STPS2H100. Power Schottky rectifier. Features. Description

Transcription

1 Power Schottky rectifier Features Datasheet - production data A K SMA STPS2H100A Table 1. Device summary Symbol A K SMB STPS2H100U K Value A SMAflat STPS2H100AF A K SMBflat STPS2H100UF Negligible switching losses High junction temperature capability Low leakage current Good trade-off between leakage current and forward voltage drop Avalanche capability specified Description Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adapters and on board DC/DC converters. Available in SMA, low-profile SMA, SMB, lowprofile SMB. I F(AV) 2 A V RRM 100 V T j (max) 175 C V F (max) 5 V June 2013 DocID6115 Rev 8 1/12 This is information on a product in full production.

2 Characteristics STPS2H100 1 Characteristics Table 2. Absolute ratings (limiting values -T amb = 25 C unless otherwise stated) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 100 V SMA / SMB T L = 130 C = 0.5 I F(AV) Average forward current SMAflat T L = 145 C = A SMBflat T L = 150 C = 0.5 I FSM Surge non repetitive forward current t p =10 ms sinusoidal 75 A P ARM Repetitive peak avalanche power t p = 1 µs T j = 25 C 2400 W T stg Storage temperature range -65 to C T j Maximum operating junction temperature (1) 175 C 1. dptot 1 < condition to avoid thermal runaway for a diode on its own heatsink dtj Rth(j-a) Table 3. Thermal resistance Symbol Parameter Value Unit SMA 30 R th(j-l) Junction to lead SMAflat 20 SMB 25 C/W SMBflat 15 Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I R (1) V F (2) Reverse leakage current Forward voltage drop T j = 25 C 1 µa V R = V RRM T j = 125 C 1 ma T j = 25 C 0.79 I F = 2 A T j = 125 C 5 T j = 25 C 8 I F = 4 A T j = 125 C V 1. Pulse test: t p = 5 ms, < 2% 2. Pulse test: t p = 380 µs, < 2% To evaluate the conduction losses use the following equation: P = 0.56 x I F(AV) + 45 I 2 F (RMS) 2/12 DocID6115 Rev 8

3 Characteristics Figure 1. Average forward power dissipation versus average forward current P F(AV) (W) δ = 5 δ = 0.1 I F(AV) (A) δ = δ = 0.5 δ=tp/t δ = T tp Figure 2. Average forward current versus ambient temperature ( = 0.5) (SMA / SMB) I F(AV) (A) δ=tp/t SMA R th(j-a) =100 C/W S (CU) =1.5cm2 T tp R th(j-a) =Rth(j-I) SMB R th(j-a) =80 C/W S (CU) =1.5cm2 T amb( C) SMA SMB Figure 3. Average forward current versus ambient temperature ( = 0.5) (SMBflat) I F(AV) (A) T R th(j-a) =Rth(j-l) δ=tp/t tp T amb( C) SMBflat R th(j-a) =40 C/W 2. S CU=2.5 cm Figure 5. Normalized avalanche power derating versus pulse duration Figure 4. Average forward current versus ambient temperature ( = 0.5) (SMAflat) I F(AV) (A) T R th(j-a) =R th(j-l) δ=tp/t tp T amb( C) SMAflat Figure 6. Normalized avalanche power derating versus junction temperature 1 P ARM(tp) P ARM(1 µs) 1.2 P ARM(Tj) P ARM(25 C) t (µs) p T ( C) j DocID6115 Rev 8 3/12 12

4 Characteristics STPS2H100 Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) Z th(j-a) /Rth(j-a) SMA Single pulse t (s) p 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 8. Relative variation of thermal impedance junction to lead versus pulse duration (SMAflat) Z th(j-l) /Rth(j-l) SMAflat Single pulse t (s) p 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Z th(j-a) /Rth(j-a) SMB Single pulse t (s) p 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 10. Relative variation of thermal impedance junction to lead versus pulse duration (SMBflat) Z th(j-l) /Rth(j-l) SMBflat Single pulse t (s) p 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 11. Reverse leakage current versus reverse voltage applied (typical values) 1.E+04 I (µa) R Figure 12. Junction capacitance versus reverse voltage applied (typical values) 100 C(pF) 1.E+03 1.E+02 1.E+01 T j =150 C T j =125 C T j =100 C T j =75 C F=1MHz V OSC=30mVRMS T j=25 C 1.E+00 T j =50 C 1.E-01 1.E-02 T j =25 C V (V) R V (V) R /12 DocID6115 Rev 8

5 Characteristics Figure 13. Forward voltage drop versus forward current (low level) I FM(A) 2.0 Figure 14. Forward voltage drop versus forward current (high level) I FM(A) T j =125 C (Maximum values) T j =125 C (Maximum values) 1.2 T j=125 C (Typical values) 10 T j=125 C (Typical values) T j=25 C (Maximum values) V FM(V) T j=25 C (Maximum values) V FM(V) Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA) R th(j-a) ( C/W) Epoxy printed circuit board FR4, Copper thickness = 35 µm S CU(cm²) Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (SMB) R th(j-a) ( C/W) Epoxy printed circuit board FR4, Copper thickness = 35 µm S CU(cm²) SMA SMB Figure 16. Thermal resistance junction to ambient versus copper surface under each lead (SMAflat) R th(j-a) ( C/W) Epoxy printed circuit board FR4, Copper thickness = 35 µm SMAflat S CU(cm²) Figure 18. Thermal resistance junction to ambient versus copper surface under each lead (SMBflat) R th(j-a) ( C/W) Epoxy printed circuit board FR4, Copper thickness = 35 µm SMBflat S CU(cm²) DocID6115 Rev 8 5/12 12

6 Package information STPS2H100 2 Package information Epoxy meets UL94, V0 Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. Figure 19. SMA dimension definitions E1 D E A1 C L A2 b Ref. Table 5. SMA dimension values Millimeters Dimensions Inches Min. Max. Min. Max. A A b c D E E L /12 DocID6115 Rev 8

7 Package information Figure 20. SMA footprint (dimensions in mm) Figure 21. SMB dimension definitions E1 D E A1 C A2 L b Ref. Table 6. SMB dimension values Millimeters Dimensions Inches Min. Max. Min. Max. A A b c E E D L DocID6115 Rev 8 7/12 12

8 Package information STPS2H100 Figure 22. SMB footprint (dimensions in mm) Figure 23. SMAflat dimension definitions D A c E E1 L 2x L1 2x b L L2 2x Ref. Table 7. SMAflat dimensions Millimeters Dimensions Inches Min. Typ. Max. Min. Typ. Max. A b c D E E L L L /12 DocID6115 Rev 8

9 Package information Figure 24. SMAflat footprint dimensions 5.52 (17) 1.52 (60) 1.20 (47) 3.12 (0.123) millimeters (inches) 1.20 (47) Figure 25. SMBflat dimension definitions D A c L L2 E E1 b L L1 Ref. Millimeters Table 8. SMBflat dimensions Dimensions Inches Min. Typ. Max. Min. Typ. Max. A b (1) c (1) D E E L L L Applies to plated leads DocID6115 Rev 8 9/12 12

10 Package information STPS2H100 Figure 26. SMBflat footprint (dimensions in mm) /12 DocID6115 Rev 8

11 Ordering information 3 Ordering information Table 9. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS2H100A S21 SMA 68 g 5000 Tape and reel STPS2H100AF F21 SMAflat 35 g Tape and reel STPS2H100U G21 SMB g 2500 Tape and reel STPS2H100UF FG21 SMBflat 50 g 5000 Tape and reel 4 Revision history Table 10. Document revision history Date Revision Changes Jul A Last update. Aug Feb SMA package dimensions update. Reference A1 max. changed from 2.70 (0.106 inches) to 2.03 mm (80 inches). Reformatted to current standards. Added ECOPACK statement. Added SMBflat package. 15-Feb Updated weight for SMBflat in Table Jun Added SMAflat package DocID6115 Rev 8 11/12 12

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