- 65 to TL Maximum lead temperature for soldering during 10 s. 260 C

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1 SMAJ5.0A-TR,CA-TR SMAJ188A-TR,CA-TR TRANSIL TM FEATURES PEAK PULSE POWER : 400 W (10/0µs) STAND OFF VOLTAGE RANGE : From 5V to 188V. UNI AND BIDIRECTIONAL TYPES LOW CLAMPING FACTOR FAST RESPONSE TIME JEDEC REGISTERED PACKAGE OUTLINE DESCRIPTION The SMAJ series are TRANSIL TM diodesdesigned specifically for protecting sensitive equipment against transient overvoltages. The SMA package allows save spacing on high density printed circuit boards. Transil diodes provide high overvoltage protection by clamping action. Their instantaneous response to transient overvoltages makes them particularly suited to protect voltage sensitive devices such as MOS Technology and low voltage supplied IC s. SMA (JEDEC D0214 AC) ABSOLUTE MAXIMUM RATINGS (Tamb = 25 C) Symbol Parameter Value Unit P PP Peak pulse power dissipation (see note 1) Tj initial = T amb 400 W P Power dissipation on infinite heatsink T amb = 50 C 3.3 W I FSM Tstg Tj Non repetitive surge peak forward current for unidirectional types Storage temperature range Maximum junction temperature tp = 10ms Tj initial = Tamb 40 A - 65 to TL Maximum lead temperature for soldering during 10 s. 260 C Note 1 : For a surge greater than the maximum values, the diode will fail in short-circuit. C C THERMAL RESISTANCES Symbol Parameter Value Unit Rth (j-l) Junction to leads 30 C/W Rth (j-a) Junction to ambient on printed circuit on recommended pad layout 120 C/W September 1998 Ed: 5A 1/5

2 ELECTRICAL CHARACTERISTICS (Tamb =25 C) Symbol Parameter I I F V RM Stand-off voltage VBR VCL I RM Breakdown voltage Clamping voltage Leakage VRM V CL V BR V RM I RM V F V IPP Peak pulse current αt Voltage temperature coefficient VF Forward voltage drop I PP I RM V R V PP V PP αt C Types max min max max max typ note2 10/0µs 8/20µs note3 note4 Unidirectional Mark. Bidirectional Mark. µa V V ma V A V A 10-4 / C pf SMAJ5.0A-TR AE SMAJ5.0CA-TR AA SMAJ6.0A-TR DUB SMAJ6.0CA-TR DBB SMAJ6.5A-TR DUC SMAJ6.5CA-TR DBC SMAJ8.5A-TR DUH SMAJ8.5CA-TR DBH SMAJ10A-TR AX SMAJ10CA-TR AC SMAJ12A-TR DUK SMAJ12CA-TR DBK SMAJ13A-TR BG SMAJ13CA-TR BH SMAJ15A-TR BM SMAJ15CA-TR AJ SMAJ18A-TR DUQ SMAJ18CA-TR DBQ SMAJ20A-TR DUR SMAJ20CA-TR DBR SMAJ22A-TR DUS SMAJ22CA-TR DBS SMAJ24A-TR DUT SMAJ24CA-TR DBT SMAJ26A-TR DUU SMAJ26CA-TR DBU SMAJ28A-TR CG SMAJ28CA-TR CH SMAJ30A-TR CK SMAJ30CA-TR CL SMAJ33A-TR CM SMAJ33CA-TR CN SMAJ40A-TR DUZ SMAJ40CA-TR DBZ SMAJ43A-TR EUA SMAJ43CA-TR EBA SMAJ48A-TR CX SMAJ48CA-TR CY SMAJ58A-TR EUF SMAJ58CA-TR EBF SMAJ70A-TR EUI SMAJ70CA-TR EBI SMAJ85A-TR EUL SMAJ85CA-TR EBL SMAJA-TR EUN SMAJCA-TR EBN SMAJ130A-TR EUQ SMAJ130CA-TR EBQ SMAJ154A-TR EUT SMAJ154CA-TR EBT SMAJ170A-TR SR SMAJ170CA-TR SS SMAJ188A-TR EUV SMAJ188CA-TR EBV %I PP 10 s PULSE WAVEFORM 10/0 s Note 2 :Pulse test : tp <50ms. Note 3 : VBR = αt * (Tamb - 25) * VBR(25 C). Note 4 :VR = 0 V, F = 1 MHz. For bidirectional types, capacitance value is divided by 2. 0 t 0 s 2/5

3 Fig 1: Peak power dissipation versus initial junction temperature. Ppp[Tj initial]/ppp[tj initial=25 C] Tj initial( C) Fig 2: Peak pulse power versus exponential pulse duration (Tj initial=25 C) Ppp(W) 0 tp(ms) Fig 3: Clamping voltage versus peak pulse current (Tj initial=25 C) Exponentialwaveform tp=20µs & tp=1ms Ipp(A).0 tp=20µs SMAJ5.0A,CA SMAJ13A,CA SMAJ26A,CA 10.0 tp=1ms SMAJ58A,CA SMAJ188A,CA 1.0 V CL(V) Fig 4-1: Capacitance versus reverse applied voltage (typical values) (SMAJxxA). Fig 4-2: Capacitanceversus reverse applied voltage (typical values) (SMAJxxCA) C(pF) 0 SMAJ5.0A F=1MHz C(pF) SMAJ5.0CA SMAJ13CA F=1MHz SMAJ13A SMAJ26A SMAJ26CA SMAJ58CA SMAJ58A SMAJ188A 10 SMAJ188CA V R(V) V R(V) /5

4 Fig 5: Peak forward voltage drop versus peak forward current (typical values) I FM(A) Fig 6: Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-a)/Rth(j-a) 1.00 Tj=125 C Tj=25 C V FM(V) tp(s) E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Fig 7: Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4 e(cu)=35µm). Rth(j-a) ( C/W) S(Cu)(cm ) Fig 8: Relative variation of leakage current versus junction temperature. 2E+3 1E+3 1E+2 1E+1 1E+0 I R [Tj] / I R [Tj=25 C] VBR 8.5V V BR < 8.5V Tj( C) 1E /5

5 ORDER CODE SMAJxxxA-TR, CA-TR SM A J 85 C A - TR SURFACE MOUNT TAPE & REEL 400 WATTS STAND OFF VOLTAGE BIDIRECTIONAL No suffix : Unidirectional MARKING : Logo, Date Code, Type Code, Cathode Band (for unidirectional types only). PACKAGE MECHANICAL DATA SMA (Plastic) E1 REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A D A b E c C L A1 A2 b E E D L FOOTPRINT DIMENSIONS (Millimeter) SMA Plastic Weight = g Packaging : standard packaging is in tape and reel Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patentor patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 1998 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 5/5

t p = 10 ms T j initial = T amb -65 to T L Maximum lead temperature for soldering during 10 s. 260 C

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