INDEX ORDERING CODE...1~4 CHIP ANTENNA...5~11 HIGH FREQUENCY MULTILAYER BAND PASS FILTER...12~18 HIGH FREQUENCY MULTILAYER BALANCED FILTER...
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- Dwayne Bond
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3 Table of Contents INDEX Subject Page ORDERING CODE...1~4 CHIP ANTENNA...5~11 HIGH FREQUENCY MULTILAYER BAND PASS FILTER...12~18 HIGH FREQUENCY MULTILAYER BALANCED FILTER...19~23 HIGH FREQUENCY MULTILAYER LOW PASS FILTER...24~26 BALUN TRANSFORMERS...27~31 DIPLEXER...32~34 COMMON MODE FILTER...35~38 COUPLER...39~40 EMI FILTER ARRAY...41 HIGH FREQUENCY CHIP INDUCTORS...42~44 MULTILAYER CHIP VARISTOR (MLV)...45~47
4 ORDERING CODE CHIP ANTENNA RF ANT A 5 T Type code Product code Dimension code Unit of dimension Application Packing HIGH FREQUENCY MULTILAYER BAND PASS FILTER RF BPF A 4 T Type code Product code Dimension code Unit of dimension Application Packing HIGH FREQUENCY MULTILAYER BALANCED FILTER RF BPB A 7 T Type code Product code Dimension code Unit of dimension Application mm Packing HIGH FREQUENCY MULTILAYER LOW PASS FILTER RF LPF A 0 T Type code Product code Dimension code Unit of dimension Application mm Packing 1
5 ORDERING CODE BALUN TRANSFORMERS RF BLN A 4 T Type code Product code Dimension code Unit of dimension Application Packing DIPLEXER RF DIP L 0 T Type code Product code Dimension code Unit of dimension Application Packing COMMON MODE FILTER RF CMF V 0 T Type code Product code Dimension code Unit of dimension Application Packing COUPLER RF CPL B 2450 T Type code Product code Dimension code Coupling Factor Unit Application Packing 2
6 ORDERING CODE EMI FILTER ARRAY RF EMA R 1 T Type code Product code Dimension code Unit of dimension Application Packing HIGH FREQUENCY INDUCTORS WL G 4N7 S G T 03 Product Code Dimension code Material Inductance Tolerance Packing Code Rated Current MULTILAYER CHIP VARISTOR (MLV) VH 0402 M 050 C G T Type code Chip Size Style Rated Voltage Capacitance Tolerance Termination Packing Cap. Code (pf) Special Request 3
7 CHIP ANTENNA STRUCTURE AND PIN ASSOCIATED 4
8 CHIP ANTENNA STRUCTURE AND DIMENSION Structure\ Dimension L W T a b c d Structure\ Dimension L W T P W P 1 P 2 P 3 P 4 P 5 5
9 CHIP ANTENNA ELECTRICAL SPECIFICATION 1.575GHz BAND WORKING FREQUENCY Frequency Range (GHz) Azimuth Bandwidth ( Gain (dbi) MHz ) VSWR (max.) Impedance Polarization Size (mm) Structure Bluetooth/WiFi BAND WORKING FREQUENCY Frequency Range (GHz) Azimuth Bandwidth ( MHz ) Gain (dbi) VSWR (max.) Impedance Polarization Size (mm) Structure WiMAX BAND WORKING FREQUENCY Frequency Range (GHz) Azimuth Bandwidth (MHz ) Gain (dbi) VSWR (max.) Impedance Polarization Size (mm) Structure For more information, please contact with local sales representative All specifications are subject to change without notice 6
10 CHIP ANTENNA TYPICAL ELECTRICAL CHARACTERISTICS Ω 7
11 CHIP ANTENNA 8
12 CHIP ANTENNA 9
13 CHIP ANTENNA RFECA E1T RFECA K1T For more information, please contact with local sales representative All specifications are subject to change without notice 10
14 HIGH FREQUENCY MULTILAYER BAND PASS FILTER STRUCTURE AND PIN ASSOCIATED 11
15 HIGH FREQUENCY MULTILAYER BAND PASS FILTER STRUCTURE AND DIMENSION Structure\ Dimension L W T A B C D E F G H ELECTRICAL SPECIFICATION DVB BAND WORKING FREQUENCY Frequency Insertion Loss Range(GHz) (db) Attenuation ( db min. ) VSWR (max.) Impedance Size(mm) STRUCTURE 1.8GHz BAND WORKING FREQUENCY Frequency Insertion Loss Range(GHz) (db) Attenuation ( db min. ) VSWR (max.) Impedance Size(mm) STRUCTURE 12
16 HIGH FREQUENCY MULTILAYER BAND PASS FILTER 2.4GHz BAND WORKING FREQUENCY Frequency Insertion Loss Attenuation VSWR Range(GHz) (db) ( db min. ) (max.) Impedance Size(mm) STRUCTURE 13
17 HIGH FREQUENCY MULTILAYER BAND PASS FILTER Frequency Insertion Loss Range(GHz) (db) Attenuation ( db min. ) VSWR (max.) Impedance Size(mm) STRUCTURE 14
18 HIGH FREQUENCY MULTILAYER BAND PASS FILTER Frequency Insertion Loss Attenuation ( db Range(GHz) (db) min. ) VSWR (max.) Impedance Size(mm) STRUCTURE 15
19 HIGH FREQUENCY MULTILAYER BAND PASS FILTER 5GHz BAND WORKING FREQUENCY Frequency Insertion Loss Range(GHz) (db) Attenuation ( db min. ) VSWR (max.) Impedance Size(mm) STRUCTURE Frequency Insertion Loss Range(GHz) (db) Attenuation ( db min. ) VSWR (max.) Impedance Size(mm) STRUCTURE For more information, please contact with local sales representative All specifications are subject to change without notice 16
20 HIGH FREQUENCY MULTILAYER BAND PASS FILTER TYPICAL ELECTRICAL CHARACTERISTICS For more information, please contact with local sales representative All specifications are subject to change without notice 17
21 HIGH FREQUENCY MULTILAYER BALANCED FILTER STRUCTURE AND PIN ASSOCIATED 18
22 HIGH FREQUENCY MULTILAYER BALANCED FILTER STRUCTURE AND DIMENSION Structure\ Dimension L W T A B C D E F G P ELECTRICAL SPECIFICATION Frequency Range (MHz) Unbalance Balance Insertion Loss (db) Attenuation ( db min. ) VSWR (Max.) Size (mm) STRUCTURE 19
23 HIGH FREQUENCY MULTILAYER BALANCED FILTER Frequency Range Impedance (MHz) Unbalance Balance Insertion Loss (db) Attenuation ( db min. ) VSWR (Max.) Size (mm) STRUCTURE 20
24 HIGH FREQUENCY MULTILAYER BALANCED FILTER Frequency Range (MHz) Unbalance Balance Insertion Loss (db) Attenuation ( db min. ) VSWR (Max.) Size (mm) STRUCTURE 5GHz BAND WORKING FREQUENCY Frequency Range (MHz) Impedance Insertion Loss (db) Attenuation ( db min. ) VSWR (Max.) Size(mm) STRUCTURE WiMAX BAND WORKING FREQUENCY Frequency Range (MHz) Insertion Loss (db) Attenuation ( db min. ) VSWR (Max.) For more information, please contact with local sales representative All specifications are subject to change without notice Size(mm) STRUCTURE 21
25 HIGH FREQUENCY MULTILAYER BALANCED FILTER TYPICAL ELECTRICAL CHARACTERISTICS For more information, please contact with local sales representative All specifications are subject to change without notice 222
![ASSOCIATED STRUCTURE AND](/docs-images/73/68903506/images/26-2.jpg "DIMENSION Structure\")
26 HIGH FREQUENCY MULTILAYER LOW PASS FILTER STRUCTURE AND PIN ASSOCIATED STRUCTURE AND DIMENSION Structure\ Dimension L W T a b c d e f ELECTRICAL SPECIFICATION GSM850/900GHz BAND WORKING FREQUENCY Frequency Range (MHz) Insertion Loss (db) Attenuation ( db min. ) VSWR (max.) Impedance Size (mm) Structure 23
27 HIGH FREQUENCY MULTILAYER LOW PASS FILTER DCS/PCS BAND WORKING FREQUENCY Frequency Range (MHz) Insertion Loss (db) TD-SCDMA BAND WORKING FREQUENCY Frequency Range (MHz) InsertionLoss (db) 2.4GHz BAND WORKING FREQUENCY Frequency Range (MHz) Insertion Loss (db) Attenuation ( db min. ) Attenuation ( db min. ) Attenuation ( db min. ) VSWR (max.) Impedance Size(mm) Structure VSWR (max.) Impedance Size(mm) Structure VSWR (max.) Impedance Size (mm) Structure 5GHz BAND WORKING FREQUENCY Frequency Range (MHz) Insertion Loss (db) Attenuation ( db min. ) VSWR (max.) Impedance Size(mm) Structure WiMAX 2.3~3.5GHz BAND WORKING FREQUENCY Frequency Range (MHz) Insertion Loss (db) Attenuation ( db min. ) VSWR (max.) Impedance For more information, please contact with local sales representative All specifications are subject to change without notice Size(mm) Structure 24
28 HIGH FREQUENCY MULTILAYER LOW PASS FILTER TYPICAL ELECTRICAL CHARACTERISTICS RFLPF16082G6W0T RFLPF16083G5W0T RFLPF16083G5W1T RFLPF16083G5W7T 0-10 db(s(2,1)) db(s(1,1)) RFLPF A0T RFLPF A0T RFLPF A1T RFLPF A2T 0-10 db(s(1,1)) db(s(2,1)) freq, GHz 25 For more information, please contact with local sales representative All specifications are subject to change without notice
29 BALUN TRANSFORMERS STRUCTURE AND PIN ASSOCIATED 26
30 BALUN TRANSFORMERS STRUCTURE AND DIMENSION Structure\ Dimension L W T a b c d e f g h ELECTRICAL SPECIFICATION Frequency Range (MHz) Unbalance Balance Return Loss (db)min. Insertion Loss (db) Amplitude Difference (db)max. Size (mm) Structure 27
31 BALUN TRANSFORMERS ISM Band 5GHz Application Frequency Range (GHz) Unbalance Balance Return Loss (db)min. Insertion Loss (db) Amplitude Difference (db)max. Size (mm) Structure WiMAX 2.3~3.5GHz Application Frequency Range (MHz) Unbalance Balance Return Loss (db)min. Insertion Loss (db) Amplitude Difference (db)max. Size(mm) Structure GSM 850/ GSM 900/ DCS1800/ PCS1900 Application Return Frequency Range (MHz) Unbalance Balance Loss (db) Min Insertion Loss (db) Amplitude Difference (db)max Attenuation (db min.) Size (mm) Structure TYPICAL ELECTRICAL CHARACTERISTICS For more information, please contact with local sales representative All specifications are subject to change without notice 28
32 BALUN TRANSFORMERS TYPICAL ELECTRICAL CHARACTERISTICS 29
33 BALUN TRANSFORMERS RFBLN AM1T59 For more information, please contact with local sales representative All specifications are subject to change without notice 30
34 DIPLEXER STRUCTURE AND PIN ASSOCIATED STUCTURE A STUCTURE B STUCTURE C STUCTURE D STUCTURE E STUCTURE F STUCTURE G STUCTURE H STUCTURE I STUCTURE J GND GND BT/ WLAN GND GPS GND GND ANT GND STRUCTURE AND DIMENSION Structure Dimension L W T a b c d e f g J 31
35 DIPLEXER ELECTRICAL SPECIFICATION Frequency (MHz) Impedance Insertion Loss ( db ) Attenuation ( db ) Return Ripple Loss (db) (db)min. Size (mm) Structure J For more information, please contact with local sales representative All specifications are subject to change without notice 32
36 DIPLEXER TYPICAL ELECTRICAL CHARACTERISTICS RFDIP L0T RFDIP L1T RFDIP L3T RFDIP L4T RFDIP L5T RFDIP L0T For more information, please contact with local sales representative All specifications are subject to change without notice 33
37 COMMON MODE FILTER STRUCTURE AND PIN ASSOCIATED STRUCTURE AND DIMENSION Unit:mm Structure\ Dimension Type L W T a b c ELECTRICAL SPECIFICATION Characteristic Impedance (Differential) Common Mode DC max. Rated Current (ma) Size(mm) Structure 34
38 COMMON MODE FILTER Characteristic Impedance (Differential) Common Mode Attenuation ( Min. ) DC Resistance Rated Current (ma) Size(mm) Structure Characteristic Impedance (Differential) DC Resistance Rated Current (ma) Size (mm) Structure Cut-off Frequency DC Resistance Rated Current (ma) Size (mm) Structure Characteristic Impedance (Differential) DC Resistance Rated Current (ma) Size (mm) Structure For more information, please contact with local sales representative All specifications are subject to change without notice 35
39 COMMON MODE FILTER TYPICAL ELECTRICAL CHARACTERISTICS 36
40 COMMON MODE FILTER For more information, please contact with local sales representative All specifications are subject to change without notice 37
41 COUPLER STRUCTURE AND PIN ASSOCIATED STRUCTURE AND DIMENSION Structure\ Dimension L W T A B C D E ELECTRICAL SPECIFICATION Application Insertion Loss (db) Coupling in BW Isolation in BW VSWR Dimension ( mm³) Structure 38
42 COUPLER TYPICAL ELECTRICAL CHARACTERISTICS 39
43 EMI FILTER ARRAY STRUCTURE AND PIN ASSOCIATED STRUCTURE AND DIMENSION Structure\ Dimension L W T A B C D E F G ELECTRICAL SPECIFICATION -3dB Cut-off Frequency (20MHz) Attenuation ( min.) Size(mm) Structure TYPICAL ELECTRICAL CHARACTERISTICS RFEMA R18T1U For more information, please contact with local sales representative All specifications are subject to change without notice 40
44 HIGH FERQUENCY INDUCTIRS STRUCTURE AND DIMENSION Chip Size WL1608 Series WL1005 Series WL0603 Series HIGH FREQUENCY INDUCTOR 1608 (0603) Walsin Part Number L(nH) Tolerance Q Min (MHz) Typical Frequency (MHz) SRF Typical (MHz) RDC Maximum IDC (ma) 41
45 HIGH FERQUENCY INDUCTIRS HIGH FREQUENCY INDUCTOR 1005 (0402) Walsin Part Number L(nH) Tolerance Q Min (MHz) Typical Frequency (MHz) SRF Typical (MHz) RDC Maximum IDC (Ma) 42
46 HIGH FERQUENCY INDUCTIRS Walsin Part Number L(nH) Tolerance Q Min (MHz) Typical Frequency (MHz) SRF Typical (MHz) RDC Maximum IDC (Ma) HIGH FREQUENCY INDUCTOR 0603 (0201) Walsin Part Number L(nH) Tolerance Q Min (MHz) Typical Frequency (MHz) SRF Typical (MHz) RDC Maximum IDC (ma) For more information, please contact with local sales representative All specifications are subject to change without notice 43
47 MULTILAYER CHIP VARISTOR(MLV) INTRODUCTION-PLATED & LEAD-FREE TERMINATION FEATURES at APPLICATIONS Size L a 444
48 MULTILAYER CHIP VARISTOR(MLV) QUICK REFERENCE SPECIFICATIONS VH Series Maximum Continuous Working Voltage Maximum Ratings Maximum Non-Repetitive Surge Energy (10/100μs) Max. Clamping Voltage at Current (8/20μs) Nominal Voltage at 1mA(DC) Current Max. 1MHz VM(DC) WTM VC VN(DC) Min. VN(DC) Max. C (V) (J) (V) (V) (V) (pf) % Maximum Continuous Working Voltage Typical ESD Trigger Voltage Typical ESD clamping Voltage after 30ns Leakage VDC Minimum ESD pulse withstand 1MHz VM(DC) VT Clamp (V) μa Times Cp (pf) 45
49 MULTILAYER CHIP VARISTOR(MLV) QUICK REFERENCE SPECIFICATIONS VZ Series Maximum Continuous Working Voltage Maximum Ratings Maximum Non-Repetitive Surge Energy (8/20μs) Maximum Non-Repetitive Surge Energy (10/1000μs) Max. Clamping Voltage at Current (8/20μs) VM (DC) VM (AC) ITM WTM VC Nominal Voltage at 1mA(DC) Current VN (DC) Min. VN (DC) Max. 1MHz (V) (V) (A) (J) (V) (V) (V) (pf) C For more information, please contact with local sales representative All specifications are subject to change without notice 46
50 PLAN & MEMO 47
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