STPS340. Power Schottky rectifier. Description. Features
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1 STPS34 Power Schottky rectifier Datasheet - production data Description K A NC Single chip Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. A DPAK STPS34B A Packaged in DPAK, SMC, SMB, and SMBflat, this device is intended for use in low and medium voltage operation, high frequency inverters, free wheeling and polarity protection applications where low switching losses are required. K K Table 1. Device summary SMB STPS34U SMC STPS34S I F(AV) 3 A V RRM 4 V T j (max) 15 C V F (max).57 V A K SMBflat STPS34UF Features Very small conduction losses Negligible switching losses Low forward voltage drop Low thermal resistance Extremely fast switching Surface mounted device Avalanche capability specified ECOPACK 2 compliant component, STPS34UF April 214 DocID3624 Rev 1 1/13 This is information on a product in full production.
2 Characteristics STPS34 1 Characteristics Table 2. Absolute Ratings (limiting values) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 4 V I F(RMS) Forward rms current DPAK 6 A T c = 135 C δ =.5 DPAK I F(AV) Average forward current T L = 15 C δ =.5 SMB/SMC 3 A T L = 115 C δ =.5 SMBflat I FSM Surge non repetitive forward current t p =1 ms sinusoidal 75 A P ARM Repetitive peak avalanche power t p = 1 µs T j = 25 C 13 W T stg Storage temperature range -65 to + 15 C T j Operating junction temperature (1) 15 C 1. dptot dtj 1 Rth( j a) condition to avoid thermal runaway for a diode on its own heatsink Table 3. Thermal resistance Symbol Parameter Value Unit SMB 25 R th(j-l) Junction to lead SMBflat 15 C/W SMC 2 R th(j-c) Junction to case DPAK 5.5 C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I R (1) V F (1) Reverse leakage current Forward voltage drop T j = 25 C 2 µa V R = V RRM T j = 125 C 2 1 ma T j = 25 C.63 I F = 3 A T j = 125 C T j = 25 C.84 I F = 6 A T j = 125 C V 1. Pulse test: t p = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.42 x I F(AV) +.5 I F 2 (RMS) 2/13 DocID3624 Rev 1
3 STPS34 Characteristics Figure 1. Average forward power dissipation versus average forward current (per diode) Figure 2. Average forward current versus ambient temperature (δ =.5, per diode) (DPAK / SMB / SMC) P F(AV) (W) δ =.5 δ =.1 δ =.2 δ = I F(AV) (A) R th(j-a) =Rth(j-l) DPAK δ = R th(j-a) =65 C/W SMB / SMC T I F(AV) (A) δ=tp/t tp T.5 δ=tp/t tp. T amb( C) Figure 3. Average forward current versus ambient temperature (δ =.5, per diode) (SMBflat) I F(AV) (A) δ=tp/t T tp R th(j-a) =Rth(j-l) T amb( C) SMB flat R th(j-a) =4 C/W 2. S CU=2.5 cm Figure 4. Non repetitive surge peak forward current versus overload duration (maximum values) (DPAK) I (A) M IM t δ=.5 t(s) DPAK T c=25 C T c=75 C T c=125 C 1.E-3 1.E-2 1.E-1 1.E+ Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) I (A) M IM t δ=.5 t(s) T a=25 C T a=75 C T a=125 C 1.E-3 1.E-2 1.E-1 1.E+ SMB Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values) (SMC) I (A) M IM t δ=.5 t(s) SMC T a=25 C T a=75 C T a=125 C 1.E-3 1.E-2 1.E-1 1.E+ DocID3624 Rev 1 3/13 13
4 Characteristics STPS34 Figure 7. Non repetitive surge peak forward current versus overload duration (maximum values) SMBflat Figure 8. Normalized avalanche power derating versus pulse duration 25 2 I (A) M SMB flat 1 P ARM(t p) P ARM(1µs) 15 T L=25 C IM t δ=.5 t(s) T L=75 C T L=125 C 1.E-3 1.E-2 1.E-1 1.E t p(µs) Figure 9. Normalized avalanche power derating versus junction temperature Figure 1. Relative variation of thermal impedance junction to ambient versus pulse duration (DPAK) 1.2 P ARM( Tj) P ARM(25 C) 1..9 Z th(j-a) /Rth(j-a) DPAK T ( C) j Single pulse t (s) p δ=tp/t 1.E-3 1.E-2 1.E-1 1.E+ T tp Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration (SMC) 1. Z th(j-a) /Rth(j-a) 1. Z th(j-a) /Rth(j-a).9 SMB.9 SMC Single pulse t (s) p δ=tp/t 1.E-2 1.E-1 1.E+ 1.E+1 1.E+2 1.E+3 T tp Single pulse t (s) p δ=tp/t 1.E-2 1.E-1 1.E+ 1.E+1 1.E+2 1.E+3 T tp 4/13 DocID3624 Rev 1
5 STPS34 Characteristics Figure 13. Relative variation of thermal impedance junction to lead versus pulse duration - SMBflat Figure 14. Reverse leakage current versus reverse voltage applied (typical values) Z th(j-l) /Rth(j-l) SMB flat 1.E+1 1.E+ I (ma) R T j =15 C T j =125 C.7 T j=1 C.6 1.E-1 T j =75 C E Single pulse t (s) p 1.E-4 1.E-3 1.E-2 1.E-1 1.E+ 1.E+1 1.E-3 1.E-4 T j=25 C V (V) R Figure 15. Junction capacitance versus reverse voltage applied (typical values) 1 C(pF) F=1MHz V OSC=3mVRMS T j=25 C Figure 16. Forward voltage drop versus forward current I FM(A) T j =125 C (Maximum values) 1 T j=125 C (Typical values).1 T j =25 C (Maximum values) 1 V (V) R V FM(V) DocID3624 Rev 1 5/13 13
6 Characteristics STPS34 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (DPAK) Figure 18. Thermal resistance junction to ambient versus copper surface under each lead (SMB / SMC) R th(j-a) ( C/W) Printed circuit board FR4 copper thickness = 35 µm S CU(cm²) DPAK R th(j-a) ( C/W) Printed circuit board FR4 copper thickness = 35 µm S CU(cm²) SMB / SMC Figure 19. Thermal resistance junction to ambient versus copper surface under each lead (SMBflat) R th(j-a) ( C/W) Printed circuit board FR4 copper thickness = 35 µm 5 SMBflat S CU(cm²) /13 DocID3624 Rev 1
7 STPS34 Package Information 2 Package Information Band indicates cathode on SMB, SMBflat and SMC Epoxy meets UL94, V In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. DocID3624 Rev 1 7/13 13
8 Package Information STPS34 Ref. Table 5. DPAK dimension values Millimeters Dimensions Inches Min. Typ. Max. Min. Typ. Max. A A A b b c c D E e H L L L V2 8 8 Figure 2. DPAK footprint dimensions (in mm) A B 1.5 This footprint ensures insultation up to 63 V rms (according to IEC 664-1) The device must be positioned within.5 A B 8/13 DocID3624 Rev 1
9 STPS34 Package Information Table 6. SMB dimensions E1 Ref. Dimensions Millimeters Inches Min. Max. Min. Max. D A C E L A1 A2 b A b c E E D L Figure 21. SMB footprint (dimensions in mm) DocID3624 Rev 1 9/13 13
10 Package Information STPS34 Table 7. SMBflat dimensions Ref. Millimeters Dimensions Inches E E1 D b A L L c L2 L1 Min. Typ. Max. Min. Typ. Max. A b (1) c (1) D E E L L L Applies to plated leads Figure 22. SMBflat footprint (dimensions in mm) /13 DocID3624 Rev 1
11 STPS34 Package Information Table 8. SMC package dimensions E1 Ref Dimensions Millimeters Inches Min. Max. Min. Max. D A A b E c C E2 L A1 A2 b E E E D L Figure 23. Footprint dimensions (in millimeters) DocID3624 Rev 1 11/13 13
12 Ordering information STPS34 3 Ordering information Table 9. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS34U U34 SMB.17 g 25 STPS34S S34 SMC.243 g 25 Tape and reel STPS34B 75 Tube S34 DPAK.3 g STPS34B-TR 25 Tape and reel STPS34UF FU34 ECOPACK 2 SMBflat.5 g 5 Tape and reel 4 Revision history Table 1. Document revision history Date Revision Description of changes Jul-23 7B Last update. Feb-25 8 Layout update. No content change. 8-Feb Apr Reformatted to current standard. Added ECOPACK statement. Added SMBflat package. Updated ECOPACK statement. Corrected Y axis in Figure 16 and Section 2: Package Information. 12/13 DocID3624 Rev 1
13 STPS34 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 214 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America DocID3624 Rev 1 13/13 13
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