MCM M x 4 Bit Static Random Access Memory SEMICONDUCTOR TECHNICAL DATA MCM6949 MOTOROLA FAST SRAM

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1 SEMICONDUCTOR TECHNICL DT Order this document by /D 1M x 4 Bit Static Random ccess Memory The is a 4,194,304 bit static random access memory organized as 1,048,576 words of 4 bits. Static design eliminates the need for external clocks or timing strobes. The is equipped with chip enable (E) and output enable (G) pins, allowing for greater system flexibility and eliminating bus contention problems. Either input, when high, will force the outputs into high impedance. The is available in a 400 mil, 32 lead surface mount SOJ package. Single 3.3 V 5%, + 10% Power Supply Fast ccess Time: 8/10/12/15 ns Equal ddress and Chip Enable ccess Time ll Inputs and Outputs are TTL Compatible Three State Outputs Power Operation: 195/165/160/155 m Maximum, ctive C PIN NMES YJ PCKGE 400 MIL SOJ CSE ddress Inputs W Write Enable G Output Enable E Chip Enable Data Input/Output NC No Connection VDD V Power Supply VSS Ground REV 9 5/20/99 MOTOROL FST SRM Motorola, Inc

2 BLOCK DIGRM ROW DECODER MEMORY MTRIX INPUT DT CONTROL COLUMN I/O COLUMN DECODER E W G PIN SSIGNMENT E 6 27 G 7 26 VDD 8 25 VSS VSS 9 24 VDD W NC 2 MOTOROL FST SRM

3 TRUTH TBLE (X = Don t Care) E G W Mode I/O Pin Cycle Current H X X Not Selected High Z ISB1, ISB2 L H H Output Disabled High Z IDD L L H Read Dout Read IDD L X L Write High Z Write IDD BSOLUTE MXIMUM RTINGS (See Note) Rating Symbol Value Unit Power Supply Voltage Relative to VSS VDD 0.5 to V Voltage Relative to VSS for ny Pin Except VDD Vin, Vout 0.5 to VDD V Output Current (per I/O) Iout ± 20 m Power Dissipation PD 1.0 W Temperature Under Bias Tbias 10 to + 85 C Operating Temperature T 0 to + 70 C Storage Temperature Plastic Tstg 55 to C NOTE: Permanent device damage may occur if BSOLUTE MXIMUM RTINGS are exceeded. Functional operation should be restricted to RECOMMENDED OPER- TING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to these high impedance circuits. This BiCMOS memory circuit has been designed to meet the dc and ac specifications shown in the tables, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow of at least 500 linear feet per minute is maintained. DC OPERTING CONDITIONS ND CHRCTERISTICS (VDD = 3.3 V 5%, + 10%, T = 0 to + 70 C, Unless Otherwise Noted) RECOMMENDED OPERTING CONDITIONS Parameter Symbol Min Typ Max Unit Supply Voltage (Operating Voltage Range) VDD V Input High Voltage VIH 2.2 VDD V Input Low Voltage VIL 0.5* 0.8 V *VIL (min) = 0.5 V dc; VIL (min) = 2.0 V ac (pulse width 2.0 ns). DC CHRCTERISTICS Parameter Symbol Min Max Unit Input Leakage Current (ll Inputs, Vin = 0 to VDD) Ilkg(I) ± 1.0 µ Output Leakage Current (E = VIH, Vout = 0 to VDD) Ilkg(O) ± 1.0 µ Output Low Voltage (IOL = m) VOL 0.4 V Output High Voltage (IOH = 4.0 m) VOH 2.4 V POWER SUPPLY CURRENTS C ctive Supply Current (Iout = 0 m, VDD = Max) C Standby Current (VDD = Max, E = VIH, No Other Restrictions on Other Inputs) CMOS Standby Current (E VDD 0.2 V, Vin VSS V or VDD 0.2 V) (VDD = Max, f = 0 MHz) Parameter Symbol 0 to + 70 C Unit 8: tvv = 8 ns 10: tvv = 10 ns 12: tvv = 12 ns 15: tvv = 15 ns 8: tvv = 8 ns 10: tvv = 10 ns 12: tvv = 12 ns 15: tvv = 15 ns IDD ISB m m ISB2 20 m MOTOROL FST SRM 3

4 CPCITNCE (f = 1.0 MHz, dv = 3.3 V, T = 25 C, Periodically Sampled Rather Than 100% Tested) Parameter Symbol Typ Max Unit Input Capacitance ll Inputs Except Clocks and s E, G, W Cin Cck pf Input/Output Capacitance CI/O 5 8 pf C OPERTING CONDITIONS ND CHRCTERISTICS (VDD = 3.3 V 5%, + 10%, T = 0 to + 70 C, Unless Otherwise Noted) Input Pulse Levels to 3.0 V Input Rise/Fall Time ns Input Timing Measurement Reference Level V Output Timing Measurement Reference Level V Output Load See Figure 1 RED CYCLE TIMING (See Notes 1 and 2) Parameter Symbol Min Max Min Max Min Max Min Max Unit Notes Read Cycle Time tvv ns 3 ddress ccess Time tvqv ns Enable ccess Time telqv ns 4 Output Enable ccess Time tglqv ns Output Hold from ddress Change txqx ns Enable Low to Output ctive telqx ns 5, 6, 7 Output Enable Low to Output ctive tglqx ns 5, 6, 7 Enable High to Output High Z tehqz ns 5, 6, 7 Output Enable High to Output High Z tghqz ns 5, 6, 7 NOTES: 1. W is high for read cycle. 2. Product sensitivities to noise require proper grounding and decoupling of power supplies as well as minimization or elimination of bus contention conditions during read and write cycles. 3. ll read cycle timings are referenced from the last valid address to the first transitioning address. 4. ddresses valid prior to or coincident with E going low. 5. t any given voltage and temperature, tehqz max telqx min, and tghqz max tglqx min, both for a given device and from device to device. 6. Transition is measured ± 200 mv from steady state voltage. 7. This parameter is sampled and not 100% tested. 8. Device is continuously selected (E VIL, G VIL). TIMING LIMITS OUTPUT Z0 = 50 Ω RL = 50 Ω VL = 1.5 V The table of timing values shows either a minimum or a maximum limit for each parameter. Input requirements are specified from the external system point of view. Thus, address setup time is shown as a minimum since the system must supply at least that much time. On the other hand, responses from the memory are specified from the device point of view. Thus, the access time is shown as a maximum since the device never provides data later than that time. Figure 1. C Test Load 4 MOTOROL FST SRM

5 RED CYCLE 1 (See Note 8) tvv (DDRESS) Q (DT OUT) txqx PREVIOUS DT VLID DT VLID tvqv RED CYCLE 2 (See Note 4) tvv (DDRESS) telqv E (CHIP ENBLE) telqx tehqz G (OUTPUT ENBLE) Q (DT OUT) HIGH Z tglqx tglqv DT VLID tghqz tvqv SUPPLY CURRENT IDD ISB MOTOROL FST SRM 5

6 WRITE CYCLE 1 (W Controlled; See Notes 1, 2, and 3) Parameter Symbol Min Max Min Max Min Max Min Max Unit Notes Write Cycle Time tvv ns 4 ddress Setup Time tvwl ns ddress Valid to End of Write tvwh ns ddress Valid to End of Write (G High) tvwh ns Write Pulse Width twlwh twleh ns Write Pulse Width (G High) twlwh twleh ns Data Valid to End of Write tdvwh ns Data Hold Time twhdx ns Write Low to Data High Z twlqz ns 5, 6, 7 Write High to Output ctive twhqx ns 5, 6, 7 Write Recovery Time twhx ns NOTES: 1. write occurs during the overlap of E low and W low. 2. Product sensitivities to noise require proper grounding and decoupling of power supplies as well as minimization or elimination of bus contention conditions during read and write cycles. 3. If G goes low coincident with or after W goes low, the output will remain in a high impedance state. 4. ll write cycle timings are referenced from the last valid address to the first transitioning address. 5. Transition is measured ± 200 mv from steady state voltage. 6. This parameter is sampled and not 100% tested. 7. t any given voltage and temperature, twlqz max < twhqx min, both for a given device and from device to device. (DDRESS) WRITE CYCLE 1 (W Controlled; See Notes 1, 2, and 3) tvv tvwh twhx E (CHIP ENBLE) twlwh twleh W (WRITE ENBLE) tvwl tdvwh twhdx D (DT IN) DT VLID Q (DT OUT) HIGH Z twlqz HIGH Z twhqx 6 MOTOROL FST SRM

7 WRITE CYCLE 2 (E Controlled; See Notes 1, 2, and 3) Parameter Symbol Min Max Min Max Min Max Min Max Unit Notes Write Cycle Time tvv ns 4 ddress Setup Time tvel ns ddress Valid to End of Write tveh ns ddress Valid to End of Write (G High) tveh ns Enable Pulse Width Enable Pulse Width (G High) teleh, telwh teleh, telwh ns 5, ns 5, 6 Data Valid to End of Write tdveh ns Data Hold Time tehdx ns Write Recovery Time tehx ns NOTES: 1. write occurs during the overlap of E low and W low. 2. Product sensitivities to noise require proper grounding and decoupling of power supplies as well as minimization or elimination of bus contention conditions during read and write cycles. 3. If G goes low coincident with or after W goes low, the output will remain in a high impedance state. 4. ll write cycle timing is referenced from the last valid address to the first transitioning address. 5. If E goes low coincident with or after W goes low, the output will remain in a high impedance condition. 6. If E goes high coincident with or before W goes high, the output will remain in a high impedance condition. (DDRESS) WRITE CYCLE 2 (E Controlled; See Notes 1, 2, and 3) tvv tveh teleh E (CHIP ENBLE) tvel telwh tehx W (WRITE ENBLE) tdveh D (DT IN) DT VLID Q (DT OUT) HIGH Z tehdx ORDERING INFORMTION (Order by Full Part Number) Motorola Memory Prefix Part Number MCM 6949 XX XX XX Shipping Method (R = Tape and Reel, Blank = Rails) Speed (8 = 8 ns, 10 = 10 ns, 12 = 12 ns, 15 = 15 ns) Package (YJ = 400 mil SOJ) Full Part Numbers YJ8 YJ10 YJ12 YJ15 YJ8R YJ10R YJ12R YJ15R MOTOROL FST SRM 7

8 PCKGE DIMENSIONS YJ PCKGE 400 MIL SOJ CSE K L G DETIL Z 16 F 32 PL 0.17 (0.007) S T B S S N D 32 PL 0.17 (0.007) S T B S S NOTE 3 DETIL Z P 0.17 (0.007) S T S B S B E C 0.10 (0.040) T SETING PLNE R S RDIUS 0.25 (0.010) S T S B S NOTE 3 NOTES: 1. DIMENSIONING ND TOLERNCING PER NSI Y14.5M, CONTROLLING DIMENSION: INCH. 3. TO BE DETERMINED T PLNE T. 4. DIMENSION ND D DO NOT INCLUDE MOLD PROTRUSION. MOLD PROTRUSION SHLL NOT EXCEED 0.15 (0.006) PER SIDE. 5. DIMENSION ND B INCLUDE MOLD MISMTCH ND RE DETERMINED T THE PRTING LINE. INCHES MILLIMETERS DIM MIN MX MIN MX B C D E F G BSC 1.27 BSC K L BSC 0.64 BSC N P R S Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/ffirmative ction Employer. Mfax is a trademark of Motorola, Inc. How to reach us: US / EUROPE / Locations Not Listed: Motorola Literature Distribution; JPN: Motorola Japan Ltd.; SPD, Strategic Planning Office, 141, P.O. Box 5405, Denver, Colorado, or Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan Mfax : RMFX0@ .sps.mot.com TOUCHTONE SI/PCIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, Motorola Fax Back System US & Canada ONLY Dai King Street, Tai Po Industrial Estate, Tao Po, N.T., Hong Kong. /mfax / HOME PGE : / CUSTOMER FOCUS CENTER: /D MOTOROL FST SRM