FD 12FD FDSOI Next Gen 20nm L G Si channel ISPD SiC RSD 25nm T BOX 20nm L G Si channel ISPD SiC RSD Non planar / trigate / stacked Nanowires 25nm T BOX 28nm 14nm Alternative to scaling and diversification 10nm 2017 FinFET nm Disruptive scaling Hybrid logic 5nm Steep slope devices Mechanical switches Si Quantum bits Monolithic 3D for 3D VLSI 43

38 EXPLORE NEW WAYS AS ALTERNATIVE TO SILICON New technologies Quantum computing Printed/flexible electronics Carbon nanotubes Photonics Neuro inspired (nano) technologies Reservoir computing Adiabatic computing MEMS for computing Synthetic biology, blob computing Swarm computing Symbiotic computing Analogue/physic/hybrid computing 44

39 NON VOLATILE MEMORIES PCM MRAM Magnetic effect Can change the structure of memory hierarchy? + 64/128 addressing scheme Do we still need files? Direct access of objects CBRAM GST GeTe GST + HfO 2 OXRAM Ag / GeS 2 Thermal effect TiN/HfO 2 /Ti/TiN Electronic effect oxygen vacancies Electrochemical effect 45

40 The problem: IT projected to challenge future electricity supply From Total Consumer Power Consumption Forecast, Anders S.G. Andrae, October

41 COST OF MOVING DATA -> COMPUTING IN MEMORY Source: Bill Dally, «To ExaScale and Beyond» 49

42 NEUROMORPHIC ACCELERATOR: DYNAPS-SL (INI-ZURICH) Neuram3 1 st chip IBM True North Technology 28 nm FDSOI 28nm CMOS Supply Voltage 1 V 0.7V Neuron Type Analog Digital Neurons per core Core Area 0.36 mm mm 2 Computation Parallel processing Time multiplexing Fan In/Out 2k/8k 256/256 Synaptic Operation per Second per Watt 300 GSOPS/W *1 46 GSOPS/W Energy per synaptic event <2 pj *2 10 pj Energy per spike <0.375 nj *3 3.9 nj 1 At 100Hz mean firing rate, by appending 4 local-core destinations per spike, 400 k events will be broadcast to 4 cores with 25% connectivity per event. 400 k x 1 k x 25% / 300 μ W = 300 GSOPS/W 2 In case of 25% match in each core, energy per synaptic event = energy per broadcast / (256*25%) =120pJ/64 = 2 pj 3 Energy per spike = total power consumption / spikes numbers = 300 uw/800 k = nj 50

43 OFF-CHIP PHOTONICS Photonics: cost in sending information, nearly nothing in transmission Optical Transceiver Chip D IC Chip B Chip C Fiber Ferrule PIC Driver / TIA Micropillars Si interposer or laminate substrate IC PCB S1 Off board: AOC, optical modules Off chip: Optical I/O Time 52

44 IN-PACKAGE PHOTONICS Thermal Dissipation Optical Transceiver Chip A Chip D Chip B Chip C Through Silicon Via Primary I/O Cu pillars Signal Thermal Dissipation Computing Cores Signal Digital Cu pillars & proximity lines Tx/Rx photo diode RF Cu pillars Integr. Rx/Tx Photonic Interposer Substrate modul RAM Light source Power Power Power Power Laser S1 S2 Off board: AOC, optical modules Off chip: Optical I/O Optical network in package 53

45 Polynomial transformation of NP-hard problems for Quantum annealers Adiabatic quantum computation (Farhi et al. in 2000) as an alternative quantum model for solving NP-hard optimization problems considered classically insoluble! D-Wave System Hardware The system solves only one binary optimization problem : Embedding a realistic problem instance : Physical qubits on each colored path represent one logical qubit UC-F16/presentations/D-Wave.pdf Problem: Qubit efficiency! Possible solution : Search for an efficient operating path for an adiabatic quantum computer Slide from Christian Gamrat Daniel Vert - Daniel.vert2@cea.fr 54

46 QUANTUM HARDWARE ARCHITECTURE AND SYSTEM Importance of studying the full stack system architecture to connect quantum devices with conventional computing systems Hardware level System stack The system stack from low level quantum hardware to high level algorithms Overview of a quantum computer architecture. Pink is quantum, Green is the interface and Blue parts are conventional Fu et al A Heterogeneous Quantum Computer Architecture, Proc. ACM, From work by Slide from Christian Gamrat 55

47 FUSING PARADIGMS AT HARDWARE LEVEL At the hardware level, the good old Von Neumann/ CMOS partnership can act as a computing substrate Acting as coordination / communication node Allowing Hardware / Software integration Neuro Engine Quantum Engine Qubits on Silicon Maurand et al, Nature Com., Jul Coordination Engine Von Neumann style CMOS Technology binary data Graphical Engine Decision Engine NVM Synapses on Silicon Semantical Engine Numerical Engine Numerical Neuro Quantum Graphics Engine engine engine engine Physical and logical interface layer Slide from Christian Gamrat CMOS Substrate D. Roclin et al, IEEE NanoArch,

48 COORDINATE PARADIGMS AT SOFTWARE LEVEL A sequential program (running on the coordinator) distributes tasks to engines Accelerator as services (J. Cong) Tasks are distributed to computing engines Instruction streams Supervised Learning Unsupervised Learning Quantum Engine Why would we want that? Domain specific expressiveness Run hard tasks, speedup NP problems Provide cognitive functions Stefanini et al. Frontiers Neuroinformatics August 2014 Valiron et al., Programming the Quantum Future, Commun. ACM, vol. 58, no. 8, pp , Jul Fu et al. Proc. ACM, May

49 OUTLINE Algorithm Applications Data Hardware Language 58

50 PARALLELISM AND SPECIALIZATION ARE NOT FOR FREE Frequency limit parallelism Energy efficiency heterogeneity Ease of programming

51 PARALLELISM AND SPECIALIZATION ARE NOT FOR FREE Frequency limit parallelism Energy efficiency heterogeneity Ease of programming

52 PARALLELISM AND SPECIALIZATION ARE NOT FOR FREE Frequency limit parallelism Energy efficiency heterogeneity Ease of programming

53 Managing complexity Cognitive solutions for complex computing systems: Using AI and optimization techniques for computing systems Creating new hardware Generating code Optimizing systems Similar to Generative design for mechanical engineering

54 USING AI FOR MAKING CPS SYSTEMS: GENERATIVE DESIGN APPROACH The user only states desired goals and constraints -> The complexity wall might prevent explaining the solution Autodesk Motorcycle swingarm: the piece that hinges the rear wheel to the bike s frame 64

55 EXAMPLE: DESIGN SPACE EXPLORATION FOR DESIGN MULTI-CORE PROCESSORS 1 (2010) Ne-XVP project Follow-up of the TriMedia VLIW ( -XVP ) 1,105,747,200 heterogeneous multicores in the design space 2 millions years to evaluate all design points AI inspired techniques allowed to reduce the induction time to only few days => x16 performance increase 1 M. Duranton et all., Rapid Technology-Aware Design Space Exploration for Embedded HeterogeneousMultiprocessors in Processor and System-on-Chip Simulation, Ed. R. Leupers,

56 AUTOML AND OTHER PROGRAM GENERATORS 66

57 2017: GOOGLE; USING DEEP LEARNING TO DESIGN DEEP LEARNING Neural Architecture Search, using a recurrent neural network to compose neural network architectures using reinforcement learning on CIFAR-10 (character recognition) From arxiv: v2, Barret Zoph, Quoc V. Le Google Brain 67

58 PROGRAMMING 2.0: LET THE COMPUTER DO THE JOB: Describing what the program should accomplish, rather than describing how to accomplish it as a sequence of the programming language primitives. For example, describe the concurrency of an application, not how to parallelize the code for it. (Good) compilers know better about architecture than humans, they are better at optimizing code 68

59 CONCLUSION: WE LIVE AN EXCITING TIME! 69

60 70

61 Thank you for your attention Centre de Grenoble 17 rue des Martyrs Grenoble Cedex Centre de Saclay Nano-Innov PC Gif sur Yvette Cedex

POST CMOS PATHFINDING. Leti Innovation Days June 28-29, 2017

POST CMOS PATHFINDING. Leti Innovation Days June 28-29, 2017 POST CMOS PATHFINDING DEVELOPING THE BUILDING BLOCKS FOR DATA PROCESSING The challenges to continue the performance improvement of data processing systems are multiple Improve the energy efficiency to

More information

Eurolab-4-HPC Roadmap. Paul Carpenter Barcelona Supercomputing Center Theo Ungerer University of Augsburg

Eurolab-4-HPC Roadmap. Paul Carpenter Barcelona Supercomputing Center Theo Ungerer University of Augsburg Eurolab-4-HPC Roadmap Paul Carpenter Barcelona Supercomputing Center Theo Ungerer University of Augsburg 1 Agenda EuroLab-4-HPC Roadmap Scope, Organisation and Status EuroLab-4-HPC Roadmap Topics Discussion

More information

Silicon photonics integration roadmap for applications in computing systems

Silicon photonics integration roadmap for applications in computing systems Silicon photonics integration roadmap for applications in computing systems Bert Jan Offrein Neuromorphic Devices and Systems Group 2016 IBM Corporation Outline Photonics and computing? The interconnect

More information

Neuro-Fuzzy and Soft Computing: Fuzzy Sets. Chapter 1 of Neuro-Fuzzy and Soft Computing by Jang, Sun and Mizutani

Neuro-Fuzzy and Soft Computing: Fuzzy Sets. Chapter 1 of Neuro-Fuzzy and Soft Computing by Jang, Sun and Mizutani Chapter 1 of Neuro-Fuzzy and Soft Computing by Jang, Sun and Mizutani Outline Introduction Soft Computing (SC) vs. Conventional Artificial Intelligence (AI) Neuro-Fuzzy (NF) and SC Characteristics 2 Introduction

More information

FROM BRAIN RESEARCH TO FUTURE TECHNOLOGIES. Dirk Pleiter Post-H2020 Vision for HPC Workshop, Frankfurt

FROM BRAIN RESEARCH TO FUTURE TECHNOLOGIES. Dirk Pleiter Post-H2020 Vision for HPC Workshop, Frankfurt FROM BRAIN RESEARCH TO FUTURE TECHNOLOGIES Dirk Pleiter Post-H2020 Vision for HPC Workshop, Frankfurt Science Challenge and Benefits Whole brain cm scale Understanding the human brain Understand the organisation

More information

ICT Micro- and nanoelectronics technologies

ICT Micro- and nanoelectronics technologies EPoSS Proposers' Day, 2 Feb 2017, Brussels ICT 31-2017 Micro- and nanoelectronics technologies Eric Fribourg-Blanc, Henri Rajbenbach, Andreas Lymberis European Commission DG CONNECT (Communications Networks,

More information

Proposers Day Workshop

Proposers Day Workshop Proposers Day Workshop Monday, January 23, 2017 @srcjump, #JUMPpdw Cognitive Computing Vertical Research Center Mandy Pant Academic Research Director Intel Corporation Center Motivation Today s deep learning

More information

How material engineering contributes to delivering innovation in the hyper connected world

How material engineering contributes to delivering innovation in the hyper connected world How material engineering contributes to delivering innovation in the hyper connected world Paul BOUDRE, Soitec CEO Leti Innovation Days - July 2018 Grenoble, France We live in a world of data In perpetual

More information

Weebit Nano (ASX: WBT) Silicon Oxide ReRAM Technology

Weebit Nano (ASX: WBT) Silicon Oxide ReRAM Technology Weebit Nano (ASX: WBT) Silicon Oxide ReRAM Technology Amir Regev VP R&D Leti Memory Workshop June 2017 1 Disclaimer This presentation contains certain statements that constitute forward-looking statements.

More information

Eurolab-4-HPC Long-Term Vision on High-Performance Computing

Eurolab-4-HPC Long-Term Vision on High-Performance Computing Foundation for a Centre of Excellence in High-Performance Computing Systems Eurolab-4-HPC Long-Term Vision on High-Performance Computing Editors: Theo Ungerer, Paul Carpenter Funded by the European Union

More information

This list supersedes the one published in the November 2002 issue of CR.

This list supersedes the one published in the November 2002 issue of CR. PERIODICALS RECEIVED This is the current list of periodicals received for review in Reviews. International standard serial numbers (ISSNs) are provided to facilitate obtaining copies of articles or subscriptions.

More information

ARTEMIS The Embedded Systems European Technology Platform

ARTEMIS The Embedded Systems European Technology Platform ARTEMIS The Embedded Systems European Technology Platform Technology Platforms : the concept Conditions A recipe for success Industry in the Lead Flexibility Transparency and clear rules of participation

More information

Journal Title ISSN 5. MIS QUARTERLY BRIEFINGS IN BIOINFORMATICS

Journal Title ISSN 5. MIS QUARTERLY BRIEFINGS IN BIOINFORMATICS List of Journals with impact factors Date retrieved: 1 August 2009 Journal Title ISSN Impact Factor 5-Year Impact Factor 1. ACM SURVEYS 0360-0300 9.920 14.672 2. VLDB JOURNAL 1066-8888 6.800 9.164 3. IEEE

More information

Research Statement. Sorin Cotofana

Research Statement. Sorin Cotofana Research Statement Sorin Cotofana Over the years I ve been involved in computer engineering topics varying from computer aided design to computer architecture, logic design, and implementation. In the

More information

Chapter 1: Introduction to Neuro-Fuzzy (NF) and Soft Computing (SC)

Chapter 1: Introduction to Neuro-Fuzzy (NF) and Soft Computing (SC) Chapter 1: Introduction to Neuro-Fuzzy (NF) and Soft Computing (SC) Introduction (1.1) SC Constituants and Conventional Artificial Intelligence (AI) (1.2) NF and SC Characteristics (1.3) Jyh-Shing Roger

More information

Chalcogenide Memory, Logic and Processing Devices. Prof C David Wright Department of Engineering University of Exeter

Chalcogenide Memory, Logic and Processing Devices. Prof C David Wright Department of Engineering University of Exeter Chalcogenide Memory, Logic and Processing Devices Prof C David Wright Department of Engineering University of Exeter (david.wright@exeter.ac.uk) Acknowledgements University of Exeter Yat-Yin Au, Jorge

More information

Application of AI Technology to Industrial Revolution

Application of AI Technology to Industrial Revolution Application of AI Technology to Industrial Revolution By Dr. Suchai Thanawastien 1. What is AI? Artificial Intelligence or AI is a branch of computer science that tries to emulate the capabilities of learning,

More information

Parallel Computing 2020: Preparing for the Post-Moore Era. Marc Snir

Parallel Computing 2020: Preparing for the Post-Moore Era. Marc Snir Parallel Computing 2020: Preparing for the Post-Moore Era Marc Snir THE (CMOS) WORLD IS ENDING NEXT DECADE So says the International Technology Roadmap for Semiconductors (ITRS) 2 End of CMOS? IN THE LONG

More information

Deep Learning Overview

Deep Learning Overview Deep Learning Overview Eliu Huerta Gravity Group gravity.ncsa.illinois.edu National Center for Supercomputing Applications Department of Astronomy University of Illinois at Urbana-Champaign Data Visualization

More information

HOW TO CONTINUE COST SCALING. Hans Lebon

HOW TO CONTINUE COST SCALING. Hans Lebon HOW TO CONTINUE COST SCALING Hans Lebon OUTLINE Scaling & Scaling Challenges Imec Technology Roadmap Wafer size scaling : 450 mm 2 COST SCALING IMPROVED PERFORMANCE 3 GLOBAL TRAFFIC FORECAST Cloud Traffic

More information

IBM Research - Zurich Research Laboratory

IBM Research - Zurich Research Laboratory October 28, 2010 IBM Research - Zurich Research Laboratory Walter Riess Science & Technology Department IBM Research - Zurich wri@zurich.ibm.com Outline IBM Research IBM Research Zurich Science & Technology

More information

The Future of Packaging ~ Advanced System Integration

The Future of Packaging ~ Advanced System Integration The Future of Packaging ~ Advanced System Integration Enabling a Microelectronic World R. Huemoeller SVP, Adv. Product / Platform Develop June 2013 Product Segments End Market % Share Summary 2 New Product

More information

H2020 Future and Emerging Technologies (FET)

H2020 Future and Emerging Technologies (FET) H2020 Future and Emerging Technologies (FET) ICT-Energy Workshop, Bristol, September 15 th 2015 51214 Andrea Feltrin Future and Emerging Technologies DG CONNECT European Commission FET mission To turn

More information

sensors & systems Imagine future imaging... Leti, technology research institute Contact:

sensors & systems Imagine future imaging... Leti, technology research institute Contact: Imaging sensors & systems Imagine future imaging... Leti, technology research institute Contact: leti.contact@cea.fr From consumer markets to high-end applications smart home IR array for human activity

More information

Swarm Intelligence W7: Application of Machine- Learning Techniques to Automatic Control Design and Optimization

Swarm Intelligence W7: Application of Machine- Learning Techniques to Automatic Control Design and Optimization Swarm Intelligence W7: Application of Machine- Learning Techniques to Automatic Control Design and Optimization Learning to avoid obstacles Outline Problem encoding using GA and ANN Floreano and Mondada

More information

AI Application Processing Requirements

AI Application Processing Requirements AI Application Processing Requirements 1 Low Medium High Sensor analysis Activity Recognition (motion sensors) Stress Analysis or Attention Analysis Audio & sound Speech Recognition Object detection Computer

More information

A.I in Automotive? Why and When.

A.I in Automotive? Why and When. A.I in Automotive? Why and When. AGENDA 01 02 03 04 Definitions A.I? A.I in automotive Now? Next big A.I breakthrough in Automotive 01 DEFINITIONS DEFINITIONS Artificial Intelligence Artificial Intelligence:

More information

On-chip Networks in Multi-core era

On-chip Networks in Multi-core era Friday, October 12th, 2012 On-chip Networks in Multi-core era Davide Zoni PhD Student email: zoni@elet.polimi.it webpage: home.dei.polimi.it/zoni Outline 2 Introduction Technology trends and challenges

More information

Binary Neural Network and Its Implementation with 16 Mb RRAM Macro Chip

Binary Neural Network and Its Implementation with 16 Mb RRAM Macro Chip Binary Neural Network and Its Implementation with 16 Mb RRAM Macro Chip Assistant Professor of Electrical Engineering and Computer Engineering shimengy@asu.edu http://faculty.engineering.asu.edu/shimengyu/

More information

Beyond Buzzwords: Emerging Technologies That Matter

Beyond Buzzwords: Emerging Technologies That Matter Norm Rose President Beyond Buzzwords: Emerging Technologies That Matter Demystifying Emerging Technologies for the Global Travel Industry April 26, 2018 Overview otechnology Evolution and Hype oemerging

More information

ITRS Update (and the European situation) Mart Graef Delft University of Technology

ITRS Update (and the European situation) Mart Graef Delft University of Technology ITRS Update (and the European situation) Mart Graef Delft University of Technology Overview Roadmapping: Moore s Law & More than Moore Europe and the Roadmap Beyond CMOS: Nano-Tec Infrastructures: ENI2

More information

Visvesvaraya Technological University, Belagavi

Visvesvaraya Technological University, Belagavi Time Table for M.TECH. Examinations, June / July 2017 M. TECH. 2010 Scheme 2011 Scheme 2012 Scheme 2014 Scheme 2016 Scheme [CBCS] Semester I II III I II III I II III I II IV I II Time Date, Day 14/06/2017,

More information

Cybernetics, AI, Cognitive Science and Computational Neuroscience: Historical Aspects

Cybernetics, AI, Cognitive Science and Computational Neuroscience: Historical Aspects Cybernetics, AI, Cognitive Science and Computational Neuroscience: Historical Aspects Péter Érdi perdi@kzoo.edu Henry R. Luce Professor Center for Complex Systems Studies Kalamazoo College http://people.kzoo.edu/

More information

RF DEVICES: BREAKTHROUGHS THANKS TO NEW MATERIALS. Jean-René Lequepeys. Leti Devices Workshop December 3, 2017

RF DEVICES: BREAKTHROUGHS THANKS TO NEW MATERIALS. Jean-René Lequepeys. Leti Devices Workshop December 3, 2017 RF DEVICES: BREAKTHROUGHS THANKS TO NEW MATERIALS Jean-René Lequepeys CELLULAR RF MARKETS RF cellular markets are still progressing Smartphones remain the main driver Declining growth rate but more complex

More information

KÜNSTLICHE INTELLIGENZ JOBKILLER VON MORGEN?

KÜNSTLICHE INTELLIGENZ JOBKILLER VON MORGEN? KÜNSTLICHE INTELLIGENZ JOBKILLER VON MORGEN? Marc Stampfli https://www.linkedin.com/in/marcstampfli/ https://twitter.com/marc_stampfli E-Mail: mstampfli@nvidia.com INTELLIGENT ROBOTS AND SMART MACHINES

More information

Architecting Systems of the Future, page 1

Architecting Systems of the Future, page 1 Architecting Systems of the Future featuring Eric Werner interviewed by Suzanne Miller ---------------------------------------------------------------------------------------------Suzanne Miller: Welcome

More information

Advances and Perspectives in Health Information Standards

Advances and Perspectives in Health Information Standards Advances and Perspectives in Health Information Standards HL7 Brazil June 14, 2018 W. Ed Hammond. Ph.D., FACMI, FAIMBE, FIMIA, FHL7, FIAHSI Director, Duke Center for Health Informatics Director, Applied

More information

If Bridges Could Talk

If Bridges Could Talk If Bridges Could Talk Maria Feng, Reinwick Professor Director, Sensing, Monitoring and Robotics Technology (SMaRT) Lab, Associate Director, NSF IUCRC Center for Energy Harvesting Materials & Systems Columbia

More information

Silicon Photonics Transceivers for Hyper Scale Datacenters: Deployment and Roadmap

Silicon Photonics Transceivers for Hyper Scale Datacenters: Deployment and Roadmap Silicon Photonics Transceivers for Hyper Scale Datacenters: Deployment and Roadmap Peter De Dobbelaere Luxtera Inc. 09/19/2016 Luxtera Proprietary www.luxtera.com Luxtera Company Introduction $100B+ Shift

More information

SenseMaker IST Martin McGinnity University of Ulster Neuro-IT, Bonn, June 2004 SenseMaker IST Neuro-IT workshop June 2004 Page 1

SenseMaker IST Martin McGinnity University of Ulster Neuro-IT, Bonn, June 2004 SenseMaker IST Neuro-IT workshop June 2004 Page 1 SenseMaker IST2001-34712 Martin McGinnity University of Ulster Neuro-IT, Bonn, June 2004 Page 1 Project Objectives To design and implement an intelligent computational system, drawing inspiration from

More information

SpiNNaker. Human Brain Project. and the. Steve Furber. ICL Professor of Computer Engineering The University of Manchester

SpiNNaker. Human Brain Project. and the. Steve Furber. ICL Professor of Computer Engineering The University of Manchester SpiNNaker and the Human Brain Project Steve Furber ICL Professor of Computer Engineering The University of Manchester 1 200 years ago Ada Lovelace, b. 10 Dec. 1815 "I have my hopes, and very distinct ones

More information

Technology trends in the digitalization era. ANSYS Innovation Conference Bologna, Italy June 13, 2018 Michele Frascaroli Technical Director, CRIT Srl

Technology trends in the digitalization era. ANSYS Innovation Conference Bologna, Italy June 13, 2018 Michele Frascaroli Technical Director, CRIT Srl Technology trends in the digitalization era ANSYS Innovation Conference Bologna, Italy June 13, 2018 Michele Frascaroli Technical Director, CRIT Srl Summary About CRIT Top Trends for Emerging Technologies

More information

Perspectives on Neuromorphic Computing

Perspectives on Neuromorphic Computing Perspectives on Neuromorphic Computing Todd Hylton Brain Corporation hylton@braincorporation.com ORNL Neuromorphic Computing Workshop June 29, 2016 Outline Retrospective SyNAPSE Perspective Neuromorphic

More information

Analog Custom Layout Engineer

Analog Custom Layout Engineer Analog Custom Layout Engineer Huawei Canada s rapid growth has created an excellent opportunity to build and grow your career and make a big impact to everyone s life. The IC Lab is currently looking to

More information

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 2010 Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 2010 Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 2010 Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging Christophe Kopp, St ephane Bernab e, Badhise Ben Bakir,

More information

ES 492: SCIENCE IN THE MOVIES

ES 492: SCIENCE IN THE MOVIES UNIVERSITY OF SOUTH ALABAMA ES 492: SCIENCE IN THE MOVIES LECTURE 5: ROBOTICS AND AI PRESENTER: HANNAH BECTON TODAY'S AGENDA 1. Robotics and Real-Time Systems 2. Reacting to the environment around them

More information

Smart Integrated Systems (and more)

Smart Integrated Systems (and more) Smart Integrated Systems (and more) - Integrating the European Digital Industrial Strategy - Nikolaos Kyrloglou, Henri RAJBENBACH European Commission DG CONNECT 39 th OE-A Working Group Meeting 11-Oct-2016

More information

CSC384 Intro to Artificial Intelligence* *The following slides are based on Fahiem Bacchus course lecture notes.

CSC384 Intro to Artificial Intelligence* *The following slides are based on Fahiem Bacchus course lecture notes. CSC384 Intro to Artificial Intelligence* *The following slides are based on Fahiem Bacchus course lecture notes. Artificial Intelligence A branch of Computer Science. Examines how we can achieve intelligent

More information

Opportunities and challenges of silicon photonics based System-In-Package

Opportunities and challenges of silicon photonics based System-In-Package Opportunities and challenges of silicon photonics based System-In-Package ECTC 2014 Panel session : Emerging Technologies and Market Trends of Silicon Photonics Speaker : Stéphane Bernabé (Leti Photonics

More information

Artificial Intelligence and Robotics Getting More Human

Artificial Intelligence and Robotics Getting More Human Weekly Barometer 25 janvier 2012 Artificial Intelligence and Robotics Getting More Human July 2017 ATONRÂ PARTNERS SA 12, Rue Pierre Fatio 1204 GENEVA SWITZERLAND - Tel: + 41 22 310 15 01 http://www.atonra.ch

More information

Cognitronics: Resource-efficient Architectures for Cognitive Systems. Ulrich Rückert Cognitronics and Sensor Systems.

Cognitronics: Resource-efficient Architectures for Cognitive Systems. Ulrich Rückert Cognitronics and Sensor Systems. Cognitronics: Resource-efficient Architectures for Cognitive Systems Ulrich Rückert Cognitronics and Sensor Systems 14th IWANN, 2017 Cadiz, 14. June 2017 rueckert@cit-ec.uni-bielefeld.de www.ks.cit-ec.uni-bielefeld.de

More information

Framework Programme 7

Framework Programme 7 Framework Programme 7 1 Joining the EU programmes as a Belarusian 1. Introduction to the Framework Programme 7 2. Focus on evaluation issues + exercise 3. Strategies for Belarusian organisations + exercise

More information

Technology Trends with Digital Transformation

Technology Trends with Digital Transformation Technology Trends with Digital Transformation 26 April 2017 Dr. Seungyun Lee Digital transformation is the change associated with the application of digital technology in all aspects of human society.

More information

Future and Emerging Technologies. Ales Fiala, Head of Unit C2 European Commission - DG CONNECT Directorate C - Excellence in Science

Future and Emerging Technologies. Ales Fiala, Head of Unit C2 European Commission - DG CONNECT Directorate C - Excellence in Science Future and Emerging Technologies Ales Fiala, Head of Unit C2 European Commission - DG CONNECT Directorate C - Excellence in Science FET in Horizon 2020 Excellent Science pillar in H2020 European Research

More information

NEREID. H2020-ICT-CSA: Micro- and Nano-Electronics Technologies Grant Agreement n Enrico Sangiorgi,

NEREID. H2020-ICT-CSA: Micro- and Nano-Electronics Technologies Grant Agreement n Enrico Sangiorgi, NEREID H2020-ICT-CSA: Micro- and Nano-Electronics Technologies Grant Agreement n 685559 Enrico Sangiorgi, enrico.sangiorgi@unibo.it University of Bologna/IUNET, Scientific Coordinator of Nereid 11 th MOS

More information

2015 ITRS/RC Summer Meeting

2015 ITRS/RC Summer Meeting 2015 ITRS/RC Summer Meeting July 11 and 12, Stanford University, CISX 101 July 11 Time Duration Presentation Title Speaker Affiliation 7:30 am Breakfast 8:00 am 60 min Introduction Paolo Gargini ITRS 9:00am

More information

Factories of the Future 2020 Roadmap. PPP Info Days 9 July 2012 Rikardo Bueno Anirban Majumdar

Factories of the Future 2020 Roadmap. PPP Info Days 9 July 2012 Rikardo Bueno Anirban Majumdar Factories of the Future 2020 Roadmap PPP Info Days 9 July 2012 Rikardo Bueno Anirban Majumdar RD&I roadmap 2014-2020 roadmap will cover R&D and innovation activities guiding principles: industry competitiveness,

More information

Packaging Roadmap: The impact of miniaturization. Bob Pfahl, inemi Celestica-iNEMI Technology Forum May 15, 2007

Packaging Roadmap: The impact of miniaturization. Bob Pfahl, inemi Celestica-iNEMI Technology Forum May 15, 2007 Packaging Roadmap: The impact of miniaturization Bob Pfahl, inemi Celestica-iNEMI Technology Forum May 15, 2007 The Challenges for the Next Decade Addressing the consumer experience using the converged

More information

Goals of this Course. CSE 473 Artificial Intelligence. AI as Science. AI as Engineering. Dieter Fox Colin Zheng

Goals of this Course. CSE 473 Artificial Intelligence. AI as Science. AI as Engineering. Dieter Fox Colin Zheng CSE 473 Artificial Intelligence Dieter Fox Colin Zheng www.cs.washington.edu/education/courses/cse473/08au Goals of this Course To introduce you to a set of key: Paradigms & Techniques Teach you to identify

More information

Lecture 1 What is AI?

Lecture 1 What is AI? Lecture 1 What is AI? CSE 473 Artificial Intelligence Oren Etzioni 1 AI as Science What are the most fundamental scientific questions? 2 Goals of this Course To teach you the main ideas of AI. Give you

More information

COMPACT FUZZY Q LEARNING FOR AUTONOMOUS MOBILE ROBOT NAVIGATION

COMPACT FUZZY Q LEARNING FOR AUTONOMOUS MOBILE ROBOT NAVIGATION COMPACT FUZZY Q LEARNING FOR AUTONOMOUS MOBILE ROBOT NAVIGATION Handy Wicaksono, Khairul Anam 2, Prihastono 3, Indra Adjie Sulistijono 4, Son Kuswadi 5 Department of Electrical Engineering, Petra Christian

More information

The Nature of Informatics

The Nature of Informatics The Nature of Informatics Alan Bundy University of Edinburgh 19-Sep-11 1 What is Informatics? The study of the structure, behaviour, and interactions of both natural and artificial computational systems.

More information

Overview. 1 Trends in Microprocessor Architecture. Computer architecture. Computer architecture

Overview. 1 Trends in Microprocessor Architecture. Computer architecture. Computer architecture Overview 1 Trends in Microprocessor Architecture R05 Robert Mullins Computer architecture Scaling performance and CMOS Where have performance gains come from? Modern superscalar processors The limits of

More information

Recent Developments in Multifunctional Integration. Stephan Guttowski, Head of Technology Park»Heterointegration«, Fraunhofer FMD

Recent Developments in Multifunctional Integration. Stephan Guttowski, Head of Technology Park»Heterointegration«, Fraunhofer FMD Recent Developments in Multifunctional Integration Stephan Guttowski, Head of Technology Park»Heterointegration«, Fraunhofer FMD Founding Participants 2 One-Stop-Shop for developments from wafer technologies

More information

Digital Transformation. A Game Changer. How Does the Digital Transformation Affect Informatics as a Scientific Discipline?

Digital Transformation. A Game Changer. How Does the Digital Transformation Affect Informatics as a Scientific Discipline? Digital Transformation A Game Changer How Does the Digital Transformation Affect Informatics as a Scientific Discipline? Manfred Broy Technische Universität München Institut for Informatics ... the change

More information

MEDIA RELEASE FOR IMMEDIATE RELEASE 26 JULY 2016

MEDIA RELEASE FOR IMMEDIATE RELEASE 26 JULY 2016 MEDIA RELEASE FOR IMMEDIATE RELEASE 26 JULY 2016 A*STAR S IME KICKS OFF CONSORTIA TO DEVELOP ADVANCED PACKAGING SOLUTIONS FOR NEXT-GENERATION INTERNET OF THINGS APPLICATIONS AND HIGH-PERFORMANCE WIRELESS

More information

Artificial intelligence, made simple. Written by: Dale Benton Produced by: Danielle Harris

Artificial intelligence, made simple. Written by: Dale Benton Produced by: Danielle Harris Artificial intelligence, made simple Written by: Dale Benton Produced by: Danielle Harris THE ARTIFICIAL INTELLIGENCE MARKET IS SET TO EXPLODE AND NVIDIA, ALONG WITH THE TECHNOLOGY ECOSYSTEM INCLUDING

More information

Digital Disruption Thrive or Survive. Devendra Dhawale, August 10, 2018

Digital Disruption Thrive or Survive. Devendra Dhawale, August 10, 2018 Digital Disruption Thrive or Survive Devendra Dhawale, August 10, 2018 To disrupt is to exist 72% of CEOs say that rather than waiting to be disrupted by competitors, their organization is actively disrupting

More information

Architecture ISCA 16 Luis Ceze, Tom Wenisch

Architecture ISCA 16 Luis Ceze, Tom Wenisch Architecture 2030 @ ISCA 16 Luis Ceze, Tom Wenisch Mark Hill (CCC liaison, mentor) LIVE! Neha Agarwal, Amrita Mazumdar, Aasheesh Kolli (Student volunteers) Context Many fantastic community formation/visioning

More information

EU's contribution to research and innovation in Electronics

EU's contribution to research and innovation in Electronics EU's contribution to research and innovation in Electronics Henri.RAJBENBACH@ec.europa.eu Nikolaos.KYRLOGLOU@ec.europa.eu European Commission DG CONNECT (not legally binding presentation) SEMICON Europa-Flex

More information

Embedding Artificial Intelligence into Our Lives

Embedding Artificial Intelligence into Our Lives Embedding Artificial Intelligence into Our Lives Michael Thompson, Synopsys D&R IP-SOC DAYS Santa Clara April 2018 1 Agenda Introduction What AI is and is Not Where AI is being used Rapid Advance of AI

More information

Technology & Manufacturing

Technology & Manufacturing Technology & Manufacturing Jean-Marc Chery Chief Operating Officer Front-End Manufacturing Unique capability 2 Technology portfolio aligned with application focus areas Flexible IDM model with foundry

More information

Towards affordance based human-system interaction based on cyber-physical systems

Towards affordance based human-system interaction based on cyber-physical systems Towards affordance based human-system interaction based on cyber-physical systems Zoltán Rusák 1, Imre Horváth 1, Yuemin Hou 2, Ji Lihong 2 1 Faculty of Industrial Design Engineering, Delft University

More information

Course Outline. Textbook: G. Michael Schneider and Judith L. Gersting, "Invitation to Computer Science C++ Version," 3rd Edition, Thomson, 2004.

Course Outline. Textbook: G. Michael Schneider and Judith L. Gersting, Invitation to Computer Science C++ Version, 3rd Edition, Thomson, 2004. 2005/Sep/12 1 Course Outline Textbook: G. Michael Schneider and Judith L. Gersting, "Invitation to Computer Science C++ Version," 3rd Edition, Thomson, 2004. Outline 1. The Algorithm Foundations of Computer

More information

William Milam Ford Motor Co

William Milam Ford Motor Co Sharing technology for a stronger America Verification Challenges in Automotive Embedded Systems William Milam Ford Motor Co Chair USCAR CPS Task Force 10/20/2011 What is USCAR? The United States Council

More information

COMPUTATONAL INTELLIGENCE

COMPUTATONAL INTELLIGENCE COMPUTATONAL INTELLIGENCE October 2011 November 2011 Siegfried Nijssen partially based on slides by Uzay Kaymak Leiden Institute of Advanced Computer Science e-mail: snijssen@liacs.nl Katholieke Universiteit

More information

New Wave SiP solution for Power

New Wave SiP solution for Power New Wave SiP solution for Power Vincent Lin Corporate R&D ASE Group APEC March 7 th, 2018 in San Antonio, Texas. 0 Outline Challenges Facing Human Society Energy, Environment and Traffic Autonomous Driving

More information

Adopting Standards For a Changing Health Environment

Adopting Standards For a Changing Health Environment Adopting Standards For a Changing Health Environment November 16, 2018 W. Ed Hammond. Ph.D., FACMI, FAIMBE, FIMIA, FHL7, FIAHSI Director, Duke Center for Health Informatics Director, Applied Informatics

More information

Introduction. Reading: Chapter 1. Courtesy of Dr. Dansereau, Dr. Brown, Dr. Vranesic, Dr. Harris, and Dr. Choi.

Introduction. Reading: Chapter 1. Courtesy of Dr. Dansereau, Dr. Brown, Dr. Vranesic, Dr. Harris, and Dr. Choi. Introduction Reading: Chapter 1 Courtesy of Dr. Dansereau, Dr. Brown, Dr. Vranesic, Dr. Harris, and Dr. Choi http://csce.uark.edu +1 (479) 575-6043 yrpeng@uark.edu Why study logic design? Obvious reasons

More information

Introduction to IEEE CAS Publications

Introduction to IEEE CAS Publications Introduction to IEEE CAS Publications Gianluca Setti 12 1 Dep. of Engineering (ENDIF) University of Ferrara 2 Advanced Research Center on Electronic Systems for Information Engineering and Telecommunications

More information

The Evolution of Artificial Intelligence in Workplaces

The Evolution of Artificial Intelligence in Workplaces The Evolution of Artificial Intelligence in Workplaces Cognitive Hubs for Future Workplaces In the last decade, workplaces have started to evolve towards digitalization. In the future, people will work

More information

Disrupt or be Disrupted: Research Findings from the CDO Project & Policy Implications

Disrupt or be Disrupted: Research Findings from the CDO Project & Policy Implications Disrupt or be Disrupted: Research Findings from the CDO Project & Policy Implications David A. Wolfe, Ph.D. Co-Director, Innovation Policy Lab Munk School of Global Affairs University of Toronto Presentation

More information

Deep Learning for Autonomous Driving

Deep Learning for Autonomous Driving Deep Learning for Autonomous Driving Shai Shalev-Shwartz Mobileye IMVC dimension, March, 2016 S. Shalev-Shwartz is also affiliated with The Hebrew University Shai Shalev-Shwartz (MobilEye) DL for Autonomous

More information

Computational Intelligence Introduction

Computational Intelligence Introduction Computational Intelligence Introduction Farzaneh Abdollahi Department of Electrical Engineering Amirkabir University of Technology Fall 2011 Farzaneh Abdollahi Neural Networks 1/21 Fuzzy Systems What are

More information

Silicon Photonics Technology Platform To Advance The Development Of Optical Interconnects

Silicon Photonics Technology Platform To Advance The Development Of Optical Interconnects Silicon Photonics Technology Platform To Advance The Development Of Optical Interconnects By Mieke Van Bavel, science editor, imec, Belgium; Joris Van Campenhout, imec, Belgium; Wim Bogaerts, imec s associated

More information

Overview and Roadmap for European projects in Optical Interconnects

Overview and Roadmap for European projects in Optical Interconnects Overview and Roadmap for European projects in Optical Interconnects Dptm. of Informatics, Aristotle Univ. of Thessaloniki, Greece http://phos-net.csd.auth.gr/ Why is an overview needed? To identify possible

More information

Practical Information

Practical Information EE241 - Spring 2010 Advanced Digital Integrated Circuits TuTh 3:30-5pm 293 Cory Practical Information Instructor: Borivoje Nikolić 550B Cory Hall, 3-9297, bora@eecs Office hours: M 10:30am-12pm Reader:

More information

Mixed-Signal Design Innovations in FDSOI Technology. Boris Murmann April 13, 2016

Mixed-Signal Design Innovations in FDSOI Technology. Boris Murmann April 13, 2016 Mixed-Signal Design Innovations in FDSOI Technology Boris Murmann April 13, 2016 Outline Application trends and needs Review of FDSOI advantages Examples High-speed data conversion RF transceivers Medical

More information

DSP Valley Designing Smart Products

DSP Valley Designing Smart Products DSP Valley Designing Smart Products Engineering Mobility Days Coimbra 21-5-2014 Slide 1 Outline 1. DSP Valley? 2. Jobopportunities within the network General information Jobs and company profiles 3. Application

More information

CS4617 Computer Architecture

CS4617 Computer Architecture 1/26 CS4617 Computer Architecture Lecture 2 Dr J Vaughan September 10, 2014 2/26 Amdahl s Law Speedup = Execution time for entire task without using enhancement Execution time for entire task using enhancement

More information

Radio Deep Learning Efforts Showcase Presentation

Radio Deep Learning Efforts Showcase Presentation Radio Deep Learning Efforts Showcase Presentation November 2016 hume@vt.edu www.hume.vt.edu Tim O Shea Senior Research Associate Program Overview Program Objective: Rethink fundamental approaches to how

More information

PROGRAMMABLE PHOTONIC ICS:

PROGRAMMABLE PHOTONIC ICS: PROGRAMMABLE PHOTONIC ICS: MAKING OPTICAL DEVICES MORE VERSATILE Wim Bogaerts PIC International 9-10 April 2018 1 (SILICON) PICS TODAY Rapidly growing integration O(1000) components on a chip photonics

More information

Neuromorphic VLSI Event-Based devices and systems

Neuromorphic VLSI Event-Based devices and systems Neuromorphic VLSI Event-Based devices and systems Giacomo Indiveri Institute of Neuroinformatics University of Zurich and ETH Zurich LTU, Lulea May 28, 2012 G.Indiveri (http://ncs.ethz.ch/) Neuromorphic

More information

Data-Starved Artificial Intelligence

Data-Starved Artificial Intelligence Data-Starved Artificial Intelligence Data-Starved Artificial Intelligence This material is based upon work supported by the Assistant Secretary of Defense for Research and Engineering under Air Force Contract

More information

Creating Intelligence at the Edge

Creating Intelligence at the Edge Creating Intelligence at the Edge Vladimir Stojanović E3S Retreat September 8, 2017 The growing importance of machine learning Page 2 Applications exploding in the cloud Huge interest to move to the edge

More information

Si Photonics Technology Platform for High Speed Optical Interconnect. Peter De Dobbelaere 9/17/2012

Si Photonics Technology Platform for High Speed Optical Interconnect. Peter De Dobbelaere 9/17/2012 Si Photonics Technology Platform for High Speed Optical Interconnect Peter De Dobbelaere 9/17/2012 ECOC 2012 - Luxtera Proprietary www.luxtera.com Overview Luxtera: Introduction Silicon Photonics: Introduction

More information

Datorstödd Elektronikkonstruktion

Datorstödd Elektronikkonstruktion Datorstödd Elektronikkonstruktion [Computer Aided Design of Electronics] Zebo Peng, Petru Eles and Gert Jervan Embedded Systems Laboratory IDA, Linköping University http://www.ida.liu.se/~tdts80/~tdts80

More information

The Transformative Power of Technology

The Transformative Power of Technology Dr. Bernard S. Meyerson, IBM Fellow, Vice President of Innovation, CHQ The Transformative Power of Technology The Roundtable on Education and Human Capital Requirements, Feb 2012 Dr. Bernard S. Meyerson,

More information

Welcome to Informatics

Welcome to Informatics Welcome to Informatics People On the premises: ~ 100 Academic staff ~ 150 Postdoc researchers ~ 80 Support staff ~ 250 PhD students ~ 200 Masters students ~ 400 Undergraduates (200 1 st year) Graduating

More information

Markets for On-Chip and Chip-to-Chip Optical Interconnects 2015 to 2024 January 2015

Markets for On-Chip and Chip-to-Chip Optical Interconnects 2015 to 2024 January 2015 Markets for On-Chip and Chip-to-Chip Optical Interconnects 2015 to 2024 January 2015 Chapter One: Introduction Page 1 1.1 Background to this Report CIR s last report on the chip-level optical interconnect

More information