DIMWLS1 DIMWLS1 IGBT Chopper Module Lower rm Control Replaces December 3 version, issue FDS56971.1 FDS56972. February 4 FETURES 1µs Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY PRMETERS CES 1 CE(sat) * (typ) 2.2 (max) (PK) (max) 4 *(Measured at the power busbars and not the auxiliary terminals) PPLICTIONS Choppers Motor Controllers Induction Heating 7(E 2 ) 6(G 2 ) Resonant Converters Power Supplies 1(,C2) 2(E2) 3(K) The Powerline range of high power modules includes half bridge, chopper, dual, single and bidirectional switch configuratio covering voltages from 6 to 33 and currents up to 36. The DIMWLS1 is a 1, n channel enhancement mode, iulated gate bipolar traistor (IGBT) chopper module configured with the lower arm of the bridge controlled. The IGBT has a wide reverse bias safe operating area (RBSO) plus full 1µs short circuit withstand. Fig. 1 Chopper circuit diagram The module incorporates an electrically isolated base plate and low inductance cotruction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. ORDERING INFORMTION Order s: DIMWLS1 Note: When ordering, please use the whole part number. Outline type code: W (See package details for further information) Fig. 2 Electrical connectio (not to scale) Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures. 1/8
DIMWLS1 BSOLUTE MXIMUM RTINGS PER RM Stresses above those listed under 'bsolute Maximum Ratings' may cause permanent damage to the device. In extreme conditio, as with all semiconductors, this may include potentially hazardous rupture of the package. ppropriate safety precautio should always be followed. Exposure to bsolute Maximum Ratings may affect device reliability. = 25 C unless stated otherwise Test Conditio CES Collectoremitter voltage GE = 1 GES Gateemitter voltage ±2 Continuous collector current = 8 C (PK) Peak collector current 1ms, = 115 C 4 P max traistor power dissipation = 25 C, T j = 1 C 139 W I 2 t Diode I 2 t value R =, t p = 1ms, T vj = 125 C 6.25 k 2 s isol Isolation voltage per module Commoned terminals to base plate. C RMS, 1 min, Hz 2 Q PD Partial discharge per module IEC1287. 1 = 13, 2 = 1, Hz RMS 1 PC THERML ND MECHNICL RTINGS Internal iulation: l 2 O 3 Clearance: 13mm Baseplate material: Cu CTI (Critical Tracking Index): 175 Creepage distance: 24mm Test Conditio Min. Typ. R th(jc) Thermal resistance traistor (per arm) Continuous dissipation 9 C/kW junction to case R th(jc) Thermal resistance diode (per arm) Continuous dissipation 194 C/kW (ntiparallel and freewheel diode) junction to case R th(ch) Thermal resistance case to heatsink Mounting torque 5Nm 15 C/kW (per module) (with mounting grease) T j Junction temperature Traistor 1 C Diode 125 C T stg Storage temperature range 4 125 C Screw torque Mounting M6 3 5 Nm Electrical connectio M6 2.5 5 Nm 2/8 Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures.
DIMWLS1 ELECTRICL CHRCTERISTICS = 25 C unless stated otherwise. Test Conditio Min. Typ. ES Collector cutoff current GE =, CE = CES.25 m (IGBT and Diode arm) GE =, CE = CES, = 125 C 6 m I GES Gate leakage current GE = ±2, CE = 1 µ GE(TH) Gate threshold voltage = 1m, GE = CE 4.5 5.5 6.5 CE(sat) Collectoremitter saturation voltage GE = 15, = 2.2 2.7 GE = 15, =,, = 125 C 2.6 3.1 Diode forward current DC M Diode maximum forward current t p = 1ms 4 F Diode forward voltage = 2.1 2.4 (IGBT and Diode arm) =, = 125 C 2.1 2.4 C ies Input capacitance CE = 25, GE =, f = 1MHz 33 nf L M Module inductance per arm 2 nh R INT Internal traistor resistance.23 mω SC Data Short circuit. I SC T j = 125 C, CC = 9, I 1 1375 t p 1µs, CE(max) = CES L*. di/dt I 2 1125 IEC 67479 Note: Measured at the power busbars and not the auxiliary terminals) L* is the circuit inductance + L M Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures. 3/8
DIMWLS1 ELECTRICL CHRCTERISTICS IGBT RM = 25 C unless stated otherwise Test Conditio Min. Typ. t d(off) Turnoff delay time = 6 t f Fall time GE = ±15 E OFF Turnoff energy loss CE = 6 2 t d(on) Turnon delay time R G(ON) = R G(OFF) = 4.7Ω 24 t r Rise time L ~ 7nH 95 E ON Turnon energy loss 25 Q g Gate charge 2 µc Q rr Diode reverse recovery charge =, R = 6, 3 µc I rr Diode reverse current d /dt = 23/µs 1 E REC Diode reverse recovery energy 13 = 125 C unless stated otherwise Test Conditio Min. Typ. t d(off) Turnoff delay time = 8 t f Fall time GE = ±15 7 E OFF Turnoff energy loss CE = 6 27 t d(on) Turnon delay time R G(ON) = R G(OFF) = 4.7Ω 385 t r Rise time L ~ 7nH 11 E ON Turnon energy loss 4 Q rr Diode reverse recovery charge =, R = 6, µc I rr Diode reverse current d /dt = /µs 16 E REC Diode reverse recovery energy 2 4/8 Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures.
DIMWLS1 TYPICL CHRCTERISTICS 4 3 Common emitter = 25 C ce is measured at power busbars and not the auxiliary terminals 4 3 Common emitter = 125 C ce is measured at power busbars and not the auxiliary terminals 3 3 Collector current, () 2 1 Collector current, () 2 1 1 1 GE = 1 GE = 12 GE = 15 GE = 2.5 1. 1.5 2. 2.5 3. 3.5 4. Collectoremitter voltage, ce () GE = 1 GE = 12 GE = 15 GE = 2.5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. Collectoremitter voltage, ce () Fig. 3 Typical output characteristics Fig. 4 Typical output characteristics Switching energy, E sw () 45 4 35 3 25 2 15 1 T c = 125 C, cc = 6, R g = 4.7 Ohms Switching energy, E sw () 55 45 4 35 3 25 2 15 1 T c = 125 C, cc = 6, = 5 E on E off E rec 1 1 Collector current, () Fig. 5 Typical switching energy vs collector current 5 E on E off E rec 4 6 8 1 12 Gate resistance, R g (Ohms) Fig. 6 Typical switching energy vs gate resistance Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures. 5/8
DIMWLS1 4 3 3 T j = 25 C T j = 125 C F is measured at power busbars and not the auxiliary terminals 4 4 3 Module Chip Forward current, () 2 1 Collector current, () 3 2 1 1 1.5 1. 1.5 2. 2.5 3. 3.5 Forward voltage, F () = 125 C ge = 15 R g = 4.7 Ohms 4 6 8 1 1 14 Collector emitter voltage, ce () Fig. 7 Diode typical forward characteristics Fig. 8 Reverse bias safe operating area 3 =125 C 1 Reverse recovery current, I rr () 2 1 1 4 6 8 1 1 14 Reverse voltage, R () Fig. 9 Diode reverse bias safe operating area IGBT and diode arm Traient thermal impedance, Z th (jc) ( C/kW ) 1 1 Fig. 1 Traient thermal impedance Diode Traistor 1 2 3 4 IGBT R i ( C/KW) 2.1 11.62 43.85 29.53 τ i (ms).11 3.14 45.6 143.2 Diode R i ( C/KW) 4.49 25.28 74.24 9.3 τ i (ms).1 3.21 38.58 113.97 1.1.1.1 1 1 Pulse width, t p (s) 6/8 Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures.
DIMWLS1 PCKGE DETILS For further package information, please visit our website or contact Customer Services. ll dimeio in mm, unless stated otherwise. DO NOT SCLE. 7(E 2 ) 6(G 2 ) 1(,C2) 2(E2) 3(K) Nominal weight: 42g Module outline type code: W Fig. 11 Package details Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures. 7/8
POWER SSEMBLY CPBILITY The Power ssembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an exteive range of air and liquid cooled assemblies covering the full range of circuit desig in general use today. The ssembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CD methods our team of design and applicatio engineers aim to provide the Power ssembly Complete Solution (PCs). HETSINKS The Power ssembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http:// email: power_solutio@dynexsemi.com HEDQURTERS OPERTIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolhire. LN6 3LF. United Kingdom. Tel: +44()152 Fax: +44()15225 CUSTOMER SERICE Tel: +44 ()1522 2753 / 291. Fax: +44 ()1522 2 SLES OFFICES Benelux, Italy & Switzerland: Tel: +33 ()1 64 66 42 17. Fax: +33 ()1 64 66 42 19. France: Tel: +33 ()2 47 55 75 53. Fax: +33 ()2 47 55 75 59. Germany, Northern Europe, Spain & Rest Of World: Tel: +44 ()1522 2753 / 291. Fax: +44 ()1522 2 North merica: Tel: (44) 25926. Fax: (44) 259259. Tel: (949) 73335. Fax: (949) 7332986. These offices are supported by Representatives and Distributors in many countries worldwide. Dynex Semiconductor 3 TECHNICL DOCUMENTTION NOT FOR RESLE. PRODUCED IN UNITED KINGDOM This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not cotitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's respoibility to fully determine the performance and suitability of any equipment using such information and to eure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. ll products and materials are sold and services provided subject to the Company's conditio of sale, which are available on request. ll brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.